JPH0712944Y2 - 電子部品実装基板の温度保護構造 - Google Patents

電子部品実装基板の温度保護構造

Info

Publication number
JPH0712944Y2
JPH0712944Y2 JP9874389U JP9874389U JPH0712944Y2 JP H0712944 Y2 JPH0712944 Y2 JP H0712944Y2 JP 9874389 U JP9874389 U JP 9874389U JP 9874389 U JP9874389 U JP 9874389U JP H0712944 Y2 JPH0712944 Y2 JP H0712944Y2
Authority
JP
Japan
Prior art keywords
board
electronic component
substrate
layer
protection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9874389U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0336974U (en, 2012
Inventor
稔 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP9874389U priority Critical patent/JPH0712944Y2/ja
Publication of JPH0336974U publication Critical patent/JPH0336974U/ja
Application granted granted Critical
Publication of JPH0712944Y2 publication Critical patent/JPH0712944Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP9874389U 1989-08-24 1989-08-24 電子部品実装基板の温度保護構造 Expired - Lifetime JPH0712944Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9874389U JPH0712944Y2 (ja) 1989-08-24 1989-08-24 電子部品実装基板の温度保護構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9874389U JPH0712944Y2 (ja) 1989-08-24 1989-08-24 電子部品実装基板の温度保護構造

Publications (2)

Publication Number Publication Date
JPH0336974U JPH0336974U (en, 2012) 1991-04-10
JPH0712944Y2 true JPH0712944Y2 (ja) 1995-03-29

Family

ID=31647828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9874389U Expired - Lifetime JPH0712944Y2 (ja) 1989-08-24 1989-08-24 電子部品実装基板の温度保護構造

Country Status (1)

Country Link
JP (1) JPH0712944Y2 (en, 2012)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5573601B2 (ja) * 2010-10-29 2014-08-20 アイシン・エィ・ダブリュ株式会社 基板の結露防止構造
EP3062142B1 (en) 2015-02-26 2018-10-03 Nokia Technologies OY Apparatus for a near-eye display
US10650552B2 (en) 2016-12-29 2020-05-12 Magic Leap, Inc. Systems and methods for augmented reality
EP4300160A3 (en) 2016-12-30 2024-05-29 Magic Leap, Inc. Polychromatic light out-coupling apparatus, near-eye displays comprising the same, and method of out-coupling polychromatic light
US10578870B2 (en) 2017-07-26 2020-03-03 Magic Leap, Inc. Exit pupil expander
CA3084811A1 (en) 2017-12-10 2019-06-13 Magic Leap, Inc. Anti-reflective coatings on optical waveguides
AU2018392482A1 (en) 2017-12-20 2020-07-02 Magic Leap, Inc. Insert for augmented reality viewing device
US10755676B2 (en) 2018-03-15 2020-08-25 Magic Leap, Inc. Image correction due to deformation of components of a viewing device
JP7319303B2 (ja) 2018-05-31 2023-08-01 マジック リープ， インコーポレイテッド レーダ頭部姿勢位置特定
WO2020010097A1 (en) 2018-07-02 2020-01-09 Magic Leap, Inc. Pixel intensity modulation using modifying gain values
US11856479B2 (en) 2018-07-03 2023-12-26 Magic Leap, Inc. Systems and methods for virtual and augmented reality along a route with markers
JP7374981B2 (ja) 2018-07-10 2023-11-07 マジック リープ， インコーポレイテッド クロス命令セットアーキテクチャプロシージャ呼出のためのスレッドウィービング
US11598651B2 (en) * 2018-07-24 2023-03-07 Magic Leap, Inc. Temperature dependent calibration of movement detection devices
WO2020028191A1 (en) 2018-08-03 2020-02-06 Magic Leap, Inc. Unfused pose-based drift correction of a fused pose of a totem in a user interaction system
CN112955073B (zh) 2018-08-22 2025-01-28 奇跃公司 患者观察系统
CN118409394A (zh) 2018-12-21 2024-07-30 奇跃公司 用于促进波导内的全内反射的气穴结构
JP2022530900A (ja) 2019-05-01 2022-07-04 マジック リープ， インコーポレイテッド コンテンツプロビジョニングシステムおよび方法
EP4004630A4 (en) 2019-07-26 2022-09-28 Magic Leap, Inc. SYSTEMS AND PROCEDURES FOR AUGMENTED REALITY
US12033081B2 (en) 2019-11-14 2024-07-09 Magic Leap, Inc. Systems and methods for virtual and augmented reality
WO2021097323A1 (en) 2019-11-15 2021-05-20 Magic Leap, Inc. A viewing system for use in a surgical environment

Also Published As

Publication number Publication date
JPH0336974U (en, 2012) 1991-04-10

Similar Documents

Publication Publication Date Title
JPH0712944Y2 (ja) 電子部品実装基板の温度保護構造
US4279292A (en) Charge coupled device temperature gradient and moisture regulator
US5522225A (en) Thermoelectric cooler and temperature sensor subassembly with improved temperature control
US5457342A (en) Integrated circuit cooling apparatus
US4904090A (en) Temperature sensing arrangement
JPS59500036A (ja) 集積回路チツプ用保持装置
KR20080012329A (ko) 가열된 압력 변환기
JP2011033479A (ja) 温度センサ
JP2001168560A (ja) 電子回路ユニット
JP2000292480A (ja) 恒温槽
JP2906154B2 (ja) サーモパイル
De Baetselier et al. A survey of the thermal stability of an active heat sink
US20210203861A1 (en) Thermal imaging
KR100979260B1 (ko) 함체용 온도 제어장치
JPH09307030A (ja) 結露防止機能付冷却装置
CN113923938B (zh) 电子设备
US4636916A (en) Apparatus for minimizing optically and thermally induced noise in precision electronic components
JPH09162379A (ja) 冷却型ｃｃｄカメラ装置
CN211701111U (zh) 一种带隔离带电体的耐高温配电箱
JP2574582Y2 (ja) 半導体素子の熱保護装置
KR200179993Y1 (ko) 패키지 테스트 장치
CN219609495U (zh) 制冷型红外光电导传感器的恒温装置
JPH0429348Y2 (en, 2012)
KR960000463Y1 (ko) 열전소자를 이용한 열전 냉각장치
JPS61172358A (ja) ペルチエ冷却法利用の集積回路

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term