JPH07109960B2 - Electronic component positioning method and device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component positioning method and apparatus for obtaining positional information and tilt information of a substrate and an electronic component to be automatically mounted and positioning them.

[0002]

2. Description of the Related Art Recent electronic components reduce the number of assembly steps by performing automatic mounting and ensure the accuracy of assembly. For this purpose, it is necessary to accurately mount the electronic component at the mounting position.

In the case of a two-terminal electronic component such as a resistor or a capacitor, since the number of terminals is small, it is not necessary to have strict accuracy in mounting. However, electronic components such as TAB having fine-pitch copper foil leads obtained by resin-molding an IC chip on a polyimide film are used to form patterned indium and tin on a glass panel (hereinafter referred to as a substrate) such as a liquid crystal panel. Thermocompression bonding is performed on a transparent electrode (ITO) lead made of an oxide compound through an anisotropic conductive film having conductivity in the thickness direction and insulating property in the plane direction.

On the other hand, the pitch of many leads arranged on the substrate and electronic parts is 0.18 to 0.25 mm, and the lead width is about 0.09 to 0.125 mm.
Strict mounting accuracy is required when mounting electronic components on a board. For this reason, it becomes difficult to mount the device accurately by simply controlling it.

Therefore, conventionally, a dedicated TV camera images the positioning + -shaped marks provided on both ends of the board and the electronic component respectively, and the position and the tilt of the board and the electronic component are obtained from the imaged result. When the position and the tilt are equal to or more than a predetermined amount, the position correction control is performed.

[0006]

[Problems to be Solved by the Invention] However, TA
A film-shaped electronic component such as B is likely to warp due to heat treatment in the resin molding process. When the positioning marks on the film thus warped are photographed in a non-contact manner using a TV camera, the positions of the positioning marks and the distance between the marks cannot be accurately measured,
There is a problem that the leads of the board and the electronic component cannot be accurately positioned. Moreover, since the board and the electronic parts such as the TAB are respectively imaged by the dedicated TV cameras and the positional information of the tilt and the like is required, the image processing of the board and the electronic parts cannot be performed in parallel. There is a problem that the processing time becomes long.

[0007]

According to the present invention, positioning marks are provided at least at two positions, and
A first imaging device having a large field of view in a method of positioning a board having a large number of leads between the both positioning marks and an electronic component having leads corresponding to the leads of the board. Allows at least 2 on the board
The positioning marks are sequentially picked up, and the rough positioning of the substrate in the X and Y directions is performed based on the increment of the positioning mark obtained from the obtained position information of the positioning mark, and the tilt of the substrate is determined. The lead of this substrate and the lead of the electronic component are positioned to face each other on the same axis, and a group of leads at both ends near both ends has a small field of view.
And the third image pickup device, and the average positions of both lead groups are respectively obtained from the imaged position information of the lead groups at both ends of the substrate, and the lead position of the substrate is obtained from both average positions of the both end lead groups. The average position and inclination of the lead tips of both lead groups are respectively obtained from the imaged position information of the lead groups at both ends of the electronic component. The midpoint and tilt of the lead position of the electronic component is calculated from the average of the tilts, and the midpoint of the lead of the board and the tilt of the substrate are aligned with the midpoint of the lead of the electronic component and the tilt of the electronic component to place the electronic component on the board. After positioning, the leads of the electronic component are superposed on the leads of the substrate.

[0008]

The substrate 1 is placed on the XY table 7. The positioning marks 4 arranged at both ends of the substrate 1 are sequentially imaged by the first imaging device 9 having a large field of view,
This image signal is converted into a digital signal by the A / D converter 14 and stored in the image memory 17. The center of gravity of each of the image signals read from this is obtained by multi-valued processing, and both coordinates are determined. The position information of the increments (ΔX, ΔY) of these two coordinates is input to the XY table drive control unit 37 to perform rough positioning of the substrate 1 in the X and Y directions, and the increments (ΔX, ΔY). ), The inclination θ _{PNL of the} substrate 1 is _expressed by the following equation θ _PNL = Tan ⁻¹ ΔY
Calculated from / ΔX and stored in the memory 33.

The ITO lead 3 of the substrate 1 and the T of the electronic component 2
The lead 3 is arranged so as to face the AB lead 5 on the same axis, and both ends of both the leads 3 and 5 are the second and third image pickup devices 1 respectively.
The image signal is picked up by 0 and 11, and this image signal is A / D converter 1
The signals 5 and 16 are converted into digital signals and stored in the image memories 18 and 19, respectively.

The image information of four leads of the one-end lead group 3L of the ITO lead 3 read out from the image memories 18 and 19 to the one-end lead position information detecting section 25 is binarized to obtain one-end lead group. 3L average position X
_ITAL is determined and stored in memory 33. Similarly, the average position X _ITOR of the lead 3 at the other end of the substrate 1 is obtained and stored in the memory 33. In addition, the one-end lead group 5 of the TAB leads 5 of the electronic component 2 read from the image memory 18 to the one-end lead position information tilt information detection unit 27.
The image signals of four leads of L are subjected to multi-value processing, and the average position X _TABL of the lead tip and the inclination θ are obtained.
_TABL is determined and stored in memory 33. Similarly, the average position X _TABR and inclination θ of the lead tips of the other end lead group 5R of the electronic component 2 read from the image memory 19 to the other end lead position information inclination information detection unit 28.
_TABR is determined and stored in memory 33.

Both average positions of the leads 3 of the substrate 1 X _ITOL
The positioning point of the substrate 1 is determined based on the midpoint P _ITO of the X and I _TOR . On the other hand, the electronic component 2 is positioned from the midpoint P _TAB between the average positions X _TABL and X _TABR of the TAB lead 5 of the electronic component 2, and the inclinations θ _TABL and θ
The inclination θ _TAB of the electronic component 2 is determined from the middle point θ _{TAB of the TABR} and the inclination θ _{PNL of the} substrate 1, and these values are X
Input to the -Y-θ table drive control unit to drive the XY-θ table 8 to drive the ITO lead 3 of the substrate 1 and the electronic component 2
The TAB leads 5 are aligned with each other.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail with reference to FIGS. 1 to 7 for positioning the substrate 1 and the electronic component 2. FIG. 1 is an explanatory view of essential parts of a positioning device for electronic parts (hereinafter, simply referred to as a positioning device) according to the present invention, FIG. 2 is a block diagram of essential parts of the positioning device, and FIG.
7 to 7 are explanatory views showing the procedure of positioning the substrate 1 and the electronic component 2.

As shown in FIG. 1, a substrate 1 is provided with a large number of conventionally known transparent electrode (ITO) leads (hereinafter referred to as ITO leads) 3 and the IT.
On both ends of the row of O leads 3, that is, on both ends of the substrate 1, + -shaped positioning marks 4 are provided, and on the upper surface, a substantially transparent for connecting the substrate 1 and the electronic component 2 by thermocompression bonding. The anisotropic conductive film is temporarily press-bonded.

The electronic component 2 is an IC having a copper foil lead (hereinafter referred to as TAB lead) 5 on a polyimide film.
The chip is resin-molded and is connected to other parts by the TAB lead 5, and + -shaped positioning marks 6 are provided at both ends of the TAB lead 5.

Reference numeral 7 denotes an XY table on which the substrate 1 is placed, which is composed of two axes in the X and Y directions and is driven by a servo motor (not shown). 8 is an X-on which the electronic component 2 is placed
The Y-θ table is composed of three axes in the X, Y, and θ directions,
Like the XY table 7, it is driven by a servo motor.

Reference numeral 9 denotes a first image pickup device, which has a relatively large field of view and recognizes the positioning mark 4 to recognize the substrate 1
For determining the rough positioning in the X and Y directions and the inclination θ _{PNL of the} substrate 1, and is fixed to the positioning device. Reference numerals 10 and 11 denote second and third image pickup devices, respectively, which have a narrow field of view. As shown in FIG.
One end regions of the O lead 3 and the TAB lead 5 (the imaging device 1
0) (corresponding to the visual field of 0) 12 and the other end region (corresponding to the visual field of the image pickup device 11) 13 are recognized and the substrate 1 and the electronic component 2
For determining the X, Y, and θ directions of
It can be moved in any direction.

As a light source (not shown) of each of the first, second and third image pickup devices 9, 10 and 11, there is a certain incident of coaxial light which is emitted from the axis of a lens (not shown). Angled oblique light is used and the ITO lead 3
The image pickup device 9 for picking up only the image is irradiated with coaxial light. The imaging devices 10 and 11 use oblique light and coaxial light. When the ITO lead 3 is imaged, the coaxial light is emitted, and when the TAB lead 5 is imaged, it is switched to oblique light.

This is because the surface of the ITO (transparent electrode) lead 3 patterned on the substrate 1 is flat and smooth, so that the incident light is specularly reflected. Therefore, when imaging with the imaging device 9, if oblique light having a certain incident angle is used, all the light is specularly reflected, so that the light does not enter the imaging device 9 located on the axis of the lens, ITO
This is because the lead 3 cannot be imaged. on the other hand,
The TAB lead 5 has a copper foil lead formed on a polyimide film by means of etching or the like, and thus has a rough surface. Therefore, when the TAB lead 5 is imaged by the imaging devices 10 and 11, the light is diffusely reflected on the surface of the TAB lead 5. Therefore, when coaxial light is irradiated, the light is incident on the imaging devices 10 and 11 on the coaxial line. This is because the image cannot be captured without it.

In FIG. 2, 14, 15, and 16 are A / Ds.
The converter converts the analog image signals from the image pickup devices 9, 10 and 11 into digital image signals. 1
Image memories 7, 18, and 19 store image signals from the A / D converters 14, 15, and 16, respectively. Two
Reference numeral 0 is a first switch, which switches the image signals of the ITO lead 3 and the TAB lead 5 in the one end region 12 imaged by the image pickup device 10, respectively. Reference numeral 21 is a switch similar to the first switch 20, and similarly to the above, the ITO lead 3 and TA in the other end area 13 imaged by the image pickup device 11
The image signal with the B lead 5 is switched.

Reference numeral 22 is a reference position information input section for outputting a reference signal for positioning. Reference numeral 23 is a positioning mark detection unit of the substrate 1, which detects increments ΔX and ΔY of the positioning marks 4 arranged at both ends of the substrate 1. 24 is the substrate 1
The tilt information calculator calculates the tilt θ _{PNL of the} substrate 1 with respect to the X and Y directions of the XY table 7 from the increments ΔX and ΔY detected by the positioning mark detector 23.

Reference numerals 25 and 26 respectively denote one end lead position information detecting portion and the other end lead position information detecting portion of the ITO lead 3, and the ITO imaged by the image pickup devices 10 and 11, respectively.
Information of the lead groups 3L and 3R in the one end region 12 and the other end region 13 of the lead 3 is detected. Reference numerals 27 and 28 respectively denote one end lead position information / tilt information detecting portion and the other end lead position information / tilt information detecting portion of the TAB lead 5, and similar to the above, one end area 12 and the other end area 1 of the TAB lead 5.
The information of the lead groups 5L and 5R in 3 is detected.

Reference numerals 29 and 30 respectively denote one end lead position information calculation section and the other end lead position information calculation section of the ITO lead 3, and the average positions of the ITO leads 3 at both ends are calculated from the position information of the lead groups 3L and 3R. . 31, 32
Is the lead position information / tilt information calculation unit at one end and the lead position information / tilt information calculation unit at the other end of the TAB lead 5,
From the position information of the lead groups 5L and 5R, TAs at both ends
The average position and tilt of the B lead 5 are calculated.

Reference numeral 33 denotes a memory, which is the tilt information of the substrate 1 from the tilt information calculation unit 24, the average position information of both ends of the ITO lead 3 from the one end and other end lead position information calculation units 29 and 30, and one end and the other. Edge lead position information / tilt information calculation unit 3
The average position information of both ends and the tilt information of both ends of the TAB lead 5 from 1 and 32 are temporarily stored.

Reference numeral 34 is a tilt information calculation unit, which uses the tilt information of the substrate 1 and the tilt information of the one end and the other end of the TAB lead 5 for the substrate 1.
And the inclination of the TAB lead 5 is determined. A position information calculation unit 35 of the substrate 1 positions the substrate 1 by calculating the midpoint of both ends of the lead from the average position information of the ITO leads 3 from the one end and the other end lead position information calculation units 29 and 30. Reference numeral 36 denotes a position information calculation unit of the electronic component 2, which is used for the T information from the one end and the other end lead position information / tilt information calculation units 31 and 32.
The electronic component 2 is positioned by calculating the midpoint of the leads on both ends from the average position information of the AB leads 5.

Reference numeral 37 denotes an XY table drive control unit which is driven by the positioning information from the positioning mark detection unit 23 to roughly position the substrate 1. 38 is XY-
The θ table drive control unit drives the XY-θ table 8 based on the information from the tilt information calculation unit 34, the board position information calculation unit 35, and the electronic component position information calculation unit 36.
The board 1 and the electronic component 2 are positioned. Reference numeral 39 is a thermocompression bonding device, which is the ITO lead 3 of the substrate 1 and the TAB of the electronic component 2.
This is for thermocompression bonding with the lead 5. Reference numeral 40 is a binarization window, and 41 is a drive unit of the imaging devices 10 and 11.

Next, regarding the operation and operation, mainly in FIG.
This will be described with reference to FIG. In the positioning device according to the present invention, as the first procedure, the image pickup device 9 recognizes the positioning marks 4 at both ends on the substrate 1. First, this will be described. When the substrate 1 is placed on a glass panel base (not shown), the substrate 1 is placed on an XY table 7 which can be moved in X and Y directions by a swing arm (not shown). At the same time, the imaging device 9 is illuminated by coaxial light.
Thus, one of the positioning marks 4 is imaged. The captured optical image is converted into an analog image signal in a photoelectric conversion unit (not shown). The analog image signal is converted into a digital signal by the A / D converter 14 and stored in the image memory 17. Next, the XY table 7 is driven by a servo motor (not shown) and the other positioning mark 4 is imaged by the image pickup device 9. Similarly, this image signal is converted into a digital signal by the A / D converter 14. It is stored in the image memory 17.

The image signals of the positioning marks 4 at both ends stored in the image memory 17 are read out to the positioning mark detecting section 23, and the center of gravity thereof is determined by the shading processing (multi-value processing) by the usual image processing means. The coordinates are obtained and the coordinates are determined. As shown in FIG. 3, based on the position information (X ₁ , Y ₁ ), (X ₂ , Y ₂ ) of the positioning marks 4 at both ends obtained in this way, the increment of both positioning marks 4 (ΔX = _{X 2 -X 1, ΔY = Y} 2 -Y
₁ ) is detected.

The position information of this increment (ΔX, ΔY) is X
It is input to the -Y drive control unit 37, and rough positioning of the substrate 1 in the X and Y directions is performed. At this position, the XY table 7 is moved.
Is fixed. That is, in this positioning, as shown in FIG. 4, both ends of the ITO lead 3 and the TAB lead 5 are located in the visual fields of the imaging devices 10 and 11, that is, the one end region 12 and the other end region 1.
The rough positioning of the XY table 7 is performed to such an extent that it enters the range of 3.

On the other hand, when the inclination θ _{PNL of the} substrate 1 is taken, the inclination information calculator 24 calculates the increment (ΔX, ΔY) from the increase of the substrate 1.
'S inclination ^{_{θ PNL, θ PNL = Tan -1}} ΔY / ΔX is calculated, the reference position (X-Y table of the X, Y-direction) inclination theta _PNL substrate 1 for is calculated, this value memory 3
3 is stored.

Next, a case where the image pickup devices 10 and 11 recognize the ITO lead 3 and the TAB lead 5 and position them will be described. The electronic component (TAB) 2 is formed in a tape-like shape and is wound around a reel (not shown). The electronic component (TAB) 2 is punched out, placed on the XY-θ table 8 and supplied by a so-called reel. Alternatively, the punched electronic component 2 may be placed on a tray (not shown) and supplied to the tray.

In this state, as shown in FIG.
Both ends of the lead 5 and the ITO lead 3 are connected to the imaging device 10,
11 visual field (one end area) 12 and visual field (other end area) 1
Located within 3. At this time, the inclination θ _{PNL of the} substrate 1 is already determined and stored in the memory 33.

Therefore, the illumination is switched to the coaxial light, and the image pickup devices 10 and 11 allow the one end region 12 and the other end region 13 to be displayed.
Each of the ITO leads 3 located at is imaged. Next, the illumination is switched to oblique light, and the TAB leads 5 are similarly imaged by the imaging devices 10 and 11, respectively.

Each of these picked-up optical images is converted into an analog image signal in a photoelectric conversion section (not shown) in each of the image pickup devices 10 and 11. These analog image signals are A / D converters 15 and 16 respectively.
Are converted into digital signals and stored in the image memories 18 and 19, respectively.

Next, within the visual field of the image pickup device 10 (one end region 1
The case where the position of the lead group 3L of the ITO lead 3 in 2) is determined by the binarization process will be described. Lead group 3 of ITO leads 3 stored in the image memory 18
The image information of L is once read by the lead position information detection unit 25, an arbitrary area therein is set, the coordinates thereof are determined, and the position of the binarization window 40 is set as shown in FIG. To be done.

In this embodiment, the image memory 1
When the image information is read from 8, the coordinates and the position of the binarization window 40 are already set. Further, when the binarization window 40 is set, dust or the like existing in a portion other than the pattern object (lead group 3L) is not recognized, and in the case of pattern recognition, it is easy to recognize features.

As shown in FIG. 5, the binarized lead group 3L (object) in the binarized window 40 has four leads from the end. In this embodiment, four lead groups 3L are used as objects in order to suppress variations in measured values and improve measurement accuracy, but the number of objects is not limited to this, and the number of objects is not limited to this. Can be adopted arbitrarily. However, although the accuracy increases as the number of objects increases, the area of each object is obtained and averaged to obtain the center of gravity. Therefore, the processing time increases as the number of objects increases. In addition, the number of objects that can be adopted is determined by the number of imaging devices 10, 1
Since this is also related to the field of view of one, the lead group 3L having four objects is employed empirically in this embodiment.

For each of the four lead groups 3L adopted, the lead position information computing section 29 once obtains each area in the binarization window 40, and from this value, the four lead groups 3L are respectively calculated. Center of gravity X ₁ , X ₂ , X
₃ and X ₄ are determined, and X _ITOL = X ₁ + X ₂ + X ₃ + X
The average value of each center of gravity is calculated from _4/4 , and this value is determined as the average position _{XITO L} of one end of the lead 3 and stored in the memory 33. Similarly, the average position _XITOR of the lead group 3R in the other end region 13 is determined and stored in the memory 33. Also in the Y direction, if the center of gravity is obtained by the same procedure, the accurate position of the substrate 1 in the X and Y directions is determined and stored in the memory 33. These position information are stored in the memory 3
3, the positional information calculation unit 35 of the substrate 1 accurately positions the substrate 1 together with the inclination θ _PNL of the substrate 1 previously obtained from the positioning mark 4.

When the position information of the lead groups 3L, 3R, etc. is read from the image memories 18, 19, the area of each lead as an object, the length of X, and the length of Y are discriminated, which is inappropriate. Such objects are set to be excluded at the stage of feature determination.

Next, the positioning of the electronic component 2 such as TAB will be described with reference to FIG. In this embodiment, the electronic component 2 can obtain the position and the inclination by subjecting the image information to multi-value processing. Also in this case, the substrate 1
The four TAB leads 5 are adopted in the same manner as adopted for the positioning of. Therefore, four of the lead groups 5L in which the image signals captured by the imaging device 10 and stored in the image memory 18 are read from the image memory 18 to the one-end lead position information / tilt information detection unit 27 of the TAB lead 5 are read. Book lead group 5L (linear equations are V ₁ , V ₂ , V ₃ ,
V ₄ ) will be described as an example.

As shown in FIG. 6, in the one-end lead position information / tilt information calculation unit 31 of the TAB lead 5, the lead group 5L (V ₁ , V ₂ , V ₃ , V ₄ ) of this lead is read. A straight line H orthogonal to the axis scans from left to right to scan four lead groups 5L (V ₁ , V ₂ , V ₃ ,
V ₄ ) intersecting points H ₁ , H ₂ , H ₃ , H _4, ...
The center of gravity of the lead 5 in the X direction G ₁₁ , G _12, ...
_{G 21, G 22 ···, G} 31, G 32 ···,
G ₄₁ , G ₄₂ ... Are obtained and each TA is calculated by the least squares method.
Determine the linear equation _{V 1, V} 2 ··· _{V N} of B lead 5,
The coefficients M ₁ , M _2, ... _{MN of} this equation are the inclinations of the leads. Therefore, the average value of the four leads V ₁ , V _2, ... _Is obtained, and the inclination of the electronic component 2 is determined as θ _TABL θ _TABL = (M ₁ + M ₂ + M ₃ + M ₄ ) / 4, and the memory is determined. Stored in 33. Further, if the obtained straight line is extended to the tip of the lead V ₁ ... And the intersections with the tip lead are respectively X ₁ , X ₂ ... X _N , the average position of the four leads is taken. , Its average position X
_TABL is X _TABL = X ₁ + X ₂ + X ₃ + X _{4/4, which} is obtained as an average position of one end (left side) of the TAB lead 5, and this value is stored in the memory 33.

Similarly, the T imaged by the image pickup device 11 is obtained.
The average position X _TABR and inclination θ _TABR of the other end (right end) of the AB lead 5 are also determined.

Next, as shown in FIG. 7, the average position X _ITOL of both ends of the ITO lead 3 thus obtained is obtained.
And _XITOR are read from the memory 33 to the position information calculation unit 35 of the substrate, where the midpoint between the two is obtained, and the IT
The positioning position P _ITO of the O lead 3 is determined. Similarly, average positions X _TABL and X at both ends of the TAB lead 5
_TABR and _TABR are read from the memory 33 to the position information calculation unit 36 of the electronic component, where the midpoint between the two is obtained, and _TBR is calculated.
The positioning position P _TAB of the AB lead 5 is determined. Similarly, the inclination θ _TAB of the TAB lead 5 is read from the memory 33 to the inclination information calculation unit 34, and is calculated from the average value of the inclinations θ _TABL and θ _{TABR at} both ends. The inclination θ _PNL of the ITO lead 3 is stored in the memory 33.

[0043] as well as the above manner X by the positioning position _{P TAB} positioning position _{P ITO} and the TAB leads 5 of ITO lead 3 which is determined, the positioning of the Y-direction, inclination theta _PNL and the electronic component 2 of the substrate 1 Of the inclination θ _TAB is corrected by the X-Y-θ table drive control unit 38.
-Y- [theta] Table 8 is rotated to match and correct T
Positioning is performed by aligning the position of the AB lead 5 with the position of the ITO lead 3.

In this way, the ITO lead 3 and the TAB are
After the positioning with the lead 5 is completed, the substrate 1 and the electronic component 2 are overlapped with each other, and the thermocompression bonding device 3 shown in FIG.
When heated by 9, the anisotropic conductive film causes the substrate 1
And the electronic component 2 are thermocompression bonded.

[0045]

The present invention corresponds to a substrate in which positioning marks are provided at least at two positions, and a large number of leads are provided between the positioning marks, and to the leads of this substrate. In the positioning method with the electronic component on which the lead is arranged, at least two positioning marks on the substrate are sequentially imaged by the first imaging device having a large field of view, and the positional information of the positioning marks obtained respectively is used. The board is roughly positioned in the X and Y directions based on the obtained increment of the positioning mark, the tilt of the board is determined, and the leads of the board and the leads of the electronic component are positioned on the same axis. The two-end lead groups near the both ends are respectively imaged by the second and third image pickup devices having a small field of view, and the positions of the lead groups at both ends of the imaged substrate are measured. The average position of both lead groups is obtained from the information, the midpoint of the lead position of the board is obtained from both average positions of the lead groups at both ends, and both lead positions are obtained from the imaged position information of the lead groups at both ends of the electronic component. The average position and tilt of the lead ends of the group are obtained, and the midpoint and tilt of the lead position of the electronic component are calculated from the average of both lead positions of both lead groups and the average of both tilts. After the electronic component is positioned on the substrate by aligning the inclination of the substrate with the center of the lead of the electronic component and the inclination of the electronic component, the leads of the electronic component are superposed on the leads of the substrate. Since the substrate and the electronic component are positioned by recognizing both ends of the lead of the electronic component and the lead of the electronic component, the accuracy of determining the position values of the both becomes very good.

Moreover, the positioning is performed by recognizing the lead groups on both ends of the leads of the board and the leads of the electronic component and by positioning at the midpoint of the lead groups on both ends, it is accurate even if there is a difference in the number of leads. In addition to accurate positioning, accurate positioning is possible even if the electronic component has a warp.

Further, the position information of the positioning marks of at least two positions on the board is multi-valued, and the position information of the lead groups on both ends of the board is obtained by the binarizing process. Since the tilt information is obtained by the multi-valued processing, the center of gravity of the electronic component is required. Therefore, the board and the electronic component that are conventionally used are not required, and the dedicated image pickup device for capturing the electronic component is not required. Since the image can be picked up by the image pickup device and processed in parallel, the processing time can be significantly shortened.

[Brief description of drawings]

FIG. 1 is an explanatory view of essential parts showing an embodiment of the present invention.

FIG. 2 is a principal block diagram showing an embodiment of the present invention.

FIG. 3 shows an embodiment of the present invention and is an explanatory diagram for determining the approximate positioning and inclination of the substrate.

FIG. 4 shows an embodiment of the present invention, in which the imaging device 1
It is explanatory drawing which shows the imaging area of 0 and 11.

FIG. 5 illustrates an embodiment of the present invention and is an explanatory diagram for detecting a lead position on a substrate.

FIG. 6 shows an embodiment of the present invention and is an explanatory diagram for detecting the position and inclination of the lead of the electronic component.

FIG. 7 shows an embodiment of the present invention and is an explanatory view showing the alignment of the leads of the substrate and the leads of the electronic component.

[Explanation of symbols]

1 substrate 2 electronic component 3 ITO lead 4 positioning mark 5 TAB lead 7 XY table 8 XY-θ table 9, 10, 11 imaging device 14, 15, 16 A / D converter 17, 18, 19 image memory 20, 21 Switcher 23 Positioning mark detection unit 24 Inclination information calculation unit 25 One end lead position information detection unit of substrate 26 Other end lead position information detection unit of substrate 27 One end lead position information / tilt information detection unit of electronic component 28 Electronic component Other end lead position information / tilt information detection unit 29 one end of ITO lead lead position information calculation unit 30 other end of ITO lead lead position information calculation unit 31 one end of TAB lead lead position information / tilt information calculation unit 32 TAB lead other Edge lead position information / tilt information calculation unit 33 Memory 34 Tilt information calculation unit 35 Substrate position information calculation unit 36 Position information calculating unit of the electronic component 37 X-Y table drive controller 38 X-Y-θ table drive controller

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hiroyuki Takasaki 1-15-1, Nishi-Shimbashi, Minato-ku, Tokyo Japan Avionics Co., Ltd. (56) Reference JP 62-86789 (JP, A) JP Sho 63-137500 (JP, A)

Claims (3)

[Claims] 1. A positioning mark is provided at least at two positions, and between these positioning marks,
In a method of positioning a board on which a large number of leads are arranged and an electronic component on which leads corresponding to the leads of the board are arranged, at least The positioning marks at various positions are sequentially imaged, rough positioning of the substrate in the X and Y directions is performed based on the increment of the positioning marks obtained from the obtained position information, and the tilt of the substrate is determined. The leads of the substrate and the leads of the electronic component are positioned to face each other on the same axis, and the two-end lead groups near both ends are imaged by the second and third image pickup devices having a small field of view, respectively. The average position of both lead groups is obtained from each position information of the lead groups, and the midpoint of the lead positions of the board is obtained from both average positions of the lead groups at both ends. From the imaged position information of the lead groups at both ends of the electronic component, the average positions and inclinations of the lead tips of both lead groups are respectively obtained, and The midpoint and tilt of the lead position of the electronic component are determined, and the midpoint of the lead of the substrate and the tilt of the substrate are aligned with the midpoint of the lead of the electronic component and the tilt of the electronic component, and After positioning the component, the lead of the electronic component is superposed on the lead of the substrate. 2. A substrate in which positioning marks are provided at least at two positions, and a large number of leads are provided between the positioning marks, and leads corresponding to the leads of the substrate are provided. A positioning device for an electronic component, the lead of the substrate is positioned in the end face direction, the substrate is placed on the substrate, and the XY table can be driven in two axial directions of X and Y; and the XY table. An X-Y-θ table which is placed in close proximity to and which can be driven in three axial directions of X, Y, and θ on which the leads of the electronic component are placed so as to face each other on the same axis of the leads of the substrate; A first image pickup device having a large visual field for picking up positioning marks disposed in at least two positions on the same side, and a visual field for picking up both end lead groups of both leads of the substrate and the electronic component, which are located opposite to each other on the same axis. Small second and third image pickup devices, an A / D converter for digitally converting the analog image signals from the first, second and third image pickup devices, and an image signal from the A / D converter First, second and third image memories for respectively storing the image signals, and image signals of one end lead groups of the substrate and the electronic component read from the second image memory, the lead on the substrate side and the electronic component. A first switch for switching to the lead on the side, and an image signal of the other end lead group of the substrate and the electronic component read from the third image memory to the lead on the substrate and the electronic component. A second switch for switching to read; and detecting position information of the positioning marks at the both ends of the image signal of the substrate read from the first image memory, and A positioning mark detection section for detecting the inclination of the -Y table, said X the position information from the positioning mark detection section
An XY table drive control unit that drives the Y table in the X and Y directions to roughly position the XY table; and a substrate that calculates the tilt of the substrate based on the position information from the positioning mark detection unit. A tilt information calculation unit; a one-end lead position information detection unit that detects position information of the one-end lead group of the substrate read from the second image memory; and an electronic component read from the second image memory. One-end lead position information detection unit that detects position information of one-end lead group, and one-end lead position information of the substrate that calculates an average position of the one-end lead group of the substrate based on position information from the one-end lead position information detection unit Of the electronic component that calculates the average position of the lead group at the one end of the electronic component based on the position information from the computing unit and the one end lead position information detection unit of the electronic component An end lead position information calculation unit, another end lead position information detection unit for detecting position information of the other end lead group of the substrate read from the third image memory, and an end lead position information read unit from the third image memory. The other end lead position information detection unit that detects the position information of the other end lead of the electronic component, and the average position of the lead group at the other end of the substrate is calculated from the position information from the other end lead position information detection unit. Another end lead position information calculation unit, another end lead position information calculation unit that calculates an average position of the other end lead group of the electronic component based on position information from the other end lead position information detection unit of the electronic component, the substrate Tilt information from the tilt information calculation unit, and average position information of one end from the one end lead position information calculation unit of the board and one end lead position information calculation unit of the electronic component,
A memory for storing average position information of the other ends from the other end lead position information calculation unit of the board and the other end lead position information calculation section of the electronic component; and the board and the board stored in the memory. A tilt information calculation unit that calculates and corrects tilt information for each of the electronic components, and a board position information calculation unit that calculates positioning of the board based on average position information of both ends of the board stored in the memory, An electronic component position information calculation unit that calculates positioning of the electronic component based on average position information of both ends of the electronic component stored in the memory, tilt information of the substrate and the electronic component, and the substrate The X-Y- [theta] table is stored in the X-Y- [theta] table based on the positioning information of the board from the position information calculation unit and the positioning information of the electronic component from the electronic component position information calculation unit. An electronic component positioning device, comprising: an XY-θ table drive control unit that is driven in a direction. 3. Position information of at least two positioning marks on a board is multivalued, and position information of lead groups at both ends of the board is obtained by binarization processing to obtain position information of lead groups at both ends of an electronic component. The electronic component positioning method according to claim 1, wherein the tilt information and the tilt information are obtained by a multi-valued process.