JPH05343447A - Illuminator for image recognition device - Google Patents

Illuminator for image recognition device

Info

Publication number
JPH05343447A
JPH05343447A JP4144263A JP14426392A JPH05343447A JP H05343447 A JPH05343447 A JP H05343447A JP 4144263 A JP4144263 A JP 4144263A JP 14426392 A JP14426392 A JP 14426392A JP H05343447 A JPH05343447 A JP H05343447A
Authority
JP
Japan
Prior art keywords
light
detected
light source
axis
optical axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4144263A
Other languages
Japanese (ja)
Inventor
Masaki Fukahori
雅紀 深堀
Shinichi Shihara
真一 紫原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP4144263A priority Critical patent/JPH05343447A/en
Publication of JPH05343447A publication Critical patent/JPH05343447A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512Aligning
    • H01L2224/85121Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8513Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]

Abstract

PURPOSE:To eliminate failure of an image recognition operation by optimizing a quantity of light incident to imaging means in response to a surface roughness of an object to be detected in the operation of an electronic component. CONSTITUTION:An to be detected and a light input unit 3a of imaging means 3 for imaging the object W are so disposed that an incident optical axis 10 of an optical system of the unit 3a becomes parallel with a normal of a surface to be detected of the object W, and a translucent mirror 9 such as a half prism, etc., is disposed on the axis 10 between the object W and the means 3. Two light sources 11, 12 are so disposed that an illuminating light from the first light source 11 is emitted substantially to the same axis as the axis 10 to the surface to be detected of the object W through the mirror 9 and the axis of the light from the second light source 12 to the object W has a suitable inclining angle theta to the axis 10. When a surface roughness is low the source 11 is fired through switching means 17 by a command signal from a controller 13 according to a difference of the surface roughnesses of the detected surfaces, while when the roughness is high the source 12 is fired.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、集積回路(IC)等の
ダイボンディング、やワイヤボンディング等の電子部品
の各種作業に使用する画像認識装置における照明装置に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illuminating device in an image recognition device used for various operations of electronic components such as die bonding of integrated circuits (ICs) and wire bonding.

【0002】[0002]

【従来の技術】従来、ICにおける半導体ペレットをリ
ードフレームの所定のアイランド位置に載置接合するダ
イボンデイング作業や、前記半導体ペレットの電極部と
リードフレームのリード部とをワイヤボンディングする
作業、また、サーマルヘッド等のセラミックス基板上の
配線部と、該セラミックス基板上に固定した駆動用IC
における電極部とのワイヤボンディング作業などにおい
て、テレビカメラにて撮像した画像から画像処理し、前
記半導体ペレットの載置位置や電極位置等のマーク部を
検出することが行われている。
2. Description of the Related Art Conventionally, die bonding work for mounting and bonding a semiconductor pellet of an IC on a predetermined island position of a lead frame, wire bonding between the electrode part of the semiconductor pellet and the lead part of the lead frame, and Wiring part on a ceramic substrate such as a thermal head, and a driving IC fixed on the ceramic substrate
In the wire bonding work with the electrode part in 1), image processing is performed from an image captured by a television camera to detect a mark part such as a mounting position of the semiconductor pellet or an electrode position.

【0003】この場合、テレビカメラの光学系に対する
入射光軸線と、被検出物におけるマーク部の表面とが略
直角であるように、被検出物を配置しておくと、被検出
物におけるマーク部検出位置の座標の演算が容易であ
る。ところで、前記マーク部の位置検出を容易にするた
め、前記テレビカメラで撮像する被検出物の表面の撮像
範囲に照明光を照射するのであるが、マーク部がリード
フレームなどのように表面粗さの粗い部分と半導体ペレ
ット等のように表面が鏡面状の滑らかな表面の部分とが
ある。
In this case, if the object to be detected is arranged such that the incident optical axis line to the optical system of the television camera and the surface of the mark part on the object to be detected are substantially at right angles, the mark part on the object to be detected is arranged. The calculation of the coordinates of the detection position is easy. By the way, in order to facilitate the position detection of the mark part, the imaging area of the surface of the object to be imaged by the television camera is irradiated with illumination light. However, the mark part has a surface roughness like a lead frame. Rough surface and a surface portion having a smooth mirror-like surface such as a semiconductor pellet.

【0004】これらの場合、前記マーク部検出表面の法
線に対する照明装置からの照射光軸線が0度(検出表面
に対する法線方向、換言すれば垂直)ではなく、傾き角
を有するような入射角を持つとき、表面が滑らかな(鏡
面状の)検出表面で全反射した反射光は、一般に検出表
面に対する法線を挟んで前記入射角と同じ角度(反射
角)で反射する。
In these cases, the incident optical axis from the illuminating device with respect to the normal line of the mark detection surface is not 0 degrees (normal direction to the detection surface, in other words, vertical), but has an inclination angle. When, the reflected light totally reflected by the smooth (mirror-like) detection surface is reflected at the same angle (reflection angle) as the incident angle with the normal to the detection surface sandwiched.

【0005】従って、鏡面状の検出表面を撮像して明る
く良く見えるようにするには、図2に示すように、テレ
ビカメラ等の撮像手段100の入光部の光学系に対する
入射光軸線101を被検出物102の表面に対して直角
な状態にセットする一方、撮像手段100と被検出物1
02との間にハーフプリズム103を配置し、該ハーフ
プリズム103にその側方から照明装置104の照射光
を入れて、被検出物102の表面における入射光と反射
光とが同軸となるようにセットすることが好ましい。こ
の照射方式を以下同軸照射という。
Therefore, in order to image a mirror-like detection surface so that it looks bright and good, as shown in FIG. 2, the incident optical axis line 101 with respect to the optical system of the light entrance portion of the image pickup means 100 such as a television camera is set. While being set in a state of being perpendicular to the surface of the detected object 102, the image pickup means 100 and the detected object 1 are set.
02, the half prism 103 is arranged between the two and the irradiation light of the illuminating device 104 is put into the half prism 103 from the side thereof so that the incident light and the reflected light on the surface of the object to be detected 102 are coaxial. It is preferable to set. This irradiation method is hereinafter referred to as coaxial irradiation.

【0006】なお、ハーフプリズム103は、直角プリ
ズムの斜面に金属薄膜(クローム膜)あるいは誘電体多
層膜をコーティングし、この2つの直角プリズムをその
両斜面で接着させたものをいい、入射面に垂直(直角)
に入射した光は斜面で反射光と透過光とに分離する。他
方、粗い表面のマーク部検出表面では、前記傾斜角度を
有する入射光に対する反射光は乱反射され、入射光の一
部のみが撮像手段に入射されるが、このような粗い検出
表面に対して、前述のように、被検出物102の表面に
おける入射光と反射光とが同軸となるようにセットする
と、前記乱反射により撮像手段100の入光部への反射
光量が極端に少なくなり、背景部分とのコントラストが
無くなる結果、画像認識や位置検出に不都合が発生す
る。この不都合を解消するため、従来では、図3に示す
ように、照明装置105の被検出物102の表面に対す
る照射光の軸線106を適宜角度(α)だけ傾けるよう
にする、いわゆる傾斜照射を実行することが好ましい。
The half prism 103 is a prism in which a metal thin film (chrome film) or a dielectric multilayer film is coated on the slope of a right-angled prism, and the two right-angle prisms are adhered on both slopes. Vertical (right angle)
The light incident on is separated into reflected light and transmitted light on the slope. On the other hand, on the rough detection surface of the mark portion, the reflected light with respect to the incident light having the inclination angle is diffusely reflected and only a part of the incident light is incident on the image pickup means. As described above, when the incident light and the reflected light on the surface of the object to be detected 102 are set so as to be coaxial with each other, the amount of the reflected light to the light incident portion of the image pickup means 100 is extremely reduced due to the diffuse reflection, and the background portion and As a result of the loss of the contrast, the inconvenience occurs in image recognition and position detection. In order to eliminate this inconvenience, conventionally, as shown in FIG. 3, so-called tilted irradiation is performed in which the axis line 106 of the irradiation light with respect to the surface of the detection object 102 of the illumination device 105 is appropriately inclined by an angle (α). Preferably.

【0007】しかし、従来では、表面粗さに相違する部
分のある被検出物の画像認識作業を実行するとき、前記
同軸照射と傾斜照射との2系統の照明装置を同時に点灯
していた。
However, conventionally, when performing the image recognition operation of the object to be detected which has a portion having a different surface roughness, the two illumination systems of the coaxial irradiation and the tilted irradiation are simultaneously turned on.

【0008】[0008]

【発明が解決しようとする課題】しかしながら、前述の
ように、2系統の照明装置を同時に点灯して画像認識作
業を実行すると、テレビカメラ等の撮像手段100にお
ける入光部への入射光量が必要以上に多くなり、却って
マーク部の画像認識や検出が困難になったり、不能にな
る。
However, as described above, if two systems of lighting devices are simultaneously turned on to perform the image recognition work, the amount of light incident on the light incident portion of the image pickup means 100 such as a television camera is required. The number of images becomes larger than the above, and on the contrary, image recognition or detection of the mark portion becomes difficult or impossible.

【0009】例えば、粗い表面の部分のマーク部を画像
認識する場合、傾斜照射による反射光の他、同軸照射に
よる照射光の一部が撮像手段100に入り込み、画像認
識や検出の邪魔になるという問題があった。本発明は前
記従来の問題を解決し、画像認識を容易かつ正確に実行
できる画像認識装置における照明装置を提供することを
目的とするものである。
For example, in the case of recognizing an image of a mark portion on a rough surface, a part of the irradiation light by the coaxial irradiation enters the image pickup means 100 in addition to the reflected light by the oblique irradiation, which hinders the image recognition and detection. There was a problem. SUMMARY OF THE INVENTION It is an object of the present invention to solve the above conventional problems and provide an illuminating device in an image recognition device that can easily and accurately perform image recognition.

【0010】[0010]

【課題を解決するための手段】前記目的を達成するた
め、本発明は、被検出物とそれを撮像する撮像手段の入
光部とを、該入光部の光学系の光軸線が被検出物の検出
表面の法線と平行状になるように配置し、被検出物に対
して2系統で光照射する光源を備えてなる画像認識装置
における照明装置において、前記被検出物と撮像手段と
の間の光軸線上にハーフプリズム等の半透鏡体を配置
し、第1光源からの照射光を前記半透鏡体を介して前記
被検出物の検出表面に前記光軸線と略同軸上に照射する
一方、第2光源から被検出物への照射光の軸線を前記光
軸線に対して適宜傾斜角度を有するように、前記2つの
光源を配置し、前記検出表面の表面粗さの相違により、
前記第1光源と第2光源との照射のON・OFFまたは
光量の増減を切り換える制御手段を備えたものである。
In order to achieve the above-mentioned object, the present invention provides an object to be detected and a light entrance portion of an image pickup means for picking up the object, in which an optical axis of an optical system of the light entrance portion is detected. An illuminating device in an image recognition apparatus, which is arranged so as to be parallel to a normal line of a detection surface of an object, and includes a light source that irradiates the object to be detected with two systems. A semi-transparent mirror body such as a half prism is arranged on the optical axis between the two, and the irradiation light from the first light source is irradiated to the detection surface of the object to be detected through the semi-transparent mirror body substantially coaxially with the optical axis. On the other hand, the two light sources are arranged so that the axis of the irradiation light from the second light source to the object to be detected has an appropriate inclination angle with respect to the optical axis, and due to the difference in the surface roughness of the detection surface,
It is provided with a control means for switching ON / OFF of the irradiation of the first light source and the second light source or switching between increase and decrease of the light amount.

【0011】[0011]

【実施例】次に、本発明を具体化した実施例について説
明すると、図1は、画像認識装置1と本発明の照明装置
2との概略構成図であり、符号3はテレビカメラまたは
2次元CCD撮像素子等からなる撮像手段、符号4は半
導体ペレット等の被検出物Wを搭載したXYテーブルで
ある。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment embodying the present invention will be described. FIG. 1 is a schematic configuration diagram of an image recognition device 1 and an illumination device 2 of the present invention, and reference numeral 3 is a television camera or a two-dimensional image. Reference numeral 4 is an XY table on which an object to be detected W such as a semiconductor pellet is mounted.

【0012】このXYテーブル4はロータリエンコーダ
等の位置検出器6を備えたX軸モータ5でX方向に移動
させる一方、同じくロータリエンコーダ等の位置検出器
8を備えたY軸モータ7でY方向に移動させるように構
成されている。前記両モータ5,7はそれぞれステッピ
イングモータ等を使用する。前記XYテーブル4上の被
検出物Wの表面に対して撮像手段3の入光部3aの光学
系に対する入射光軸線10を直角な状態にセットする一
方、前記XYテーブル4上の被検出物Wと撮像手段3の
入光部3aとの間に半透鏡体9を配置する。この半透鏡
体9は、ハーフプリズムまたはハーフミラーにて構成さ
れている。これら半透鏡体9は、後述するコーティング
面(傾斜面)を入射光軸線10に対して45度に傾けた
状態にセットする。
The XY table 4 is moved in the X-direction by an X-axis motor 5 having a position detector 6 such as a rotary encoder, while it is moved in the Y-direction by a Y-axis motor 7 having a position detector 8 such as a rotary encoder. Is configured to move to. A stepping motor or the like is used for both the motors 5 and 7. The incident optical axis 10 with respect to the optical system of the light entrance part 3a of the image pickup means 3 is set at a right angle to the surface of the detected object W on the XY table 4, while the detected object W on the XY table 4 is set. The semi-transparent mirror body 9 is disposed between the light-receiving part 3a of the image pickup means 3 and the light-receiving part 3a. The semi-transparent mirror body 9 is composed of a half prism or a half mirror. These semi-transparent mirror bodies 9 are set such that the coating surface (inclined surface) described later is inclined at 45 degrees with respect to the incident optical axis line 10.

【0013】ハーフプリズムは、直角プリズムの斜面に
金属薄膜(クローム膜)あるいは誘電体多層膜をコーテ
ィングし、この2つの直角プリズムをその両斜面で接着
させたものをいい、入射面に垂直(直角)に入射した光
は斜面で反射光と透過光とに分離することができるもの
である。なお、ハーフプリズムでは、反射光と透過光と
の光路長さは同じとなり、入射光に対して透過光の光軸
ずれはない。また、ハーフプリズムでは通常反射光と透
過光との割合は1対1である。
The half prism is a right-angled prism whose slope is coated with a metal thin film (chrome film) or a dielectric multilayer film, and these two right-angled prisms are adhered to each other on both sides thereof. ) Is incident on the slope and can be separated into reflected light and transmitted light. In the half prism, the reflected light and the transmitted light have the same optical path length, and there is no deviation of the optical axis of the transmitted light with respect to the incident light. Further, in the half prism, the ratio of the reflected light and the transmitted light is usually 1: 1.

【0014】また、ハーフミラーは、平行平面硝子の片
面に金属薄膜(クローム膜)または誘電多層膜をコーテ
ィングしたもので、45度に入射した光を反射光と透過
光とに分割する。但し、前記平行平面硝子の板厚に応じ
て、透過光は入射光に対して若干の平行の光軸ずれが発
生する。符号11は本発明の照明装置2における第1光
源で、該第1光源11は、前記半透鏡体9の側方に配置
し、入射光軸線10に対して直交する方向から第1光源
11の照射光が半透鏡体9に入射するようにセットして
ある。また、第2光源12は、その照射光の軸線が前記
XYテーブル4上の被検出物Wにおける検出表面の法線
に対して角度θだけ傾くようにセットされている。な
お、第2光源12の前記傾き角度θは手動もしくは図示
しないアクチェータにより、変更調節することができる
ように構成されている。
The half mirror is formed by coating a metal thin film (chrome film) or a dielectric multilayer film on one surface of parallel plane glass, and splits light incident at 45 degrees into reflected light and transmitted light. However, depending on the plate thickness of the parallel-plane glass, the transmitted light is slightly displaced from the incident light in the optical axis. Reference numeral 11 denotes a first light source in the illumination device 2 of the present invention, the first light source 11 being arranged laterally of the semi-transparent mirror body 9 and being arranged in a direction orthogonal to the incident optical axis 10 of the first light source 11. The irradiation light is set so as to enter the semi-transparent mirror body 9. The second light source 12 is set so that the axis of the irradiation light is inclined by an angle θ with respect to the normal line to the detection surface of the object W to be detected on the XY table 4. The inclination angle θ of the second light source 12 can be changed and adjusted manually or by an actuator (not shown).

【0015】これら画像認識装置1及び照明装置2は次
のようなコンピュータ等の電子式の制御装置13にて制
御される。即ち、制御装置13は、中央処理装置(CP
U)と、制御プログラムを記憶した読み出し専用メモリ
(ROM)と、被検出物のマーク部等のパターンや位置
についての設定上の各種データ等を記憶する随時読み書
き可能メモリ(RAM)と、入出力インターフェイス
と、これらにデータ及び制御信号を伝送するバスとを主
要素とする。また、撮像手段3にて撮像した画像データ
は画像認識回路14にて、2値化、強調等の画像処理さ
れる。
The image recognition device 1 and the illumination device 2 are controlled by an electronic control device 13 such as a computer as described below. That is, the control device 13 controls the central processing unit (CP
U), a read-only memory (ROM) that stores a control program, a readable / writable memory (RAM) that stores various kinds of setting data such as patterns and positions of the mark portion of the object to be detected, and input / output Main components are an interface and a bus for transmitting data and control signals to them. Further, the image data picked up by the image pickup means 3 is subjected to image processing such as binarization and emphasis by the image recognition circuit 14.

【0016】X軸モータ5及びY軸モータ7は、CPU
からの指令信号に応じてそれぞれ駆動回路15,16を
介して駆動され、X軸モータ5及びY軸モータ7の回転
量を位置検出器6,8の検出信号にて検出し、その値は
CPUに入力される。符号17は前記第1光源11と第
2光源12の照射のON・OFFの切換え及び照射光量
の増減切換調節を制御する切換手段であり、CPUによ
り制御される。なお、第1光源11及び第2光源12は
それぞれ手動スイッチ18,19にて手動によりON・
OFFすることができ、また図示しない可変抵抗器等に
て、第1光源11及び第2光源12の照射光量を増減調
節するように構成されている。
The X-axis motor 5 and the Y-axis motor 7 are CPUs.
Driven by drive circuits 15 and 16 in response to a command signal from the CPU, the rotation amounts of the X-axis motor 5 and the Y-axis motor 7 are detected by the detection signals of the position detectors 6 and 8, and the values are detected by the CPU. Entered in. Reference numeral 17 is a switching means for controlling the ON / OFF switching of the irradiation of the first light source 11 and the second light source 12 and the increase / decrease switching adjustment of the irradiation light amount, which is controlled by the CPU. The first light source 11 and the second light source 12 are manually turned on by the manual switches 18 and 19, respectively.
It can be turned off, and is configured to increase or decrease the irradiation light amount of the first light source 11 and the second light source 12 by a variable resistor or the like not shown.

【0017】そして、被検出物Wにおける検出すべきま
たは画像認識すべきマーク部が、表面粗さの粗いリード
フレーム部または、鏡面のように表面が滑らかな半導体
ペレット部であるかを前記制御装置13にて指定する。
その指令信号に応じて、制御装置13から切換手段17
を制御し、表面が鏡面であるとき(検出すべきマーク部
が半導体ペレット上であると指定するとき)には、第1
光源11を点灯させ、且つ第2光源12を消灯させる。
また、このとき、第1光源11の印加電圧を予めRAM
等に記憶させた設定値に変更し、前記マーク部検出に最
適な照射光量になるようにセットするのである。
The control device determines whether the mark portion to be detected or image recognized on the object to be detected W is a lead frame portion having a rough surface or a semiconductor pellet portion having a smooth surface such as a mirror surface. Specify with 13.
In response to the command signal, the control device 13 switches the switching means 17
When the surface is a mirror surface (when the mark portion to be detected is designated on the semiconductor pellet), the first
The light source 11 is turned on and the second light source 12 is turned off.
At this time, the voltage applied to the first light source 11 is previously stored in the RAM.
The setting value is changed to the setting value stored in the above, and is set so that the irradiation light amount is optimum for detecting the mark portion.

【0018】これにより、第1光源11からの照射光
は、半透鏡体9の側面に入射し、一部の光は、半透鏡体
9におけるコーティング部を通過してそのまま他方の横
側面から横方向に出る。残りの照射光は、前記コーティ
ング部にて45度下向きに屈曲して被検出物Wに向かっ
て垂直に反射し、さらに被検出物Wの検出表面で反射し
た光は、前記入射光軸線10と同軸上で半透鏡体9の下
面に入射し、一部の光はコーティング部を通過してその
まま撮像手段3における入光部に入り、残部の光は元の
第1光源方向に戻ることになる。従って、所定のマーク
部を光照射の過不足なく検出することができる。
As a result, the irradiation light from the first light source 11 is incident on the side surface of the semi-transparent mirror body 9, and a part of the light passes through the coating portion of the semi-transparent mirror body 9 and is directly transposed from the other lateral side surface. Get out in the direction. The remaining irradiation light is bent downward by 45 degrees at the coating portion and is reflected vertically toward the object to be detected W, and the light reflected on the detection surface of the object to be detected W is the same as the incident optical axis line 10. The light is incident on the lower surface of the semi-transparent mirror body 9 coaxially, part of the light passes through the coating portion and enters the light entering portion of the image pickup means 3 as it is, and the rest of the light returns to the original direction of the first light source. .. Therefore, it is possible to detect the predetermined mark portion without excess or deficiency of light irradiation.

【0019】マーク部が粗い表面であるときには、前記
制御装置13からの指令信号にて切換手段17を作動さ
せ、第1光源11をOFF(消灯)し、第2光源12を
ON(点灯)させる。この場合も、第2光源12の印加
電圧を予めRAM等に記憶させた設定値に変更し、前記
マーク部検出に最適な照射光量になるようにセットする
のである。
When the mark portion has a rough surface, the switching means 17 is operated by the command signal from the control device 13 to turn off the first light source 11 (turn off) and turn on the second light source 12 (turn on). .. Also in this case, the applied voltage of the second light source 12 is changed to a set value stored in advance in the RAM or the like, and the irradiation light amount is set to be the optimum irradiation light amount for detecting the mark portion.

【0020】これにより、被検出物Wの表面の法線に対
して適宜傾斜角度θにて照射した光の一部が粗い表面で
乱反射され、その反射光の一部が入射光軸線10と同軸
上で半透鏡体9の下面に入射し、その入射光の一部が半
透鏡体9におけるコーティング部を通過してそのまま撮
像手段3における入光部に入るので、所定のマーク部を
光照射の過不足なく検出することができる。
As a result, a part of the light emitted at an appropriate inclination angle θ with respect to the normal to the surface of the object to be detected W is diffusely reflected on the rough surface, and a part of the reflected light is coaxial with the incident optical axis line 10. Since it is incident on the lower surface of the semi-transparent mirror body 9 and a part of the incident light passes through the coating portion of the semi-transparent mirror body 9 and enters the light entering portion of the image pickup means 3 as it is, the predetermined mark portion is irradiated with light. It can be detected without excess or deficiency.

【0021】なお、前記第1光源と第2光源との点灯・
消灯の切換以外に、照射光量の増減調節(切換)も実行
すれば、より一層効果的である。
Note that the first light source and the second light source are turned on.
It is even more effective if the increase / decrease adjustment (switching) of the irradiation light amount is executed in addition to the switching of the turning-off.

【0022】[0022]

【発明の作用・効果】以上に詳述したように、本発明に
よれば、被検出物とそれを撮像する撮像手段の入光部と
を、該入光部の光学系の光軸線が被検出物の検出表面の
法線と平行状になるように配置し、前記被検出物と撮像
手段との間の光軸線上にハーフプリズム等の半透鏡体を
配置し、第1光源からの照射光を前記半透鏡体を介して
前記被検出物の検出表面に前記光軸線と略同軸上に照射
する一方、第2光源から被検出物への照射光の軸線を前
記光軸線に対して適宜傾斜角度を有するように、前記2
つの光源を配置することにより、本発明の照明装置は、
被検出物に対して2系統で光照射する光源を備える。そ
して、制御手段では、前記検出表面の表面粗さの相違に
より、前記第1光源と第2光源との照射のON・OFF
または光量の増減を切り換えるのである。このようにす
れば、被検出物の表面粗さに応じて自動的に最適な検出
照度を得ることができ、撮像手段による画像認識作業や
位置決め作業での失敗頻度を少なくでき、確実、且つ正
確な画像認識作業や位置決め作業を行うことができると
いう効果を奏する。
As described above in detail, according to the present invention, the object to be detected and the light entering portion of the image pickup means for picking it up are covered by the optical axis of the optical system of the light entering portion. The detection object is arranged so as to be parallel to the normal line of the detection surface, and a semi-transparent mirror body such as a half prism is arranged on the optical axis between the detection object and the imaging means, and irradiation from the first light source is performed. While irradiating the detection surface of the object to be detected through the semi-transparent mirror substantially coaxially with the optical axis, the axis of the irradiation light from the second light source to the object to be detected is appropriately set with respect to the optical axis. 2 so that it has a tilt angle
By arranging two light sources, the lighting device of the present invention is
A light source for irradiating the object to be detected with two systems is provided. The control means turns ON / OFF the irradiation of the first light source and the second light source due to the difference in surface roughness of the detection surface.
Alternatively, the increase / decrease of the light amount is switched. By doing so, the optimum detected illuminance can be automatically obtained according to the surface roughness of the object to be detected, and the frequency of failure in the image recognition work and the positioning work by the image pickup means can be reduced, which is reliable and accurate. It is possible to perform various image recognition work and positioning work.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明装置の概略配置図である。FIG. 1 is a schematic layout diagram of a device of the present invention.

【図2】従来の技術の説明図である。FIG. 2 is an explanatory diagram of a conventional technique.

【図3】他の従来の技術の説明図である。FIG. 3 is an explanatory diagram of another conventional technique.

【符号の説明】[Explanation of symbols]

W 被検出物 1 画像認識装置 2 照明装置 3 撮像手段 3a 入光部 4 XYテーブル 9 半透鏡体 10 入射光軸線 11 第1光源 12 第2光源 13 制御装置 17 切換手段 W Object to be detected 1 Image recognition device 2 Illumination device 3 Imaging means 3a Light entrance part 4 XY table 9 Semi-transparent mirror body 10 Incident optical axis line 11 First light source 12 Second light source 13 Control device 17 Switching means

フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H04N 7/18 B Continuation of front page (51) Int.Cl. 5 Identification code Office reference number FI Technical display area H04N 7/18 B

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 被検出物とそれを撮像する撮像手段の入
光部とを、該入光部の光学系の光軸線が被検出物の検出
表面の法線と平行状になるように配置し、被検出物に対
して2系統で光照射する光源を備えてなる画像認識装置
における照明装置において、前記被検出物と撮像手段と
の間の光軸線上にハーフプリズム等の半透鏡体を配置
し、第1光源からの照射光を前記半透鏡体を介して前記
被検出物の検出表面に前記光軸線と略同軸上に照射する
一方、第2光源から被検出物への照射光の軸線を前記光
軸線に対して適宜傾斜角度を有するように、前記2つの
光源を配置し、前記検出表面の表面粗さの相違により、
前記第1光源と第2光源との照射のON・OFFまたは
光量の増減を切り換える制御手段を備えたことを特徴と
する画像認識装置における照明装置。
1. An object to be detected and a light entrance portion of an image pickup means for picking up the object are arranged such that an optical axis of an optical system of the light entrance portion is parallel to a normal line of a detection surface of the object to be detected. Then, in the illumination device in the image recognition device provided with the light source for irradiating the object to be detected with two systems, a semi-transparent mirror body such as a half prism is provided on the optical axis between the object to be detected and the imaging means. And irradiating the irradiation light from the first light source to the detection surface of the object to be detected through the semi-transparent mirror substantially coaxially with the optical axis, while the irradiation light from the second light source to the object to be detected is The two light sources are arranged so that the axis has an appropriate inclination angle with respect to the optical axis, and due to the difference in surface roughness of the detection surface,
An illumination device in an image recognition device, comprising: a control unit that switches ON / OFF of irradiation of the first light source and the second light source or increases / decreases the amount of light.
JP4144263A 1992-06-04 1992-06-04 Illuminator for image recognition device Pending JPH05343447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4144263A JPH05343447A (en) 1992-06-04 1992-06-04 Illuminator for image recognition device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4144263A JPH05343447A (en) 1992-06-04 1992-06-04 Illuminator for image recognition device

Publications (1)

Publication Number Publication Date
JPH05343447A true JPH05343447A (en) 1993-12-24

Family

ID=15358031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4144263A Pending JPH05343447A (en) 1992-06-04 1992-06-04 Illuminator for image recognition device

Country Status (1)

Country Link
JP (1) JPH05343447A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000047296A (en) * 1998-07-31 2000-02-18 Matsushita Electric Ind Co Ltd Picture recognizing device and its method
JP2012191237A (en) * 2012-06-13 2012-10-04 Renesas Electronics Corp Manufacturing method of semiconductor device
US8574933B2 (en) 2006-09-06 2013-11-05 Renesas Electronics Corporation Fabrication method of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000047296A (en) * 1998-07-31 2000-02-18 Matsushita Electric Ind Co Ltd Picture recognizing device and its method
US8574933B2 (en) 2006-09-06 2013-11-05 Renesas Electronics Corporation Fabrication method of semiconductor device
JP2012191237A (en) * 2012-06-13 2012-10-04 Renesas Electronics Corp Manufacturing method of semiconductor device

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