JP3123835B2 - Component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art Hitherto, various component mounting apparatuses have been proposed in which a component to be mounted and a mounting location on a board are recognized by image processing, and the recognition result is reflected in a mounting operation. For example, in Japanese Patent Application Laid-Open No. 4-206600, an image pickup device is mounted on a mounting head, and a flat reflecting mirror having a reflecting surface having a constant inclination angle with respect to a nozzle axis is mounted around a component suction and conveyance shaft of the mounting head. Further, a lighting device is provided so as to be movable to a position below the component sucked by the suction nozzle,
An “electronic component detection device” that makes light reflected from a plane reflecting mirror incident on an imaging device is disclosed. In the detailed description of the invention, an optical path for imaging a positioning mark on the substrate surface is provided in addition to an optical path for imaging the component sucked by the suction nozzle, and both optical paths are shared by a beam splitter. Examples have been described. Further, when imaging a component smaller than the diameter of the component suction / conveying shaft, the suction nozzle portion may be formed of a perforated right-angle prism, or a second flat reflecting mirror for small components may be provided in the suction nozzle portion. An embodiment is also described in which an image is taken such that the silhouette of the shaft or the shaft does not protrude from the silhouette image of the part.

[0003]

In such an electronic component detection apparatus, two image pickup means are provided to capture a silhouette image corresponding to the external shape of a component from a large component to a small component. Alternatively, it is necessary to consider one way of moving one imaging unit in a straight line so as to focus on an image from each reflecting mirror or the like. In addition, when imaging a very small component, the component must be suctioned by replacing the suction nozzle with a perforated right-angle prism. In addition, in order to allow a single imaging unit to capture a silhouette image of a component from a large size to a small size and a pattern image of a substrate, the beam splitter may be moved linearly to obtain a silhouette from a plurality of types of flat reflecting mirrors. Care must be taken to guide the image to the imaging means. For this reason, the present invention minimizes, among optical components (imaging means, lighting means, reflecting mirrors, etc.) on an optical path for capturing a pattern image of a substrate and a silhouette image of the parts, which are moved,
In addition, without using expensive optical components for the suction nozzle part, the correct suction holding position of the component and the board surface, from large components such as ICs, to components that are small enough to protrude from the component outline to the nozzle outline when viewed from below, It is an object of the present invention to provide a component mounting device that performs recognition of the pattern position by a single imaging device.

[0004]

According to the present invention, the mounting head and the image pickup means are arranged vertically downward on the component mounting portion which moves in the X-Y direction, and the vertical movement space of the suction nozzle provided at the lower end of the mounting head is 45 °. A 45 ° mirror is provided that allows the reflection surface of the component to enter or exit, and when entering the component, reflects the image of the component adsorbed by the suction nozzle in the horizontal direction, and transmits light that illuminates the adsorbed component from behind around the vertical movement space. Arrange the lighting unit. Below the imaging means, there is arranged a 45 ° half mirror that reflects the component image entering from the horizontal direction upward and transmits the pattern image of the substrate entering from below upward. A reflection illuminating unit is provided behind the 45 ° half mirror in the direction in which the component image enters, and a shutter means for passing or blocking light at a position corresponding to the plane projection of the 45 ° half mirror. Place. At the time of capturing the component image, the shutter means is closed, the 45 ° mirror is made to enter directly below the suction nozzle, the transmission illumination unit is turned on to illuminate the component from behind, and at the time of capturing the board pattern image, the shutter means is opened. The mirror is retracted from directly below the suction nozzle, and the reflection illuminator is turned on to illuminate the surface of the substrate, and the state of holding the component and the pattern image of the substrate on which the component is to be mounted are imaged.
When imaging small parts, close the shutter means and
The mirror enters just below the suction nozzle to turn on the transmission illumination unit and the reflection illumination unit, and the back surface of the component (hereinafter, the surface of the component that is held by the suction nozzle is the front surface, and the opposite surface is the back surface). Only) images. By recognizing the captured image, the suction position shift and the pattern position shift are detected,
The components are mounted after correcting both deviation amounts.

Further, in the present invention, the imaging means is arranged horizontally and horizontally at the component mounting portion which moves in the X-Y direction, and the component mounting head is positioned vertically downward, and the vertical movement space of the suction nozzle provided at the lower end of the mounting head is 45 °. To enter or exit the reflective surface of
When entering, a 45 ° mirror that reflects the image of the component sucked by the suction nozzle in the horizontal direction is provided, and a transmission illumination unit that illuminates the sucked component from behind is arranged around the vertical movement space. In front of the image pickup means, a 45 ° half mirror which transmits a component image entering from a horizontal direction and reflects a pattern image of a substrate entering from below horizontally in the direction of the image pickup means is arranged. Then, the reflection illuminating unit is positioned above the 45 ° half mirror toward the direction in which the pattern image of the substrate enters, and passes or blocks light at a position corresponding to the plane projection of the 45 ° half mirror. The shutter means is arranged. When capturing the component image, close the shutter means and
The mirror is made to enter directly below the suction nozzle, the transmission illumination unit is turned on to illuminate the component from behind, and when capturing the board pattern image, the shutter is opened, and the 45 ° mirror is retracted from directly below the suction nozzle to reflect the light. The illumination unit is turned on to illuminate the surface of the board, and the holding state of the component and the pattern image of the board on which the component is to be mounted are captured. When capturing an image of a small component, the shutter means is closed, a 45 ° mirror is entered just below the suction nozzle to turn on the transmission illumination unit and the reflection illumination unit, and only the back surface image of the component is imaged. By recognizing a captured image, a suction position shift and a pattern position shift are detected, and both shift amounts are corrected to mount a component.

[0006]

The image of the component and the substrate pattern is selectively captured by a single image pickup means by the advance / retreat operation of the 45 ° mirror and the operation control of the shutter means and the transmission / reflection illumination device. Also, when the component held by the suction nozzle is viewed from below, when the component suction surface of the nozzle protrudes from the component outer part, by illuminating the component from above and below,
The luminance of the image of the protruding part suction surface approaches the luminance of the background part. That is, only the back surface image of the component is selectively captured without confusing a part of the component suction surface of the nozzle with a part of the component. Before mounting, the image of the component held by suction and the image of the board pattern on which the component is to be mounted are recognized, and the shift in the suction position of the component and the shift in the pattern position of the board are detected.
The components are mounted after correcting the amounts of both deviations.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the component mounting apparatus of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view showing one embodiment of the component mounting apparatus of the present invention. The component mounting apparatus 1 has a box-shaped base 10, on which an XY stage 2, a component mounting unit 3, a conveyor unit 4, and a first component supply unit 5 are arranged. Reference numeral 6 denotes a second component supply unit arranged beside the base 10, and supplies components to a component temporary positioning table 7 provided on the base 10. In addition, the image processing means 8 and the control means 9 are built in the base 10.

Next, the component mounting section 3 which is the gist of the present invention will be described in detail. FIG. 2 is a schematic front view of the component mounting section 3 in one embodiment of the component mounting apparatus of the present invention. The component mounting unit 3 is supported by the XY stage 2 in a suspended state, and includes the mechanism shown in FIG. 2 in the cover unit. Reference numeral 30 denotes a support plate of a component mounting portion mounted on the lower surface of the XY stage 2, and a linear motion unit 311 for vertically moving the mounting head 31 is vertically mounted on the front surface thereof. The linear motion unit 311 includes a ball screw, a ball nut, a linear guide bearing, a servomotor, and the like (not shown). The mounting head 31 is attached to a slider 312 that is fixed to the ball nut and moves up and down.

The mounting head 31 is attached to the slider 312 vertically downward, and holds, at its lower end, a suction nozzle 32 for sucking a component. The suction nozzle 32 has a square diffusion plate 321 at the top, and the diffusion plate 321 is attached to a center position of the suction nozzle 32 so that the nozzle body penetrates. Reference numeral 33 denotes a transmission illumination unit that illuminates the component sucked by the suction nozzle 32 from behind, and has a plurality of LEDs 332 arranged in a ring shape at regular intervals on the inner peripheral surface of the cylindrical member 331, At the lower end, a cylindrical light shielding plate 333 with a flange is provided so that the light of these LEDs is not directly reflected on a 45 ° mirror described later. The transmitted illumination unit 33
The support plate 3 is positioned below the suction nozzle 32 so that the center of the cylindrical member 331 is the same as the center of the component mounting head.
It is fixed to 0. As shown in FIG. 3, the cylindrical member 331 and the light-shielding plate 333 can pass through the space surrounded by the LED 332 and the hollow portion of the light-shielding plate when the component is sucked or mounted, as shown in FIG. It is sized.

Reference numeral 34 denotes an LED 33 when the component held by the suction nozzle stops at a predetermined position in the transmission illumination unit 33.
2 and a 45 ° mirror that reflects the component image illuminated by the diffusion plate 321 in the horizontal direction. The 45 ° mirror 34 is at 45 ° with respect to the vertical movement axis of the mounting head 31.
To the moving means 35 so as to move linearly at an angle of
Attached via 41.

The moving means 35 is composed of a timing belt, a pulley, a servo motor (not shown), a linear guide bearing 351 and a slider 352 that moves linearly along the bearing. This linear guide bearing 351 is attached to the support plate 30 at an angle of 45 °
Part of 2 meshes with the teeth of the timing belt. Then, when the timing belt is rotated by the specified amount by the servomotor and the pulley, the slider 352 linearly moves by the specified amount along the linear guide bearing 351. Relay board 34
1 has an L-shaped cross section, one end of which is attached to the lower surface of the slider 352, has a protruding surface on the near side in FIG. 2, and the 45 ° mirror 34 is fixed to the upper surface of this protruding surface. In this manner, the 45 ° mirror 34 is retracted 45 ° above the vertical movement space of the suction nozzle 32 during component suction and mounting, and enters directly below the suction nozzle 32 from the 45 ° direction during component recognition.

Reference numeral 36 denotes a 45 ° half mirror attached to the support plate 30 via an angle 361, which is disposed at a position facing the 45 ° mirror 34 at the component recognition position.
° Reflects the horizontal reflection image from the mirror 34 vertically upward,
Further, the pattern image of the substrate P entering from below is transmitted vertically upward. The angle 361 has an L-shaped cross section. The upper and lower sides of the 45 ° half mirror 36 are supported at both ends, and the reflection surface is fixed at 45 °.
4. The angle 361 is provided at a portion corresponding to the plane projection of the 45 ° half mirror so as not to block the image entering from below the 45 ° half mirror.
An opening 362 is provided. In addition, angle 361
A portion located behind the 45 ° half mirror has a mounting surface for a reflective illumination unit 37 described later.

Reference numeral 37 denotes a reflection illuminator located behind the 45 ° half mirror and facing a horizontal reflection image from the 45 ° mirror. The reflection illumination unit 37 includes a substrate 371 and a plurality of LEDs 3 arranged in a matrix at regular intervals.
The board 371 is fixed upright to the angle 361 such that the LED arrangement surface faces the half mirror 45 °. Reference numeral 38 denotes an imaging unit that captures an image vertically reflected by the 45 ° half mirror 36 and an image that is vertically transmitted,
The support plate 3 is positioned directly above the 45 ° half mirror 36.
Attach vertically downward to 0. The mounting positions of the 45 ° half mirror 36 and the imaging unit 38 are, as shown in FIG. 2, the distance from the imaging unit 38 to the substrate P and the 45 ° half mirror 36 and the 45 ° mirror 34 from the imaging unit 38, respectively. The components A are arranged so that the distances to the back surface of the component A via the same are equal.

The reference numeral 39 denotes a member disposed on the lower surface of the angle 361 and fixed so as to cover the opening 362 from below.
The shutter means comprises a liquid crystal plate (hereinafter, 39 is referred to as a liquid crystal shutter). The liquid crystal shutter 39 is supported on four sides by a support frame 391, and the support frame 391 is fixed around the opening 362 on the lower surface of the angle 361. The electrode of the liquid crystal shutter 39 is connected to a voltage source (not shown),
This voltage source has a function of changing the voltage applied to the liquid crystal shutter according to a command from the control means 9 described later. That is, the liquid crystal shutter 39 controls the voltage applied to its own electrode so that the transparency of the liquid crystal is set to a desired value. The liquid crystal shutter 39 blocks light entering the 45 ° half mirror from below, or the 45 ° half mirror. May transmit light reflected downward.

Reference numeral 8 denotes an image processing means for recognizing and processing an image captured by the imaging means 37.
The control means 9 controls the component mounting operation. Further, the control means 9 controls the voltage applied to the liquid crystal shutter,
The vertical movement amount of the mounting head, that is, the linear motion unit 3
11, the rotation of the servo motor of the moving means 35 is commanded according to the amount of movement of the slider 312 in the slider 352.
Is linearly moved, and the 45 ° mirror 34 is retracted from the vertical movement space of the suction nozzle 32 during component suction and component mounting, and enters just below the suction nozzle during component recognition.

The operation of the component mounting apparatus according to the present embodiment having such a configuration will be described. When the board P on which components are to be mounted is transported on the conveyor unit 4 and is held by a board positioning mechanism (not shown), first, the control unit 9 drives the XY stage 2 to The component mounting head 31 is stopped, for example, immediately above the component A positioned in a predetermined component supply cassette of the first component supply unit 5. Then, a servo motor (not shown) is driven to lower the slider 312, that is, the mounting head 31.
At this time, since the 45 ° mirror 34 is at the rising end and is separated from the vertical movement space of the suction nozzle 32, the suction nozzle 3
2 reaches the part A and holds it by suction.

After the components are sucked, the control means 9 controls the mounting head 3
1 and a predetermined position in the middle of the ascent (45 ° when the lower end of the component A sucked and held enters from the 45 ° direction).
When it reaches the position where it does not contact the mirror 34), the servo motor (not shown) of the moving means 35 is rotated by a predetermined amount. Then, the slider 352 moves along the linear guide bearing 351, and makes the 45 ° mirror 34 advance into the vertical movement space of the suction nozzle from the 45 ° direction. The control means 9
Normally holds the liquid crystal shutter 39 in a light-shielded state (applies a voltage that causes the liquid crystal to be in a light-shielded state).

When the suction nozzle reaches the height at which the component is recognized, the control means 9 stops lifting the mounting head 31 and, as shown in FIG.
Is stopped, and the LED 332 is turned on. At this time, 45
The mirror 34 is in the middle of movement, but since the mirror enters directly below the part A from the 45 ° direction, even if the movement is not stopped, the left end of the part A in FIG. When the image is captured, the image capturing means 38 captures the back side image of the component A and can start inputting to the image processing means 8. That is, as long as the 45 ° mirror 34 moves in the direction of the reflection surface without including a motion component perpendicular to the reflection surface, the distance between the back surface of the component A and the 45 ° mirror 34 is constant, and the imaging means 38 The positional relationship that the back surface of the component A is at the focal length of the mirror A does not change during the movement period of the mirror 34. When the 45 ° mirror 34 enters below the part A,
On the reflection surface, a partial image to be formed later as the whole back surface image of the component A gradually increases in size and faces 45.
The corresponding image also appears on the half mirror 36, is reflected vertically upward, and is sent to the imaging field of the imaging means 38. The time when the whole image of the part A is obtained is the time when the input to the image processing means 8 is started.

While the image processing means 8 is recognizing the input image information of the component A, the control means 9 executes XY
The stage 2 is driven, and the imaging means 38 is moved to a position on the substrate P positioned on the conveyor unit 4 where the component A is to be mounted. The image processing means 8 finishes the image recognition of the component A in the middle of the movement of the imaging means, and notifies the control means 9 of the recognition result, that is, the information on the suction position shift of the component A. Also,
After the capturing of the back surface image of the component A is completed, the control means 9 reversely rotates the servo motor (not shown) of the moving means 35 by a predetermined amount, retracts the slider 352 and the 45 ° mirror 34 upward by 45 °, and LED 372 is turned on, and the liquid crystal shutter 39 is maintained in a light transmitting state (a voltage that causes the liquid crystal to transmit light is applied). Imaging means 38
Stops on the mounting pattern of the component A, the reflective illumination unit 3
Part of the light 7 is reflected vertically downward by the 45 ° half mirror 36, passes through the liquid crystal shutter 39, and illuminates the substrate surface. The imaging unit 38 captures a substrate pattern image such as a substrate positioning mark or a land pattern image, and inputs the captured image to the image processing unit 8. At this time, since the 45 ° mirror 34 is retracted from the vertical movement space of the suction nozzle, the component image does not enter the 45 ° half mirror 36 from the horizontal direction, and only the substrate pattern image passes through the 45 ° half mirror 36. The light penetrates vertically upward and enters the imaging means 38.

While the image processing means 8 recognizes the image information of the input substrate pattern, the control means 9
The XY stage 2 is driven, the mounting head 31 is corrected by the above-described suction position deviation amount, stopped at the mounting position of the substrate P, and the suction nozzle 32 is lowered. The image processing means 8
The image recognition of the board pattern image is completed in the middle of the descent of the suction nozzle, and the recognition result, that is, the support position shift information of the board P (how much the board pattern on which the component is to be mounted is supported from the desired position is supported) (Information shown) to the control means 9. Then, the control means 9 drives the XY stage 2 again, and moves the mounting head 31 to the mounting position of the substrate P while correcting the mounting head 31 by the support position deviation amount,
After the suction nozzle 32 is lowered, the component A is mounted on the substrate P.

The operation in the case where the component A sucked and held is equal to or smaller than the component suction surface of the suction nozzle will be described. Control means 9
Is previously input by the component mounting program to indicate that the component A is a small component equivalent to the component suction surface of the nozzle, and according to the information, when the above-described component recognition is performed, together with the transmissive illumination unit 33, the reflected illumination is performed. LE of part 37
D372 is also turned on. Then, the component A becomes the diffusion plate 32
1, a part of the light of the reflection illuminating unit 37 that has been illuminated from above and transmitted through the 45 ° half mirror 36 is reflected vertically upward as the 45 ° mirror 34 enters, so that the back surface of the component A is also illuminated. It is.

In this state, the component A captured by the image pickup means 38
7 is shown in FIG. FIGS. 5 and 6 are explanatory diagrams of images captured when only the transmission illumination unit 33 and the reflection illumination unit 37 are turned on. When only the transmission illumination unit 33 is turned on, as shown in FIG.
The component A and the component suction surface of the suction nozzle protruding from the component A become an integrated silhouette image as if it were a single component. When only the reflective illumination unit 37 is turned on, the diffused plate portion serving as the background is dim, the back surface of the component A is slightly bright, and the component suction surface of the nozzle is a very bright reflected light image. Although the former silhouette image can be binarized with an appropriate threshold value, the protruding portion of the nozzle cannot be removed. The latter reflected light image is
The brightness level is divided into three levels, it is difficult to set an appropriate threshold, and it is not easy to extract an image of only the component A. Therefore, in the present invention, as described above, both the transmission illumination unit 33 and the reflection illumination unit 37 are turned on, and an image of only the component A shown in FIG. 7 is captured. That is, the image of FIG. 6 is combined with the image of FIG. 5, the background diffuser is bright, the nozzle protruding part is as bright as the diffuser, and only the back surface of the part A captures a bright image. Become. The binarization may be performed with a threshold value corresponding to the image of only the component A, and the image processing may be performed. As described above, even when the component A is small, simply turning on the reflection illumination unit 37 anew, the image recognition of the other components and the board pattern on which the components are to be mounted can be used to determine the suction holding position of the component A. A series of operations up to the detection of the displacement of the substrate pattern position and the mounting of the component with both displacement amounts corrected are the same as those described above.

FIG. 4 is a schematic front view showing another embodiment of the component mounting section 3 in the present embodiment, and only differences from the component mounting section shown in FIG. 2 will be described. The 45 ° half mirror 36 is supported on the inner surface of a U-shaped cross section 363 having one end fixed to the support plate 30 so as to be at the same position as the 45 ° half mirror 36 in FIG. The opening side of 363 is directed to an imaging unit described later. The reflection illuminating section 37 is a
With respect to the position at the time of, the 45 ° half mirror 36 itself is arranged at a line symmetrical position with the axis of symmetry as the symmetry axis. That is, the opening 364 is provided at a portion corresponding to the elevation projection of the 45 ° half mirror so that the image 363 does not block an image entering the 45 ° half mirror 36 from the horizontal direction. An inner surface of the shaped member 363 located above the 45 ° half mirror 36 has a mounting surface for the reflective illumination unit 37, and the reflective illumination unit 37 is fixed horizontally downward. As shown in FIG. 4, the imaging unit 38 includes a 45 ° half mirror 36.
And is mounted horizontally and horizontally so as to capture the horizontal reflection image from the 45 ° mirror 34.

The shape member 363 has an opening 3 at a portion corresponding to the plane projection of the 45 ° half mirror 36 so as not to block light entering the 45 ° half mirror 36 from below.
65 are provided. Then, the liquid crystal shutter 39 described above is fixed around the opening 365 via a support frame 391. Thus, the imaging means 38 captures the image of the board that the 45 ° half mirror 36 reflects horizontally and the image of the component that transmits horizontally, and the mounting position of the 45 ° half mirror 36 and the imaging means 38 is shown in FIG. 4, the distance from the imaging unit 38 to the substrate P via the 45 ° half mirror 36 is equal to the distance from the imaging unit 38 to the back surface of the component A via the 45 ° mirror 34. To be placed.

The operation when using the component mounting section of FIG.
Only the differences will be described in comparison with the operation of the component mounting unit in FIG. 2 described above. When the 45 ° mirror 34 horizontally reflects the back surface image of the component A (the same applies when the component A is as small as the component suction surface of the nozzle) by the above-described operation, the 45 ° mirror 34
The light passes through the half mirror 36 and is captured by the imaging unit 38. The control unit 9 drives the XY stage 2 while the imaging unit 38 inputs the image information of the component A to the image processing unit 8 and the image processing unit 8 recognizes the image information of the component A. , The 45 ° half mirror 36 is moved to a position where the component A of the substrate P positioned on the conveyor section 4 is to be mounted. The image processing means 8 finishes the image recognition of the component A during the movement of the 45 ° half mirror 36, and notifies the control means 9 of the recognition result, that is, the information on the displacement of the suction position of the component A.
After the capture of the back surface image of the component A is completed, the control unit 9 retracts the 45 ° mirror 34 upward by 45 ° similarly to the above-described operation, turns on the LED 372 of the reflection illumination unit 37, and activates the liquid crystal shutter 39. It is kept in a light transmitting state. When the 45 ° half mirror 36 stops on the mounting pattern of the component A, a part of the light of the reflection illuminating unit 37 transmits vertically downward through the 45 ° half mirror 36, and the liquid crystal shutter 39.
To illuminate the substrate surface. Then, the 45 ° half mirror 36 reflects a substrate pattern image such as a substrate positioning mark or a land pattern image in the horizontal direction, and the image pickup means 38 takes in the image and inputs it to the image processing means 8. At this time, since the 45 ° mirror 34 is retracted from the vertical movement space of the suction nozzle, the component image does not enter the 45 ° half mirror 36 from the horizontal direction, and only the substrate pattern image passes through the 45 ° half mirror 36. The light is reflected in the horizontal direction and enters the imaging means 38. Thereafter, the same operation as described above is performed, and the component A is mounted on the board P.

In this embodiment, the movement of the 45 ° mirror 34 from the vertical movement space of the suction nozzle is made to move linearly at an angle of 45 ° with respect to the vertical movement axis of the mounting head 31. 34 may be moved back and forth from the horizontal direction to the suction nozzle vertical movement space. Further, a 45 ° mirror 34 is pivotally supported on a fulcrum shaft provided on the support plate 30 so that the 45 ° mirror is moved from the 45 ° reflecting surface of the suction nozzle vertical movement space to a surface separated from the suction nozzle vertical movement space by 45 ° or more. You may swing forward and backward by swinging at the above angle. still,
In this embodiment, the shutter means is a liquid crystal shutter. However, it is needless to say that the opening and closing operation may be performed mechanically.

[0027]

As described above, with the component mounting apparatus of the present invention, component recognition and board pattern recognition can be performed with a single image pickup means. In addition, even when the component suction surface of the nozzle protrudes from the outer shape of the component suction-held by the suction nozzle, the protruding portion is not confused with a part of the component, and only the back surface image of the component is selected. Can recognize images. At this time, in the optical path from the component or the board to the image pickup means, only the 45 ° mirror needs to be controlled, and since the expensive nozzle is not used for the suction nozzle, the mounting head can be reduced in size. And contribute to cost reduction.

In addition to large parts such as ICs,
It is possible to accurately recognize the holding position of a component that is equal to or smaller than the component suction surface of the suction nozzle. Since the component position is detected by detecting the pattern position deviation and correcting both deviation amounts, the mounting accuracy is improved.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing the configuration of an embodiment of the component mounting apparatus of the present invention.

FIG. 2 is a schematic front view illustrating a configuration of a component mounting unit.

FIG. 3 is a schematic front view illustrating the operation of a component mounting unit.

FIG. 4 is a schematic front view showing another embodiment of the component mounting section.

FIG. 5 is an explanatory diagram illustrating an image at the time of transmitted illumination captured by an imaging unit.

FIG. 6 is an explanatory diagram showing an image at the time of reflected illumination captured by an imaging unit.

FIG. 7 is an explanatory diagram illustrating an image captured by an imaging unit at the time of simultaneous transmission and reflection illumination.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 XY stage 3 Component mounting part 31 Component mounting head 32 Suction nozzle 33 Transmission illumination part 34 45 degree mirror 35 Moving means 36 45 degree half mirror 37 Reflection illumination part 38 Imaging means 39 Shutter means 8 Image processing means 9 control means A component P board

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/30 H05K 13/00-13/04

Claims (4)

(57) [Claims] 1. A component mounting head provided in a component mounting unit that moves in the XY direction picks up a component, recognizes an image of a held state of the picked-up component and a pattern position of a substrate on which the component is to be mounted, and performs a suction position. A device that detects a shift and a pattern position shift, corrects both shift amounts, and mounts a component at a predetermined position on a substrate. The suction nozzle is provided at a lower end of a component mounting head and advances downward during component suction and mounting. And the suction nozzle is arranged around a space that moves up and down,
A transmissive illumination unit that illuminates the sucked component from behind, and a 45 ° reflecting surface enters or exits the vertical movement space of the suction nozzle, and upon entry, reflects the image of the component sucked by the suction nozzle in the horizontal direction. A 45 ° mirror to be retracted, a moving means for retracting the 45 ° mirror from the vertical movement space of the suction nozzle at the time of component suction and mounting, and entering directly below the suction nozzle at the time of component image recognition; A 45 ° half mirror which faces the 45 ° mirror at the time, reflects the horizontal reflection component image vertically upward, and transmits the pattern image of the substrate entering from below itself vertically upward; It is located behind the fumiller and has a 45 °
The substrate illuminates the substrate with light reflected downward by the mirror.
A reflection illuminating section for illuminating the back surface of the component through a 45 ° mirror with light transmitted through a 5 ° half mirror; and a 45 ° half mirror provided from below, provided at a position corresponding to the plane projection of the 45 ° half mirror. The light entering the
Shutter means for passing or blocking, imaging means for capturing the vertical reflection component image and the board pattern image, image recognition means for recognizing the component image and the board pattern image captured by the imaging means, and for capturing the component image Closing the shutter means, allowing the 45 ° mirror to enter just below the suction nozzle to turn on the transmission illuminating unit, and opening the shutter means at the time of capturing the substrate pattern image; A component mounting device, comprising: a control unit that retracts the device from directly below the suction nozzle to turn on the reflective illumination unit, and controls an operation of the device based on a recognition result of the image recognition unit. 2. The component mounting apparatus according to claim 1, wherein said control means causes said shutter means to be closed and said 45 ° mirror to enter directly below a suction nozzle when said component image is picked up. A component mounting apparatus having a function of controlling the transmission illumination unit and the reflection illumination unit according to the size of a component with respect to a component suction surface of a suction nozzle. 3. A component mounting head provided in a component mounting unit that moves in the XY direction picks up a component, recognizes an image of a held state of the picked-up component and a pattern position of a substrate on which the component is to be mounted, and performs a suction position. A device that detects a shift and a pattern position shift, corrects both shift amounts, and mounts a component at a predetermined position on a substrate. The suction nozzle is provided at a lower end of a component mounting head and advances downward during component suction and mounting. And the suction nozzle is arranged around a space that moves up and down,
A transmissive illumination unit that illuminates the sucked component from behind, and a 45 ° reflecting surface enters or exits the vertical movement space of the suction nozzle, and upon entry, reflects the image of the component sucked by the suction nozzle in the horizontal direction. A 45 ° mirror to be retracted, a moving means for retracting the 45 ° mirror from the vertical movement space of the suction nozzle at the time of component suction and mounting, and entering directly below the suction nozzle at the time of component image recognition; A 45 ° half mirror which faces the 45 ° mirror at the time, transmits the horizontal reflection component image, and reflects the pattern image of the substrate entering from below itself in a horizontal direction; and a 45 ° half mirror. 45 ° hard
The substrate is illuminated with light passing through the hood,
A reflection illuminating section for illuminating the back surface of the component through a 45 ° mirror with light reflected laterally by the hood mirror, and provided at a position corresponding to the plane projection of the 45 ° half mirror, and enters the 45 ° half mirror from below. The light
Shutter means for passing or blocking, imaging means for capturing the horizontal reflection component image and the board pattern image, image recognition means for recognizing the component image and the board pattern image captured by the imaging means, and for capturing the component image Closing the shutter means, allowing the 45 ° mirror to enter just below the suction nozzle to turn on the transmission illuminating unit, and opening the shutter means at the time of capturing the substrate pattern image; A component mounting device, comprising: a control unit that retracts the device from directly below the suction nozzle to turn on the reflective illumination unit, and controls an operation of the device based on a recognition result of the image recognition unit. 4. The component mounting apparatus according to claim 3, wherein the control means includes: when capturing the component image, closing the shutter means to cause the 45 ° mirror to enter directly below the suction nozzle. A component mounting apparatus having a function of controlling the transmission illumination unit and the reflection illumination unit according to the size of a component with respect to a component suction surface of a suction nozzle.