JPH07107746B2 - Optical information recording medium and manufacturing method thereof - Google Patents

Optical information recording medium and manufacturing method thereof

Info

Publication number
JPH07107746B2
JPH07107746B2 JP60276021A JP27602185A JPH07107746B2 JP H07107746 B2 JPH07107746 B2 JP H07107746B2 JP 60276021 A JP60276021 A JP 60276021A JP 27602185 A JP27602185 A JP 27602185A JP H07107746 B2 JPH07107746 B2 JP H07107746B2
Authority
JP
Japan
Prior art keywords
information recording
optical information
substrate
recording medium
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60276021A
Other languages
Japanese (ja)
Other versions
JPS62137747A (en
Inventor
満 清水
哲郎 生垣
精一 松島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Maxell Energy Ltd
Original Assignee
Hitachi Maxell Energy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Energy Ltd filed Critical Hitachi Maxell Energy Ltd
Priority to JP60276021A priority Critical patent/JPH07107746B2/en
Publication of JPS62137747A publication Critical patent/JPS62137747A/en
Publication of JPH07107746B2 publication Critical patent/JPH07107746B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/7207Heating or cooling of the moulded articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えばコンパクトデイスク、ビデオデイス
ク、コンピユータ用光デイスクメモリなど、光ビームを
照射することによつて情報の書込み及び読出しを行う光
情報記録用デイスクに適用されるデイスク基板の製造方
法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to optical information, such as a compact disk, a video disk, an optical disk memory for a computer, which performs writing and reading of information by irradiating a light beam. The present invention relates to a method of manufacturing a disk substrate applied to a recording disk.

〔従来の技術〕[Conventional technology]

近年、かかる光情報記録用デイスク基板としては、製造
コストが廉価であること及び軽量にして取扱いが容易で
あることから、高分子物質を射出成形したものが注目さ
れている。
In recent years, as the optical information recording disk substrate, a substrate obtained by injection-molding a polymer substance has been attracting attention because it is inexpensive in manufacturing cost and is lightweight and easy to handle.

しかしながら、高分子物質の射出成形品は、ゲート部や
押し切り部、それに偏肉部などにおいてウエルドライン
やヒケなどの外観上の欠陥が形成され易いばかりでな
く、成形時の射出圧力及び温度分布の不均一、それに、
溶融高分子物質が金型のキヤビテイ面を流動する際の配
向などによつてデイスク基板内にひずみを生じ易いとい
う問題がある。デイスク基板の製造に適用される高分子
物質としては、ポリカーボネートやポリメチルメタクリ
レートなど光透過性に優れたものが用いられるが、これ
らの高分子物質の中でポリカーボネートなどは光弾性係
数が大きく、機械的なひずみが入ることによつて光学的
異方体となり易く、複屈折が生じ易くなるという問題が
る。
However, injection molded products of polymeric materials are not only susceptible to the appearance of defects such as weld lines and sink marks at the gates, push-cuts, and uneven thicknesses, but also the injection pressure and temperature distribution during molding. Uneven, and
There is a problem that strain is likely to occur in the disk substrate due to the orientation when the molten polymer substance flows on the cavity surface of the mold. Polycarbonate, polymethylmethacrylate, and other materials with excellent light-transmitting properties are used as polymer substances applied to the production of disk substrates. Among these polymer substances, polycarbonate and others have a large photoelastic coefficient and However, there is a problem that an optical anisotropic body is likely to be formed due to the introduction of the mechanical strain, and birefringence is likely to occur.

光情報記録用デイスクは、デイスク基板の外部からデイ
スク基板の内面に形成された記録層に光ビームを照射す
ることによつて記録層に情報を書き込み、また記録層か
らの反射光強度を検知することによつて記録層に記録さ
れた情報を読み出すものであるから、デイスク基板に入
射された光ビームが複屈折を起すと、円偏向された光ビ
ームが楕円偏向を起し、正常な情報の記録及び再生が不
可能となる。特に、消去・再書込みが可能な光情報記録
用デイスクとして注目されている光磁気デイスクを実現
するためには、読出し専用デイスクあるいはドロー型デ
イスクに比べて格段に複屈折の小さなデイスク基板が必
要であり、射出成形したままの状態では到底実用に供す
ることができない。
The optical information recording disk writes information on the recording layer by irradiating the recording layer formed on the inner surface of the disk substrate from the outside of the disk substrate with information, and detects the intensity of reflected light from the recording layer. As a result, the information recorded on the recording layer is read out.Therefore, when the light beam incident on the disk substrate causes birefringence, the circularly polarized light beam causes elliptical deflection, and the normal information Recording and reproduction becomes impossible. In particular, in order to realize a magneto-optical disk, which is attracting attention as an erasable / rewritable optical information recording disk, a disk substrate having a significantly smaller birefringence than that of a read-only disk or a draw-type disk is required. However, it cannot be put to practical use in a state of being injection-molded.

上記の要請から、複屈折の小さなデイスク基板の製造方
法が嘱望されている。
From the above requirements, a method for manufacturing a disk substrate having a small birefringence is desired.

従来より、ウエルドラインやヒケなどの外観上の欠陥や
成形時の残留応力の発生を防止するための射出成形方法
としては、金型のゲート部や押し切り部、それに偏肉部
などに超音波振動を印加する方法が知られている(特開
昭52−109556)。また、射出成形時の溶融高分子物質の
配向に起因する光学ひずみを防止するための射出成形方
法としては、金型内に流入させた高分子物質に超音波振
動を印加しながら成形する方法が知られている(特開昭
58−140222)。さらに、溶融高分子物質の流動性を高め
る方法としては、高分子物質が金型内に充填された後、
その高分子物質を高周波によつて瞬間的に溶融する方法
が知られて(特開昭50−45039)。
Conventionally, as an injection molding method to prevent appearance defects such as weld lines and sink marks and residual stress during molding, ultrasonic vibration is applied to the gate part, push-cut part, and uneven thickness part of the mold. A method of applying a voltage is known (Japanese Patent Laid-Open No. 52-109556). Further, as an injection molding method for preventing optical distortion due to the orientation of the molten polymer material at the time of injection molding, there is a method of molding while applying ultrasonic vibration to the polymer material that has flowed into the mold. Known (JP Sho
58-140222). Further, as a method of increasing the fluidity of the molten polymer substance, after the polymer substance is filled in the mold,
A method is known in which the polymer substance is instantaneously melted by high frequency (Japanese Patent Laid-Open No. 450-45039).

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

しかしながら、上記した従来の残留ひずみの除去は、い
ずれも固化した成形品を再度溶融することによつて成形
品の分子配列を乱し、光学的性質の均一化を図るもので
あるから、高分子物質が不当に高温に加熱され易く、高
分子物質が劣化するという新たな問題を惹起する虞れが
ある。また、上記の残留ひずみの除去方法を実施するた
めには、いずれも超音波発生器あるいは高周波コイルと
いつた特別な装置を金型内に内蔵しなくてはならず、金
型製造費、即ち、デイスク基板の製造コストが高価にな
るという問題がある。
However, removal of the above-mentioned conventional residual strain disturbs the molecular arrangement of the molded product by melting the solidified molded product again, and aims at homogenizing the optical properties. The substance is easily heated to an unreasonably high temperature, which may cause a new problem that the polymer substance is deteriorated. Further, in order to carry out the above-mentioned residual strain removing method, it is necessary to incorporate a special device such as an ultrasonic wave generator or a high frequency coil into the mold, and the mold manufacturing cost, that is, However, there is a problem that the manufacturing cost of the disk substrate becomes high.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、上記した従来技術の問題点を解消するために
なされたものであって、光情報記録媒体に関しては、光
情報記録媒体の透明樹脂基板として、当該基板を構成す
る樹脂材料の熱変形温度以下の温度にてアニール処理さ
れ、シングルパス時の複屈折率が40nm以下に調整された
ものを用いるという構成にした。
The present invention has been made in order to solve the above-mentioned problems of the prior art, and regarding an optical information recording medium, as a transparent resin substrate of the optical information recording medium, thermal deformation of a resin material constituting the substrate is performed. The structure is such that an annealing treatment is performed at a temperature below the temperature and the birefringence index in a single pass is adjusted to 40 nm or less.

また、光情報記録媒体の製造方法に関しては、樹脂材料
をもって所定形状のディスク基板を射出成形した後、こ
のディスク基板を当該樹脂材料の熱変形温度以下の温度
にてアニール処理し、シングルパス時の複屈折率が40nm
以下に調整されたディスク基板を作製する工程を含むと
いう構成にした。
Regarding the method for manufacturing the optical information recording medium, after a disc substrate having a predetermined shape is injection-molded with a resin material, the disc substrate is annealed at a temperature equal to or lower than the thermal deformation temperature of the resin material, and a single pass Birefringence 40nm
The configuration includes the step of producing the adjusted disk substrate below.

〔実施例〕〔Example〕

以下、本発明にかかる光情報記録用デイスク基板の製造
方法の概略を、第1図に基づいて説明する。
The outline of the method for manufacturing the optical information recording disk substrate according to the present invention will be described below with reference to FIG.

まず、第1図(a)に示すように、金型1,2を一体に組
合せ、金型1に形成されたスプール3よりキヤビテイ4
内に溶融した高分子物質を高圧で射出する。キヤビテイ
4内に溶融した高分子物質が充分に充填されたのち金型
1,2を冷却して高分子物質を固化し、第1図(b)に示
すように、所定の形状の成形されたデイスク基板5を取
り出。す次いで、上記のようにして射出成形されたデイ
スク基板を、第1図(c)に示すように、加熱炉6に収
納し、当該デイスク基板5を形成する高分子物質の熱変
形温度よりもやや低い温度に保持したのち徐冷する。
First, as shown in FIG. 1 (a), the molds 1 and 2 are integrally combined, and the cavity 4 is inserted from the spool 3 formed in the mold 1.
The polymer material melted inside is injected at high pressure. Mold filled with molten polymer material in the cavity 4
1, 2 are cooled to solidify the polymer substance, and as shown in FIG. 1 (b), the disk substrate 5 having a predetermined shape is taken out. Then, the disk substrate injection-molded as described above is housed in a heating furnace 6 as shown in FIG. 1 (c), and the temperature is higher than the heat deformation temperature of the polymer substance forming the disk substrate 5. Hold at a slightly low temperature and then slowly cool.

かように、射出成形によつてひずみが残留した高分子物
質をアニールすると、配向されていた分子の配列が再度
方向性のない状態に組換えられ、光学的等方体とするこ
とができる。
As described above, when the polymer material in which the strain remains due to the injection molding is annealed, the oriented molecular arrangement is recombined into a non-oriented state again to form an optically isotropic body.

次に、いくつかの具体的実施例を掲げ、アニールがされ
ていないデイスク基板との複屈折の相違について示す。
Next, some specific examples will be given to show the difference in birefringence from the disk substrate that is not annealed.

第1実施例 平均分子量15000のポリカーボネート樹脂を第1図
(a)に示すようにして射出成形し、内径15mm、外形13
0mm、厚さ1.2mmのデイスク基板を作製した。次いで、こ
のデイスク基板を60℃のペーク炉に収納し、1時間保持
したのち室温まで徐冷してアニール処理を行つた。尚、
ポリカーボネート樹脂の熱変形温度は、約125℃であ
る。
First Example A polycarbonate resin having an average molecular weight of 15,000 was injection-molded as shown in FIG.
A disk substrate having a thickness of 0 mm and a thickness of 1.2 mm was manufactured. Next, this disk substrate was placed in a 60 ° C. pake oven, held for 1 hour, and then gradually cooled to room temperature for annealing treatment. still,
The heat distortion temperature of polycarbonate resin is about 125 ° C.

第2実施例 第1実施例と同様に作製されたデイスク基板を、80℃の
ベーク炉に収納し、1時間保持したのち室温まで徐冷し
てアニール処理を行つた。
Second Example A disk substrate manufactured in the same manner as in the first example was placed in a bake oven at 80 ° C., held for 1 hour, then gradually cooled to room temperature and annealed.

第3実施例 第1実施例及び第2実施例と同様に作製されたデイスク
基板を、100℃のベーク炉に収納し、1時間保持したの
ち室温まで徐冷してアニール処理を行つた。
Third Example A disk substrate manufactured in the same manner as in the first and second examples was placed in a bake oven at 100 ° C., held for 1 hour, and then annealed by slowly cooling to room temperature.

第4実施例 第1実施例乃至第3実施例と同様に作製されたデイスク
基板を、120℃のベーク炉に収納し、1時間保持したの
ち室温まで徐冷してアニール処理を行つた。
Fourth Example A disk substrate manufactured in the same manner as in the first to third examples was placed in a bake oven at 120 ° C., held for 1 hour, and then annealed by slowly cooling to room temperature.

第2図に、本発明の方法によつて作製されたデイスク基
板に生ずる複屈折と射出成形されたままのデイスク基板
に生ずる複屈折の比較を示す。このグラフの横軸はデイ
スク基板の中心からの距離を示し、縦軸は複屈折の大き
さを示す。尚、複屈折の測定は、レーザ波長が633nmの
エリプソメータを用い、透過法によつて測定を行つた。
FIG. 2 shows a comparison of the birefringence generated on a disk substrate manufactured by the method of the present invention with the birefringence generated on an as-molded disk substrate. The horizontal axis of this graph shows the distance from the center of the disk substrate, and the vertical axis shows the magnitude of birefringence. The birefringence was measured by a transmission method using an ellipsometer with a laser wavelength of 633 nm.

このグラフから明らかなように、射出成形後アニールを
施したデイスク基板は、射出成形したままのデイスク基
板に比べていずれも複屈折が減少する。射出成形したま
まのデイスク基板の最大複屈折の値に対する射出成形後
アニールを施したデイスク基板の最大複屈折の比率は、
60℃でアニールした場合(第1実施例)には36%、80℃
でアニールした場合(第2実施例)には31%、100℃で
アニールした場合(第3実施例)には16%、120℃でア
ニールした場合(第4実施例)には15%であり、アニー
ル温度が高いほど複屈折の減少に効果があることが判つ
た。特に、デイスク基板の内周部及び外周部における複
屈折が顕著に改善され、デイスク基板の半径方向の均一
性が改善される。
As is clear from this graph, the birefringence of the disk substrate annealed after the injection molding is smaller than that of the disk substrate as it is injection-molded. The ratio of the maximum birefringence of the disk substrate annealed after injection molding to the value of the maximum birefringence of the as-injection-molded disk substrate is
36% when annealed at 60 ° C (first embodiment), 80 ° C
31% when annealed at 2 ° C (second embodiment), 16% when annealed at 100 ° C (third embodiment), and 15% when annealed at 120 ° C (fourth embodiment). It was found that the higher the annealing temperature, the more effective the reduction of birefringence. In particular, the birefringence at the inner peripheral portion and the outer peripheral portion of the disk substrate is remarkably improved, and the uniformity of the disk substrate in the radial direction is improved.

尚、本発明に適用される高分子物質としては、ポリカー
ボネートに限定されるものではなく、所要の屈折率を有
する熱可塑性の透明高分子物質であれば、PMMA、塩化ビ
ニルなど、任意のものを用いることができる。
The polymer substance applied to the present invention is not limited to polycarbonate, and any thermoplastic transparent polymer substance having a required refractive index such as PMMA and vinyl chloride can be used. Can be used.

また、上記各実施例においては、デイスク基板をベーク
炉にて加熱する場合についてのみ説明したが、加熱手段
としてはこれに限定されるものではなく、レーザや赤外
線あるいはマイクロウエーブなどの熱戦を照射する、若
しくは熱風循環炉に入れるなど任意の手段を採ることが
できる。
Further, in each of the above-described embodiments, only the case where the disk substrate is heated in the bake furnace has been described, but the heating means is not limited to this, and a thermal battle such as laser, infrared ray or microwave is irradiated. Alternatively, any means such as putting in a hot air circulation furnace can be adopted.

さらに、アニール時の温度及び加熱速度や冷却速度等の
条件は、上記実施例に限定されるものではなく、使用す
る高分子物質の種類によつて、任意に調整することがで
きることは勿論である。。
Furthermore, the conditions such as temperature and heating rate and cooling rate during annealing are not limited to those in the above-mentioned examples, and it is needless to say that they can be arbitrarily adjusted depending on the type of polymer substance used. . .

〔発明の効果〕〔The invention's effect〕

以上説明したように、本発明によれば、光情報記録媒体
の透明樹脂基板として、当該基板を構成する樹脂材料の
熱変形温度以下の温度にてアニール処理され、シングル
パス時の複屈折率が40nm以下に調整されたものを用いる
ので、基板を透過する記録再生用光の複屈折を低減で
き、記録再生特性に優れた光情報記録媒体を作製でき
る。
As described above, according to the present invention, the transparent resin substrate of the optical information recording medium is annealed at a temperature equal to or lower than the thermal deformation temperature of the resin material forming the substrate, and has a birefringence index in a single pass. Since the one adjusted to 40 nm or less is used, the birefringence of the recording / reproducing light transmitted through the substrate can be reduced, and the optical information recording medium having excellent recording / reproducing characteristics can be manufactured.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明に係るデイスク基板の製造方法を示す工
程説明図、第2図は本発明の方法によつて作製されたデ
イスク基板に生じる複屈折と射出成形されたままのデイ
スク基板に生ずる複屈折とを比較するグラフである。 1,2:金型、3:スプール、4:キヤビテイ、5:デイスク基
板、6:加熱炉
FIG. 1 is a process explanatory view showing a method for manufacturing a disk substrate according to the present invention, and FIG. 2 is a birefringence generated in a disk substrate manufactured by the method of the present invention and a disk substrate as injection-molded. It is a graph which compares with a birefringence. 1, 2: Mold, 3: Spool, 4: Cavity, 5: Disc substrate, 6: Heating furnace

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】光情報記録媒体の透明樹脂基板として、当
該基板を構成する樹脂材料の熱変形温度以下の温度にて
アニール処理され、シングルパス時の複屈折率が40nm以
下に調整されたものを用いたことを特徴とする光情報記
録媒体。
1. A transparent resin substrate for an optical information recording medium, which has been annealed at a temperature not higher than a heat deformation temperature of a resin material constituting the substrate and whose birefringence index in a single pass is adjusted to 40 nm or less. An optical information recording medium characterized by using.
【請求項2】前記樹脂材料が、ポリカーボネート、ポリ
メチルメタクリレート、塩化ビニルで代表される熱可塑
性の樹脂材料であること特徴とする特許請求の範囲第1
項記載の光情報記録媒体。
2. The resin material is a thermoplastic resin material typified by polycarbonate, polymethylmethacrylate, or vinyl chloride.
An optical information recording medium according to the item.
【請求項3】射出成形されたポリカーボネート基板(熱
変形温度125℃)を、80℃〜120℃の温度でアニール処理
した透明樹脂基板を用いたことを特徴とする特許請求の
範囲第1項記載の光情報記録媒体。
3. A transparent resin substrate obtained by annealing an injection-molded polycarbonate substrate (heat deformation temperature 125 ° C.) at a temperature of 80 ° C. to 120 ° C .. Optical information recording medium.
【請求項4】樹脂材料をもって所定形状のディスク基板
を射出成形した後、このディスク基板を当該樹脂材料の
熱変形温度以下の温度にてアニール処理し、シングルパ
ス時の複屈折率が40nm以下に調整されたディスク基板を
作製する工程を含むことを特徴とする光情報記録媒体の
製造方法。
4. A disc substrate having a predetermined shape is injection-molded from a resin material, and the disc substrate is annealed at a temperature not higher than the heat deformation temperature of the resin material so that the birefringence index in a single pass is 40 nm or less. A method of manufacturing an optical information recording medium, comprising a step of manufacturing an adjusted disk substrate.
JP60276021A 1985-12-10 1985-12-10 Optical information recording medium and manufacturing method thereof Expired - Lifetime JPH07107746B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60276021A JPH07107746B2 (en) 1985-12-10 1985-12-10 Optical information recording medium and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60276021A JPH07107746B2 (en) 1985-12-10 1985-12-10 Optical information recording medium and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPS62137747A JPS62137747A (en) 1987-06-20
JPH07107746B2 true JPH07107746B2 (en) 1995-11-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP60276021A Expired - Lifetime JPH07107746B2 (en) 1985-12-10 1985-12-10 Optical information recording medium and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPH07107746B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985468B2 (en) * 1992-01-28 1999-11-29 松下電器産業株式会社 Method for molding substrate for optical recording medium and method for producing substrate for optical recording medium
JP3988516B2 (en) * 2002-04-23 2007-10-10 松下電工株式会社 Manufacturing method of resin molded body and manufacturing apparatus thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120719A (en) * 1984-07-09 1986-01-29 Asahi Chem Ind Co Ltd Manufacture of plastic base for optical disk

Also Published As

Publication number Publication date
JPS62137747A (en) 1987-06-20

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