JPH07106487A - Board-assembled sheet for mounting electronic component, its manufacture and lead-frame sheet - Google Patents

Abstract

PURPOSE:To provide, in a simple structure, a board-assembled sheet, for mounting of electronic components, wherein, when a board for mounting of electronic components is separated into individual lead frames from the board-assembled sheet for mounting of the electronic components, the board can be separated easily without a need for stamping a suspension pin and the quality of a lead can be ensured sufficiently. CONSTITUTION:Suspension pins for a lead-frame sheet 20 which is constructed on lead frames 10 and frame materials 21 and which holds the frame materials 21 on the board frames 10 are formed as grooved suspension pins 22 which are provided with groove parts formed by a half etching operation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting board assembly sheet, a method of manufacturing the same, and a lead frame sheet. The present invention relates to a mounting board assembly sheet, a manufacturing method thereof, and a lead frame sheet used in the manufacturing method.

[0002]

2. Description of the Related Art As shown in FIGS. 7 and 8, a semiconductor chip having a plurality of leads and an insulating base material attached to both sides of the leads so that the leads project outward are mounted on a semiconductor chip. There is an electronic component mounting board in which electronic components such as the above are electrically connected to the outside by each lead through a conductor circuit or a through hole. Such electronic component mounting substrates are mass-produced, and generally, a plurality of electronic component mounting substrates are integrally manufactured in a sheet shape as an electronic component mounting substrate aggregate sheet.

Here, as shown in FIG. 9, the conventional electronic component mounting board assembly sheet has a plurality of lead frames each having a plurality of leads and a lead frame material for connecting and holding each lead, and each lead. A lead frame sheet having a frame frame material arranged on an outer peripheral portion of the frame and a hanging pin that is provided between the frame frame material and the lead frame and holds the lead frame on the frame frame material is provided. Was provided with an insulating base material attached to each desired portion so that each lead protrudes outward.

Further, such a conventional electronic component mounting board assembly sheet is manufactured by a manufacturing process as shown in FIG. 10. This manufacturing process will be described below.

First, a lead frame sheet is integrally formed from a metal plate (a), and insulating substrates are thermocompression bonded to both surfaces of the lead frame sheet (b). Next, a conductor circuit having a desired pattern, a through hole for electrically connecting the conductor circuit and the lead inside the insulating substrate, and the like are formed on the surface of the insulating substrate (not shown). Next, the outer shape of the insulating base material of each electronic component mounting substrate is formed, and the unnecessary insulating base material is removed from the lead frame sheet (c). Then, the insulating base material sheet remains at desired portions on both sides of the lead frame sheet, that is, the electronic component mounting board assembly sheet in which the insulating base material as the individual electronic component mounting board is formed is formed (d). ). At this time, in each electronic component mounting board, its leads are held by the lead frame material of the lead frame, and further, each lead frame is held by the frame frame material by the hanging pins.

By the way, the suspension pins of the lead frame sheet are formed to have sufficient strength to withstand the thermocompression bonding process of the insulating resin, which causes a large stress in the lead frame sheet. Therefore, the electronic component mounting board cannot be easily separated from the electronic component mounting board assembly sheet for each lead frame. Therefore, when the electronic component mounting board is separated from the electronic component mounting board assembly sheet for each lead frame, as shown in FIG.
The hanging pin was punched out by a punching die.

[0007]

However, when the hanging pin is punched out by the punching die as described above,
Since the punching die comes into contact with the exposed lead, the lead may be deformed or dented by foreign matter such as scraps of the insulating base material or metal pieces attached to the lead or the die, and lead quality is significantly deteriorated. There was a problem.

The respective inventions of the present invention have been made in view of such circumstances, and the object of the invention is, first, that the inventions of claims 1 and 2 are from an electronic component mounting board assembly sheet to an electronic component mounting board. An electronic component mounting board assembly sheet capable of easily separating the component mounting board for each lead frame without punching out hanging pins and ensuring sufficient lead quality, and the same It is to provide a manufacturing method with a simple structure and method.

According to the third aspect of the present invention, when the electronic component mounting board aggregate sheet is manufactured without causing any trouble in manufacturing the electronic component mounting substrate aggregate sheet, the electronic component mounting board is formed. It is an object of the present invention to provide a lead frame sheet that can easily separate an electronic component mounting substrate for each lead frame from an assembly sheet with a simple structure.

[0010]

Means for Solving the Problems In order to solve the above problems, the means adopted by the present invention will be described with reference to the reference numerals used in the drawings. Are integrally formed from the plurality of leads 11 and each lead 11
A plurality of lead frames 10 each having a lead frame member 12 for connecting and holding the frame members, a frame frame member 21 disposed on an outer peripheral portion of each lead frame 10, and the frame frame member 2
1 and a lead frame sheet 20 provided with a hanging pin for holding the lead frame 10 on a frame frame member 21 that is provided between the lead frame 10 and the lead frame 10, and the leads 11 are externally attached to desired portions on both surfaces of the lead frame sheet 20. In the electronic component mounting board assembly sheet 300 including the insulating base material 30 adhered so as to project in one direction, the hanging pin is formed into a groove portion 22a formed by half etching.
It is the board assembly sheet 300 for mounting electronic components, characterized in that the hanging pin 22 with grooves having the above is used.

Next, the invention of claim 2 provides: "(1) A plurality of leads 1 which are integrally formed from a metal plate.
1 and a lead frame member 12 for connecting and holding each lead 11, a plurality of lead frames 10, a frame frame member 21 arranged on an outer peripheral portion of each lead frame 10, and a groove portion formed by half etching A grooved hanging pin 22 that has a frame 22a and is installed on the frame frame member 21 and the lead frame 10 to hold the lead frame 10 on the frame frame member 21, and a frame frame that is installed on the frame frame member 21 and the lead frame 10. Lead frame 1 on material 12
A step of thermocompression-bonding the insulating base material 30 to both surfaces of the lead frame sheet 20 provided with the reinforcing suspension pins 23 holding 0; (2) Reinforcement of the lead frame sheet 20 in which the insulating base material 30 is thermo-compression bonded to both surfaces. The step of punching out the hanging pin 23; (3) the step of removing the unnecessary insulating base material 30a from both surfaces of the lead frame sheet 20 punched out of the reinforcing hanging pin 23; Of the electronic component mounting board assembly sheet 300.

[0012] Finally, the invention of claim 3 is that "a plurality of lead frames 10 integrally formed from a metal plate and having a plurality of leads 11 and a lead frame member 12 for connecting and holding each lead 11; A frame frame member 21 provided on the outer peripheral portion of each lead frame 10 and a frame frame member 21 having a groove portion 22 a formed by half etching and erected between the frame frame member 21 and the lead frame 10.
A grooved hanging pin 22 for holding the lead frame 10,
The lead frame sheet 20 "is characterized in that the frame frame member 21 and the lead frame 10 are provided with a reinforcing suspension pin 23 that holds the lead frame 10 on the frame member 21".

The reinforcing hanging pins 23 in the method for manufacturing the electronic component mounting board assembly sheet 300 according to the second aspect of the invention and the lead frame sheet 20 according to the third aspect of the invention are similar to the grooved hanging pins 22. It may have a groove 22a. That is, all the hanging pins are groove portions 22.
In the manufacturing process of the electronic component mounting board assembly sheet 300, a part of the suspension pins is punched out as the reinforcing suspension pins 23, and the suspension pins remaining in the manufactured electronic component mounting board assembly sheet 300 are lead frames. The hanging pin 22 with a groove for holding 10 may be used.

[0014]

Next, the operation of the electronic component mounting board assembly sheet 300 of the present invention, the method of manufacturing the same, and the lead frame sheet 20 thus constructed will be described.

First, in the electronic component mounting board assembly sheet 300 according to the invention of claim 1, the hanging pin for holding the lead frame 10 on the frame member 21 is provided with a groove portion 22a formed by half etching. Hanging pin 22
It is what Therefore, the electronic component mounting board 100 can be easily separated from the electronic component mounting board assembly sheet 300 for each lead frame 10 by folding the grooved hanging pins 22 with a hand tool such as a nipper or by hand. .
That is, when the electronic component mounting substrate 100 is separated from the electronic component mounting substrate assembly sheet 300 for each lead frame 10, it is not necessary to punch the hanging pins with a punching die as in the conventional case, and the quality of the exposed leads 11 is ensured. Will be secured.

Next, the operation of the electronic component mounting board assembly sheet 300 according to the invention of claim 2 and the operation of the lead frame sheet 20 according to the invention of claim 3 will be described below together.

First, the lead frame 10 of the lead frame sheet 20 is held by the frame frame member 21 by the grooved hanging pins 22 and the reinforcing hanging pins 23.
For this reason, the lead frame 10 is sufficiently firmly held by the frame frame member 21, and the lead frame 10 is carelessly used even in the thermocompression bonding process of the insulating base material 30 in which a large stress is applied to the lead frame sheet 20. The insulating base material 30 is not separated from the lead frame sheet 20.
It will be surely attached to both sides without any trouble.

Next, the reinforcing suspension pin 22 is in a state in which the unnecessary insulating base material 30a is still attached to both surfaces of the lead frame sheet 20, that is, both surfaces of the lead 11 are covered with the unnecessary insulating base material 30a. Punched in the open state. Therefore, when the reinforcing suspension pin 23 is punched, the punching die 40 does not come into contact with the lead 11 and the lead 11 is not deformed or dented by foreign matter such as scraps of the insulating base material 30 or metal pieces. The quality of the lead 11 is surely ensured.

Finally, even if the reinforcing suspension pins 23 are punched out, the lead frame 10 is still held by the frame frame member 21 by the grooved suspension pins 22, so that, for example, the subsequent conductor circuit forming step and through hole formation are performed. In various steps such as steps, the lead frame 10 is not inadvertently separated from the lead frame sheet 20, and the manufacture thereof is not hindered.

[0020]

Embodiments of the electronic component mounting board assembly sheet 300, the manufacturing method thereof and the lead frame sheet 20 according to the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an embodiment of the lead frame sheet 20 of the invention according to claim 3. The lead frame sheet 20 includes a plurality of lead frames 10 each having a plurality of leads 11 and a lead frame member 21 that connects and holds the leads 11, and each lead frame 10 includes a grooved hanging pin 22. It is held on the frame member 21 by means of the reinforcing suspension pins 23. The lead frame sheet 20 is integrally formed of a metal plate having excellent conductivity such as a copper plate.

As shown in FIGS. 2 and 3, the grooved hanging pin 22 is provided with a groove portion 22a formed by half etching at the connection portion with the lead frame 10. The lead frame 10 can be easily broken off by hand tools such as nippers or by hand. In addition, the groove portion 22
If a is provided, the grooved hanging pins 22 to the lead frame 1
This is convenient because when the 0 is broken off, burrs and remaining pieces of the grooved hanging pins 22 are unlikely to occur on the lead frame 10 side.

FIG. 4 shows the lead frame sheet 20.
An example of a process of manufacturing an electronic component mounting substrate assembly sheet 300 by using is shown. First, the lead frame sheet 20 as described above is formed (a), and the insulating base material 30 is thermocompression bonded to both surfaces of the lead frame sheet 20 (b).

Next, a conductor circuit having a desired pattern and through holes for electrically connecting the conductor circuit and the leads 11 are formed on the surface of the insulating base material 30 (not shown). It should be noted that this step may be appropriately performed in the subsequent steps.

Next, the reinforcing suspension pins 23 of the lead frame sheet 20 are attached to the insulating base material 30 on both sides thereof.
At the same time, it is punched by the punching die 40 (c). Here, if the insulating base material 30 in the punched portion, that is, the insulating base material 30 in both surface portions of the reinforcing hanging pin 23 is removed in advance, it is convenient that the reinforcing hanging pin 23 is smoothly punched.

Finally, the outer shape of the individual electronic component mounting substrate 100 as the insulating base material 30 is formed on the insulating base material 30 adhered on both sides of the lead frame sheet 20 by laser processing or the like, and unnecessary insulation is performed. The base material 30a is removed by, for example, peeling it from the lead frame sheet 20 (d). Then, a plurality of electronic component mounting substrates 10 as shown in FIG.
The electronic component mounting board assembly sheet 300 according to the first aspect of the invention having 0 is manufactured (e). Here, in each electronic component mounting board 100, the lead 11 is connected to the lead frame material 12 and held by the lead frame 10, and the lead frame 10 is laid between the lead frame 10 and the frame frame material 21. It is held by the lead frame sheet 20 by the grooved hanging pins 22 which can be easily broken off.

When the electronic component mounting substrate 100 is separated from the electronic component mounting substrate assembly sheet 300 into each lead frame 10, a plurality of electronic component mounting substrates 100 are formed on one lead frame 10 as shown in FIG. An electronic component mounting board assembly 200 including the above is formed. In addition,
Not limited to this, one lead frame 10 may be provided with one electronic component mounting substrate 100, but a plurality of electronic component mounting substrates 100 are treated as an electronic component mounting substrate assembly 200 in this way. This is convenient and easy to handle, for example, in a step of mounting an electronic component on the electronic component mounting board 100, a step of sealing substantially the entire electronic component mounting board 100 with a resin, and the like.

[0028]

As described above in detail, first, in the electronic component mounting board assembly sheet and the manufacturing method thereof according to the first and second aspects of the present invention, the lead frame is used as the frame material of the lead frame sheet. , A board assembly sheet for mounting electronic components held by a hanging pin with a groove that can be easily broken off with a hand tool such as a nipper, and a manufacturing method thereof.

According to the first and second aspects of the present invention, when the electronic component mounting board is separated from the electronic component mounting board assembly sheet for each lead frame, the hanging pins need not be punched out. It is possible to provide an electronic component mounting board assembly sheet that can be easily separated and can sufficiently secure the quality of leads and a manufacturing method thereof with a simple structure and method.

Further, in the lead frame sheet according to the invention of claim 3, the lead frame is used as a frame frame material, and the reinforcing hanging pin and the grooved hanging pin as described above are punched out in the manufacturing process of the electronic component mounting board assembly sheet. I have kept it.

According to the third aspect of the present invention, when the electronic component mounting board aggregate sheet is manufactured without any trouble in manufacturing the electronic component mounting substrate aggregate sheet, It is possible to provide a lead frame sheet that can easily separate the electronic component mounting substrate for each lead frame from the mounting substrate assembly sheet with a simple structure.

[Brief description of drawings]

FIG. 1 is a partial plan view showing an embodiment of a lead frame sheet according to the invention of claim 3;

FIG. 2 is an enlarged view of part A in FIG.

3 is a sectional view taken along line BB in FIG.

FIG. 4 is a process drawing showing an embodiment of a method of manufacturing an electronic component mounting board assembly sheet according to the invention of claim 2;

FIG. 5 is a partial plan view showing an embodiment of an electronic component mounting board assembly sheet according to the invention of claim 1;

FIG. 6 is a plan view showing an example of an electronic component mounting board assembly.

FIG. 7 is a plan view showing an example of an electronic component mounting board.

8 is a cross-sectional view taken along line CC of FIG.

FIG. 9 is a partial plan view showing a conventional electronic component mounting board assembly sheet.

FIG. 10 is a process drawing showing a method for manufacturing a conventional electronic component mounting substrate assembly sheet.

FIG. 11 is a partial cross-sectional front view showing a state in which the hanging pins of the conventional electronic component mounting board assembly sheet are punched out.

[Explanation of symbols]

 10 Lead Frame 11 Lead 12 Lead Frame Material 20 Lead Frame Sheet 21 Frame Frame Material 22 Groove Hanging Pin 22a Groove 23 Reinforcement Hanging Pin 30 Insulating Base Material 30a Unnecessary Insulating Base Material 40 Punching Die 100 Electronic Component Mounting Board 200 Electronic Component mounting board assembly 300 Electronic component mounting board assembly sheet

Claims (3)

[Claims] 1. A plurality of lead frames integrally formed of a metal plate, each lead frame having a plurality of leads and a lead frame member connecting and holding the leads, and a frame disposed on an outer peripheral portion of each lead frame. A lead frame sheet provided with a frame material, a hanging pin that is laid between the frame frame material and the lead frame and holds the lead frame on the frame frame material, and the leads are provided at desired positions on both surfaces of the lead frame sheet. In an electronic component mounting board assembly sheet provided with an insulating base material attached so as to project outward, the hanging pin is a grooved hanging pin having a groove portion formed by half etching, A board assembly sheet for mounting electronic components. 2. (1) A plurality of lead frames integrally formed of a metal plate, each lead frame having a plurality of leads and a lead frame member for connecting and holding the leads, and arranged on the outer peripheral portion of each lead frame. A frame frame material, a grooved suspension pin that has a groove portion formed by half etching and is erected between the frame frame material and the lead frame, and holds the lead frame in the frame frame material; the frame frame material and the lead frame; A step of thermocompression-bonding an insulating base material to both surfaces of a lead frame sheet provided with a reinforcing suspension pin for holding the lead frame on the frame frame material; (2) a lead frame sheet in which the insulating base materials are thermo-compression bonded (3) Removing unnecessary insulating base material from both sides of the lead frame sheet in which the reinforcing hanging pins are punched out; Claim 1 electronic component carrier set sheet manufacturing method as set forth which comprises a degree. 3. A plurality of lead frames integrally formed of a metal plate, each lead frame having a plurality of leads and a lead frame member for connecting and holding each lead, and a frame disposed on an outer peripheral portion of each lead frame. A frame material, a grooved hanging pin that has a groove portion formed by half etching and is erected on the frame frame material and the lead frame and holds the lead frame on the frame frame material, and is erected on the frame frame material and the lead frame. A lead frame sheet, comprising: a frame frame member; and a reinforcing suspension pin for holding the lead frame.