JPH07106132A - Chip filter part and manufacture thereof - Google Patents

Abstract

PURPOSE:To simplify the process of manufacture by a method wherein element component parts are superposed on a heat-proof insulating substrate. CONSTITUTION:The title chip filter part is formed by superposing a heat resistant insulating substrate 1, the spiral coil conductor 2 containing the terminal electrode 2a formed on the insulating substrate 1, a dielectric layer 3 with which the coil conductor 2 is coated, a spiral coil conductor 4 containing the terminal electrode 4a formed on the dielectric layer 3, an insulating layer 5 with which the coil conductor 4 is coated in such a manner that the other end of the coil conductor 4 is exposed, a terminal conductor 6 with a terminal electrode 6a on the insulating layer 5 and an insulating protective film 7 with which the whole materials are coated. As a result, the reliability of connection can be improved, the process of manufacture can be simplified, and even when the chip filter part is arranged on a printed wiring substrate, the degree of freedom of circuit pattern can be improved because the circuit pattern can be laid out from two direction of the substrate end part, and the chip filter part having high practicability can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a distributed constant type chip filter component.

[0002]

2. Description of the Related Art Conventionally, as a chip filter component shown in the equivalent circuit of FIG. 24, a green sheet on which a spiral first coil conductor is formed, as proposed in Japanese Patent Laid-Open No. 3-21810. , L (inductance) -C (capacitance) distributed constant type chip in which a green sheet on which a spiral second coil conductor is formed and a green sheet to be a dielectric layer are further laminated and integrally fired A filter component is disclosed.

In the conventional chip filter component, a predetermined capacitance component is generated in the dielectric layer interposed between the spiral first coil conductor and the spiral second coil conductor, and for example, the first coil is used. By setting the conductor to the ground potential, the chip filter component of the equivalent circuit of FIG. 24 was obtained.

[0004]

However, in the above-mentioned chip filter component, since it is formed by stacking green sheets, when the terminal is led out from one end of the first coil conductor or both ends of the second coil conductor. Must have terminal electrodes formed on the front surface or the back surface of the laminated substrate through a via-hole conductor that penetrates the thickness of the green sheet.
The manufacturing process becomes complicated, and in order to connect such a minute via-hole conductor and a predetermined pattern, it is necessary to control the stacking position of each green sheet with high accuracy.

Further, in the above-mentioned chip filter component, the structure of the terminal electrode is not clearly disclosed, and it cannot be said that the chip filter component can be practically used as a chip component to be surface-mounted on a printed wiring board. That is, when reflow soldering is performed on the predetermined circuit pattern of the printed wiring board together with other chip-shaped electronic components, the terminal electrodes are soldered or migrated.

The present invention has been devised in view of the above-mentioned problems, and an object thereof is a simple structure, excellent mass productivity, stacking reliability, and connection reliability between a coil conductor and a terminal electrode. (EN) Provided are a chip filter component which is remarkably improved and is highly practical, and a manufacturing method thereof.

[0007]

The first invention of the present invention is as follows:
On a heat-resistant insulating substrate, a spiral-shaped first coil conductor formed so that one end is led out to an end side of the substrate, and substantially the entire surface of the substrate so as to cover the first coil conductor. A formed dielectric layer, and a spiral-shaped second coil formed on the dielectric layer so as to substantially face the first coil conductor and one end of which is led to an edge of the substrate. A conductor, an insulating layer formed on the second coil conductor so that at least the other end is exposed, and the other end of the second coil conductor is led to an edge of the substrate on the insulating layer. It is a chip filter component in which the terminal conductors and the terminal conductors are superimposed on each other.

According to a second aspect of the present invention, there is provided a spiral first coil conductor, a dielectric layer, a spiral second coil conductor substantially facing the first coil conductor on a heat resistant insulating substrate. An insulating layer that exposes the other end of the second coil conductor and a terminal conductor that connects to the other end of the second coil conductor are overlapped with each other, and the first terminal electrode at one end of the first coil conductor and the second In a chip filter component in which a second terminal electrode at one end of the coil conductor and a third terminal electrode that is a terminal conductor are respectively led to the end sides of the substrate, wherein the first to third terminal electrodes are of the substrate. Between the two terminal electrodes, which are led out to a pair of opposite edges and are led to one edge,
It is a chip filter component in which a concave portion that separates two terminal electrodes is formed.

According to a third aspect of the present invention, a plurality of spiral first coil conductors are formed on a heat resistant insulating substrate, and a dielectric layer is formed to cover the plurality of first coil conductors. A plurality of spiral second coil conductors that substantially face the first coil conductor are formed on the body layer, and an insulating layer is formed so that at least the other end is exposed on each of the second coil conductors. And a plurality of terminal conductors are formed on the insulating layer so as to be connected to the other end of each second coil conductor, and a plurality of first conductors extending from one end of each first coil conductor are formed. The terminal electrodes, the plurality of second terminal electrodes extending from one end of the second coil, and the plurality of third terminal electrodes that are terminal conductors are a pair of substrate edges that are parallel to each other and that are parallel to the arrangement direction of the plurality of coil conductors. And the adjacent edge derived on one side. Between the terminal electrodes, a tip filter component formed by a recess for partitioning the said terminal electrodes.

In each of the above chip filter parts,
The first to third terminal electrodes are the surface of a heat-resistant insulating substrate,
It is desirable that it is formed over the end face and the back face and that it is composed of a base conductor film and a surface plating layer.

A fourth invention is a spiral first coil conductor, a dielectric layer, a spiral second coil conductor substantially facing the first coil conductor on a heat resistant insulating substrate, An insulating layer that exposes the other end of the second coil conductor and a terminal conductor that connects to the other end of the second coil conductor are overlapped with each other, and one end of the first coil conductor, one end of the second coil conductor, and the second coil conductor are formed. In the method for manufacturing a chip filter component, wherein the terminal conductors connected to the other end of the coil conductor are led out as the first to third terminal electrodes on the respective sides of the heat-resistant insulating substrate, and in the region of the heat-resistant insulating substrate. A conductor film serving as a first coil conductor and a first terminal electrode is formed on the surface of each region of a large-sized substrate in which vertical and horizontal dividing grooves are formed, and first, second, and third terminal electrodes are formed on the back face of each region. Conductive film is printed with conductive paste A step of forming by firing, a step of forming a dielectric layer covering the first coil conductor on the surface of each region by printing a dielectric paste and firing, and a step of forming a dielectric layer in each region by a first Forming a second coil conductor that substantially opposes the coil conductor and a conductor film that becomes a second terminal electrode integrated with the conductor by printing and firing a conductive paste, and the second step of each region. On the coil conductor,
A step of forming an insulating layer by printing and firing an insulating paste so that at least the other end of the second coil conductor is exposed, and connecting to the other end of the second coil conductor on the insulating layer in each region, And a step of forming a terminal conductor, which is to be the third terminal electrode, which is led out to the edge of the substrate, by printing and firing a conductive paste; a step of primary dividing the large-sized substrate into strips; and a step of primary dividing The step of forming a conductor film for connecting the conductor films to be the terminal electrodes on the front and back surfaces of each region by printing and firing a conductive paste on the end surface exposed by And a step of performing electrode plating on each of the conductor films on the front surface, the back surface, and the end surface that will become the first to third terminal electrodes.

[0012]

In the first invention, since the first coil conductor, the dielectric layer and the second coil conductor are directly formed on the heat resistant insulating substrate, the first terminal electrode and the second terminal electrode are formed. Directly extends from one end of the first coil conductor and one end of the second coil conductor. Therefore, it is possible to achieve an LC distributed constant type filter component in which the connection reliability between the first coil conductor, the second coil conductor and the terminal electrode is greatly improved.

Further, it is not necessary to perform precise stacking alignment of the green sheets as in the prior art, the structure can be simplified, and the stacking reliability as a whole is greatly improved.

In the second invention, in addition to the first invention, the first to third terminal electrodes are led out to a pair of opposite edges of the substrate, so that the terminal electrodes are formed. In this case, the circuit pattern of the printed wiring board, which can be achieved by the treatment on the pair of end faces and is soldered to the terminal electrodes, can be drawn only in two directions (a pair of end sides) of the component. There is no restriction on the routing of the circuit pattern above, and a highly practical chip filter component can be achieved.

Further, since a recessed portion is formed at the end side of the board between the adjacent terminal electrodes led out to the pair of end sides, when soldering is performed on the circuit pattern of the printed wiring board. Also, it is possible to effectively prevent a short circuit between the adjacent terminal electrodes.

In the third invention, a plurality of filter elements are integrated on the same substrate while having the action of the chip filter component disclosed in the first invention and the second invention, and thus a plurality of filter elements are integrated. When it is used for a circuit of a printed wiring board that requires a filter, the area occupied by the chip filter component on the printed wiring board can be substantially reduced, which is highly practical.

Further, each of the above-mentioned terminal electrodes is formed over the front surface, the end surface and the back surface of the end side of the substrate on which the terminal electrode is formed, and the surface is prevented from being eroded by solder and wetted with solder. Since the plating layer for improving the performance is formed, the chip filter component can be surface-mounted by reflow soldering like other chip-shaped electronic components.

In the invention of the fourth manufacturing method, all the laminated structures are formed by printing and laminating a conductive paste, a dielectric paste and an insulating paste. Connection reliability is improved, and mass productivity is greatly improved.

Further, practically, when soldering to a circuit pattern of a printed wiring board, plating coating is important in order to prevent solder erosion of the terminal electrodes. , The plating step is completely separated with the secondary division as a boundary, that is, the plating step is performed after dividing each substrate individually, so that the productivity is greatly improved.

Further, in manufacturing the chip filter parts of the second and third aspects of the present invention, the base conductor film to be each terminal electrode can be collectively processed on the end face of the strip-shaped substrate which is primary-divided. , Productivity is greatly improved.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 is a perspective view according to the first invention, FIG. 2 is a sectional view taken along line XX of FIG. 1, and FIGS. 3 to 14 are plan views of main manufacturing steps.

As shown in FIGS. 1 and 2, the chip filter component of the present invention includes a first spiral-shaped insulating substrate 1 and a first terminal electrode 2a formed on the insulating substrate 1. Coil conductor 2, a dielectric layer 3 covering the first coil conductor 2, a spiral second coil conductor 4 including a second terminal electrode 4a formed on the dielectric layer 3, the second coil conductor 4, An insulating layer 5 covering the second coil conductor 4 so as to expose the other end of the second coil conductor 4, a terminal conductor 6 having the third terminal electrode 6a on the insulating layer 5, and further covering the whole. The insulating protection films 7 are formed so as to overlap each other.

The insulating substrate 1 is made of a heat-resistant insulating material such as rectangular ceramic or glass. As shown in FIG. 4, a first coil conductor 2 for a predetermined number of turns, for example, two turns, is formed on the insulating substrate 1.

The first coil conductor 2 is made of a low resistance material such as Ag or Cu, and one end of the spiral outer periphery is
It extends to one side 1z of the insulating substrate 1. This extended portion becomes the first terminal electrode 2a.

The dielectric layer 3 is made of a dielectric material having a high dielectric constant such as barium titanate, and as shown in FIG. 5, it covers substantially the entire surface of the substrate 1 so as to cover the first coil conductor 2. Is formed. Its thickness is about 20 to 40 μm.

The second coil conductor 4 is made of a low resistance material such as Ag or Cu and has a spiral shape of, for example, two turns so as to substantially face the first coil conductor 2 as shown in FIG. And one end of the outer peripheral portion thereof has one end side of the insulating substrate 1, that is, the end side 1z on which the first terminal electrode 2a is formed.
It extends to the end side 1x orthogonal to. This extended portion becomes the second terminal electrode 4a.

The insulating layer 5 is made of an insulating material mainly containing glass or the like, and as shown in FIG. 7, at least the other end 4b on the inner peripheral side of the second coil conductor 4 is exposed. It is formed so as to cover the second coil conductor 4.

The terminal conductor 6 is made of a low resistance material such as Ag or Cu, and is connected to the exposed other end of the second coil conductor 4 on the insulating layer 5 as shown in FIG. Further, it is formed so as to extend to one end side of the substrate 1, that is, the end side 1y opposite to the end side 1x on which the second terminal electrode 4a is formed. This extended portion becomes the third terminal electrode 6a.

The insulating protection film 7 is made of an insulating material such as glass as a main component. As shown in FIG. 9, at least the third terminal electrode 6a is exposed to expose the terminal conductor 6 and the insulating layer 5. It is formed on substantially the entire surface of the substrate 1 so as to cover the second coil conductor 4 and the like.

In each of the above-mentioned terminal electrodes 2a, 4a, 6a, the second terminal electrode 4a and the third terminal electrode 6a are led out to a pair of opposite end sides 1x, 1y of the rectangular insulating substrate 1. Therefore, the first terminal electrode 2a is led to one of the opposite side edges 1z of the insulating substrate 1.

The terminal electrodes 2a, 4a and 6a are shown in FIG.
As shown in FIG. 3, the substrate 1 is formed over the front surface, the end surface, and the back surface, and the structure thereof is the base conductor films 21a, 41a, 61a formed in a U-shaped cross section, and the base conductor films. 21a, 41a, 61a plating layers covering the surface, for example, nickel plating layers 22a, 42a, 62a,
It is composed of solder plating layers 23a, 43a and 63a. The nickel plating layers 22a, 42a, 62a and the solder plating layers 23a, 43a, 63a are the base conductor film 21a,
41a and 61a prevent solder erosion and migration and improve solder wettability when soldered to a predetermined circuit pattern of a printed wiring board. The surface mounting by reflow soldering becomes possible like the chip-shaped electronic component.

Of the above-mentioned terminal electrodes, the first terminal electrode 2a
Serves as a ground terminal, and the second terminal electrode 4a and the third terminal electrode 6a serve as input / output terminals, respectively.

As a result, since the dielectric layer 3 is interposed between the first coil conductor 2 and the second coil conductor 4,
A predetermined capacitance component is generated, and this capacitance component is connected to the inductance components of the respective coil conductors 2 and 4 to form the chip filter component of the equivalent circuit shown in FIG.

The method for manufacturing the above chip filter component will be described with reference to FIGS. 3 to 14. First, as shown in FIG. 3, the process is finally divided into a plurality of vertical and horizontal directions so that a plurality of insulating substrates 1 can be extracted. A large substrate 10 having division grooves 11 and 12 is prepared. In the following description of the manufacturing process, only one region 1a divided into the dividing grooves 11 and 12 will be described, but similar processes are simultaneously performed in other regions.

Next, as shown in FIG. 4, a spiral-shaped first coil conductor 2 of about 2 turns is provided on the surface side of the region 1a.
And the underlying conductor film 21a to be the terminal electrode 2a on the front side,
Further, the underlying conductor films 21a, 41a, 61a to be the terminal electrodes 2a, 4a, 6a are also formed on the back surface side by printing, drying, and baking a low-resistance metal material such as an Ag-based paste. Here, the underlying conductor film 21a of the terminal electrode 2a
The terminal electrodes 4a and 6a so as to be close to the dividing groove 12.
The underlying conductor films 41a and 61a are formed so as to be close to the two dividing grooves 11.

Next, as shown in FIG. 5, the dielectric layer 3 is formed over substantially the entire area 1a so as to cover the first coil conductor 2.
To form. Specifically, it is formed by printing, drying and firing a dielectric paste containing barium titanate as a main component.

Next, as shown in FIG. 6, the first coil conductor 2 (covered in FIG. 6 does not appear) on the dielectric layer 3.
The second coil conductor 4 and the second coil conductor 4 so as to substantially face
The underlying conductor film 41a, which is to be the second terminal electrode 4a and extends from one end on the outer peripheral side of the coil conductor 4,
For example, it is formed by printing, drying, and baking an Ag-based paste.

Next, as shown in FIG. 7, an insulating layer 5 is formed on the second coil conductor 4 so that at least the other end 4b of the second coil conductor 4 is exposed. Specifically, when printing an insulating paste (eg, glass paste), the other end 4 is controlled by controlling the paste transmission area of the screen mesh.
Printing is performed so that b is exposed, dried, and then baked.

In the figure, the insulating layer 5 extends around the other end 4b of the second coil conductor 4 and from the surrounding to the side that is the one end side 1y of the region 1a in which the third terminal electrode 6a is formed. As described above, that is, the second coil conductor 4 is formed in a substantially half region portion, but it may be formed on the entire surface of the second coil conductor 4.

Next, as shown in FIG. 8, on the insulating layer 5,
The terminal conductor 6 connected to the other end 4b of the second coil conductor 4 and extending to one end side of the region facing the second terminal electrode 4a is printed with a low resistance metal material such as Ag paste. It is formed by drying and baking.

Next, as shown in FIG. 9, an insulating protective film 7 is formed so that a part of the underlying conductor films 21a, 41a, 61a on the front surface side of the first to third terminal electrodes is exposed, and glass or the like is mainly used. It is formed by printing, drying and baking an insulating paste as a component.

Through the steps up to this point, in the region 1a, the base conductor films 21a, 41a, 61a of the first to third terminal electrodes 2a, 4a, 6a on the front surface side and the back surface side formed in the step shown in FIG. 4 are formed. The underlying conductor films 21a, 41a, 61a are arranged to face each other.

Next, as shown in FIG.
Is primarily divided along the dividing groove 11. As a result, the large-sized substrate 10 becomes a plurality of strip-shaped substrates 10a, and the end portions of the underlying conductor films 41a and 61a on both the front and back surfaces that become the second and third terminal electrodes 4a and 6a appear from the divided end faces. .

Next, as shown in FIG. 11, by using an aligning jig, the strip-shaped substrates 10a are aligned so that the divided end faces by the primary division are on the front surface side. In addition, the underlying conductor films 41a and 61a on the end faces to be the second and third terminal electrodes 4a and 6a are formed of a low resistance metal material such as Ag.
It is formed by printing, drying, and firing a system paste. As a result, the underlying conductor film 41 of the second and third terminal electrodes 4 and 6 is formed.
a and 61a are, as shown in FIG. 2, end sides 1x of the substrate 1,
In 1y, a series of base conductor films 41a and 61a having a U-shaped cross section extending from the front surface side to the end surface and the back surface is formed.

Next, as shown in FIG. 12, the strip-shaped substrate 10a is secondarily divided along the dividing groove 12 and divided into individual regions 1a to obtain the size of the substrate 1.

Next, as shown in FIG. 13, an alignment jig is used to align the divided end faces of the substrate 1, particularly the end face on which the first terminal electrodes 2a are formed, to be the front side. On the end face, the base conductor film 21a on the end face which becomes the first terminal electrode 2a
Is formed by printing, drying and firing a low resistance metal material such as an Ag-based paste. As a result, the base conductor film 21a of the first terminal electrode 2 becomes a series of base conductor film 21a having a U-shaped cross section from the front surface side to the end surface to the back surface.

Next, as shown in FIG. 14, a plating process is performed, and plating layers, for example, nickel plating layers 22a, 42 are formed on the surfaces of the base conductors 21a, 41a, 61a having a U-shaped cross section.
a, 62a and solder plating layers 23a, 43a, 63a are formed.

As a result, the chip filter component shown in FIGS. 1 and 2 is achieved.

According to the above chip filter component, the first coil conductor 2, the dielectric layer 3 and the second coil conductor 2 are provided on the insulating substrate 1.
The coil conductor 4, the insulating layer 5, and the terminal conductor 6 are overlapped with each other, and the first coil conductor 2 and the first terminal electrode 2a connected to one end on the outer peripheral side of the first coil conductor 2 and the second coil The conductor 4 and the second terminal electrode 4 connected to one end on the outer peripheral side thereof
Since it is integrated with a, the connection reliability is greatly improved.

Further, unlike the conventional chip filter parts, since the green sheets are not laminated, it is not necessary to align the green sheets and the like, and the structure can be simplified. As a result, the overall lamination reliability and connection reliability can be improved. The property is greatly improved.

Further, terminal electrodes 2, 4 for soldering to a predetermined circuit pattern (not shown) on the printed wiring board,
6 is the plated layers 22a, 23a, 42a, 43a, 62
a, 63a, the base conductor film 21
The solder erosion and migration of a, 41a and 61a can be effectively suppressed, and the solder wettability becomes excellent, and it is possible to realize surface mounting by reflow soldering jointly with other chip-shaped electronic components. It becomes an excellent chip filter component.

Further, in the manufacturing method, since the main constituent parts are repeated printing and baking using the thick film technique, manufacturing of chip filter parts manufactured by stacking and integrally baking green sheets as in the conventional case. Compared to the method,
Manufacturing yield will be improved and manufacturing control will be eased.

FIG. 15 is a plan view of a chip filter part corresponding to the second aspect of the present invention. In the figure,
The dotted line portion shows the first terminal electrode 20a extending from one end of the first coil conductor 2.

As shown in FIG. 15, the characteristic part of this embodiment is that the first terminal electrode 20, the second terminal electrode 4a, and the third terminal electrode 4a are provided.
The three terminals of the terminal electrode 6a are led to a pair of opposite sides of the insulating substrate 1, for example, 1x and 1y. For example, the first terminal electrode 20 is provided on one end 1x.
a and the second terminal electrode 4a are opposite to the edge 1x
The first terminal electrode 20a and the third terminal electrode 6a are led out to y.

Here, the first terminal electrode 20a is led out to the pair of both ends 1x and 1y, respectively.
The outer end of the coil conductor 2 may be formed into a strip-shaped terminal electrode shape extending in the direction connecting both ends 1x and 1y.

Further, as described above, the pair of both end sides 1x, 1y
The terminal electrodes having different functions, that is, the first terminal electrode 20a and the second terminal electrode 4a, and the first terminal electrode 20a and the third terminal electrode 4a.
Of the terminal electrode 6a. In this case, it is necessary to prevent a short circuit between adjacent terminal electrodes. This short circuit is caused in a manufacturing process, for example, when an end face underlying conductor film to be a terminal electrode is printed on a divided end face, sagging of the conductive paste occurs, short-circuiting adjacent end face underlying conductor films, and a printed wiring board. When soldering to the predetermined circuit pattern, a solder bridge is generated between adjacent terminal electrodes, and a short circuit phenomenon occurs.

In order to prevent this short circuit, in this embodiment, between the adjacent terminal electrodes, the concave portion 13 recessed toward the inside of the substrate,
13 is formed. The shape of the recess 13 is semicircular in FIG. 15, but if the opening width and the depth of the recess 13 are appropriately set, the recess 13 may have, for example, a semi-elliptical shape, a rectangular shape, or a triangular shape. I do not care. In addition, the preferable opening width is
For example, it is 1.0 mm or more, and the recess depth is 0.5 mm or more.

Further, in the chip filter component shown in FIG. 15, the terminal electrodes have a pair of opposite side edges 1x, 1y of the substrate 1.
Therefore, when soldering to the predetermined circuit pattern of the printed wiring board, it is only necessary to draw the circuit pattern from two directions of the mounting portion of the chip filter component (the mounting portion of the chip filter component of FIGS. 1 and 2). Therefore, the degree of freedom in designing the circuit pattern is improved, and the area occupied by the chip filter component and the circuit pattern connected thereto in the printed wiring board is reduced.

Thus, all the terminal electrodes 20a, 4a,
The productivity of the manufacturing process can be greatly improved by forming the pair of opposite sides 6a, that is, the sides 1x and 1y formed by the primary division.

In manufacturing the chip filter component shown in FIG. 15, it is important to form the first coil conductor 2 and the first terminal electrode 20a into a predetermined shape by using the large-sized substrate 10 shown in FIG. . Regarding the large-sized substrate 10, the concave portion 1 is provided between the portions where the adjacent terminal electrodes are led out.
The opening 13a is formed in advance so as to straddle the dividing groove 11 which becomes 3. Further, regarding the first coil conductor 2 and the first terminal electrode 20a, the first terminal electrode 20a extending in, for example, the orthogonal direction is provided at one end on the outer peripheral side of the first coil conductor 2.
The base conductor film 21a is connected to the base conductor film 21a, and both ends thereof are led out to the pair of end sides 1x and 1y of the substrate 1.

After that, the manufacturing is performed based on the above-mentioned FIGS. Then, the dividing groove 11 corresponding to the above-mentioned FIG.
By performing the primary division along with, all the portions where the first electrode 20a, the second electrode 4a, and the third terminal electrode 6a are formed appear on the division end surface of the division groove 11.

Thereafter, as shown in FIG. 11, in printing, drying and firing a base conductor film to be a terminal electrode on the primary division end face, the first electrode 20a, the second electrode 4a, and the third terminal electrode 6a are formed. The underlying conductor film can be collectively formed.

Therefore, after the secondary division corresponding to FIG. 12 is performed, the terminal electrodes on the edges (represented by the edge 1z in FIG. 1) orthogonal to the substrate edges 1x and 1y corresponding to FIG. It is not necessary to form the underlying conductor film, and the plating process corresponding to FIG. 14 can be immediately performed. After all, the pair of end sides 1x, 1 facing all the terminal electrodes 20a, 4a, 6a
By forming y, it is not necessary to align the individual insulating substrates 1 ...
The productivity of the manufacturing process can be greatly improved.

In FIG. 15, the first terminal electrode 20a and the second terminal electrode 4a are provided on the side of the edge 1x of the substrate 1 on the side of the edge 1x.
Although the first terminal electrode 20a and the third terminal electrode 6a are formed on the y side, they are derived from the shapes of the first coil conductor 2 and the first terminal electrode 20a, and the second coil conductor 4. By changing the shape of the second terminal electrode 4a and the shape of the third terminal electrode 6a derived from the terminal conductor 6, the edge 1 of the substrate 1 is changed.
Only the first terminal electrode 20a may be led out to the x side, and the second terminal electrode 4a and the third terminal electrode 6a may be led out to the end side 1y side.

Further, in FIG. 15, the first terminal electrode 20a
Are led to both ends 1x and 1y of the substrate 1, respectively, but may be led to only one end, for example, 1x side, and the other end, for example, 1y side may be omitted. With this configuration, only one terminal electrode, for example, the third terminal electrode 6a exists on the other end side, and therefore it is not necessary to consider prevention of short circuit with other terminal electrodes. Since it is not necessary to form an opening extending over the division groove 11 of the large-sized substrate 10 which becomes the end side 1y, the large-sized substrate 10 can be formed relatively easily.

FIG. 17 is a plan view of a chip filter component corresponding to the third invention of the present invention, which is a state in which the insulating protective film 7 is omitted for the sake of explanation.

As shown in FIG. 17, a characteristic part of this embodiment is that the insulating substrate 1 is composed of a plurality of, for example, two elements composed of two LCs.

That is, two chip filter elements having the structure shown in FIG. 15 are arranged, the first coil conductor 2, the first terminal electrode 20a formed integrally with the first coil conductor 2,
The second coil conductor 4, the second terminal electrode 4a integrally formed with the second coil conductor 4, the terminal conductor 6, and the third terminal electrode 6a integrally formed with the second coil conductor 4 correspond to two elements on one insulating substrate 1. Has been formed.

Here, a plurality of dielectric layers 3 and insulating layers 5 may be formed corresponding to each element, or may be formed continuously in each element as shown in FIG.

Further, all the terminal electrodes 20a, 4a, 6a
15 and FIG. 1 because the pair of edges 1x and 1y of the substrate 1 formed by the dividing grooves 11 face each other.
As described in the embodiment shown in FIG. 6, the manufacturing process can be greatly simplified.

For example, in FIG. 17, on the edge 1x of the substrate 1, the second terminal electrode 4a of the first element A from the upper side of the drawing,
The first terminal electrode 20a of the same element A, the second terminal B of the second element B
From the upper side of the drawing, the third terminal electrode 6a of the first element A and the first terminal electrode 20a of the same element B are drawn out from the upper side of the drawing. 1 terminal electrode 20a, 3rd terminal electrode 6a of 2nd element B, the same element B
The first terminal electrode 20a of is derived.

Further, between the terminal electrodes having different functions,
Recesses 13 are formed to prevent short circuits.

To achieve the chip filter component shown in FIG. 17, a large substrate 10 as shown in FIG. 18 is used.
That is, the region 1a defined by the dividing grooves 11 and 12 is set to a size such that a plurality of elements, for example, two elements A and B can be formed, and the opening 13a serving as a recess 13 for separating the terminal electrodes is formed.・ Is formed. Since the first coil conductor 2 and the first terminal electrode 20a have been described with reference to FIG. 16, they are omitted here.

As described above, the L-
By forming the C filter element, it is possible to handle a plurality of elements as one component according to the requirements of a predetermined circuit formed on the printed wiring board, so that the printed wiring board can be downsized, It becomes a highly effective chip filter component.

FIG. 19 shows another embodiment corresponding to the third invention, in which the chip filter part shown in FIG. 18 is miniaturized.

In the chip filter part shown in FIG. 18,
Four terminal electrodes are provided on each of the pair of side edges 1x and 1y of the substrate 1 (two first terminal electrodes 20a and two second terminal electrodes 4a on the side edge 1x, and two terminal electrodes 2 on the side edge 1x). One first terminal electrode 20a and two third terminal electrodes 6a) are formed, but in the chip filter component shown in FIG. 19, three terminal electrodes are provided on each of the pair of edges 1x, 1y of the substrate 1. Has been formed.

Each terminal electrode will be described with reference to FIGS. 19 and 20. The end side 1x of the substrate 1 has the second terminal electrode 4a of the first element A and the first terminal A of the same element A from the upper side of the figure. And the second terminal electrode 4a of the second element B is derived,
On the edge 1y of the substrate 1, the third terminal electrode 6a of the first element A and the first terminal electrode 2 of the second element B are arranged from the upper side of the drawing.
a, the third terminal electrode 6a of the second element B is formed.

That is, as shown in FIG. 20, each element A, B
The first terminal electrodes 2a of the respective elements A to the boundary portions of the respective elements so that, for example, the first terminal electrodes 2a of the respective elements A are led out from the end side 1x side of the substrate 1, and the first terminals of the respective elements B are The electrode 2a is led out from the end side 1y side of the substrate 1 to a position facing the first terminal electrode 2a of each element A.

To achieve the chip filter component having such a structure, a large substrate 10 as shown in FIG. 20 is used. That is, the region 1 defined by the dividing grooves 11 and 12
The opening 13a is set to have a size such that a plurality of elements can be formed, and serves as a recess 13 for separating the terminal electrodes.
... are formed. Also, the first coil conductor 2,
A second coil conductor 4 (not shown in FIG. 20) and a terminal conductor 6 (not shown in FIG. 20) are formed in a target shape with a line (a boundary portion between the elements A and B) passing through the two first electrodes 2a. To do.

Although FIG. 19 and FIG. 20 have been described with two elements, in the case of four elements, six elements, ..., Since there are a plurality of pairs of elements A and B in FIG. It can be easily dealt with based on the disclosed idea. In the case of three elements, five elements, ..., There are elements that do not form the above pair, but the element structure of FIG. 19 and the element structure of FIG.
And the element structure of the modification may be combined.

FIG. 21 shows another embodiment of the third invention. A characteristic part of this embodiment is that a plurality of elements, for example, a first terminal electrode integrated with one end of each of the first coil conductors 2 and 2 of the elements A and B are shared.

That is, one end of each of the first coil conductors 2 and 2 is drawn out to the boundary portion between the two elements A and B, and one end of each of the first coil conductors 2 and 2 is common to the opposite end sides 1x and 1y of the substrate 1 in a strip shape. The conductor film 200 is formed, and both ends of the common conductor 200 are led out to the end sides 1x and 1y to form common first terminal electrodes 200a and 200a, respectively. The other structure is similar to that of FIG. 19, and thus the description thereof is omitted.

FIG. 22 shows still another embodiment of the third invention. A characteristic part of this embodiment is that a first terminal electrode integrated with one end of each of the first coil conductors 2 and 2 of a plurality of elements, for example, elements A and B is shared, and one of the opposite sides of the substrate is used. Is shared only by the end side 1y of. Board 1
From the upper side of the drawing, the second terminal electrode 4a of the first element A, the third terminal electrode 6a of the same element A, the second terminal electrode 4a of the second element B, the same element The third terminal electrode 6a of B is formed, and the first common electrode 201 is formed on the edge 1y of the substrate 1.

Further, on the end side 1x of the substrate 1, four terminal electrodes 4a and 6a are divided, and a recess 13 for preventing a short circuit between them is formed.

FIG. 23 is a diagram for explaining the shape of the large-sized substrate 10 and the shapes of the first coil conductor 2 and the first common electrode 201 for achieving the chip filter component.
One end on the outer peripheral side of the first coil conductor 2 of the two elements A and B extends in a direction to be an end side 1y of the substrate 1 formed by cutting the dividing groove 11, and further, each first One end of the coil conductor 2 has a divided groove 11 which is the end side 1y of the substrate 1.
Is integrated with the underlying conductor film of the strip-shaped first common electrode 201 in the arrangement direction.

Further, the dividing groove 11 which becomes the end side 1x of the substrate 1
After the division, an opening 13a to be a concave portion 13 is formed so as to extend over the division groove 11, and the division groove 11 to be the end side 1y of the substrate 1 has a normal linear division. It is a groove.

In this embodiment, the second electrode terminal 4a and the third electrode terminal 6a are led out to the same substrate edge side, for example, 1x, as compared with the above-mentioned embodiment. This can be achieved by changing the shapes of 5 and the terminal conductor 6.

The insulating layer 5 shown in FIG. 22 is formed in an island shape corresponding to each element, but like the dielectric layer 3, it is formed continuously over each element. It doesn't matter.

According to this embodiment, since the common first terminal electrode 201 is formed widely in the element arrangement direction,
Can be stably connected to the ground potential. In addition, by setting the portion connected to the first coil conductor 2 to the first coil conductor 2 in a shortest and wide range, it is possible to more stably connect to the ground potential and improve the characteristics.

Further, like the other electronic parts on the printed wiring board, the second terminal electrode 4a and the third terminal electrode 6a are concentrated on one end side of the part when soldered to a predetermined circuit pattern. Therefore, in designing the circuit pattern of the signal line, since it does not intersect with the pattern of the ground potential connected to the first end electrode 201, the degree of freedom in setting the circuit pattern is further improved.

Although two elements have been described in FIG. 22, three elements, four elements, ... Can be used.

In each of the above-described embodiments, the spiral coil conductor pattern has a substantially rectangular shape, but the shape is not limited to a rectangular shape, and various shapes such as a circular shape and an elliptical shape can be used.

[0093]

As described above, according to each of the inventions, since each element component can be superposed on the heat-resistant insulating substrate, the manufacturing process can be improved as compared with the conventional green sheet laminating method. Is simplified, and the connection reliability is greatly improved. For example, since the first terminal electrode extending from one end of the first coil conductor and the second terminal electrode extending from one end of the second coil conductor are respectively integrated with the coil conductor, their connection The reliability is improved and the manufacturing process is simplified.

Further, since all the terminal electrodes can be formed on a pair of opposite edges of the substrate, the manufacturing process can be greatly simplified, and the circuit pattern can be laid out even when it is arranged on the printed wiring board. Is 2 on the edge of the board
Since it can be formed from the direction, the degree of freedom of the circuit pattern is improved, and the chip filter component is highly practical.

Further, since a plurality of elements can be integrated on one board, when arranging them on a printed wiring board,
The area occupied by the chip filter parts can be reduced, which can greatly contribute to downsizing of the printed wiring board.

Further, according to the manufacturing method, the plating layer for preventing the solder erosion when soldering on the printed wiring board is performed in the final step of the manufacturing step, so that the manufacturing step can be simplified.

[Brief description of drawings]

FIG. 1 is a perspective view of a chip filter component according to a first invention.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 4 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 5 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 6 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 7 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 8 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 9 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 10 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 11 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 12 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 13 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 14 is a plan view of one step for explaining the method of manufacturing the chip filter component of the present invention.

FIG. 15 is a plan view of a chip filter component according to a second invention.

16 is a plan view of one step for explaining the method of manufacturing the chip filter component of FIG.

FIG. 17 is a plan view of a chip filter component according to a third aspect of the present invention with an insulating protective film omitted.

FIG. 18 is a plan view of one step for explaining the method of manufacturing the chip filter component of FIG.

FIG. 19 is a plan view showing another embodiment of the chip filter component of the third invention, with an insulating protective film omitted.

20 is a plan view of one step for explaining the method of manufacturing the chip filter component shown in FIG. 19. FIG.

FIG. 21 is a plan view of a step illustrating another method for manufacturing the chip filter component shown in FIG. 19.

FIG. 22 is a plan view of another embodiment of the chip filter component of the third invention, with an insulating protective film omitted.

FIG. 23 is a plan view of a step illustrating another method for manufacturing the chip filter component shown in FIG. 22.

FIG. 24 is an equivalent circuit diagram of a chip filter component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Heat resistant insulating substrate 2 ... 1st coil conductor 2a, 20a, 200a, 201 ... 1st terminal electrode 3 ... Dielectric layer 4 ... 2nd coil conductor 4a ... Second terminal electrode 5 ... Insulating layer 6 ... Terminal conductor 6a ... Third terminal electrode 10 ... Large substrate 1a ... Area 11 and 12 ... ..Division grooves 13 ... Recesses 13a ... Openings 1x, 1y ... End sides

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Masato Takeda 22 Kyocera Corporation, 5-5 Higashinokitainouemachi, Yamashina-ku, Kyoto-shi, Kyoto Prefecture

Claims (4)

[Claims] 1. A spiral-shaped first coil conductor formed on a heat-resistant insulating substrate such that one end thereof is led out to an end side of the substrate, and the first coil conductor so as to cover the first coil conductor. A dielectric layer formed on substantially the entire surface of the substrate, and a spiral shape formed on the dielectric layer so as to substantially face the first coil conductor and one end of which is led to an edge of the substrate. A second coil conductor, an insulating layer formed on the second coil conductor so as to expose at least the other end of the second coil conductor, and the second insulating layer on the insulating layer. A chip filter component, characterized in that terminal conductors led out from the other end of the coil conductor to the edge of the substrate are superposed on each other. 2. A spiral-shaped first coil conductor, a dielectric layer, and a spiral-shaped second coil conductor that substantially faces the first coil conductor are insulated from each other on a heat-resistant insulating substrate. A layer, and a terminal conductor connected to the second coil conductor, and the first coil conductor,
A chip filter component in which each of one ends of the second coil conductor and the terminal conductor is led out to an edge of the substrate as first to third terminal electrodes, wherein the first to third terminal electrodes are the substrate. A chip filter component, which is formed on a pair of opposite side edges of the substrate and on which the two terminal electrodes are led out, are formed with recesses for partitioning the two terminal electrodes. . 3. A plurality of spiral-shaped first coil conductors on a heat-resistant insulating substrate, a dielectric layer covering the plurality of first coil conductors, and substantially on the dielectric layer. A plurality of spiral second coil conductors facing the first coil conductor, and an insulating layer formed on each of the second coil conductors such that the other end of each of the second coil conductors is exposed. And a plurality of terminal conductors that are respectively overlapped with each other so as to be connected to the other end of each of the second coil conductors, and a plurality of first terminal electrodes extending from one end of each of the first coil conductors and a second coil. A plurality of second terminal electrodes extending from one end and a plurality of third terminal electrodes, which are terminal conductors, are led out to a pair of opposite substrate edges parallel to the arrangement direction of the plurality of coil conductors, and one end Between the terminal electrodes that are adjacent to each other and are drawn to the side. Chip filter components, characterized in that recesses partitioning is formed by forming. 4. A spiral-shaped first substrate on a heat-resistant insulating substrate.
A coil conductor, a dielectric layer, and a spiral second coil conductor that substantially opposes the first coil conductor,
An insulating layer and a terminal conductor connected to the other end of the second coil conductor are overlapped with each other, and one end of the first coil conductor, one end of the second coil conductor and one end of the terminal conductor are A method of manufacturing a chip filter component, each of which is led out as a first to a third terminal electrode, wherein a step of preparing a large-sized substrate in which vertical and horizontal dividing grooves are formed to divide into regions of the heat-resistant insulating substrate; A conductor film that will become the first coil conductor and the first terminal electrode on the front surface of the above, and a conductor film that will become the first, second, and third terminal electrodes on the back surface of each region by printing and firing a conductive paste And a step of forming a dielectric layer covering the first coil conductor on the surface of each region by printing and firing a dielectric paste, and a first coil conductor on the dielectric layer of each region. The second one that is substantially opposite to And forming a conductive film to be the second conductor and the second terminal electrode by printing and firing a conductive paste, and so that at least the other end of the second coil conductor is exposed on the second coil conductor in each region. A step of forming an insulating layer on the insulating layer in each region by printing and firing an insulating paste, and a third terminal connected to the other end of the second coil conductor on the insulating layer in each region and led to the edge of the substrate. A step of forming a terminal conductor including an electrode by printing and firing a conductive paste; a step of primary dividing the large-sized substrate into strips; and an end face exposed by the primary division, terminals on both front and back surfaces of each region A step of forming a conductor film for connecting the conductor films to be electrodes by printing and firing a conductive paste, a step of secondarily dividing the strip-shaped substrate, and the first to third terminal electrodes Front, back, and end conductors Above, the manufacturing method of the chip filter components, characterized in that the step of performing an electrode plating, including.