JPH07130575A - Laminated filter component - Google Patents

Abstract

PURPOSE:To enable a current component of high frequency which flows through a ground-side conductor and must be eliminated to be removed by a method wherein a ground electrode is so connected to one end of each split ground-side conductor as to enable ground ocurrents which flow through the ground-side conductors to flow in the same direction with a signal current which flows through a signal-side conductor. CONSTITUTION:A ground-side conductor 2, a dielectric layer 3, and a signal-side coil conductor 4 are laminated on an insulating board 1, and the ground-side conductor 2 is divided into split conductor groups 2A to 2D. A ground terminal electrode 2a is so connected to one end each conductor 21a to 23c as a to enable ground currents which flows through the conductors 21a to 23c of the split conductor groups 2A to 2D flow in the same direction with a signal current which flows through a signal-side coil conductor 4. By this stetup, a current component of high frequencies to eliminate can be made to pass easily and discharged to a ground.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to filter characteristics, and more particularly to a wide band laminated filter component.

[0002]

2. Description of the Related Art Conventionally, as a filter component shown in the equivalent circuit of FIG. 18, a coil conductor on the signal side and a coil conductor on the ground side are made of a dielectric material, as proposed in Japanese Patent Laid-Open No. 3-21810. They were facing each other through the layers.
Thus, there is a distributed constant type filter component in which a capacitance is generated between the signal side coil conductor and the ground side coil conductor, and the inductance component of the coil conductor is combined.

[0003]

In the above filter component, when a signal current is passed through the signal side coil conductor, the signal side coil conductor and the ground side coil conductor are magnetically coupled, and the dielectric layer is thinned. In that case, the coupling becomes noticeable and interferes with the ground current flowing through the coil conductor on the ground side, deteriorating the filter characteristics.

As a means for preventing this, there is a method in which the ground side coil conductor is divided into a plurality of pieces and the divided ground side conductors are grounded to the ground (Japanese Patent Laid-Open No. 3-2).
15917).

In practice, however, even if the divided ground side conductor is simply grounded, the overall inductance component does not decrease significantly, and the current of the high frequency component to be eliminated flowing in the divided ground side conductor is sufficient. There is a problem in that the band does not flow, and as a result, the band, for example, the -20 dB band becomes extremely narrow.

The present invention has been devised in view of the above problems, and an object thereof is to effectively remove a current of a high frequency component to be eliminated flowing in a ground side conductor facing a signal side coil conductor. As a result, it is to provide a filter component having a wide -20 dB band.

[0007]

According to a first aspect of the present invention, a divided ground-side conductor, a dielectric layer, and a spiral signal-side coil conductor are superposed on an insulating substrate, and the divided ground is formed. A multilayer filter component in which a side conductor is disposed so as to substantially face the signal side coil conductor, wherein each of the divided ground side conductors has a ground current flowing through the ground side conductor at one end thereof. The multilayer filter component is connected to the ground terminal electrode such that the flow direction is the same as the flow direction of the signal current flowing through the signal side coil conductor.

According to a second aspect of the present invention, a coil pattern serving as a signal-side coil conductor and a ground-side conductor pattern are disposed between layers of a plurality of laminated dielectric layers such that both patterns face each other with a dielectric layer interposed therebetween. In the multilayer filter component arranged, the ground side conductor pattern arranged between the dielectric layers has a signal current flowing in a signal side coil conductor pattern in at least one end of which a flow direction of a ground current flowing in the ground side conductor pattern is In the laminated filter component, the ground terminal electrode is connected so as to be in the same direction as the flow direction of.

[0009]

According to the present invention, since the ground side conductor is composed of a plurality of divided ground side conductors, the inductance component of the entire ground side conductor can be reduced, and the signal side coil conductor is substantially It is possible to obtain an LC circuit based on the inductance component and the capacitance component between the signal side coil conductor and the ground side conductor.

Further, since the terminal electrodes of the divided ground side conductors are arranged at one end side so that they flow in the same direction as the signal current direction of the opposing signal side coil conductors, the high frequencies to be eliminated. The component currents will easily pass and be effectively removed to ground.

As a result, in the filter characteristic, the LC circuit is constituted by the inductance component of the coil conductor on the signal side and the capacitance component between the divided ground-side conductors facing the inductance component, and the high-frequency characteristic is obtained. Noise is reduced, and a laminated filter component suitable for practical use has a wide band particularly at -20 dB.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings.

FIG. 1 is an external perspective view of a laminated filter component of the present invention, and FIG. 2 is a sectional view taken along line XX in FIG.

The laminated filter component of the present invention comprises a heat-resistant insulating substrate 1, a ground side conductor 2 composed of a plurality of divided conductors 21a to 23c, a dielectric layer 3, a spiral signal side coil conductor 4, and a dielectric layer 5. It is composed of a terminal conductor 6 and an insulating protective film 7.

The insulating substrate 1 is made of a heat resistant insulating material such as a rectangular ceramic.

The ground side conductor 2 is made of a conductor material containing Ag, Cu or the like as a main component, and as shown in FIG. 4, is divided into four along a diagonal line as a whole. The shape is similar to the spiral shape for one turn. Here, the four conductor groups along the diagonal are referred to as divided conductor groups 2A to 2D.

For example, the divided conductor group 2A is composed of an outermost peripheral conductor 21a parallel to and close to the side A of the insulating substrate 1 and an inner peripheral conductor 22a adjacent to the outermost peripheral conductor 21a. The group 2B is composed of an outermost conductor 21b and an inner conductor 22b adjacent to the outermost conductor 21b.
C includes an outermost conductor 21c, an inner conductor 22c and an innermost conductor 23c adjacent to the outermost conductor 21c, and the divided conductor group 2D includes an outermost conductor 21d and an innermost adjacent conductor 21d. It is composed of a conductor 22d.

Of the four divided conductor groups 2A to 2D, two divided conductor groups 2A and 2D, 2B and 2C are connected. In FIG. 4, the outermost conductor 2 of the divided conductor group 2D
1d on the upper side in the figure and the outermost conductor 21 of the divided conductor group 2A
a is connected to the right side in the figure, and is connected to the lower side of the outermost conductor 21b of the divided conductor group 2B in the figure and the left side of the outermost conductor 21c of the divided conductor group 2C in the figure. The connecting conductors are the first ground terminal electrode 24a and the second ground terminal 24b exposed on the sides A and C of the substrate.

With the above configuration, the divided conductor groups 2A to 2D
The flow direction of the ground current in each of the conductors 21a to 23c is
The direction is indicated by the dotted arrow in FIG. Here, what is important is that the flow direction of the ground current is the same as the flow direction of the signal current of the signal side coil conductors 4 facing each other.

The dielectric layer 3 is made of a high dielectric constant dielectric material such as barium titanate, and is formed so as to cover the entire ground side conductor 2 as shown in FIG.
Its thickness is about 20 to 40 μm.

The signal-side coil conductor 4 is made of a conductive material such as Ag or Cu, and has a spiral shape of, for example, two turns so as to substantially face the ground-side conductor 2 as shown in FIG. One end of the outer peripheral portion extends to a side D of the insulating substrate 1, that is, a side orthogonal to the sides A and C where the ground terminal electrodes 24a and 24b are formed. This extended portion becomes the signal output side terminal electrode 4a.

The insulating layer 5 is made of an insulating material such as glass as a main component, and as shown in FIG. 7, the other end 4b on the inner peripheral side of the signal side coil conductor 4 is exposed to expose the signal side coil. It is formed so as to cover the conductor 4.

The terminal conductor 6 is made of a conductor material such as Ag or Cu, and is connected to the exposed other end of the signal side coil conductor 4 on the insulating layer 5 as shown in FIG. It is formed so as to extend to the side B of 1. This extended portion becomes the signal input side terminal electrode 6a.

The insulating protective film 7 is made of an insulating material containing glass or the like as a main component, and as shown in FIG. 9, at least the third terminal electrode 6a is exposed to expose the terminal conductor 6 and the insulating layer 5. It is formed on substantially the entire surface of the substrate 1 so as to cover the second coil conductor 4 and the like.

The first ground terminal electrode 24a and the second ground terminal electrode 24a
1 to 3, the ground terminal electrode 24b of the connection conductor 24c of the end face and the back face of the sides A and C of the substrate 1 is
Are integrated through. This integrated terminal electrode is particularly called a ground terminal electrode 2a.

Further, the terminal electrodes 4a and 6a are formed in a U-shaped cross section over each of the front surface, the end surface and the back surface of the substrate 1. The structure of each terminal electrode 2a, 4a, 6a is shown in FIG.
Like the output side terminal electrode 4a, a base conductor film 41 made of a metal material such as Ag or Cu similar to the coil conductor 4;
The base conductor film 41 is composed of a single-layer or multi-layered plating layer 42a, 42b.

As a result, the ground side conductor 2, more specifically, each conductor 21a of the divided conductor groups 2A to 2D divided into four.
23c and the signal-side coil conductor 4, a predetermined capacitance component is generated in the dielectric layer 3, and this capacitance component is connected to the inductance component of the signal-side coil conductor 4 to form L- It becomes a laminated filter component of C circuit.

A method for manufacturing the above-mentioned laminated filter component will be described with reference to FIGS. It should be noted that FIGS. 3 to 8 show only one element region (hereinafter, referred to as the insulating substrate 1) in a large insulating substrate in which vertical and horizontal dividing grooves are formed so that a plurality of insulating substrates 1 can be extracted. It was

First, as shown in FIG. 3, on the back surface side of the insulating substrate 1, a conductor film serving as the connecting conductor 24c is provided between the side A and the side C, and a back surface side serving as the input side terminal electrode 6a at the side B portion. The conductive film on the back side, which becomes the output side terminal electrode 4a, is formed on the side C part of the conductive film by printing, drying and baking the conductive paste.

Next, as shown in FIG. 4, on the front surface side of the insulating substrate 1, the coil conductor 2 and the ground terminal electrode 24a composed of the conductors 21a to 23c of the four divided conductor groups 2A to 2D, Conductors 24b are formed by printing, drying, and baking a conductive paste. In addition, in FIGS. 3 and 4, the baking process may be performed in the same process.

Next, as shown in FIG. 5, the divided conductor group 2A
The dielectric layer 3 is formed so as to cover the ground side conductor 2 composed of 2D. Specifically, it is formed by printing, drying and firing a dielectric paste containing barium titanate as a main component.

Next, as shown in FIG. 6, on the dielectric layer 3, the signal side coil conductor 4 and the signal side are arranged so as to substantially face the ground side conductor 2 (not covered by the ground side conductor 2 in FIG. 6). A conductor to be the output terminal electrode 4a extending from one end on the outer peripheral side of the coil conductor 4 (side D side of the substrate 1) is formed by printing, drying, and firing a low-resistance metal material such as an Ag-based paste.

Next, as shown in FIG. 7, an insulating layer 5 is formed on the signal side coil conductor 4 so that at least the other end 4b of the signal side coil conductor 4 is exposed. Specifically, when printing an insulating paste (eg, glass paste), the other end 4 is controlled by controlling the paste transmission area of the screen mesh.
Printing is performed so that b is exposed, dried, and then baked.

In the figure, the insulating layer 5 is formed in a region where the terminal conductor 6 including the other end 4b of the signal side coil conductor 4 is formed, that is, in half of the entire substrate. It may be formed on the entire surface of.

Next, as shown in FIG. 8, on the insulating layer 5,
The other end 4b of the signal side coil conductor 4 is connected to the side B of the substrate 1.
The terminal conductor 6 extending to the side and the conductor to be the input terminal electrode 6a are printed with a low resistance metal material, for example, an Ag-based paste.
It is formed by drying and baking.

Next, as shown in FIG. 9, each terminal electrode 24
The insulating protective film 7 is formed by printing, drying and baking an insulating paste containing glass or the like as a main component so that a part of a, 24b, 4a and 6a is exposed.

After that, the large-sized substrate is divided along the dividing grooves and divided into individual insulating substrates 1.

Next, as shown in FIG. 10, each of the terminal electrodes 24a and 24b and the connection conductor 24c on the back surface are formed on the divided end faces.
Between the front surface conductor and the rear surface conductor which become the input / output terminal electrodes 4a and 6a.
d, 4c and 6c are formed by baking a conductive paste, and then a plating layer is formed on the surface of the base conductor of each terminal electrode 2a, 4a and 6a.

In FIG. 10, for example, primary division is performed so that the sides A and C of the substrate 1 are exposed, then the end face conductor 24d is formed, and then the sides B and D of the substrate 1 are exposed. 2nd division as shown in FIG.
The plating treatment may be performed after forming a and 6a.

As described above, according to the laminated filter component of the present invention, the ground-side conductor 2 has a plurality of conductors 21a to 2a.
Since it is divided into 3c, the inductance component of the ground side conductor 2 can be reduced, and the inductance component of the signal side coil conductor 4 and the conductors 21a to 23c of the ground side conductor 2 and the signal side coil conductor are substantially included. It is possible to obtain the filter element of the LC circuit due to the capacitance component between the two.

As shown in FIG. 4, the ground currents of the conductors 21a to 23c of the divided conductor 2 on the ground side flow in the same direction as the signal current of the coil conductor 4 on the signal side. Therefore, the current of the high frequency component to be removed easily passes and is removed to the ground.

As a result, in the filter characteristic, the LC circuit is substantially constituted by the inductance component of the coil conductor on the signal side and the capacitance component between the divided coil conductors on the ground side facing the inductance component, and High-frequency noise is reduced, and a laminated filter component suitable for practical use has a wide band particularly at -20 dB.

The inventor of the present invention has a multilayer filter component of the present invention in which the ground side conductor 2 is divided as shown in FIG.
The filter characteristics were measured for the multilayer filter component of the comparative example in which the ground-side conductor 2 corresponding to (1) has a series of spiral shapes.

FIG. 11 is a filter characteristic diagram of the product of the present invention, and FIG. 12 is a filter characteristic diagram of the comparative product. As is apparent from the figure, when comparing the band of -20 dB, for example, the product of the present invention has a frequency of 360 MHz, and the comparison product has a frequency of 7 MHz.
At 0 MHz, the inductance component is reduced due to the division of the ground side conductor 2, and further the high frequency component removability due to the induced current by the signal side coil conductor 4 by using the divided conductors 21a to 23c in consideration of the flow direction of the ground current. The enhancement achieves a broad band laminated filter component.

In the above embodiment, the ground-side conductor 2
Is divided into four divided conductor groups 2A to 2D,
The divided conductor groups 2A and 2D are connected to each other, and the divided conductor groups 2B and 2C are connected to each other. However, the connection may be changed depending on the current flow direction of the signal side coil conductor 4 facing the ground side conductor 2. You can

Further, the first to fourth ground side terminal electrodes may be formed respectively without connecting the divided conductor groups 2A to 2D.

FIG. 13 is a second invention, and is an external perspective view of a laminated filter component, and FIG. 14 is YY in FIG.
FIG. 15 is a sectional view taken along line ZZ in FIG. 13, and FIG. 16 is an exploded perspective view.

The laminated filter component has six dielectric layers 1
01a to 101f and the respective dielectric layers 101a to 101f
Ground side conductor pattern 102b formed between the layers of
102f, signal side coil conductor patterns 103b to 103
A laminated body main body 111 made of f, and an input-side terminal electrode 11 formed on a pair of opposing end faces of the laminated body main body 111.
2. The output side terminal electrode 113 and the ground side terminal electrodes 114a and 114c formed on the other pair of end faces.

Specifically, as shown in FIG. 16, the ground side conductor patterns 102b to 104f, the signal side coil conductor patterns 103b to 103f, and the via hole conductor 104.
b-104e are formed by printing or filling a conductive paste, and dielectric green sheets having a predetermined shape to be the dielectric layers 101b to 101f and a dielectric green sheet to be the dielectric layer 101a are laminated and pressure-bonded, and after molding , Formed by integral sintering.

Such a signal side coil conductor pattern 1
Via-hole conductors 104b to 104e for connecting to the other ends of the signal-side coil conductor patterns 103c to 103f formed between adjacent layers are formed at one ends of the 03b to 103e.

Also, the signal side coil conductor pattern 103f
Has one end extending to the end (on the side of the end D of the laminated body 111) between the dielectric layers 101e and 10f, and is connected to the input terminal electrode 112. The other end of the signal side coil conductor pattern 103b has dielectric layers 101a and 101a.
It extends to the end portion (on the side of the end side B of the laminated body 111) between the layer and b, and is connected to the output terminal electrode 113.

Ground side conductor patterns 102b, 102
d and 102f are formed so as to face the signal-side tile conductor patterns 103c and 103e between adjacent layers, and one end thereof is an end portion of each layer (edge C of the laminated body 111).
Side) and is connected to the ground terminal electrode 114c. In addition, the ground side conductor patterns 102c and 102
e is a signal-side tile conductor pattern 103 between adjacent layers
b, 103d, 103f, and one end thereof is an end portion of each layer (edge A of the laminated body 111).
Side) and is connected to the ground terminal electrode 114a. The ground terminal electrodes 114a and 114c are integrated by a conductor on the back surface side of the laminated body 111, as shown in FIGS.

Such a laminated body 111 is shown in FIG.
It is created using the green sheets shown in (a) and (b).

FIG. 17A shows the dielectric layers 101b and 10b.
It is a top view of the green sheet used as 1d and 101f.
For example, on the green sheet that becomes the dielectric layer 101d, a through hole that becomes the via-hole conductor 104d is formed at a position that becomes one end of the substantially C-shaped signal-side coil conductor pattern 103d, and then this is formed by a conductive paste. While filling the through holes, a substantially U-shaped signal side coil conductor pattern 103d and a substantially L-shaped ground side conductor pattern 102d are formed by printing.

Here, one end of the substantially L-shaped ground-side conductor pattern 102d, for example, the end portion of the L-shaped short side extends to the side C side of the green sheet. Regarding the dielectric layer 101b, the signal side coil conductor pattern 1 is used.
An extension conductor extending to the side B side of the green sheet is provided at the other end of 03b, and an extension conductor extending to the side D side of the green sheet is provided at one end of the signal side coil conductor pattern 103f for the dielectric layer 101f. Form each.

FIG. 17B shows the dielectric layers 101c and 10c.
It is a top view of the green sheet used as 1e. For example, on the green sheet to be the dielectric layer 101c, a through hole to be the via-hole conductor 104c is formed at a position which is one end of the substantially C-shaped signal-side coil conductor pattern 103c, and then this is formed by a conductive paste. While filling the through holes, a substantially U-shaped signal-side coil conductor pattern 103c and a substantially L-shaped ground-side conductor pattern 102c are formed by printing. Here, one end of the substantially L-shaped ground-side conductor pattern 102c, for example, L
The ends of the character-shaped short sides extend to the side A of the green sheet.

The respective green sheets and the green sheet to be the dielectric layer 101a are laminated by thermocompression bonding, cut into the shape of the laminated body 111 or divided grooves are formed, and after integral sintering, it is necessary. Corresponding to the input / output terminal electrodes 112, 113 and the sides A, C on the outer peripheral surface of the laminated body 111, for example, the end faces corresponding to the sides B, C of the laminated body 111. The ground-side terminal electrodes 114a and 114c are formed on the respective end faces by baking a conductive paste.

As a result, the signal side coil conductor pattern 1
The other end of 03b is the output side terminal electrode 113, and the one end of the signal side coil conductor pattern 103f is the input side terminal electrode 11
2, ground side conductor patterns 102b, 102d, 1
One end of 02f is connected to the ground side terminal electrode 114c, and one end of the ground side conductor patterns 102c and 102e is connected to the ground side terminal electrode 114a.

Therefore, the flow of the signal current of the signal side coil conductor patterns 103b to 103f in the laminated body main body 111 is as shown by the solid line arrow, and the ground conductor pattern 102 is formed.
The flows of the ground currents of c to 102e are as shown by the dotted arrows, and the currents of the signal side coil conductor patterns 103b to 103f and the ground conductor patterns 102c to 102e which face each other with the dielectric layers 101b to 101e sandwiched therebetween. Flow in the same direction.

As a result, the ground side conductors 102c to 102c
02e is divided into a plurality of parts, each of which has a ground potential, so that the inductance component of the ground side conductors 102c to 102e can be reduced, and substantially the inductance components of the signal side coil conductor patterns 103b to 103f and the signal side. An LC filter element can be obtained by the capacitance component generated between the coil conductor patterns 103b to 103f and the ground side conductor patterns 102c to 102e.

Further, each ground side conductor pattern 102c
Since the flow direction of the ground current of 102e flows in the same direction as the direction of the signal current of the coil conductors 103b to 103f on the signal side, the current of the high frequency component to be eliminated easily passes to the ground. It will be removed, and it will become a broadband filter component with a wide band of, for example, -20 dB.

In the first invention, the dielectric layer 3 may be formed by a thin film technique such as sputtering of tantalum pentoxide.

In the second invention, the signal side coil conductor pattern and the ground side conductor pattern are arranged side by side on the green sheet. However, for example, only one signal side coil conductor pattern is formed on one green sheet, and the other is arranged. Only the ground side conductor pattern may be formed on the green sheet. Various terminal electrode structures are possible, such as using a via-hole conductor for the terminal electrode and drawing it to the front surface or the back surface to connect the terminal electrode to this via-hole conductor. Further, the number of laminated green sheets can be arbitrarily changed according to the filter characteristics.

[0064]

As described above, according to the present invention, since the ground-side conductor is divided into a plurality of parts and each is connected to the ground terminal electrode, the inductance component of the ground-side conductor pattern can be reduced. Yes, practically,
LC due to the inductance component of the signal side coil conductor and the capacitance component between the signal side coil conductor and the ground side conductor
The circuit can be obtained.

Further, since the ground current flows through each conductor or conductor pattern forming the divided ground side conductor in the same direction as the signal current direction of the signal side coil conductor, the current of the high frequency component to be eliminated easily passes. However, it will be removed to the ground.

As a result, the filter characteristics become a laminated filter component suitable for practical use, which has a wide band particularly at -20 dB.

[Brief description of drawings]

FIG. 1 is a perspective view of a laminated filter component according to the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is a plan view of a main manufacturing process of the laminated filter component of the present invention.

FIG. 4 is a plan view of the main manufacturing process of the laminated filter component of the present invention.

FIG. 5 is a plan view of a main manufacturing process of the laminated filter component of the present invention.

FIG. 6 is a plan view of a main manufacturing process of the laminated filter component of the present invention.

FIG. 7 is a plan view of main manufacturing steps of the laminated filter component of the present invention.

FIG. 8 is a plan view of main manufacturing steps of the laminated filter component of the present invention.

FIG. 9 is a plan view of main manufacturing steps of the laminated filter component of the present invention.

FIG. 10 is a plan view of main manufacturing steps of the laminated filter component of the present invention.

FIG. 11 is a characteristic diagram showing the filter characteristics of the product of the present invention.

FIG. 12 is a characteristic diagram showing filter characteristics of a comparative product.

FIG. 13 is an external perspective view of the laminated filter component of the second invention.

14 is a cross-sectional view taken along line YY in FIG.

FIG. 15 is a sectional view taken along line ZZ in FIG.

FIG. 16 is an exploded perspective view of the laminated filter component of the second invention.

17 (a) and 17 (b) are plan views of a green sheet, respectively.

FIG. 18 is an equivalent circuit diagram of a filter component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... Ground side conductor 2A to 2D ... Divided conductor group 21a to 23c ... Conductor 2a ... Ground terminal electrode 3 ... Dielectric Layer 4 --- Signal side coil conductor 4a --- Output side terminal electrode 5 --- Insulating layer 6 --- Terminal conductor 6a --- Input side terminal electrode 111 ... Laminate body 101a to 101f ... Dielectric layer 102b to 102f ... Ground side conductor pattern 103b to 103f ... Signal side coil conductor pattern 104b to 104e ... Via hole conductor

Claims (2)

[Claims] 1. A divided ground side conductor, a dielectric layer, and a spiral signal side coil conductor are superposed on an insulating substrate, and the divided ground side conductor is substantially a signal side coil conductor. Is a laminated filter component arranged so as to face each other, wherein each of the divided ground-side conductors has a signal current flowing in a signal-side coil conductor at one end thereof in which a flow direction of a ground current flowing in the ground-side conductor is A multilayer filter component, in which the ground terminal electrodes are connected so as to be the same in the flow direction of. 2. A coil pattern serving as a signal side coil conductor and a ground side conductor pattern are arranged between layers of a plurality of laminated dielectric layers such that both patterns face each other with a dielectric layer interposed therebetween. A multilayer filter component, wherein the ground-side conductor pattern arranged between the dielectric layers has a signal-side coil conductor pattern in which at least one end of the ground-side conductor pattern has a flow direction of a ground current flowing through the ground-side conductor pattern that faces the dielectric layer. A multilayer filter component in which a ground terminal electrode is connected so as to be in the same direction as a flow direction of a signal current flowing through.