JPH07101701B2 - Film carrier, molding method using the same, and mold die - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to, for example, a long film carrier on which an IC chip is mounted, and a resin-sealed molding of the IC chip and a portion to be sealed of a required peripheral portion thereof. There is a feeling of improvement in the molding method and the molding die for achieving this.

[Conventional technology]

The degree of integration of IC chips tends to increase due to the recent demand for multi-functionality.

For this reason, the leads have been made to have an extremely high density and a large number of pins, and the products themselves have been made to be ultra-small and ultra-thin in order to use IC cards.

As IC chip mounting technology that can meet these requirements,
The TAB (Tape Automated Bonding) method is known.

In this TAB method, a large number of leads are mounted on a carrier tape made of a polyimide resin film, and each inner lead and each surface electrode of the IC chip are connected via a bump, respectively. The structure of the film carrier used will be described with reference to FIGS. 13 to 16.

As shown in the figures, sprocket holes 2 for feeding the tape are formed at both edges of the carrier tape 1 made of a polyimide resin film.

A mounting hole for the IC chip 3 is formed in the center of the carrier tape 1.

The support ring 5 is inserted into the hole through the tie bar 4.
And a device hole 6 for fitting the IC chip 3 in the support ring 5, and
Outer lead holes 7 are provided on the outer circumference of the support ring 5 for arranging outer leads.

Further, a large number of leads 8 which are conductors are integrally mounted in the mounting holes of the IC chip 3 described above. Further, the inner leads 8 _{1 of each} of the leads 8 are projected into the device hole 6 described above, and the outer leads 8 ₂ of each of the leads 8 are installed on the outer lead hole 7 described above. Further, a test pad 8 ₃ is provided at an extended end of each outer lead 8 ₂ .

Further, IC chip 3 described above, the inner leads a bonding for connecting the surface thereof electrodes and the inner leads ₈₁ via bumps 9 are securely mounted on the carrier tape 1.

In addition, the IC chip 3 on the carrier tape 1 and its peripheral portion,
That is, the sealed portion 10 of the film carrier set corresponding to the shape of the cavity of the molding die is resin-sealed by means such as a transfer molding method, and then cut and separated from the outer lead 8 ₂ portion. by, the respective electrodes of the outer leads 8 ₂ and the printed wiring board in the product itself, so-called, are those which can be respectively connected by outer lead bonding.

[Problems to be solved by the invention]

By the way, when the above-mentioned sealed portion of the carrier tape is resin-molded by the molding method, there are the following problems in resin molding.

For example, based on the normal transfer molding method,
First, a film carrier is supplied to a predetermined position of a mold (both upper and lower molds) to perform mold clamping, and then a resin material heated and melted in a pot of the mold is formed into a mold including a runner and a gate. When pressure is injected into the cavity of the mold through the transfer passage 11, the sealed portion 10 of the film carrier is sealed in the mold package 12 formed corresponding to the shape of the mold cavity. Will be done (see Figure 16).

However, when clamping the upper and lower molds,
At the peripheral edge of the cavity on the PL (parting line) surface, a gap corresponding to the thickness t of the lead 8 (usually about 35 μm)
m) and a space portion composed of a gap corresponding to between the respective outer leads _82, i.e., since the inner and outer communicating portion 13 of the mold cavity as shown in Fig. 16 occurs, which is injected into the mold cavity the molten The resin material is passed from the communicating portion 13 to the outer lead hole 7
It will flow out into the mold and will further penetrate between the PL surfaces of both molds to form a resin burr.

Therefore, because it is not possible to obtain a predetermined resin pressure, voids are formed inside and outside the mold package, weakening its mechanical strength, and an unfilled state in the cavity occurs due to insufficient amount of resin, ensuring the sealed part such can not be performed resin-seal-molding, further, such a leaked resin material adhered to the outer leads 8 ₂ causes the poor connection between the outer lead and the printed wiring board of the electrode, the kind In addition to reducing the quality and reliability of the product, both types above, P.
There is an adverse effect such as requiring a reliable cleaning process for the L surface.

To prevent leakage resin from such mold cavity, for example, the PL surface of the mold (upper and lower dies), space between the outer leads 8 ₂ described above (i.e., the communicating portion of the cavity and out Although it is effective to dispose a concave-convex fitting portion that fits in 13), this kind of means for improving the mold structure cannot be adopted for the following reason.

That is, the pitch p of the standard outer leads 8 ₂ is about 45 due to the above-mentioned demands for ultra-high pin count and ultra-miniaturization of the leads 8.
It is set to 0 μm (inner lead pitch is about 150 μm), and the lead thickness t is usually about 35 μm. Therefore, it is extremely difficult to obtain a structure of a molding die adapted to such standard dimensional accuracy. is there.

Therefore, the present invention provides a film carrier improved so as to efficiently and surely prevent resin leakage to the outside of the sealed portion of the film carrier during molding, and the film carrier. It is an object of the present invention to provide a molding method capable of molding a molded product having a moisture resistance function, high quality and high reliability, and a molding die thereof by using.

[Means for solving problems]

A film carrier according to the present invention for solving the above-mentioned conventional problems includes a large number of leads and a support ring for supporting the leads, and an inner lead and an IC chip in each of the leads are integrated. In the film carrier connected to each other, required small piece portions are respectively provided at positions between the leads in the support ring, and the small piece portions are respectively joined to the cavity peripheral portion of the molding die. It is characterized by being extended.

Further, the film carrier according to the present invention is characterized in that it is configured in a structure of a plurality of support rings by arranging a required number of inner support rings inside the support ring described above with a required interval. To do.

Further, the film carrier according to the present invention is such that a support ring is installed in a hole for IC chip mounting in the carrier tape via a required tie bar, and the tie bar portion is required to communicate with both cavity portions in the molding die. It is characterized in that a through hole is formed.

Further, the film carrier according to the present invention is characterized in that the surface of the carrier tape corresponding to the position of the molten resin material transfer passage of the molding die is coated with a required resin release agent.

Further, the film carrier according to the present invention is characterized in that a required thin portion is formed at least at a joint portion of each small piece portion provided on the support ring with the peripheral edge portion of the mold cavity. .

Further, the molding method according to the present invention using the above film carrier is such that small pieces of a required shape are respectively provided at positions between the leads in a support ring supporting a large number of leads, and at the time of molding, The small piece is deformed or pushed by the mold clamping pressure, and
The deformed or crushed small pieces are tightly fitted in the spaces formed between the leads, and in this state, the molten resin material is injected under pressure into the cavity of the mold. Then, the portion to be sealed of the film carrier fitted and set in the cavity is resin-sealed and molded.

Further, the molding method according to the present invention using the above film carrier is such that projecting small piece portions of a required shape at positions between the leads in a support ring supporting a large number of leads, and at least in each of the small piece portions. A required thin portion is formed at the joint with the peripheral edge of the mold cavity, and at the time of molding, the thin portion of each small piece is pressed and deformed by the mold clamping pressure of the mold, and the deformed each The thin portions are tightly fitted in the spaces formed between the leads, and in this state, the molten resin material is pressure-injected into the cavity of the mold to be fitted into the cavity. The sealed portion of the set film carrier is resin-sealed and molded.

Further, in the mold die for the film carrier according to the present invention, substantially the same space portion for inflowing the molten resin material is provided between the cavity surface of the die and the surface of the sealed portion of the film carrier. It is characterized by.

[Action]

According to the present invention, at the time of mold clamping of a mold die, it is possible to deform or crush each small piece portion (or its thin portion) provided on the support ring by utilizing the mold clamping pressure, and the deformation thereof. Alternatively, the crushed small pieces can be closely fitted to the positions between the leads (inside the communicating portion inside the mold cavity).

Therefore, the peripheral edge of the cavity in the molding die is
Since it is in a state of being substantially sealed by the small pieces that are tightly fitted in the positions between the leads, by performing molding in this state, resin leakage from the peripheral edge of the mold cavity is achieved. Is efficiently and reliably prevented.

Also, by adopting a multiple support ring structure with the required spacing and separating each support ring with a mold resin, it is possible to efficiently and reliably prevent moisture absorption on the IC chip side. Is.

Further, by forming a required through hole in the tie bar portion on which the support ring is provided so as to communicate with both the cavity portions of the molding die, it is possible to smoothly fill the molten resin material into the both cavities. The strength of the tie bar portion can be improved.

Further, by coating the surface of the carrier tape corresponding to the position of the molten resin material transfer passage of the molding die with a required resin release agent, it is possible to easily form a resin molded body which is unnecessary as a product solidified in the passage. It can be peeled off and removed.

In addition, by forming a required thin portion at least at the joint of each small piece of the support ring with the peripheral edge of the die cavity, the thin portion is bent with a small pressing force when the die is clamped. It can be transformed.

Further, by providing substantially the same space for inflowing the molten resin material between the die cavity surface and the surface of the sealed portion of the film carrier, the molten resin material can be smoothly filled into the cavity. Can, and therefore
The molten resin material flown into the cavity can prevent adverse effects such as bending and deforming the sealed portion in the vertical direction.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 shows an essential part of a film carrier according to the present invention, and its basic structure is the same as that shown in FIGS. 13 to 16.

That is, sprocket holes 22 (see FIG. 9) for feeding the tape are formed in both edges of the carrier tape 21, and a mounting hole for the IC chip 23 is formed in the center of the carrier tape. Has been drilled.

A support ring 25 is provided in this hole via a tie bar 24.
And a device hole 26 for fitting the IC chip 23 in the support ring 25, and
An outer lead hole 27 is provided on the outer circumference of the support ring 25 for mounting an outer lead.

Further, the mounting hole of the IC chip 23 as described above with a number of leads 28 which is a conductor is integrally mounted, the inner leads 28 ₁ in the respective leads are respectively projected into the device hole 26 as described above, also The outer lead 28 ₂ of each lead is laid on the outer lead hole 27 described above.
Furthermore, a test pad is provided on the extended end of each outer lead.
28 ₃ are provided respectively.

Moreover, IC chip 23 described above, the inner lead bonding for connecting the surface thereof electrodes and the inner leads 28 ₁ via the bumps 29, it is securely mounted on the carrier tape 21.

Further, required small piece portions 25 ₁ are provided to project between the leads 28 (outer leads 28 _{2 in the} illustrated example) of the support ring 25, and these small piece portions 25 ₁
Is the mold cavity when the mold is clamped.
It is extended to the position where it joins with the peripheral portion of 30.

The film carrier having the above-described structure is such that the IC chip 23 on the carrier tape 21 and its required peripheral portion, that is, the sealed portion 20 set corresponding to the shape of the cavity 30 of the mold (see FIG. 9). ) Is resin-sealed and molded by means such as a transfer molding method, and then the outer lead 28
By cutting and separating from the _two parts, each outer lead 28 ₂ of the product itself and each electrode of the printed wiring board can be connected by outer lead bonding.

By the way, the film carrier according to the present invention is used in the same manner as the conventional one, but at the position between the leads 28 in the support ring 25, the bonding position with the mold cavity peripheral portion at the time of mold clamping. based on the configuration in which each projecting pieces 25 ₁ and extended to the, as compared with the conventional one in which remarkable the following effects can be obtained.

That is, like the conventional film carrier, the film carrier is first supplied to a predetermined position of the mold cavity 30 in the mold open state (see FIG. 2), and then the intermediate mold clamping of the mold is performed. (See FIG. 3) and complete mold clamping (see FIG. 4 or 5) are performed.

However, this in the course of the mold from an intermediate clamping leads to complete clamping, the nub 25 ₁ in the support ring 25, for receiving the clamping pressure through the periphery of the mold cavity 30, each of said small pieces part 25 ₁ is crushed deformed or between PL surface of the mold (see FIG. 4 or FIG. 5)
At the same time, the deformed or crushed small piece portions 25 ₁ are closely fitted to the positions between the leads 28 (outer leads 28 ₂ ), that is, the inner communication portions of the mold cavity.

Therefore, the peripheral edge of the cavity 30 in the molding die is substantially sealed by the small pieces that are closely fitted to the positions between the leads 28, and in this state, the transfer molding method or the like is used. By performing molding, it is possible to efficiently and surely prevent resin leakage from the peripheral edge of the mold cavity 30.

In addition, the mold cavity 30 and the above-mentioned mold transfer passage side are provided with at least one tie bar 24 ₁ of the carrier tape.
They are communicated with each other through a gate (see reference numeral 11 _{1 in} FIG. 9) of a mold provided so as to be bonded to the surface, and therefore the molten resin material is pressurized into the cavity 30 through the transfer passage and the gate. Will be injected.

At this time, in particular, between the lower die cavity surface and the surface of the sealed portion of the film carrier fitted in the lower die cavity, a large inflow space portion of the molten resin material as shown in FIG. When the film carrier 30 ₁ is configured, the film carrier is thin, and the space 30 ₁
There is a possibility that the molten resin material, which is sequentially flown into and filled in, causes the above-mentioned sealed portion to float and to be bent or deformed.

Therefore, for example, the cross-sectional shape of the lower mold cavity is improved so that substantially the same space for inflowing the molten resin material as shown in FIG. 5 is provided between the lower mold cavity surface and the surface of the sealed portion. by providing the portion 30 _2, smoothly by flowing filling, that the molten resin material is prevented adverse effects, such as to be curved or deformed the object seal portion in the vertical direction in the molten resin material the cavity Is something that can be done.

Further, the carrier tape 21 corresponding to the above-mentioned transfer passage.
Since a resin molded body that is unnecessary as a product solidified in the passage is attached to the surface of the carrier tape, the surface of the carrier tape is, for example, for the purpose of easily peeling and removing the resin molded body, It is preferable to coat with a required resin release agent such as a fluororesin.

A mold air vent (not shown) is provided on at least one or more tie bars 24 except the above-mentioned gate installation position. Therefore, when the molten resin material is injected under pressure into the mold cavity 30, the air in the cavity is sequentially discharged from the air vent to the outside based on the filling action of the molten resin material. At the end of the air discharging action, a part of the molten resin material flows in and is solidified and formed in the air vent. Therefore, it is possible to reliably prevent voids from being formed in the mold package due to the air discharging action in the cavity, and it is possible to prevent unnecessary resin outflow from the air vent.

The present invention is not limited to the embodiment described above,
The configuration and method arbitrarily and appropriately changed / selected can be adopted as necessary without departing from the spirit of the present invention.

For example, a desired thinned portion may be formed at least at the joint portion of each small piece portion provided on the support ring with the peripheral edge portion of the mold cavity.

When the small piece portion 25 ₁ having such a thin portion is adopted, the thin portion of the small piece portion is easily bent and deformed by the mold clamping pressure during the complete mold clamping of the mold shown in FIG. It is possible to closely fit the inside and outside communicating portions of the mold cavity. That is, in this case, the bending deformation action of the thin portion of the small piece portion 25 ₁ can be smoothly performed, so that the thin portion can be bent and bent with a small pressing force.
It becomes possible to deform by pressing. Thus, for example, clamping pressure of the mold acting on the nubs 25 _1, in which the adverse effects of such deforming the leads through the small piece portion can be prevented.

Further, by further improving the structure of the mold cavity shown in FIG. 5, the cross-sectional shapes of the upper and lower cavities are, for example, as shown in FIG. between the surface of, by providing substantially the same molten resin material flowing space portion 30 ₂ can be and simultaneously it flows filled smoothly into the molten resin material upper and lower both cavity 30. Therefore, it is possible to prevent the sealed portions of the film carriers set in both cavities from being adversely bent or deformed in the vertical direction due to the molten resin material flowing into the cavities. is there.

Further, the small piece portion disposed between the leads of the support ring is shown in the embodiment diagram as being projected on the outer lead hole side, but the small piece portion may be formed on the device hole side of the carrier tape as necessary. It is also possible to employ a configuration in which the projection is provided.

Regarding the length, width, shape, etc. of the above-mentioned small pieces,
Any of them can be set arbitrarily and appropriately. In short, the small piece portion is deformed or crushed by the mold clamping pressure of the mold in the molding apparatus, so that the leads are closely fitted to each other. Anything can be combined.

Further, in the embodiment, the case where the molding means by the transfer molding method is adopted has been described, but it is obvious that the present invention can be applied to the molding by the usual injection molding method.

Further, the structure of the film carrier shown in the examples has a structure of a three-layer tape in which a carrier tape made of a polyimide resin film and a conductor lead (copper foil) are bonded with an adhesive. You may employ | adopt the structure of the 2-layer tape which does not use an adhesive agent for the bonding of the lead and the lead.

By the way, although the polyimide resin film is excellent in heat resistance and strength, its hygroscopicity is regarded as a little problem.
That is, since it is customary for such a molded product for sealing and molding an IC chip to have moisture resistance, it is preferable that the structure of the mold package has a moisture resistance function.

The embodiment shown in FIG. 9 and FIG. 10 is an improvement in the structure of the mold package obtained by the above-described embodiment so that the function of moisture resistance can also be provided.

That is, the feature of this embodiment is that a plurality of support ring structures are formed by disposing a required number of inner support rings inside the support ring with a required interval.

The film carrier shown in each drawing has a narrow auxiliary tie bar 24a inside the support ring 25 in the above embodiment.
By bridging the inner support ring 25 ₂ through, but constructed from the structure of the double support ring having a predetermined gap 31 between the both support rings. In the figure, reference numeral 20 indicates a sealed portion of the film carrier, reference numeral 22 indicates a sprocket hole, and other configurations are substantially the same as the configurations of the above-described embodiment,
The same components are designated by the same reference numerals.

Both support rings in the structure of this embodiment 25, 25 ₂
Are separated by a required gap 31, and both support rings are separated by the mold resin in the mold package. Therefore, for example, when the molded product is mounted on the substrate, the outer support ring 25 is even assuming that the moisture absorption, which is capable of efficiently prevented from entering into the IC chip 23 side transmitted to the inner support ring 25 _2.

The embodiment shown in FIG. 11 is improved by adopting the above-mentioned two-layer tape structure so that the structure of the mold package can also have the above-mentioned moisture resistance function.

That is, as described above, the structure of the two-layer tape is such that the carrier tape made of the polyimide resin film and the conductor lead are bonded to each other without using an adhesive, and the hole processing means by chemical etching is adopted. Therefore, the support ring supporting tie bars (24 ₁ , 24, 24 ₂ ) as shown in FIGS. 1 and 9 are all unnecessary. For this reason, in particular,
Auxiliary tie bars 24 ₂ is not required in the configuration of the embodiment shown in FIG. 9, further, because both the support ring 25 _3, 25 ₄ will be completely separated while maintaining a predetermined gap 31 _1, the outer support ring Even if it is assumed that 25 ₃ has absorbed moisture, it can efficiently and surely prevent the moisture from penetrating into the IC chip 23 side through the inner support ring 25 ₄ .

Further, when the above-described configuration including a plurality of required support rings is adopted, the gap between the support rings is filled with the molten resin material during molding. That is, since the gap is the communicating portion between the upper and lower cavities, the upper and lower packages molded in the both cavities are completely integrally molded in the communicating portion, and therefore, the joining and joining of the both packages is performed. The strength can be improved.

In the embodiment shown in FIG. 12, the upper and lower cavities of the molten resin material are formed by forming required vertical through holes in each tie bar 24, 24 ₁ in the configuration of the embodiment shown in FIG.
It is improved so that the injection / filling action into the inside of the cavity 30 is performed at the same time, and the air in both cavities is discharged more efficiently.

That is, the above-mentioned tie bar 24 ₁ corresponds to the gate position of the mold, and therefore, a configuration is adopted in which a gate hole 24 ₃ that penetrates vertically through this tie bar 24 ₁ and communicates with both cavities 30 is adopted. If the gate hole 24
It is possible to simultaneously flow from ₃ into both cavities and smoothly fill both cavities. Further, by adopting a configuration in which at least one or all of the tie bars 24 other than the above tie bars 24 ₁ are also provided with air vent holes 24 ₄ that penetrate vertically and communicate with the insides of both cavities 30. ,
Te filling action coupled with the molten resin material described above, is the air in the both cavities intended can be efficiently discharged to the outside through the air vent holes 24 _4. Therefore, according to the configuration of this embodiment, when the molten resin material is injected into the cavity under pressure, the inflow filling action and the air exhaust action can be more efficiently performed without bending the sealed portion of the film carrier. There is an advantage that the tie bar portion can be reinforced while being able to perform it well and surely.

〔The invention's effect〕

According to the film carrier of the present invention, it is possible to efficiently and surely prevent resin leakage to the outside of the sealed portion during molding of the sealed portion. Has a positive effect.

Further, the film carrier according to the present invention has an excellent practical effect that a molded product having a reliable moisture resistance function can be provided.

Further, by coating the surface of the carrier tape corresponding to the molten resin material transfer passage of the mold with a required resin release agent, the resin molding solidified in the passage can be easily separated and removed. It has a practical effect.

Further, the film carrier according to the present invention has an advantage that it can be easily formed and processed at the same time as the formation of the support ring in the carrier tape without increasing the total number of forming and processing steps.

Further, when the film carrier according to the present invention is used, it is possible to efficiently and reliably prevent resin leakage to the outside of the range of the sealed portion during molding of the sealed portion. It is possible to provide a molding method capable of reliably molding a molded product having high quality and high reliability.

Further, when using the molding die according to the present invention, between the cavity surface and the surface of the portion to be sealed in the film carrier, since substantially the same space portion for the molten resin material inflow is provided, Since the molten resin material can be smoothly filled in the cavity, it has an excellent practical effect that a molded product having high quality and high reliability can be reliably molded. .

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view showing a main part of a film carrier according to the present invention. 2 to 4 are explanatory views of a molding method according to the present invention using the film carrier, and FIG. 2 shows a main part of the mold when the mold is opened by supplying the film carrier to the mold cavity. Partially cut-away vertical end view, FIG. 3 is a partially cut-away vertical cross-sectional view of the mold main part at the time of intermediate mold clamping, and FIG. 4 is partially cut-away vertical cross-sectional view of the mold main part at the time of complete mold clamping. Is. FIG. 5 is a partially cutaway vertical cross-sectional view showing a completely clamped state of a main part of a molding die according to the present invention. FIGS. 6 to 12 show another embodiment of the present invention. FIG. 6 is a partial cutaway vertical section of the main part of the mold during intermediate mold clamping when the film carrier is supplied to the mold cavity. Fig. 7 is a partially cutaway vertical sectional view of the main part of the mold at the time of complete mold clamping for explaining the molding method using the film carrier, and Fig. 8 is the complete mold clamping of the main part of the mold. FIG. 9 is a partially cutaway vertical sectional view showing a state, FIG. 9 is a partially cutaway plan view showing a main part of the film carrier, and FIG. 10 is AA of FIG.
FIG. 11 is a vertical sectional view taken along the line, and FIG. 11 and FIG. 12 are a plan view and a perspective view, respectively, showing a main part of the film carrier. FIGS. 13 to 16 are explanatory views of a transfer molding method using a conventional film carrier, FIG. 13 is a plan view showing an essential part of the film carrier, and FIG. 14 is a BB line in FIG. FIG. 15 is a partial cutaway perspective view of the film carrier corresponding to FIG. 13, and FIG. 16 is a partial cutaway of a film carrier main portion for explaining problems during resin sealing molding. It is a schematic perspective view. [Explanation of symbols] 11 …… Transport passage 11 ₁ …… Gate 12 …… Mold package 13 …… Internal / external communication part 20 …… Sealed part 21 …… Carrier tape 22 …… Sprocket hole 23 …… IC chip 24 …… Tie bar 24 ₁ …… Tie bar 24 ₂ …… Auxiliary tie bar 24 ₃ …… Gate hole 24 ₄ …… Air vent hole 25 …… Support ring 25 ₁ …… Small piece 25 ₂ …… Support ring 25 ₃ …… Support ring 25 ₄ …… Support ring 26 …… Device hole 27 …… Outer lead hole 28 …… Lead 28 ₁ …… Inner lead 28 ₂ …… Outer lead 28 ₃ …… Test pad 29 …… Bump 30 …… Cavity 30 ₁ …… Space part 30 ₂ …… Space part 31 …… Gap 31 ₁ …… Gap

Claims (8)

[Claims] 1. A film carrier comprising a large number of leads and a support ring for supporting the leads, and an inner lead of each of the leads and an IC chip integrally connected to each other. While projecting the required small piece parts at the positions between,
A film carrier, characterized in that each of the small pieces is extended to a position where it joins with a peripheral edge of a cavity in a molding die. 2. The structure of a plurality of support rings is provided by disposing a required number of inner support rings inside the support ring with a required space therebetween. The described film carrier. 3. A carrier ring is provided in a hole for mounting an IC chip in a carrier tape via a required tie bar, and a required through hole communicating with both cavities in a molding die is bored in the tie bar portion. The film carrier according to claim (1) or (2), wherein the film carrier is configured as follows. 4. The surface of the carrier tape corresponding to the position of the molten resin material transfer passage of the molding die is coated with a required resin release agent.
Thru | or the film carrier of Claim (3). 5. The film according to claim 1, wherein each of the small pieces provided on the support ring is formed by forming a required thin portion at least at a joint with the peripheral edge of the mold cavity. Career. 6. A support ring supporting a large number of leads is provided with small pieces of a desired shape at positions between the respective leads, and at the time of molding the molding, the small pieces are pressed by a mold clamping pressure. It is deformed or crushed, and the deformed or crushed small pieces are tightly fitted in the spaces formed between the leads, and in this state, melted in the cavity of the mold. A molding method, which comprises injecting a resin material under pressure to mold a sealed portion of a film carrier fitted and set in the cavity with a resin. 7. A small piece portion of a required shape is provided at a position between the leads in a support ring supporting a large number of leads, and at least a joint portion of each small piece portion with a peripheral edge of a mold cavity. While forming the required thin portion, at the time of molding, the thin portion of each small piece portion is pressed and deformed by the mold clamping pressure of the mold, and the deformed thin portion is placed at a position between the leads. They are closely fitted in the respective space portions formed, and in this state, the molten resin material is pressure-injected into the cavity of the mold to set the sealed portion of the film carrier fitted and set in the cavity. A molding method characterized by performing resin encapsulation molding. 8. A molding die for a film carrier, wherein substantially the same space for inflowing the molten resin material is provided between the cavity surface of the die and the surface of the sealed portion of the film carrier. Type.