JPH02278845A - Film carrier and molding by using same and molding metal die - Google Patents

Abstract

PURPOSE:To efficiently an surely prevent a resin from being leaked to the outside of a range of a part to be sealed by a method wherein required small-piece parts protrude at positions between individual leads at a support ring and are extended respectively to positions which are bonded to peripheral edge parts of a cavity at a molding metal die. CONSTITUTION:Leads are supplied to prescribed positions of a metal-mold cavity 30 in an open state; an intermediate mold-fastening operation and a complete mold- fastening operation of a metal die are executed. During a process from the intermediate mold-fastening operation to the complete mold-fastening operation of the metal die, individual small-piece parts 251 at a support ring 25 are subjected to a mold-fastening pressure via peripheral edge parts of the metal-die cavity 30; accordingly, the individual small-piece parts 251 are deformed or squeezed between a point P and a point L of the metal die. The deformed or squeezed small-piece parts 251 are fit respectively closely to positions between individual leads 28 (outer leads 282), i.e., to interconnection parts between the inside and the outside of the metal-die cavity. When a molding operation is executed in this manner, it is possible to efficiently and surely prevent a resin from being leaked from the peripheral edge part of the metal-die cavity.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to, for example, a long film carrier on which an IC chip is mounted, and a resin-sealed portion of the IC chip and its necessary surrounding areas. The present invention relates to a molding method for molding and an improvement of the molding die thereof.

[Conventional technology]

The degree of integration of IC chips tends to increase due to recent demands for multifunctionality.

For this reason, leads have become ultra-high-density and have a large number of bins, and the products themselves have become ultra-miniaturized for use in IC cards, etc.
Ultra-thin designs are being made.

TAB (Tape Automated Bonding) is an IC chip mounting technology that can meet these demands.
The method is known.

This TAB method attaches a large number of leads to a carrier tape made of polyimide resin film, and connects each inner lead to each surface electrode of an IC chip through bumps. The structure of the film carrier will be explained based on FIGS. 13 to 16.

As shown in these countries, sprocket holes 2 for feeding the tape are bored in both edges of a polyimide resin film carrier tape 1.

Further, an IC chip 3 is placed in the center of the carrier tape 1.
Mounting holes are drilled.

A support ring 5 is inserted into this hole via a tie bar 4.
A device hole 6 for fitting the IC chip 3 is provided in the support ring 5, and an outer lead hole 7 for installing the outer lead is provided on the outer periphery of the support ring 5. is provided.

Further, a large number of conductive conductive conductive boards 8 are integrally mounted in the mounting hole of the IC chip 3 described above. Further, the inner leads 81 of each lead 8 are respectively projected into the device hole 6 described above, and the outer lead 82 of each lead 8 is installed over the outer lead hole 7 described above, and Each outer lead 82
A test pad 83 is provided at the extended end of each of the test pads 83 .

Moreover, the above-mentioned IC chip 3 has its surface electrode and each inner lead 8! The carrier tape 1 is reliably mounted on the carrier tape 1 by inner lead bonding, which connects the two via the bumps 9.

In addition, the IC chip 3 on the carrier tape 1 and its surrounding area, that is, the sealed portion 10 of the film carrier, which is set corresponding to the shape of the cavity of the mold, are molded with resin by means such as a transfer molding method. By sealing and then cutting and separating from the J outer lead 82 portion, each outer lead 82 in the product itself and each electrode of the printed wiring board can be connected to each other by so-called outer lead bonding. be.

[Problem that the invention seeks to solve]

By the way, when the sealed portion of the carrier tape described above is resin-sealed by a molding method, there are the following problems in terms of resin molding.

For example, based on the usual transfer molding method,
First, a film carrier is supplied to a predetermined position of a mold (both upper and lower molds) and the mold is clamped, and then the resin material heated and melted in the pot of the mold is applied to the mold consisting of runners and gates. When the film carrier is injected under pressure into the mold cavity through the transfer passage 11, the sealed portion 10 of the film carrier is sealed in a mold package 12 molded to correspond to the shape of the mold cavity. (See Figure 16).

However, when both the upper and lower molds are clamped, there is a gap (usually about 35 μm) corresponding to the thickness t of the lead 8 and a gap (usually about 35 μm) at the cavity periphery on the P and L (parting line) planes of both molds. Since a space consisting of a gap corresponding to the leads 82 is created, that is, a communicating part 13 between the inside and outside of the mold cavity as shown in FIG. The resin flows out into the outer lead hole 7 and further infiltrates between the P and L surfaces of both molds, forming a resin barrier.

Therefore, voids may be formed inside and outside the flat molded package, which cannot obtain the specified resin pressure, weakening its mechanical strength, or the cavity may be left unfilled due to insufficient amount of resin, making it difficult to securely seal the sealed part. In addition, the leaked resin material may adhere to each outer lead 8□ and cause a poor connection between the outer lead and the electrode of the printed wiring board. In addition to reducing the quality and reliability of the product, both types 2 above
) There are disadvantages such as the need for a leaning process to ensure the integrity of the surface.

In order to prevent such resin leakage from inside the mold cavity, for example, the space between the outer leads 82 described above (i.e., the communication between the inside and outside of the cavity) must be Although it is effective to provide a concavo-convex fitting portion that fits into the portion 13), this type of means for improving the mold structure cannot be adopted for the following reasons.

That is, in response to the above-mentioned demands for an extremely large number of bins and miniaturization of the leads 8, the pitch p of the standard outer leads 82 is set to approximately 450 μm (the inner lead pitch is approximately 150 μm), and the lead thickness t is usually about 35 μm
Therefore, it is extremely difficult to obtain a mold configuration that is compatible with such standard dimensional accuracy.

SUMMARY OF THE INVENTION Therefore, the present invention provides an improved film carrier that can efficiently and reliably prevent resin leakage outside the sealed portion of the film carrier during molding. It is an object of the present invention to provide a molding method and a mold die thereof, which can mold a molded product having moisture resistance, high quality, and high reliability by using the present invention.

[Means for solving problems]

A film carrier according to the present invention for solving the above-mentioned conventional problems includes a large number of leads and a support ring for supporting these leads, and also integrates an inner lead and an IC chip in each lead. A film carrier connected to the support ring, in which required small pieces are provided protrudingly at the positions of the respective lead openings in the support ring, and each of the small pieces is provided at a position where each of the small pieces is joined to the peripheral edge of the cavity in the mold. It is characterized by an extended structure.

Further, the film carrier according to the present invention is characterized in that a required number of inner support rings are arranged inside the above-mentioned support rings at two required intervals, thereby forming a structure of multiple support rings. It is something to do.

Further, in the film carrier according to the present invention, a support ring is installed in the IC chip mounting hole in the carrier tape via a required tie bar, and a support ring is installed in the tie bar portion to communicate with both cavities in the mold die. It is characterized by having a through-hole.

Furthermore, the film carrier according to the present invention is characterized in that the surface of the carrier tape corresponding to the position of the molten resin material transfer path of the mold is coated with a required resin release agent.

Further, the film carrier according to the present invention is characterized in that each of the small pieces provided on the support ring is formed with a required thin portion at least at the joint portion with the peripheral edge of the mold cavity. .

Furthermore, in the molding method according to the present invention using the above-mentioned film carrier, a support ring supporting a large number of leads is provided with small pieces of a desired shape projecting between each lead, and each of the above-mentioned The small piece is deformed or crushed by the clamping pressure of the mold, and
The deformed or crushed small pieces are tightly fitted into the spaces formed between the leads, and in this state, molten resin material is injected under pressure into the cavity of the mold. The film carrier is characterized in that the portion to be sealed of the film carrier fitted and set in the cavity is molded to be sealed with a resin.

Further, in the molding method according to the present invention using the above-mentioned film carrier, small pieces of a desired shape are respectively provided protrudingly at positions between the leads in a support ring supporting a large number of leads, and at least In addition to forming a required thin part at the joint with the peripheral edge of the mold cavity, the thin part of each of the small pieces is pressed and deformed by the clamping pressure of the mold during molding, and the deformed part is The thin portions are tightly fitted into the spaces formed between the respective leads, and in this state, molten resin material is injected under pressure into the cavity of the mold and fitted into the cavity. This method is characterized in that the portion of the set film carrier to be sealed is molded with resin.

Furthermore, the mold for a film carrier according to the present invention has a substantially identical space for inflow of molten resin material between the cavity surface of the mold and the surface of the sealed portion of the film carrier. It is characterized by:

[Effect]

According to the present invention, when the mold is clamped, each small piece (
or its thin wall portion) can be deformed or crushed, and each of the deformed or crushed small pieces can be tightly fitted into the positions between the respective leads (within the inside and outside communication parts of the mold cavity). .

Therefore, the periphery of the cavity in the mold is
Since the above-mentioned small pieces closely fitted between the leads create a substantially sealed state, by performing molding in this state, resin leakage from the periphery of the mold cavity can be avoided. can be efficiently and reliably prevented.

In addition, by adopting a multiple support ring structure with the required spacing and separating each support ring through a molded resin, it is possible to efficiently and reliably prevent moisture absorption on the IC chip side. It is.

In addition, by providing the required through-holes that communicate with both cavities in the mold die in the tie bar section on which the support ring is installed, it is possible to smoothly fill the molten resin material into both cavities. This can improve the strength of the tie bar portion.

In addition, by coating the surface of the carrier tape corresponding to the position of the molten resin material transfer path in the mold mold with the necessary resin release agent, it is easy to remove the resin molding that is no longer needed as a product solidified in the path. It can be peeled off and removed.

In addition, by forming a required thin part in each small piece of the support ring at least at the joint with the mold cavity periphery, the thin part can be bent by a small pressing force when the mold is clamped. It is something that can be transformed.

In addition, by providing substantially the same space for the molten resin material to flow in between the mold cavity surface and the surface of the sealed portion of the film carrier, the molten resin material can be smoothly filled into the cavity. can, therefore,
This can prevent harmful effects such as the molten resin material flowing into the cavity causing the sealed portion to curve or deform in the vertical direction.

〔Example〕

Next, the present invention will be explained based on embodiment figures.

FIG. 1 shows the main parts of a film carrier according to the present invention, and its basic structure is the same as that shown in FIGS. 13 to 16.

That is, sprocket holes 22 (see FIG. 9) for feeding the tape are bored at both edges of the carrier tape 2), and an IC chip 23 is formed at the center of the carrier tape.
Mounting holes are drilled.

A support ring 25 is installed in this hole via a tie bar 24, and a device hole 26 for fitting the IC chip 23 is provided in the support ring 25. Outer lead holes 27 for installing outer leads are provided on the outer periphery.

Further, a large number of conductor leads 28 are integrally attached to the mounting hole of the IC chip 23 described above, and the inner leads 281 of each lead are respectively projected into the device hole 26, and , the outer lead 282 of each lead is connected to the outer lead hole 27 described above.
Further, a test pad 28-4 is provided on the extended end of each outer lead.

Further, the above-mentioned IC chip 23 is reliably mounted on the above-mentioned carrier tape 2) by inner lead bonding which connects its surface electrode and each inner lead 28+ via bumps 29.

In addition, each lead 28 (
On the outer lead 282), required small pieces 251 are protruded from each space between the outer leads 282), and these small pieces 251 close the mold cavity 30 when the mold is clamped. They each extend to the position where they join with the peripheral edge.

The film carrier having the above-mentioned configuration has the IC chip 23 on the carrier tape 2) and its required surrounding area, that is, the sealed portion 20 (see FIG. ) is resin-sealed using a transfer molding method or the like, and then cut and separated from the outer lead 282 portion of the outer lead 282 to separate each outer lead 282 and each electrode of the printed wiring board in the product itself. , which can be connected to each other by outer lead bonding.

By the way, the above-mentioned film carrier according to the present invention is used in the same manner as the conventional one, but the support ring 25 has a joint position between each lead 28 with the mold cavity periphery during mold clamping. Based on the structure in which the small piece portions 251 are provided in a protruding manner, the following remarkable effects can be obtained compared to the conventional structure.

That is, like the conventional film carrier, the film carrier according to the present invention is first supplied to a predetermined position of the mold cavity 30 in the mold open state (see FIG. 2), and then the film carrier is supplied to the intermediate mold clamping part of the mold. (See FIG. 3) and complete mold clamping (See FIG. 4 or 5).

However, in the process from intermediate mold clamping to complete mold clamping of the mold, each of the small pieces 25 in the support ring 25 receives mold clamping pressure via the peripheral edge of the mold cavity 30, so each of the small pieces The part 25r is P of the mold,
The small pieces 251 are deformed or crushed between the L surfaces (see FIG. 4 or 5), and each of the deformed or crushed small pieces 251 is attached to each lead 28 (outer lead 28).
2), that is, they are tightly fitted into the internal and external communication portions of the mold cavity.

Therefore, the periphery of the cavity 30 in the mold is substantially sealed by the small pieces closely fitted in the positions between the leads 28. By performing molding, resin leakage from the peripheral edge of the mold cavity 30 can be efficiently and reliably prevented.

Note that the mold cavity 30 and the above-mentioned mold transfer passage side are connected to at least one tie bar 2 of the carrier tape.
The gate of the mold (9th
Accordingly, the molten resin material is injected under pressure into the cavity 30 through the transfer passage and gate.

At this time, in particular, there is a wide inflow space for the molten resin material as shown in FIG. 301, the film carrier is thin, and this space portion 3
0. There is a possibility that the molten resin material that is sequentially poured into and filled with the sealing material may cause the sealed portion to rise and become curved or deformed.

Therefore, for example, the cross-sectional shape of the lower mold cavity may be improved to create a space between the lower mold cavity surface and the surface of the sealed portion, which is approximately the same as shown in FIG. By providing the portion 302, the molten resin material can smoothly flow into and fill the cavity, thereby preventing problems such as the molten resin material bending and deforming the sealed portion in the vertical direction. It is possible.

In addition, carrier tape 2 corresponding to the above-mentioned transfer passage
) will adhere to the surface of the carrier tape, which will become unnecessary as a product solidified in the passage, so in order to easily peel and remove the resin molding, the surface of the carrier tape may be removed, for example. It is preferable to coat with a required resin release agent such as , fluororesin or the like.

In addition, a mold air vent (not shown) is provided on at least one tie bar 24 other than the above-mentioned gate arrangement position.
is installed. Therefore, when the molten resin material is injected into the mold cavity 30 under pressure, the air in the cavity is sequentially discharged to the outside from the air vent based on the filling action of the molten resin material. A portion of the molten resin material flows into the air vent at the end of the air vent and is solidified within the air vent. Therefore, it is possible to reliably prevent voids from being formed in the mold package due to the air discharge action within the cavity, and it is also possible to prevent excess resin from flowing out from the air vent.

The present invention is not limited to the embodiments described above,
Without departing from the spirit of the present invention, configurations and methods that are arbitrarily and appropriately changed or selected can be adopted as necessary.

For example, a required thin portion may be formed in each of the small pieces provided on the support ring at least at the joint portion with the peripheral edge of the mold cavity.

When adopting the small piece part 251 having such a thin wall part, when the mold is completely clamped as shown in FIG. 7, the thin part of the small piece part is easily bent and deformed by the mold clamping pressure, and the mold It can be tightly fitted into the internal/external communication part of the cavity. That is, in this case, the thin portion of the small piece portion 251 can be smoothly bent and deformed, so that the thin portion can be bent and pressed with a small pressing force. Therefore, for example, it is possible to prevent problems such as the mold clamping pressure of the mold acting on the small piece portion 251 deforming each lead via the small piece portion.

Further, the structure of the mold cavity shown in FIG. 5 is further improved, and the cross-sectional shape of both the upper and lower cavities is changed, for example, as shown in FIG. By providing substantially the same molten resin material inflow space portion 302 between the surfaces of the molten resin material and the upper and lower cavities 30, the molten resin material can be smoothly and simultaneously filled into both the upper and lower cavities 30. Therefore, it is possible to prevent the sealed portion of the film carrier set in both cavities from being bent or deformed in the vertical direction by the molten resin material flowing into the cavities. be.

In addition, although the small pieces disposed between each lead of the support ring are shown protruding from the outer lead hole side in the example drawings, the small pieces may be placed on the device hole side of the carrier tape as necessary. You may adopt the structure where it protrudes from.

Regarding the length, width, shape, etc. of the small piece mentioned above,
Each of these can be set arbitrarily and appropriately.In short, the small pieces are deformed or crushed by the clamping pressure of the mold in the molding device, so that they fit tightly between each lead. It is fine as long as it matches.

Further, in the embodiment, a case has been described in which a molding method using a transfer molding method is adopted, but it is clear that the present invention can also be applied to molding using a normal injection molding method.

In addition, the structure of the film carrier shown in the example diagram consists of a carrier tape made of polyimide resin film and a conductor lead (
Although the carrier tape has a three-layer tape structure in which the carrier tape and the lead are bonded together using an adhesive, a two-layer tape structure in which no adhesive is used to bond the carrier tape and the lead may also be adopted.

Incidentally, polyimide resin films have excellent heat resistance, strength, etc., but their hygroscopicity is somewhat problematic.

That is, since this type of molded product for sealing and molding an IC chip is usually required to be moisture resistant, it is preferable that the structure of the molded package has a moisture resistant function.

The embodiment shown in FIGS. 9 and 10 is an improvement to the structure of the molded package obtained in the above-described embodiment so that the above-mentioned moisture resistance function can also be provided.

That is, the feature of this embodiment is that a required number of inner support rings are arranged inside the support ring at required intervals, thereby forming a plurality of support ring structures.

The film carrier shown in each figure has 1. By constructing the inner support ring 252 through the auxiliary tie bar 242 with a width of
) is constructed from a double support ring structure. In the figure, reference numeral 20 indicates a sealed portion of the film carrier, and reference numeral 22 indicates a sprocket hole, and the other configurations are substantially the same as those of the above embodiment, so the same structural members are used. are given the same symbols.

In the configuration of this embodiment, both support rings 25, 2
52 are separated with a required gap 3), and both support rings are separated by mold resin within the mold package. For example, when a molded product is mounted on a board, the outer support ring Even if it is assumed that 25 has absorbed moisture, this can be efficiently prevented from penetrating through the inner support ring 252 and into the C-chip 23 side.

The embodiment shown in FIG. 11 employs the above-described two-layer tape structure, so that the structure of the molded package is improved so that the above-described moisture resistance function can also be provided.

That is, as described above, the structure of this two-layer tape is such that the carrier tape made of polyimide resin film and the conductor leads are bonded together without using an adhesive, and holes are formed by chemical etching. From the support ring support tie bar as shown in Fig. 1 and Fig. 9 (
241, 24, 242) are all unnecessary. For this reason,
In particular, the auxiliary tie bar 24□ in the configuration of the embodiment shown in FIG.
254 are completely separated by maintaining the required gap 3)+, so even if it is assumed that the outer support ring 253 absorbs moisture, it is unlikely that this will pass through the inner support ring 254 and enter the IC chip 23 side. can be efficiently and reliably prevented.

Moreover, when employing the configuration provided with the above-mentioned required plurality of support rings, the gaps between the support rings will be filled with molten resin material during molding. That is, since the gap is a communication part between the upper and lower cavities, both the upper and lower packages molded in the two cavities are completely integrally molded at the communication part, and therefore, the joining of the two packages and It can improve strength.

The embodiment shown in FIG. 12 has the structure of the embodiment shown in FIG. This has been improved so that the injection and filling action can be performed at the same time, and the air in both cavities can be discharged more efficiently.

That is, the tie bar 24 described above corresponds to the gate position of the mold, and therefore, the gate hole 243 vertically penetrates the tie bar 24+ portion and communicates with the inside of both cavities 3o.
When adopting a configuration in which a gate hole 24. is bored, molten resin material is poured into the gate hole 24. This allows the liquid to flow into both cavities at the same time, and allows smooth filling of both cavities. In addition, the tie bar 2
At least one or all of the tie bars 24 other than 41 are also penetrated vertically and have both openings 3.
By adopting a configuration in which an air vent hole 244 communicating with the inside of the cavity is formed, in combination with the filling action of the molten resin material described above, the air inside the two cavities is transferred to each air vent hole 2.
44 and can be efficiently discharged to the outside. Therefore, according to the configuration of this embodiment, when the molten resin material is injected into the cavity under pressure, the inflow filling action and air discharging action are made more efficient without causing any curved deformation of the sealed portion of the film carrier. This has the advantage that it can be done well and reliably, and that the tie bar portion can be reinforced.

〔Effect of the invention〕

According to the film carrier of the present invention, an advantage is that during molding of the sealed portion, resin leakage outside the sealed portion can be efficiently and reliably prevented. This has practical effects.

Further, the film carrier according to the present invention has excellent practical effects such as being able to provide a molded product with reliable moisture resistance.

Another advantage is that by coating the surface of the carrier tape corresponding to the passageway for transferring molten resin material in the mold with a necessary resin release agent, the resin molded body solidified in the passageway can be easily peeled off and removed. This has practical effects.

Furthermore, the film carrier according to the present invention has the advantage that it can be easily molded simultaneously with the molding of the support ring in the carrier tape, for example, without increasing the overall number of molding processes.

Furthermore, when using the film carrier according to the present invention, resin leakage outside the sealed portion can be efficiently and reliably prevented during molding of the sealed portion. This has the effect of providing a molding method that can reliably mold a molded product with high quality and high reliability.

Furthermore, when using the mold according to the present invention, a space portion is provided between the cavity surface of the mold and the surface of the sealed portion of the film carrier for the molten resin material to flow in from time to time. Since the molten resin material can be smoothly filled into the cavity, it has an excellent practical effect of reliably molding a molded product with high quality and high reliability. be.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway perspective view showing essential parts of a film carrier according to the present invention. 2 to 4 are explanatory diagrams of the molding method according to the present invention using the film carrier, and FIG. 2 shows the main parts of the mold when the film carrier is supplied to the mold cavity and the mold is opened. A partially cutaway longitudinal sectional end view, Fig. 3 is a partially cutaway vertical sectional view of the main part of the mold during intermediate mold clamping, and Fig. 4 is a partially cutaway longitudinal sectional view of the main part of the mold during complete mold clamping. It is. FIG. 5 is a partially cutaway vertical cross-sectional view showing the main part of the mold according to the present invention in a completely clamped state. 6 to 12 show other embodiments of the present invention, and FIG. 6 is a partially cutaway longitudinal section of the main part of the mold during intermediate mold clamping when the film carrier is supplied to the mold cavity. 7 is a partially cutaway vertical sectional view of the main part of the mold during complete mold clamping to explain the molding method using the film carrier, and Fig. 8 is a vertical sectional view of the main part of the mold fully clamped. 9 is a partially cutaway plan view showing the main parts of the film carrier, FIG. 10 is a longitudinal sectional front view taken along line A-A in FIG. 9, and FIGS. FIG. 12 is a plan view and a perspective view showing essential parts of the film carrier. FIG. 13 to FIG. 16 are explanatory diagrams of a transfer molding method using a conventional film carrier.
The figure is a plan view showing the main parts of the film carrier, FIG. 14 is a longitudinal cross-sectional end view taken along line BB in FIG. 13, and FIG. 15 is a partially cutaway perspective view of the film carrier corresponding to FIG. 13.
FIG. 16 is a partially cutaway schematic perspective view of the main part of the film carrier for explaining problems during resin sealing molding. [Explanation of symbols] 11...Transfer passage 111...Gate 12...Mold package 13...Interior/outside communication portion 20...Sealed portion 2)...Carrier tape 22...Sprocket Hole 23...IC chip 24...Tie bar 241...Tie bar 242...Auxiliary tie bar 243...Gate hole 244...Air vent hole 25...Support ring 251...Small piece part 252...・Support ring 253... Support ring... Support ring... Device hole... Outer lead hole... Lead... Inner lead... Outer lead... Test pad... Bump...・Cavity...Space part...Space part...Gap Gap...Gap Gap 7th theta drawing UN qco

Claims (8)

[Claims] (1) A film carrier comprising a large number of leads and a support ring for supporting these leads, and integrally connecting the inner leads of each lead to an IC chip, wherein 1. A film carrier comprising: projecting small pieces at required positions, and extending each small piece to a position where it joins a peripheral edge of a cavity in a mold. (2) Inside the support ring, through the required interval,
2. The film carrier according to claim 1, wherein the film carrier has a plurality of support rings by arranging a required number of inner support rings. (3) A support ring is installed in the IC chip mounting hole in the carrier tape via a required tie bar, and a required through hole is drilled in the tie bar to communicate with both cavities in the mold die. The film carrier according to claim (1) or claim (2), characterized in that: (4) Claims (1) to (3) characterized in that the surface of the carrier tape corresponding to the position of the molten resin material transfer path of the mold is coated with a required resin release agent. film carrier. (5) The film carrier according to claim 1, characterized in that each of the small pieces provided on the support ring is formed with a required thin portion at least at the joint portion with the peripheral edge of the mold cavity. (6) In a support ring that supports a large number of leads, small pieces of a desired shape are protruded between the leads, and during molding, each of the small pieces is deformed or deformed by the clamping pressure of the mold. The crushed and deformed or crushed small pieces are tightly fitted into the spaces formed between the leads, and in this state, the molten resin material is poured into the cavity of the mold. 1. A molding method comprising: injecting under pressure to mold a sealed portion of a film carrier fitted and set in the cavity with a resin. (7) Protruding small pieces of a desired shape between each lead in a support ring supporting a large number of leads;
In addition, a required thin portion is formed in each of the small pieces at least at the joint portion with the peripheral edge of the mold cavity, and during molding, the thin portion of each of the small pieces is pressed and deformed by the clamping pressure of the mold. , and the deformed thin portions are tightly fitted into the spaces formed between the leads, and in this state, molten resin material is injected under pressure into the cavity of the mold. A molding method comprising: molding a sealed portion of a film carrier fitted and set in the cavity with a resin. (8) A mold for a film carrier, characterized in that a substantially identical space for the inflow of molten resin material is provided between the cavity surface of the mold and the surface of the sealed portion of the film carrier.