JPH0691539A - Electrodeposition grinding wheel and manufacture thereof - Google Patents

Abstract

PURPOSE:To reduce weight of a grinding wheel base body, prevent rust, and provide vibration absorptivity by forming an optional shape abrasive grain layer without carrying out masking or forming work of a non-electrolytic metal plating layer. CONSTITUTION:Pin holes 6a and 6b of a pin to support a reinforcing member 5 in a metal mold are formed inside of a resin layer of a grinding wheel base body 2 to which the reinforcing member 5 is fixed. The outer peripheral surface of the reinforcing member 5 is exposed from the resin layer 4, and constitutes an abrasive grain layer forming surface 5a. When an electric current is supplied to the reinforcing member 5 in a metal plating tank while using a pin groove for inserting an electrode, a super abrasive grain is fixed on the abrasive grain layer forming surface 5a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrodeposition grindstone in which a grindstone base supporting an abrasive grain layer is made of resin, and a method for producing the same.

[0002]

2. Description of the Related Art Conventionally, the problems to be solved by the invention
An electrodeposition grindstone using a metal grindstone base (base metal) is formed by masking the grindstone base and adhering a large number of superabrasive grains to the abrasive grain layer forming surface via a metal plating layer. There is. However, such an electrodeposition grindstone has various problems that it is heavy in weight, the degree of freedom of the shape of the grindstone base is small, and minute pitching and chatter vibration are likely to occur during grinding.

As an electrodeposition grindstone for improving such a defect, a grindstone base made of resin has been proposed. That is, this electrodeposition grindstone, the surface of the grindstone base made of resin is subjected to a masking treatment for covering the non-abrasive grain layer forming surface to form an electroless plating layer, and further a metal plating layer is formed on this electroless plating layer. It is deposited and superabrasive grains are fixed on this layer. With such an electrodeposition grindstone, the above-mentioned drawbacks of the electrodeposition grindstone using a metal grindstone base (base metal) are improved.

However, in the case of an electrodeposition grindstone using a resin grindstone base, the manufacturing process such as the formation of the electroless plating layer and the masking work is complicated, and the manufacturing cost is increased.

In view of the above problems, it is an object of the present invention to provide an electrodeposition grindstone having a simpler structure and manufacturing process, and a manufacturing method thereof.

[0006]

In the electrodeposition grindstone according to the present invention, a conductive reinforcing member is fixed in a grindstone base made of a resin layer, and a superabrasive grain is present on a portion of the reinforcing member exposed on the surface of the grindstone base. And the resin layer of the grindstone base is provided with holes communicating with the reinforcing member from the outer surface by the supporting member for supporting the reinforcing member in the mold during resin injection molding. It is characterized by doing so.

The method for producing an electrodeposition grindstone according to the present invention is
A conductive reinforcing member is fixed in a grindstone base made of a resin layer, and the resin layer communicates with the reinforcing member from an outer surface by a supporting member for supporting the reinforcing member in the mold during resin injection molding. By immersing the grindstone base having the holes formed therein in a plating solution and energizing the reinforcing member through the holes, the superabrasive grains are electrodeposited on the portion of the reinforcing member exposed on the surface of the grindstone base. It is characterized by having done.

Further, the grindstone base is formed in a ring shape, and a ring-shaped reinforcing wire is built in the resin layer thereof.

The resin layer of the grindstone base contains non-conductive fibers dispersed therein.

[0010]

The electrodeposition grindstone according to the present invention is exposed on the surface of the grindstone base by energizing the reinforcing member through the holes formed by the supporting member during the injection molding of the grindstone base by the mold in the manufacturing process thereof. An abrasive grain layer can be formed on the abrasive grain layer forming surface of the reinforcing member. Further, the contact with the work material can be detected by energizing the reinforcing member through the hole.

In the method for manufacturing an electrodeposition grindstone according to the present invention, a hole communicating with the reinforcing member from the resin layer is formed by the supporting member during injection molding of the grindstone substrate with a die, and the reinforcing member is energized through this hole. By doing so, plating for forming the abrasive grain layer can be performed, and the area where the abrasive grain layer is formed is exposed on the surface of the grindstone substrate without requiring masking work or electroless plating layer forming work. It can be set by the surface area of the reinforcing member.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view showing a partial vertical cross section of an electrodeposition grindstone according to this embodiment, and FIG. 2 is a vertical cross sectional view of an injection molding die for manufacturing a grindstone base of the electrodeposition grindstone according to this embodiment. In FIG. 1, an electrodeposition grindstone 1 has, for example, a ring shape, and has a ring-shaped grindstone base 2, a metal plating layer formed on the surface of the abrasive grain layer formation, and a diamond, for example, fixed to the metal plating layer. Or an abrasive grain layer 3 made of superabrasive grains such as CBN. In the grindstone base 2, a ring-shaped reinforcing member 5 is fixed to the inside of a ring-shaped resin layer 4 molded by the injection molding die shown in FIG. As the resin constituting the resin layer 4 of the grindstone base 2, a Bakelite resin is used in the present embodiment, but other materials such as thermoplastic resins such as polyamide, polyacetal, polycarbonate, or unsaturated polyester, epoxy are used as the resin. You may use thermosetting resin etc., such as resin. Then, non-conductive fibers such as ceramic fibers are dispersed and mixed in this resin.

The reinforcing member 5 is for reinforcing the strength of the grindstone during the grinding rotation of the electrodeposition grindstone, and is made of a conductive material capable of plating the surface thereof. The outer peripheral surface of the reinforcing member 5 is exposed from the outer peripheral surface of the resin layer 4,
The abrasive grain layer forming surface 5a is configured. This abrasive grain layer forming surface 5
a is obtained by appropriately setting the exposed region of the grindstone base 2 by injection molding of the resin according to the width of the reinforcing member 5 or the like,
The abrasive grain layer 3 having a desired area and shape can be formed on the surface. As the conductive material forming the reinforcing member 5, steel such as stainless steel or mild steel is usually used, but aluminum alloy or the like may be used for weight reduction. A pair of pin holes 6a, 6b are formed on the upper surface and the lower surface of the grindstone base 2 and extend from the respective surfaces to the upper surface and the lower surface of the reinforcing member 5 and communicate with them. The pin holes 6a and 6b can be used as electrodes to be inserted when superabrasive grains are electrodeposited. By energizing the reinforcing member 5 through the pin holes 6a and 6b, the reinforcing member 5 can be formed.
The superabrasive grains can be electrodeposited on the abrasive grain layer forming surface 5a. The pin holes 6a and 6b are appropriately provided in pairs in the circumferential direction of the grindstone base 2, and in this embodiment, the pin holes 6a and 6b are arranged at substantially equal intervals so that a uniform plating layer is formed over the entire circumference of the abrasive grain layer forming surface 5a. At least 3 pairs are drilled.

Next, an injection mold for forming the grindstone base 2 will be described with reference to FIG. The injection molding die 8 has a ring shape, and in its longitudinal cross section, a substantially rectangular cavity 9 filled with resin is formed by a communication portion 10 communicating with the inner peripheral surface thereof. Further, the mold 8 communicates with a resin flow supply runner 11 formed outside along the outer peripheral surface of the mold 8 at appropriate points through injection holes 12. The reinforcing member 5 includes a pair of pins 13a and 13b extending from several positions on the upper and lower surfaces of the mold 8 in the cavity 9.
Is held at a substantially central portion in the vertical direction, and its outer peripheral surface abuts against and is supported by the outer peripheral surface of the cavity 9.

Next, a method for manufacturing the electrodeposition grindstone 1 shown in FIG. 1 will be described. First, the reinforcing member 5 is installed in the cavity 9 such that the outer peripheral surface of the reinforcing member 5 contacts the outer peripheral surface of the cavity 9 of the injection molding die 8 shown in FIG. It is made to pinch by each pin 13a, 13b. At this time, the outer peripheral surface of the reinforcing member 5 is preliminarily formed as an abrasive grain layer forming surface 5a so as to have a desired width and shape corresponding to the abrasive grain layer. Further, in order to form a uniform plated layer, it is preferable to provide the pins 13a and 13b at three or more positions at appropriate intervals. Then, the resin in which the ceramic fibers are dispersed and mixed is injected and filled into the cavity 9 from the runner 11 through the injection hole 12. In this way, the grindstone base 2 in which the reinforcing member 5 is covered with the resin layer 4 is injection-molded. Next, the grindstone base 2 is set in a plating tank, and a large number of superabrasive grains are dispersed on the abrasive grain layer forming surface 5a. Then, a metal plating layer of Ni, Co, or the like is deposited by the electrolytic plating method or the electroless plating method, and the superabrasive grains are fixed on the abrasive grain layer forming surface 5a. This operation is performed over the entire surface 5a of the grindstone base 2 on which the abrasive grain layer is formed. In this way, the electrodeposition grindstone 1 is manufactured.

As described above, according to the present embodiment, the electrodeposition grindstone 1 can be relatively easily manufactured without masking work and without forming the electroless plating layer on the resin layer 4. The number can be reduced. Moreover, since the reinforcing member 5 also serves as the electroless plating layer of this kind of electrodeposition grindstone according to the above-mentioned prior art, the structure is relatively simple, and the abrasive grains of any shape can be formed without performing a masking operation. Layers can be formed.

In addition to this, the contact state between the work material and the grindstone base 2 is detected by disposing conductive fibers dispersed in the resin layer 4 in the above-mentioned prior art to make the grindstone base conductive. Although this has been done, this can be done in this embodiment by connecting the pin holes 6a and 6b to the reinforcing member 5 by inserting electrodes. Therefore, a non-conductive ceramic fiber is provided in the resin layer 4. Further, since the grindstone base 2 is made of resin, the grindstone can be reduced in weight, has a vibration absorbing property, reduces minute chipping and chatter vibration during cutting, and improves the finished surface roughness. Further, rust of the grindstone base 2 can be prevented.

Next, FIG. 3 shows another structure in which the resin layer 4 of the grindstone base 2 is further reinforced. That is, in the figure,
In the resin layer 4, an appropriate number of ring-shaped metal wires 15 are arranged. Each metal wire rod 15 has a mold 8 at the time of resin injection.
In which the reinforcing members 5 are connected to each other or individually
It may be held by being connected to the above, or it may be supported in the air by a pin or the like extending from the mold 8 like the reinforcing member 5.

The pins 13a and 13b form a support member.

[0020]

As described above, the electrodeposition grindstone according to the present invention and the method for manufacturing the same are provided with a hole communicating with the reinforcing member in the resin layer of the grindstone base, and the reinforcing member is energized through the hole. Since the superabrasive grains are fixed, the electrodeposition grindstone can be relatively easily manufactured without performing the masking work or the electroless plating layer forming work, and the number of steps can be reduced. Moreover, since the reinforcing member also serves as the electroless plating layer of the conventional seed stone, the structure is relatively simple, and the abrasive grain layer of any shape can be formed without performing the masking work. Further, the contact state between the work material and the grindstone base can be detected by energizing the reinforcing member through the hole of the resin layer, and it is not necessary to dispose the conductive fiber in the resin layer. In addition to this, since the grindstone base is made of resin, the grindstone can be made lightweight, has vibration absorption, reduces minute chipping and chatter vibration during cutting, and improves the finished surface roughness. Further, it is possible to prevent rust on the grindstone base.

[Brief description of drawings]

FIG. 1 is a perspective view showing a partial vertical section of an electrodeposition grindstone according to an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view showing a state where a reinforcing member is housed in an injection molding die for molding a grindstone base.

FIG. 3 is a diagram showing a modification of the embodiment shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electroplated whetstone 2 Whetstone base 3 Abrasive grain layer 4 Resin layer 5 Reinforcing member 6a, 6b Pin hole 8 Injection molding die 13a, 13b Pin

Claims (4)

[Claims] 1. A conductive reinforcing member is fixed in a grindstone base made of a resin layer, and superabrasive grains are electrodeposited on a portion of the reinforcing member exposed on the surface of the grindstone base. An electrodeposition grindstone in which a hole is formed in the resin layer so as to communicate with the reinforcing member from the outer surface of the supporting member for supporting the reinforcing member in the mold during resin injection molding. 2. A conductive reinforcing member is fixed in a grindstone substrate made of a resin layer, and the resin layer has an outer surface formed by a supporting member for supporting the reinforcing member in a mold during resin injection molding. A grinding wheel base body having a hole communicating with the reinforcing member is immersed in a plating solution, and the reinforcing member is energized through the groove, so that the portion of the reinforcing member exposed on the surface of the grinding stone base body is super-abrasive. A method for producing an electrodeposition grindstone in which particles are electrodeposited. 3. The electrodeposition grindstone according to claim 1 or 2, wherein the grindstone base is formed in a ring shape, and a ring-shaped reinforcing wire is incorporated in the resin layer thereof. Or its manufacturing method. 4. The electrodeposition grindstone according to claim 1 or 2, wherein a non-conductive fiber is dispersed and incorporated in the resin layer of the grindstone base.