JPH06190727A - Electrodeposited grinding wheel - Google Patents

Abstract

PURPOSE:To provide an electrodeposited grinding wheel which is not likely to generate chipping or chattering at machining and is easy to form a complicated abrasive grain layer shape. CONSTITUTION:A non-electrolytic plating layer 4 is formed on the abrasive grain layer forming surface 2A of a grindstone substrate 2 consisting of a resin, and a number of super-abrasive grains 6 are fixed onto this non-electrolytic plating layer 4 by a metal plating layer 8. Electroconductive fibers are dispersed in the resin constituting the grindstone substrate 2, which is thereby given electroconductiveness.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrodeposition grindstone which is less likely to cause chipping or chatter vibration and has a good finished surface roughness.

[0002]

2. Description of the Related Art Conventionally, electrodeposition grindstones have a large number of superabrasive grains adhered to the surface of the abrasive grain layer on a metal-made grindstone substrate (base metal) of various shapes via a metal plating layer. It is formed by

In such a conventional electrodeposition grindstone, during cutting of a work material, due to a cutting impact generated in each abrasive grain,
There is a drawback that minute chipping and chatter vibration are likely to occur. Further, when manufacturing a grindstone with a complicated abrasive grain layer shape such as a full-form grindstone, it is necessary to shape the grindstone base to match the shape of the abrasive grain layer, but the conventional base metal is manufactured in such a shape. It is not easy to do this, and a grindstone with higher productivity has been demanded. The present invention is intended to solve the above problems.

[0004]

In the electrodeposition grindstone according to the present invention, an electroless plating layer is formed on a surface of a grinding wheel base made of resin on which an abrasive grain layer is formed, and superabrasive particles are electroplated on the electroless plating layer. It is characterized by being worn.

Conductive fibers may be dispersed in the resin constituting the grindstone base, so that the grindstone base may have conductivity.

[0006]

In the electrodeposition grindstone having the above structure, since the grindstone base is made of resin and has a vibration absorbing property, the cutting impact of each abrasive grain during cutting is absorbed. Further, the weight of the grindstone base is smaller than that of the conventional electrodeposition grindstone using a base metal, and the weight of the whole grindstone is also small.

In addition, when conductive fibers are dispersed in the resin forming the grindstone base to make the grindstone base electrically conductive, the heat dissipation and strength of the grindstone base are improved and the work material is improved. Contact with can be detected by conduction.

[0008]

【Example】

FIG. 1 is a side view showing an embodiment of an electrodeposition grindstone according to the present invention, and FIG. 2 is an enlarged sectional view of an abrasive grain layer of the electrodeposition grindstone. In the electrodeposition grindstone 1 of this embodiment, superabrasive grains 6 such as diamond or CBN are metal-plated on the abrasive grain layer forming surface 2A of a wheel-shaped resin-made grindstone substrate 2 via an electroless plating layer 4. The electrodeposited abrasive grain layer 10 adhered by the layer 8 is formed. In this embodiment, the abrasive grain base 2 is a wheel type and the abrasive grain layer forming surface 2A is a concave curved surface, but the present invention is not limited to this and may be any shape conventionally used. .

The resin constituting the grindstone base 2 is preferably a thermoplastic resin such as polyamide, polyacetal or polycarbonate, or a thermosetting resin such as unsaturated polyester or epoxy resin. Particularly, the electroless plating layer 4 and As a resin with high bonding strength of polyphenylene ether,
Examples thereof include polysulfone and polyether sulfone. In this embodiment, carbon fibers, metal fibers made of metal such as glass whiskers and stainless fibers, and conductive fibers such as carbon or metal whiskers are dispersed and mixed in the resin forming the grindstone base 2. In order to secure the conductivity of the grindstone base 2 and to increase the strength, for example, in the case of stainless fiber, the fiber length 1
It is preferable to add a material having a diameter of 0 to 50 mm in an amount of 5 to 20% by volume.

The electroless plating layer 4 is made of Ni, Co, C.
It is made of a metal such as u and has a thickness of 5 to 10
The range is preferably 0 μm. When the thickness is less than 5 μm, it becomes difficult to obtain uniform conductivity over the entire surface, it is difficult to deposit the metal plating layer 8 uniformly, and the metal stone layer 2 is easily peeled off. Conversely 1
It is unnecessary to make the thickness larger than 00 μm, and it takes time to form the plating layer.

The grain size and concentration of the superabrasive grains 6, the metal plating layer 8
The thickness may be appropriately set according to the application of the grindstone.

Next, a method for manufacturing the above electrodeposition grindstone will be described. First, the grindstone base 2 is formed into a predetermined shape with resin. The grindstone substrate 2 may be manufactured by an injection molding method using a thermoplastic resin such as foliamide or a hot pressing method using a thermosetting resin such as phenol.

At the time of manufacturing the grindstone base 2, conductive fibers such as carbon fibers, metal fibers, carbon or metal whiskers are dispersed and mixed in the resin.

Next, the surface of the grindstone base 2 formed as described above is subjected to a masking treatment for covering the non-abrasive grain layer forming surface, and thereafter, an activation treatment such as dipping in a palladium chloride solution is carried out. Give.

Then, the grindstone base 2 is immersed in a plating solution to perform electroless plating, and the grindstone base 2 has a thickness of 20.
The electroless plating layer 4 having a thickness of 80 μm is formed. Before the formation of the electroless plating layer 4, the resin surface of the grindstone base 2 may be roughened to have a surface roughness Rmax of about 2 to 5 μm to increase the bonding strength of the electroless plating layer 4.

Next, the grindstone base 2 on which the electroless plating layer 4 is formed is set in a plating tank, and a large number of superabrasive grains 6 are dispersed on the surface of the abrasive grain layer. Then, a metal plating layer 8 of Ni, Co or the like is deposited by the electrolytic plating method or the electroless plating method, and the superabrasive grains 6 are fixed on the electroless plating layer 4. This operation is performed over the entire surface of the grindstone base 2 on which the abrasive grain layer is formed.

After that, if the masking is removed from the grindstone base, the electrodeposition grindstone according to the present invention is manufactured.

According to such an electrodeposition grindstone, the grindstone base 2
Is made of resin and has a vibration absorbing property, so that the cutting impact of each superabrasive grain 6 at the time of grinding is absorbed, minute chipping is less likely to occur on the surface of the work material, and chatter vibration is less likely to occur. . Therefore, the finished surface roughness is better than that of the conventional electrodeposition grindstone using the metal base metal using the same grain size.

Further, since the weight of the grindstone base 2 is smaller than that of the conventional electrodeposition grindstone using a base metal, the weight of the whole grindstone is also small, the force required to drive the grindstone is small, and the running cost of the grinder is reduced. can do.

Further, since the abrasive grain layer forming surface 2A of the grindstone base 2 can be easily manufactured into the above-mentioned quadratic curve shape or other complicated shapes, a grindstone having a complicated abrasive grain layer shape can be efficiently used. Can be produced well.

Further, in this embodiment, since conductive fibers are dispersed in the resin forming the grindstone base 2 to make the grindstone base 2 conductive, the heat dissipation of the grindstone base 2 can be improved. While improving the strength,
This has an advantage that the contact state between the work material and the grindstone base 2 can be detected by conduction. However, the conductive fibers may not be dispersed in the grindstone base 2.

[0023]

As described above, according to the electrodeposition grindstone of the present invention, since the grindstone base is made of resin and has a vibration absorbing property, the cutting impact of individual superabrasive grains during grinding is absorbed, Small chipping is less likely to occur on the surface of the work material, and chatter vibration is less likely to occur. Therefore,
The finished surface roughness is better than that of a conventional electrodeposition grindstone using a metal base metal using the same grain size.

Further, since the weight of the grindstone base is smaller than that of the conventional electrodeposition grindstone using a base metal, the weight of the whole grindstone is also small, and the force required to drive the grindstone can be reduced.

Further, since it is easy to manufacture the grindstone base into a desired shape, it is possible to efficiently produce a grindstone having a complicated abrasive grain layer shape such as a full-form grindstone.

In addition, when conductive fibers are dispersed in the resin forming the grindstone base to make the grindstone base conductive, the heat dissipation of the grindstone base can be improved and the strength can be improved. Further, the contact state between the work material and the grindstone base can be detected by conduction.

[Brief description of drawings]

FIG. 1 is a partially cutaway side view showing an electrodeposition grindstone according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view of an abrasive grain layer of the electrodeposition grindstone of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electroplated grindstone 2 Grindstone base 2A Abrasive grain layer formation surface 4 Electroless plating layer 6 Super abrasive grain 8 Metal plating layer 10 Electroplated abrasive grain layer

Claims (2)

[Claims] 1. An electro-deposited grindstone, wherein an electroless plating layer is formed on a surface of a grindstone base made of a resin on which an abrasive grain layer is formed, and superabrasive grains are electrodeposited on the electroless plating layer. 2. The electrodeposition grindstone according to claim 1, wherein electrically conductive fibers are dispersed in the resin forming the grindstone base, whereby the grindstone base has conductivity.