JPH069134U - Probe board with diagonal linear probe - Google Patents

Abstract

(57) [Summary] [Purpose] The probe assembly accuracy can be easily improved, all the probes can be surely brought into contact with the terminals of the semiconductor integrated circuit under test at a substantially constant pressure, and the probe height for any terminal arrangement can be improved. Allows for density placement. [Structure] Each probe 5 is linear, and a large number of linear probes 5 are held by an insulator 6 so as to extend obliquely downward with respect to the printed circuit board 7 and to be parallel to each other. The insulator 6 is attached to the printed circuit board 7 at a fixed position, and thus the probe 5 is assembled and used in a linear shape without being bent.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement in a probe substrate used for inspection of integrated circuit chips in a manufacturing process of a large scale semiconductor integrated circuit (LSI).

[0002]

[Prior art]

 Due to the recent remarkable progress in the degree of integration of semiconductor integrated circuits, a large number of probes are required to be provided on a probe substrate, and various types of arrays are required. ing.

The probe substrate is generally circular or substantially square, and a large number of probes are insulated from each other through a ring-shaped probe support member formed of ceramic or aluminum on the lower surface of the central portion of the print substrate having through holes. It is configured to be fixed by molding the material.

FIG. 4 is a sectional view showing an example of a conventional probe substrate, and each is shown as a sectional view including a probe.

The cross-sectional view of FIG. 4 (a) is shown as a right half cross section from the center of the conventional probe substrate 21, but the diameter of the probe substrate 21 gradually increases as the probe 22 approaches the tip 22 a. The probe 22 is formed in a taper shape so as to be thin, and the entire probe 22 is oblique to the substrate 23 of the probe substrate 21 (generally, an angle of about 10 degrees with respect to the surface of the substrate 23), and the insulating material 24 is formed by molding or the like. The insulating material 24 is fixed and fixed to the lower surface of the central portion of the substrate 23 via the probe supporting member 25. The probe supporting member 25 is made of ceramic, aluminum, or the like, and also functions as a spacer.

The tip 22a of the probe 22 is bent near the tip 22a so that the tip 22a faces in a substantially vertical direction when the substrate 22 is placed horizontally.

In the inspection of the semiconductor integrated circuit, when the inspection table 27 on which the integrated circuit chip 26 is mounted is raised from the lower side toward the probe substrate 21, the tip 22 a of the probe 22 is connected to the terminal 28 of the semiconductor integrated circuit to be inspected. Contact each.

Further, in the conventional probe substrate 29 shown in FIG. 4B, the probe 30 is perpendicular to the substrate 31, and therefore when the substrate 31 is placed horizontally, the probes 30 are all oriented in the vertical direction. As described above, the insulating material 32 is fixed by molding or the like, and the insulating material 32 is fixed to the substrate 31 via the probe supporting member 33.

[0009]

[Problems to be solved by the device]

 The placement of the tips 22a and 30a of the probes 22 and 30 requires accuracy, and the tips 22a and 30a of all the probes 22 and 30 need to be exactly on the same plane, as shown in FIG. 4 (a). In the probe 22 having such a structure, it is necessary to bend the tip 22a, and in order to maintain the assembly accuracy of the probe 22, an operator conventionally adjusts the position by tweezers or the like. Further, the probe 30 having the structure as shown in FIG. 4B is suitable for high-density arrangement because the probes 30 are all arranged vertically, but when the probe 30 makes contact with the terminals 35 of the integrated circuit chip 34, Since the elasticity of the tip 30a cannot be utilized, if the tip 30a is irregularly arranged, the tip 30a hits the terminal 35 of the integrated circuit chip 34 first, so that the tip 30a of all the probes 30 can be pressed. 4 does not come into contact with the predetermined terminals 35 of the integrated circuit chip 34 under a constant pressure, and if the inspection table 36 on which the integrated circuit chip 34 is mounted is raised with a strong force from below toward the probe substrate 29, As indicated by the chain double-dashed line in (c), the probe 30 whose tip 30a hits the terminal 35 first bends in the middle and comes into contact with the adjacent probe 30. There is a possibility that.

The object of the present invention is to improve the probe assembling accuracy easily, to ensure that all the probes are in contact with the terminals of the semiconductor integrated circuit under test with a substantially constant pressure, and for any terminal arrangement. It is an object of the present invention to provide a probe substrate that enables high-density arrangement.

[0011]

[Means for Solving the Problems]

 In the present invention, each probe is linear, and a large number of the linear probes are held by an insulator so as to extend obliquely downward with respect to the print substrate and parallel to each other. The insulator is attached to the printed circuit board at a fixed position.

[0012]

[Action]

 In the present invention, by arranging the linear probes in an obliquely parallel manner, the tips of the probes in a high-density arrangement in which the assembly accuracy is significantly improved are brought into elastic contact with the terminals of the semiconductor integrated circuit under test obliquely.

[0013]

【Example】

 1 is a bottom view of a probe substrate according to an embodiment of the present invention, FIG. 2 is a top view of the same, and FIG. 3 is an enlarged sectional view taken along the line AA 'in FIG.

The probe substrate 1 has a square hole 3 formed in the center of a base plate 2 formed of anodized aluminum or the like whose surface is insulated (FIG. 3). An annular rectangular probe support member 4 is fixed, and an insulator 6 integrally holding a probe 5 is fitted and fixed in an inner diameter portion of the probe support member 4.

As shown in FIG. 3, the probe 5 formed in a linear shape is an insulator 6 whose upper and lower surfaces are parallel to each other, and all the probes 5 form an oblique constant angle with respect to the insulator 6, and the tip thereof. The output ends 5b of the probes 5 are inserted into the through holes 8 of the printed circuit board 7 fixed to the upper surface of the base plate 2 and soldered to each other. .

As described above, since the probe 5 is not bent but is linearly held by the insulator 6 by molding or the like, the operator does not need to adjust the tip 5a of the probe 5, When each terminal of the integrated circuit chip (not shown) comes into contact with the tip 5a of the probe 5, the tip 5a of each probe 5 surely contacts the corresponding terminal with a constant pressure.

Further, even when the tip 5a of the probe 5 is slightly displaced vertically from the same plane, the elasticity of the probe 5 causes the tip 5a of each probe 5 to move to a corresponding predetermined terminal. Make sure contact.

As shown in FIG. 2, on the upper surface of the printed board 7, the printed pattern 10 is formed from the terminal 9 of the through hole 8 to which the output end 5 b of each probe 5 is connected, toward the peripheral portion of the printed board 7. Is formed, and the output terminal 11 in the peripheral portion of the printed circuit board 7 is connected to ground and a power supply, electronic circuit parts, test / inspection equipment, and the like. Note that, in FIG. 2, only a part of the print pattern 10 is shown.

Further, in the probe substrate 1, as shown in FIG. 3, the probe 5 has no bent portion, and the probes 5 can be arranged in parallel at a high density so that the probes 5 can be overlapped at an oblique constant angle. By vertically arranging the probes 5 arranged in columns in the horizontal direction as shown in Fig. 3 and arranging them in the horizontal direction, the integrated circuit in which terminals exist not only in the peripheral portion of the integrated circuit chip but also at arbitrary positions in the chip. The probe 5 can be flexibly arranged also on the circuit chip.

(Modification) The base plate 2 is not always necessary. For example, if the thickness of the printed board is increased and the strength is increased, the base plate 2 may be omitted and the insulator 6 may be directly fixed to the lower surface of the printed board. Further, the probe supporting member 4 may be omitted and the insulator 6 may be fixed to the lower surface of the base plate 2 or the printed circuit board.

[0021]

[Effect of device]

 As described above, according to the present invention, each probe is linear, and a large number of such linear probes extend obliquely downward with respect to the printed circuit board and are parallel to each other. Since it was held by an insulator and attached to the position fixed to the printed circuit board, the probe was assembled and used in a straight line shape without being bent. , The probe assembly accuracy can be easily improved, all the probes can be surely brought into contact with the terminals of the semiconductor integrated circuit under test with a substantially constant pressure, and the probes can be mounted to any terminal arrangement. Can be arranged in density.

[Brief description of drawings]

FIG. 1 is a bottom view of a probe substrate according to an embodiment of the present invention.

FIG. 2 is likewise a top view of the probe substrate.

FIG. 3 is a sectional view taken along the line AA ′ in FIG.

FIG. 4 is a cross-sectional view showing an example of a conventional probe substrate.

[Explanation of symbols]

 1 probe board 2 base plate 3 hole 4 probe support member 5 probe 5a tip 5b output end 6 insulator 7 printed circuit board 8 through hole 9 terminal 10 printed pattern 11 output terminal

Claims (1)

[Scope of utility model registration request] 1. A probe board comprising a printed circuit board having a printed pattern and a large number of probes electrically connected to the printed pattern of the printed circuit board, wherein each probe is linear and the linear A large number of probes are held by an insulator so as to extend obliquely downward with respect to the printed circuit board and parallel to each other, and the insulator is mounted at a position fixed to the printed circuit board. A probe substrate provided with an oblique linear probe.