JPH0690099A - Jig for supporting substrate - Google Patents

Abstract

PURPOSE:To provide a jig for supporting substrate which operates desirably in cooperation with a printer for printing a cream solder onto a printed circuit board and a mounter for mounting devices. CONSTITUTION:A jig for supporting substrate 12A wherein a layer 12 consisting of a material which can be transformed according to the shape of a mounted component (for example, urethane foam material) is formed on a base 13, and on the plane opposite to a printed circuit board on which a component to be supported has been already mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board supporting jig, and in particular, a board which performs a suitable operation in cooperation with a printing apparatus for printing cream solder on a printed circuit board and a mounting apparatus for mounting components. The present invention relates to a supporting jig.

[0002]

2. Description of the Related Art FIG. 4 is a view showing a conventional substrate supporting jig (first conventional example) usually called a backup jig. This (A) of FIG. 4 shows the first
FIG. 11 is a top view of a conventional example of FIG. 1, in which a pair of guide rails 41 for holding and carrying a printed circuit board are provided on both sides of a back-up (printing apparatus) board supporting jig 42 made of an appropriate metal material. ing. FIG. 4B is a side view of the first conventional example, in which the substrate supporting jig 42 located at a position lower than the pair of guide rails 41 is formed by the pair of guide rails 41. In the void (arrow F
It is designed to proceed.

The one shown in FIG. 5 is a conventional board supporting jig (secondary jig, also called a backup jig), which is also applied to a printed circuit board on which components are mounted on both sides. It is a figure which shows the prior art example. FIG. 5 (A) is a top view of the second conventional example, in which a pair of guide rails 51 is composed of an appropriate number of metal square poles (a circular pole may be used) for backup ( It is arranged on both sides of the substrate supporting jig 52 (of the printing apparatus). Here, the appropriate number of substrate supporting jigs 52 are provided at a certain predetermined interval so as to support the printed circuit board at a position where no component is mounted. Also, FIG. 5 (B)
FIG. 6 is a side view of the second conventional example, in which a substrate supporting jig 52 located at a position lower than the pair of guide rails 51 is placed in a space formed by the pair of guide rails 51 (arrow F). It is designed to proceed). In both the first conventional example and the second conventional example,
The board supporting jig of a certain predetermined printing apparatus is elevated to the lower surface of the printed circuit board supported by the guide rails.

The above-described first conventional example and second conventional example have some drawbacks as follows. (1): When the board supporting jig is attached so as to cover the entire area of the lower side of the board as in the first conventional example, in the first conventional example, the board on which the component is mounted only on one side thereof (that is, Applicable only to single-sided mounting board). If it is applied to a double-sided mounting board,
There is an inconvenience that the mounted component hits the substrate supporting jig (for backup). (2): As in the second conventional example, when board supporting jigs (for backup) made of, for example, a square pole are used, these board supporting jigs may be attached to a place where no component is mounted. Needed. With this, the current high-density mounting cannot be accurately supported. Moreover, the thickness of the cream solder to be printed varies, resulting in an increase in defective products. In particular, the substrate used is thin (0.
8 mm or less), stable printing cannot be performed. (3): In the above-mentioned second conventional example, a substrate supporting jig (for backup) made of, for example, a circular column is used (the mounter is used as described above).
At times, depending on where these substrate supporting jigs are attached, the substrate to be used may be warped or slanted, so that the so-called pushing amount becomes unstable. Then, it causes chips to stand in a state where no components are mounted, and as a result, the number of defective products increases. In particular, when the substrate used is thin (0.8 mm or less), its effect becomes significant.

[0005]

As described above, the above-mentioned conventional technique has the following problems. That is, when the board supporting jig is attached so as to cover the entire area on the lower side of the board as in the first conventional example, this can be applied only to the single-sided mounting board, and if it is applied to the double-sided mounting board,
There has been a problem that the mounted component hits the board supporting jig. Further, if substrate supporting jigs made of, for example, a quadrangular prism are used as in the second conventional example, the mounting locations of these substrate supporting jigs are limited to locations where no components are mounted on the substrate, There is a problem that it is not possible to accurately respond to the current high-density mounting, which leads to an increase in defective products. Further, in the above-mentioned second conventional example, when substrate supporting jigs made of, for example, circular columns are used, undesired deformation of the substrate to be used occurs depending on the places where these substrate supporting jigs are attached. However, this also leads to an increase in defective products.

The present invention has been made in order to solve the above-mentioned problems, and can be suitably applied to a double-sided mounting board as well, and can reliably prevent an increase in defective products. The object is to provide a supporting jig.

[0007]

A board supporting jig according to the present invention corresponds to the shape of the mounted component on a surface of the printed circuit board on which the component is mounted and which faces the component mounting surface. A board supporting jig provided with a layer made of a material capable of being deformed by: embossing the component mounting surface of the printed circuit board,
The part corresponding to the shape of the part is deformed beyond its original elastic limit, and the deformed part is made of a material that has a soft cushioning property that is not originally present;
It is characterized by that.

[0008]

The jig for supporting a substrate according to the present invention corresponds to the shape of the mounted component such as a layer made of urethane foam material on the surface facing the printed circuit board on which the component to be supported is mounted. And a layer made of a material that can be deformed is provided. For this reason, even if a component is mounted on the lower surface of the printed circuit board, the urethane foam material layer is only deformed at the corresponding portion, and the printed circuit board is securely fixed at the remaining portion. There is an advantage that it can be supported. For example, even in a printed circuit board on which components are mounted on both sides, printing of cream solder and mounting of components can be performed easily and reliably.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic explanatory view of an embodiment of a substrate supporting jig according to the present invention. This (A) of FIG.
[FIG. 3] is a top view of the above embodiment, showing a pair of guide rails 11
Are arranged on both sides of a back-up (printing apparatus) substrate supporting jig 12A including the urethane foam layer 12. The urethane foam layer here can be replaced by, for example, polyethylene foam. Also, FIG.
(B) is a side view of the above-described embodiment, showing a board supporting jig 12A at a position lower than the pair of guide rails 11.
Are advanced (in the direction of arrow F) into the space formed by the pair of guide rails 11. Here, the substrate supporting jig 12A comprises a base 13 and a urethane foam layer 12 provided on the upper surface thereof.

FIG. 2 is a schematic explanatory view of a substrate supporting jig which is a modified example of the above-described embodiment and is provided with measures for increasing the strength thereof and further preventing damage to the parts. FIG. 2A is a top view of the modified example, in which a pair of guide rails 11 are arranged on both sides of a back-up (printing apparatus) substrate supporting jig 12B including a urethane foam layer 12. ing. 2B is a side view of the modified example, in which a board supporting jig 12B located at a position lower than the pair of guide rails 11 is formed in the space formed by the pair of guide rails 11. (In the direction of arrow F). Here, the substrate supporting jig 12B is configured such that the conductive rubber layer 14 is provided on the upper surface of the base body 13 and the urethane foam layer 12 is further provided on the upper surface thereof. By adopting such a configuration, As a result, the increase in strength and the prevention of damage to the parts are more surely ensured. Further, the conductive rubber layer 14 and the urethane foam layer 12 are not limited to one layer as described above, but may be a plurality of layers as necessary.

FIG. 3 is an explanatory diagram related to the operation mode of the substrate supporting jig according to the above embodiment. First, in FIG. 3A, a urethane foam material 31 having an appropriate thickness
To prepare. Next, in FIG. 3B, one surface of the urethane foam material 31 is embossed. That is, a desired printed circuit device 34 is manufactured in advance as a so-called reference device by attaching a required part 33 to a predetermined printed circuit board 32, and this is attached to one surface of the urethane foam material 31. And pressed to form a urethane foam layer 31A having a corresponding uneven portion. The required number of urethane foam layers 31A can be prepared in advance. Then, in FIG. 3C, the urethane foam layer 31A is fixed (using a double-sided tape or the like) to the upper surface of the base portion 35 made of an appropriate metal material or plastic material, and finally. A substrate supporting jig is formed. The board supporting jig thus formed is arranged on the upper surface of the rising portion 36 (for the cream solder printing device or the component mounting device), and the required cream solder is printed or the component is mounted. It will be. Further, FIG. 3D shows an example that can be used together with a conventional jig for supporting a substrate in the shape of a square pole or a circular pole. (D) of this FIG.
In, the urethane foam layer 31A and the base portion 3
5 is provided with an opening corresponding to an appropriate position, and the above-mentioned columnar jig 37 is provided.
Is to be inserted.

In the state shown in FIG. 3 (C) or FIG. 3 (D), the required cream solder printing or component mounting work is performed on the printed circuit board (not shown). The above-mentioned operation is performed on a certain number of printed circuit boards, and the urethane foam layer 31A
When the hardness falls below a certain allowable limit, only the urethane foam layer 31A is replaced with another unused one. After the replacement work, the work of printing the required cream solder or mounting the component is continued.

[0013]

As described in detail above, in the substrate supporting jig according to the present invention, a layer made of a material typified by urethane foam is provided on the surface facing the printed circuit board to be supported. Is configured. For this reason, even if a component is mounted on the lower surface of the printed circuit board, the urethane foam material layer is only deformed at the corresponding portion, and the printed circuit board is securely fixed at the remaining portion. It has the advantage of being supportable. Further, when the hardness of the layer 31A made of a material typified by urethane foam falls below a certain allowable limit, only the layer 31A made of a material typified by the urethane foam is replaced with another unused one. Since there is no need to replace the substrate supporting jig as a whole, there is an economic merit that the manufacturing cost is reduced accordingly.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view of an embodiment of a substrate supporting jig according to the present invention.

FIG. 2 is a schematic explanatory view of a substrate supporting jig, which is a modified example of the above-described embodiment and whose strength is increased.

FIG. 3 is an explanatory diagram related to an operation mode of the jig for supporting a substrate according to the embodiment.

FIG. 4 is a view showing a conventional substrate supporting jig (first conventional example).

FIG. 5 is a view showing a conventional substrate supporting jig (second conventional example).

[Explanation of symbols]

 11: guide rail; 12: urethane foam layer; 12A, 12B: substrate supporting jig; 13: base portion; 14: conductive rubber layer;

Claims (1)

[Claims] 1. A layer made of a material capable of being deformed corresponding to the shape of the mounted component is provided on a surface of the printed circuit board on which the component is mounted, the surface being opposed to the component mounting surface. A jig for supporting a substrate, wherein the layer is formed by pressing the component mounting surface of the printed circuit board so that a portion corresponding to the shape of the component is deformed beyond its original elastic limit. The deformed portion is made of a material having a soft cushioning property which is not present in the original; a substrate supporting jig.