JPH0686367U - U-shaped through hole structure - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a structure of a U-shaped through hole capable of improving connection strength when soldering with a terminal inserted in the U-shaped through hole formed on the edge of a printed circuit board. . In a structure in which a rod-shaped terminal 4 is connected and fixed via a solder 5 in a U-shaped through hole 10 formed on an edge of a printed circuit board 1, unevenness 1 is formed on an inner wall of the U-shaped through hole.
1 and 12 were formed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement of a U-shaped through hole formed by cutting out at an edge portion of a printed circuit board. More specifically, it prevents the external terminals to be soldered from falling off while the tip is inserted into the U-shaped through hole. The present invention relates to a structure of a U-shaped through hole having an excellent function to perform.

[0002]

[Prior art]

 Printed circuit boards used in various electronic devices and communication devices are connected to the method of connecting the components mounted on the circuit board with changes in the form of external output terminals connected to the circuit board and improvement in the component mounting density. There are also various changes in form. 3 (a) (b) (c) and (d) are plan views showing the connection example for deriving the external output terminals from the edge of the printed board 1 in the direction parallel to the board surface, and the connection procedure, etc. FIG. 3 is a partially enlarged plan view showing a rod-shaped terminal 4 (iron or the like made of nickel on a nickel plate) extending from an electronic component 3 such as a feedthrough capacitor in a U-shaped through hole 2 formed by cutting out along an edge of the printed board 1. (Plated) is inserted from the direction parallel to the board surface and fixed with solder. This through hole 2 is formed by plating a copper conductor film 5 on the inner wall surface of the U-shaped cutout obtained by cutting out the edge of the substrate with a drill. It is fixed to the conductor film 5 by the solder 6 while being inserted and positioned in the through hole ((b) (c)). Reference numeral 7 in the figure is a land made of copper foil or the like. However, this connection structure does not have sufficient adhesive holding force in the pull-out direction indicated by arrow A, and when a force in the pull-out direction A is applied, as shown in (d), the solder 4 and the terminal 4 are the same. There was a problem that it easily slipped out in the direction.

[0003]

[The purpose of the device]

 The present invention has been made in view of the above, and is a U-shaped through hole capable of improving the connection strength when soldering with a terminal inserted in the U-shaped through hole formed at the edge of a printed circuit board. It is intended to provide a structure.

[0004]

[Outline of the device]

 In order to achieve the above object, the present invention has a structure in which a bar-shaped terminal is connected and fixed through a solder in a U-shaped through hole formed at an edge of a printed circuit board, the U-shaped through hole being deeper than its opening. It is characterized by having a large diameter portion.

[0005]

[Example of device]

 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings. 1 (a) and 1 (b) are a plan view showing a configuration example of a U-shaped through hole according to an embodiment of the present invention and a plan view showing a state in which terminals are connected. In addition, referring also to FIG. 3A, the same reference numerals are given to the same portions. Further, the through hole of this embodiment is referred to as a U-shaped through hole for convenience. Further, for convenience of explanation, the illustration of the land around the through hole is omitted. The U-shaped through hole 10 of this embodiment has a planar shape having concavo-convex portions 11 on the inner walls facing each other, and by setting a large feed pitch of the drill when the edge of the substrate 1 is cut by the drill. Form. A copper conductor film 5 is entirely plated on the inner wall of the through hole with a uniform thickness, and a rod-shaped terminal 4 of an electronic component 3 such as a feedthrough capacitor is inserted as shown in FIG. 1 (b) and connected by solder 6. .

The uneven portion 11 of the illustrated embodiment is illustrated as a wavy uneven shape, but this is only an example, and the uneven shape of the triangle as shown in FIG. It may be a gear-shaped unevenness as shown in (b). Further, as shown in (c), at least one recess 12 (or protrusion) may be provided on the inner wall of the U-shaped through hole.

According to the present invention, as shown in each of the above embodiments, at least one concave portion or convex portion is provided on the opposing inner walls of the U-shaped through hole so as to fill the through hole. When the solder is caught in the recess or the protrusion, the terminal 4 integrated with the solder cannot be removed from the through hole 10.

By filling the molten solder with the terminal 4 inserted in the U-shaped through hole 10 having the above-described structure, the terminal holding force after the solder is solidified is increased, and the pulling force in the A direction is increased. Even if it acts, it will not fall out easily. Since the terminals 4 are made of metal such as iron plated with nickel and have good wettability with solder, the terminals 4 will not fall off from the solder.

[0009]

[Effect of device]

 As described above, according to the present invention, at least one concave portion or convex portion is provided on the opposing inner walls of the U-shaped through hole formed from the edge of the substrate toward the inside, and the concave portion is filled. Since the fixing force with the inner wall can be increased by the solder applied or the solder fixed to the convex portion, even if a force in the pulling direction is applied to the terminal fixed via the solder, Since the solder is caught in the concave portion or the convex portion, the terminal does not fall off.

[Brief description of drawings]

1A and 1B are a plan view showing a configuration example of a U-shaped through hole according to an embodiment of the present invention and a plan view showing a state in which terminals are connected.

FIG. 2 (a), (b) and (c) are configuration explanatory views of a modified example of the present invention.

3 (a), (b), (c) and (d) are plan views showing a connection example for deriving the external output terminal from the edge of the printed circuit board in a direction parallel to the board surface, and a connection procedure. It is a partially expanded top view which shows etc.

[Explanation of symbols]

3 feedthrough capacitors, 4 bar terminals, 5 conductor films, 6
Solder, 10 U type through hole, 11 uneven part, 12
Recess (projection),

Claims (1)

[Scope of utility model registration request] 1. In a structure in which a rod-shaped terminal is connected and fixed through solder in a U-shaped through hole formed on an edge of a printed board, unevenness is formed on an inner wall of the U-shaped through hole. Type through-hole structure.