JPH0685480B2 - How to mount electronic components - Google Patents

Description

Description: INDUSTRIAL APPLICABILITY The present invention does not damage the copper foil in the insertion hole when inserting and mounting an electronic component with a lead into a board, and the lead has a thick wire diameter. The present invention relates to a method of mounting electronic components that can firmly fix terminals to a board.

Structure of Conventional Example and Problems There are first and second conventional mounting methods for electronic components on a substrate.
As shown in the figure, a clinching method is used in which the lead terminals of the electronic component 2 inserted in the substrate 1 are bent inward or outward by a clincher 4 attached to the tip of the lever type anvil unit 3. However, if the lead wire requires a considerable force to bend hard, this method will forcefully bend it by using the point a of 5 as a fulcrum, so that the damage of this part is remarkable and it is large in the board copper foil which is the board circuit pattern. It is confirmed that it will be scratched. In recent years, as the accuracy of the board has been further increased, such scratching of the copper foil in the board insertion hole has become a serious problem for the user in terms of board quality.

In addition, if the material is not only hard but also has a large lead wire diameter, the clinch method may be fundamentally impossible.

As a second mounting method, as shown in FIG. 3, the insertion hole of the board 1 is set in the lead terminal of the insertion electronic component 2 in a press-fitted state, and the board 1 is press-fitted and fixed. However, this method is not preferable in terms of the quality of the board because the board hole is rubbed and inserted, and the board copper foil is similarly scratched. In addition, there is a problem of strictness of hole accuracy control and a problem that when the substrate is transported after insertion, the lead terminals start to come off due to vibration, and floating occurs in the electronic component.

SUMMARY OF THE INVENTION In view of the above-mentioned conventional drawbacks, the present invention is an electronic component mounting method capable of reliably fixing to a substrate without damaging the substrate copper foil even when the material of the lead terminal of the electronic component is hard or the wire diameter is large. Is provided.

In order to achieve this object, the electronic component mounting method of the present invention is such that a corner portion of a lead terminal of an electronic component with a rectangular lead terminal is provided with a groove having a width smaller than the diameter of the lead terminal of the same shape from two directions under the substrate. It has a configuration in which a flash is generated by plastically deforming it with a concave tool, and the projection is used to fix the electronic component to the substrate. According to this configuration, the leads of the electronic component and the copper foil in the board insertion hole can be kept in non-contact with each other during plastic deformation, so the insertion hole can be a blunt hole instead of a press fit, which is a big problem in the conventional method. It is possible to realize a good mounting state in which there are no scratches, and the electronic parts do not float from the substrate.

Also, by changing the inner width of the concave tool, the same power can be applied to lead terminals with a large wire diameter.

Description of Embodiments One embodiment of the present invention will be described below with reference to the drawings.

4 to 7 show the configuration and operation of the electronic component mounting method according to the embodiment of the present invention. First, the configuration will be described.

In FIGS. 4 to 7, 1 is a substrate into which an electronic component is inserted, 2 is a leaded electronic component to be inserted, and 2 is a square pin as an example. 6 is a chucking tool for gripping and inserting this electronic component, 7 is a head drive unit for supporting the chucking tool 6 and 8 is an XY drive unit for bringing the head drive unit 7 to a predetermined hole position on the substrate. Is.

9 and below are tools for plastically deforming the lead wire 2a of the electronic component 2 whose cutting edge is located on the diagonal extension of the square pin and has a width 9a smaller than the diameter of the lead wire 2a as shown in FIG. It has a concave shape. Reference numeral 10 is a liftable sedge type anvil unit, 11 is a lever to which the tool of 9 is attached, and 12 is an arm connected to the lever of 11. A frame 13 supports the lever 11 and the arm 12, and is fixed by a lever fulcrum pin 14 and an arm point pin 15.

A second piston rod 16 is connected to the arm 12 by a second piston rod fulcrum pin 17, and constitutes a toggle mechanism together with the lever 11. Reference numeral 18 denotes a first piston rod, which serves to push in the second piston rod 16. 19 is a cylinder tube,
20 is a cylinder block.

The mounting method and the operation of the electronic component mounting apparatus configured as described above will be described below.

First, in FIG. 4, the XY drive unit 8 inserts the electronic component 2 by the head drive unit 7 and the chucking tool 6 which have come to the predetermined insertion hole positions of the substrate 1, and at the same time the sedge type anvil unit 10 of 9 or less is formed. To rise. As for the positional relationship between the angle pin lead position of the electronic component 2 and the tool 9, the tool 9 is arranged at an angle of 45 degrees with respect to the electronic component 2 as shown in FIG. This is based on the idea of crimping the leads of the electronic component 2 under the substrate 1 and stopping it in the insertion hole so as to minimize the force for generating a flash that can be fixed.

First, the tool 9 rises in a state of being opened by the diameter of the hole into which the electronic component 2 is inserted, as shown in the diagram on the left side of FIG. 5, to avoid interference with the leads of the electronic component 2.

After rising, air is sent into the first piston rod 18 of FIG. 7, and the force is transmitted to the second piston rod 16. This force is transmitted to the lever 11 via the arm 12. That is, the force expanded by the torgu mechanism is transmitted to the tool 9 attached to the tip of the lever 11, and the leads of the electronic component 2 start to be crimped. The tool 9 plastically deforms the square pin from the state shown on the right side of FIG. 5, and a force is applied until the lead of the electronic component 2 is finally deformed into the shape shown in FIG.

EFFECTS OF THE INVENTION As described above, according to the present embodiment, the lead of the electronic component inserted into the board is not brought into contact with the copper foil of the board as in the conventional clinch method, so that the flaw of the copper foil is completely eliminated. It is not recognized, and the state of good quality circuit board patterns can always be maintained. In addition, there is a design use that the same crushing margin can be obtained with the same force even by changing the width of the inner side of the concave tool for the lead terminal of an electronic component having a large wire diameter that cannot be clinched.

Further, unlike the press-fitting method, the insertion hole may be a ridiculous hole, so that the hole accuracy can be easily controlled, the floating of the component after insertion is small, and stable mounting is always realized.

[Brief description of drawings]

FIG. 1 is an explanatory view of an example of a device by a clinch method for bending a lead of a conventional electronic component, FIG. 2 is an explanatory view of a state of being bent by that method, and FIG. 3 is a press-fitting method which is another conventional mounting method. FIG. 4 (a) is a plan view of an apparatus for carrying out a method for mounting an electronic component without damaging a copper foil on a substrate according to an embodiment of the present invention, and FIG. 4 (b) is a front view thereof. FIGS. 5 (a) and 5 (b) are explanatory views of the state before mounting by the same method, FIG. 6 (a) is an explanatory view of the state before mounting by the same method, and FIG. 6 (a) is mounting by the same method. FIG. 6B is an enlarged plan view of the latter, FIG. 6B is a perspective view of the same, and FIG. 7 is a detailed sectional view of an apparatus for carrying out the method. 1 ... Board, 2 ... Electronic parts, 3 ... Lever type anvil unit, 4 ... Clincher, 6 ... Chucking tool, 7 ... Head drive section, 8 ... XY drive section, 9 ...
… Tool, 10 …… Sedge type anvil unit, 11 ……
Lever, 12 …… Arm, 13 …… Frame, 14 …… Lever fulcrum pin, 15 …… Arm fulcrum pin, 16 …… Second piston rod, 17 …… Second piston rod fulcrum pin, 18 ……
1st piston rod, 19 …… Cylinder tube, 20 ……
Cylinder block.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Hiroshi Nakagawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References Japanese Patent Publication Sho 55-28240 (JP, B1)

Claims (1)

[Claims] 1. A lead terminal of an electronic component with a lead terminal is automatically inserted into a hole of a board, and the lead terminal has a width smaller than the diameter of the lead terminal and is the same as the longitudinal direction of the inserted lead terminal under the board. It is sandwiched by two concave tools having the same shape and having grooves formed in the same direction, and the groove of the tool is pressed from two opposite directions so as to fit with a part of the lead terminal, whereby a part of the lead terminal is pressed. A method of mounting an electronic component in which a flash is generated by plastically deforming, and a projection caused by the flash fixes the electronic component to a substrate.