JPH06828Y2 - 半導体用ヒートパイプ放熱器 - Google Patents
半導体用ヒートパイプ放熱器Info
- Publication number
- JPH06828Y2 JPH06828Y2 JP5171089U JP5171089U JPH06828Y2 JP H06828 Y2 JPH06828 Y2 JP H06828Y2 JP 5171089 U JP5171089 U JP 5171089U JP 5171089 U JP5171089 U JP 5171089U JP H06828 Y2 JPH06828 Y2 JP H06828Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- base plate
- hole
- heat
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 238000001125 extrusion Methods 0.000 claims description 7
- 238000005219 brazing Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 239000010949 copper Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5171089U JPH06828Y2 (ja) | 1989-05-01 | 1989-05-01 | 半導体用ヒートパイプ放熱器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5171089U JPH06828Y2 (ja) | 1989-05-01 | 1989-05-01 | 半導体用ヒートパイプ放熱器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02142544U JPH02142544U (en, 2012) | 1990-12-04 |
| JPH06828Y2 true JPH06828Y2 (ja) | 1994-01-05 |
Family
ID=31571384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5171089U Expired - Lifetime JPH06828Y2 (ja) | 1989-05-01 | 1989-05-01 | 半導体用ヒートパイプ放熱器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06828Y2 (en, 2012) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008210593A (ja) * | 2007-02-23 | 2008-09-11 | Matsushita Electric Works Ltd | 照明装置 |
-
1989
- 1989-05-01 JP JP5171089U patent/JPH06828Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02142544U (en, 2012) | 1990-12-04 |
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