JPH0682516A - Thermostatic ic handler - Google Patents

Abstract

PURPOSE:To eliminate the need of replacement of transfer passage located in a thermostatic bath for an IC handier compatible with various types of IC. CONSTITUTION:Device receiving sections 9a-9d, stocker sections 10a-10d, individual separating sections 15a-15d, orienter sections 11a-11d, vertical shoots 12a-12d, R shoots 13a-13d, and device discharge sections 14a-14d constituting lanes 8a-8d in a thermostatic tank 3 for the IC handier are constructed not to feed same devices but to transfer devices having different packaging method or sizes thus eliminating the need for replacement of internal members in the thermostatic bath 3 at the time of testing/measurement of various types of devices.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for testing / measuring the electrical characteristics of an IC device, and relates to a constant temperature IC handler used for measuring the IC device in a low temperature or high temperature state. It is a thing.

[0002]

2. Description of the Related Art IC handlers are used for testing IC devices.
In an IC device test measurement apparatus for performing measurement, the IC device is connected to a test head of an IC tester, and a mechanism section for accommodating the devices after the test measurement in a classified manner is configured. Here, the device may be measured not only at room temperature but also in a low temperature state or a high temperature state. When measuring a device in a low temperature state or a high temperature state, the transport path of the device is housed in a constant temperature bath to keep the constant temperature bath in a predetermined temperature state.

Here, in order to make the test and measurement more efficient,
Some IC handlers are provided with a plurality of lanes for transporting devices, and are configured to transport one or a plurality of devices in each lane.

In recent years, various types of IC device packages have come to be used. Further, there are some packages having the same package type but different sizes and shapes. As long as the various types of devices slide by their own weight, the respective transport routes must be dedicated, and the socket portion for connecting the device to the test head of the IC tester must have a shape suitable for the device. However, it is not always rational to use a dedicated IC handler and IC tester for each type of device. Therefore, the test
An IC handler compatible with other types by changing the setup of the IC handler according to the type of device to be measured has been conventionally used. here,
The main replacement parts when performing this setup change are a loader section for supplying a device, an unloader section for storing measured devices in a classified manner, and a lane and a socket section for transporting the devices. .

[0005]

By the way, the test / measurement of the IC device may be carried out by heating or cooling the device in addition to the case of being carried out at room temperature. In order to perform high temperature test and low temperature test in this way, a constant temperature bath is provided in the device transport path, and the inside of this constant temperature bath is kept at the temperature state where the test / measurement is performed, and the device is heated or cooled. I have to. Therefore, in order to replace the transportation path of the lane located in this constant temperature tank, the inside of the constant temperature tank is once returned to normal temperature, the transportation path is exchanged by opening the constant temperature tank, and then the set temperature of the constant temperature tank is changed. Must be Particularly in the low temperature handler, the device must be cooled to, for example, about -30 ° C to -55 ° C, and dew condensation may occur when the device is returned from such a low temperature state to room temperature. However, there is a problem in that it requires a great deal of handling and the time required for changing the setup becomes extremely long.

Some devices to be tested and measured may not be produced in large quantities depending on the product type. As described above, even in a small-quantity-produced product, it is still necessary to test and measure its electrical characteristics. It is extremely troublesome to change the setup each time when testing and measuring devices manufactured in high-mix low-volume production.Especially, it takes a very long time to replace the transport path in the constant temperature bath, and it is not always necessary. The operating efficiency of the device is not good.

The present invention has been made in view of the above points, and an object of the present invention is to provide a multi-product type I
The purpose of the C handler is to eliminate the need to replace the transport path located in the constant temperature bath.

[0008]

In order to achieve the above-mentioned object, the present invention is directed to a portion of a transport path from a loader section to an unloader section, at least from a loader side to a test head disposition position. Is provided in a constant temperature tank, and a plurality of transfer paths located in the constant temperature tank are provided as a plurality of different lanes for sliding different types of IC devices, respectively, and are mounted between the loader section and each different lane. I
The feature is that lane selection means for selecting one lane of different lanes is provided according to the type of the C device.

[0009]

By adopting such a configuration, when changing the type of device to be tested / measured, it is only the loader section and the unloader section that need to be changed, and the device in the thermostatic chamber must be changed. There is no need to replace the transport path. Therefore, the time required for changing the setup can be significantly shortened.

Although a plurality of lanes are provided, the route for actually carrying the device is only one of the plurality of lanes, and the other lanes are inactive. However, in the case of high-mix low-volume production, the apparatus cannot be operated during the setup change time, and the operator is restricted by the setup change work during that time. Therefore, rather than performing frequent setup changes, the operating efficiency of the device will be improved, and considering that the operator can be freed from the setup changes, it is more rational and the operating efficiency of the device is also improved. Instead, it gets better.

[0011]

Embodiments of the present invention will now be described in detail with reference to the drawings. First, FIG. 1 shows a schematic configuration of the entire IC handler. In the figure, 1 is a loader section, 2 is an unloader section, and 3 is a constant temperature bath. In the loader unit 1, the IC devices 4 are housed in a magazine 5 arranged in a line, and by tilting the magazine 5,
The device 4 can be taken out by sliding the device 4 by its own weight. A device supply unit 6 is connected to the loader unit 1, and the device supply units 6 can accommodate the devices 4 accommodated in one magazine 5 in a line. . A well-known individual separating mechanism is provided at the outlet of the device supply unit 6, and
It is possible to send them separately.

Reference numeral 7 denotes a distribution shuttle. The distribution shuttle 7 has a space for accommodating one device 4, and one device 4 is separated from the device supply unit 6 and the constant temperature bath is provided via this distribution shuttle 7. It is supposed to be sent within 3. A plurality of lanes 8 (four lanes 8a to 8d are shown in the drawing) are distributed inside the constant temperature bath 3, and the shuttle 7 selects any one of these lanes 8a to 8d. The device 4 is supplied with the device 4. Therefore, the sorting shuttle 7 constitutes a lane selecting means, and can be moved in the direction of the arrow in the figure by a feed screw means or the like.

Lane 8 of the constant temperature bath 3 (in the following description, the reference numeral 8 is used to collectively refer to the lanes, and the reference numerals 8a to 8d are used to refer to each lane, The same applies to each part that makes up this lane.
The numbers a to d are attached to each number) indicates the device receiving unit 9, the stocker unit 10, the orienter unit 11,
It is composed of a vertical chute 12, an R chute 13 and a device discharge part 14. The device receiving unit 9 is for receiving the device 4 from the sorting shuttle 7 and sending it into the constant temperature bath 3, and constitutes a unit for introducing the device 4 into the constant temperature bath 3. The stocker unit 10 heats or cools the device 4 by allowing the device 4 to stay therein for a predetermined time. A large number of devices 4 can be retained in the stocker unit 10. Therefore, when the devices 4 are sent out from the stocker unit 10, it is necessary to separate the devices 4 one by one. For this purpose, an individual separating section 15 is provided at the outlet of the stocker section 10. These device receiving section 9, stocker section 10 and individual separating section 15
Is inclined by a predetermined angle.

The orienter section 11 is for transferring the device 4 to the vertical chute 12, and the test head 16 of the IC tester faces the vertical chute 12 and is connected to the socket section 17 provided in the test head 16. Is able to. Therefore, the vertical chute 12 is provided with a mechanism for positioning and clamping the device 4 and for bringing the device into and out of contact with the socket portion 17. Since this mechanism is well known, illustration and description of its specific structure are omitted. In this way, the vertical chute 12 tests and measures the electrical characteristics of the device 4, and the device 4 that has completed the test and measurement passes from the R chute 13 to the outside of the thermostatic chamber 3 via the device discharge unit 14. And is transferred to the unloader unit 2.

The unloader section 2 divides the device 4 into a plurality of categories (8 categories in the drawing) based on the measurement results and stores them. For this purpose, the unloader unit 2
The device receiving portions 18a to 18h over eight rows.
Is provided, and a sorting shuttle 19 is provided for receiving the device 4 from the plurality of device discharging units 14 provided and sending the device 4 to any of the device receiving units 18a to 18h. The sorting shuttle 19 is configured to be movable in the arrow direction by a feed screw means or the like.

Next, FIGS. 2 to 5 show cross-sections of devices of different types and a transport path suitable for transporting the devices. FIG. 2 shows a DIP type device D ₁ and a chute S ₁ which is a transport path suitable for transporting the device D ₁ . In this device D ₁ , since the lead L ₁ extending from the package portion P ₁ extends downward, the guide rail portion G ₁ of the chute S ₁ is formed.
The lower surface of the package P ₁ comes into contact with the left and right leads L
₁ is conveyed so as to extend downward along the side wall.

Further, the SOP type device D shown in FIG.
₂ is provided with leads L ₂ extending laterally to the left and right of the package part P ₂ , and a chute S ₂ suitable for carrying this device D ₂ is provided on both left and right sides of the package part P ₂ . Therefore, the inclined wall formed on the roof part of the roof part serves as a guide part G ₂ . The sliding surface C ₂ of the device D ₂ is in contact with almost the entire surface of the package portion P ₂ .

The device D ₃ shown in FIG. 4 has an S having leads L ₃ bent inward to the left and right of the package P _3.
A chute S _{3 which} is an OJ type device and is suitable for carrying this device D ₃ is also a SOP type device D ₂
Similarly to the above, an inclined wall formed in the roof portion for guiding the left and right sides of the package portion P ₃ is used as a guide portion G ₃ . However, the running surface C ₃ of the device D ₃ is narrower than the running surface C ₂ of the SOP type device D ₂ in order to avoid the bent part of the lead L ₃ on the lower surface of the package P _3. ing.

Furthermore, in FIG. 5, ZIP type device D ₄ which extend the lead L ₄ from one side of the package portion P ₄
The chute S ₄ that constitutes the transport path of the device D ₄ includes a package guide portion G ₄ that accommodates the package portion P ₄ and a slit-shaped opening O ₄ that extends the lead L _4. ing.

In addition to these devices, there are various package systems, and for these, the chute has a suitable shape. Also, the device is
Not only are the package methods different, but devices of the same package method may have different sizes. Therefore, devices of different packaging methods and sizes must be transported using different chutes.

Thus, the device receiving section 9 and the stocker section 1
0, the orienter unit 11, the vertical chute 12, the R chute 13, the device discharge unit 14, and the individual separation unit 15 constitute a transport path for the device 4 in the constant temperature bath 3, and these are as shown in FIG. 4 lanes 8a-8d
And the device receiving portions 9a to 9d and the stocker portions 10a to 10 which form the lanes 8a to 8d.
d, orienter parts 11a to 11d, vertical chute 12a
.About.12d, R shoots 13a to 13d, device ejecting portions 14a to 14d, and individual separating portions 15a to 15d are packaged so that devices of different sizes can be transported.

Now, for example, the first lane 8a has the shape of a chute S ₁ suitable for carrying the DIP type device D _1, and the second lane 8b has a chute for the SOP type device D ₂ . S ₂ ungated, the third lane. 8c SOJ
Types of devices chute conveying the D ₃ S _3, and a shape of the chute S ₄ suitable for transporting the device D ₄ of the ZIP type fourth lane 8d. Also, each lane 8a-
socket portion 17 facing the respective vertical chutes 12a~12d of d even each are made as a structure suitable for connecting the device D ₁ to D ₄ which is transported to each lane 8 a to 8 d.

Then, using this IC handler, the DIP
When testing and measuring the device D ₁ of the mold, the loader unit 1 and the unloader unit 2 cannot set the magazine for the device D ₁ , and the sorting shuttle 7 and the sorting shuttle 19 are set to the device D 1. _{It is} for one.

Thus, the device D ₁ supplied from the loader unit 1 is received by the distribution shuttle 7, and the distribution shuttle 7 is displaced to a position facing the device receiving unit 9a in the lane 8a. And
At this position, the device D ₁ is transferred from the sorting shuttle 7 to the device receiving portion 9a and introduced into the constant temperature bath 3 which is in a predetermined temperature state. The supply of the device D _{1 into} the constant temperature bath 3 is sequentially performed at regular time intervals. The device D ₁ supplied into the constant temperature bath 3 has the stocker unit 10
The temperature is brought to a measurement temperature state by staying for a certain period of time in a, and in this state, the individual separating section 15 separates one by one and moves to the vertical chute 12 via the orienter section 11, and the socket section in the vertical chute 12 is separated. 17
After being positioned and clamped at a position facing with, it is connected to the socket portion 17 to test and measure its electrical characteristics. When this test / measurement is completed, the positioning clamp of the device D ₁ by the vertical chute 12 is released, and the device is discharged from the R chute 13a to the device discharge part 14a.
After that, the product is sorted and stored in the unloader unit 2 by the sorting shuttle 19 according to the quality based on the test / measurement results.

Next, after the test / measurement of the device D ₁ is completed, in order to test / measure the device D ₂ , it is necessary to change the setup of the IC handler. For this,
The loader unit 1 including the device supply unit 6 and the unloader unit 2 including the device receiving units 18a to 18h, the sorting shuttle 7 and the sorting shuttle 19 are exchanged. Since these are located outside the constant temperature bath 3, they can be easily replaced and can be quickly replaced. However, it is not necessary to replace the members provided in the constant temperature bath 3.
Then, from the replaced sorting shuttle 7 to the device D ₂
When introducing into the constant temperature bath 3, the lane 8b is selected and the device D ₂ is supplied to the device receiving portion 9b in the lane 8a. This causes device D ₂ to
While traveling along the lane 8b, its electrical characteristics can be tested and measured.

When changing the lanes in the thermostat 3 from the state in which the device D ₁ is tested and measured to the state in which the device D ₂ can be tested and measured, In addition to replacing the loader unit 1 including the device supply unit 6 and the unloader unit 2 including the device receiving units 18a to 18h, the sorting shuttle 7 and the sorting shuttle 19, members constituting the lane are replaced, and a constant temperature is maintained. It takes time to return the inside of the tank 3 to room temperature and to bring the inside of the tank to the measurement temperature after the lane exchange. In particular, when used as a low temperature handler, if the temperature is rapidly returned to room temperature, dew condensation will occur. Therefore, it is necessary to return the room temperature to a room temperature over a considerable period of time. It takes about half an hour to about 2 hours, and it takes about 30 minutes to 1 hour from room temperature to the measurement temperature. Furthermore, if the time required for exchanging each member is added, it takes at least about 3 hours. On the other hand, when the members arranged inside the constant temperature bath 3 are not replaced and only the member located outside the constant temperature bath 3 is replaced among the members that need to be replaced, it takes 30 minutes or less. Therefore, the setup can be changed in an extremely short time.

Needless to say, when performing the test / measurement of the devices D ₃ and D ₄ , the same setup change is carried out, but it is not necessary to replace the members provided in the constant temperature bath 3. .

As a result, for example, in the case of performing a test / measurement by successively exchanging a small number of devices of a wide variety of products, even if the test / measurement is actually performed, one of the four lanes is used. Even if you only use
Considering the time for changing the setup, it is more rational and the operation efficiency of the device is improved. In addition, considering that the worker performs the work of changing the setup for a long time, it becomes more advantageous.

In the above embodiment, four lanes are provided, but an appropriate number of lanes such as eight lanes may be provided. In addition, even if the shoot is in one lane, the shoot S shown in FIG.
₅ , DIP type device D ₁ (left half in the figure)
A guide rail portion G _5a suitable for guiding the vehicle and a guide portion G _5b suitable for guiding the SOP type device D ₂ (right half in the figure) on the roof portion. For example, two types of devices can be transported in a single lane. Further, in this case, the socket portions may be provided at two positions above and below the vertical lane, and a mechanism for positioning the device may be provided at a position corresponding to each socket portion. Further, although the lane selection means is formed by the distribution shuttle, the device supply section connected to the loader section is provided at a position directly connected to the lane suitable for carrying the device supplied by the loader section. It may be configured.

[0030]

As described above, according to the present invention, a plurality of transfer paths provided in the constant temperature bath are provided with different types of I.
Since a plurality of different lanes for sliding the C device are not provided and lane selection means for selecting one lane of the different lanes is provided between the loader section and each different lane, it is possible to provide a wide variety of products. In performing the test / measurement of the electrical characteristics of a small amount of IC devices, it is extremely easy to change the setup, and the test / measurement can be efficiently performed.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of an IC handler showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a structure of a chute of a DIP type IC device.

FIG. 3 is a diagram illustrating a configuration of a chute of an SOP type IC device.

FIG. 4 is an explanatory diagram of a structure of a chute of an SOJ type IC device.

FIG. 5 is an explanatory diagram of a structure of a chute of a ZIP type IC device.

FIG. 6 is a configuration explanatory diagram of a chute shared by DIP type and SOP type IC devices.

[Explanation of symbols]

1 the loader section 2 unloader unit 3 constant-temperature bath _{4, D 1, D 2,} D 3, D 4 IC device 7 distributed shuttle 8,8a~8d lane 9,9a~9d device receiving portion 10,10a~10d stocker 11, 11a to 11d Orienter part 12, 12a to 12d Vertical chute 13, 13a to 13d R chute 14, 14a to 14d Device discharge part 15, 15a to 15d Individual separation part

Claims (2)

[Claims] 1. An IC device sent out from a loader unit is separated one by one and conveyed by its own weight sliding, connected to a test head, and tested for electrical characteristics of this IC device.
The measurement is performed, and the quality is classified into the unloader unit based on the measurement result, and at least from the loader side to the position where the test head is arranged in the transport path from the loader unit to the unloader unit. In a configuration in which a portion between them is provided in a constant temperature bath, a plurality of transfer paths are provided in the constant temperature tank, and each of these transfer paths is made up of a plurality of different lanes for sliding different types of IC devices. A constant-temperature system characterized in that a lane selection means for selecting one of the different lanes is provided between the section and each different lane according to the type of IC device attached to the section. IC handler. 2. The lane selection means is formed of a shuttle member, one of which is connectable to a device delivery position of a loader section and the other of which is selectively connectable to each of the different lanes,
The constant temperature IC handler according to claim 1, wherein the shuttle member is moved by a driving means.