JPH0677619A - Structure of printed board - Google Patents
Structure of printed boardInfo
- Publication number
- JPH0677619A JPH0677619A JP22554892A JP22554892A JPH0677619A JP H0677619 A JPH0677619 A JP H0677619A JP 22554892 A JP22554892 A JP 22554892A JP 22554892 A JP22554892 A JP 22554892A JP H0677619 A JPH0677619 A JP H0677619A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- lead wires
- circuit board
- printed
- printed boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はプリント基板構造に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board structure.
【０００２】[0002]
【従来の技術】従来のプリント基板構造を図７〜図９に
ついて説明する。図において、１は集合プリント基板、
２は一つのパターンを印刷した１台分に相当するプリン
ト基板で、部分２ａと２ｂに分割されている。３ａ〜３
ｃはリード線で、プリント基板２の各穴４に挿入されて
いる。2. Description of the Related Art A conventional printed circuit board structure will be described with reference to FIGS. In the figure, 1 is a collective printed circuit board,
Reference numeral 2 is a printed circuit board corresponding to one unit on which one pattern is printed and is divided into portions 2a and 2b. 3a-3
Reference numeral c is a lead wire, which is inserted into each hole 4 of the printed circuit board 2.
【０００３】リード線３ａ〜３ｃの一端をＡ部の形状と
しているのは、プリント基板組立後、Ｂ点でカットし、
その他のプリント基板からのリード線等（図示せず）と
接続するためである。図７，図８に示す如く集合プリン
ト基板１にリード線３ａ〜３ｃ及びその他の部品（図示
せず）を実装後、半田そうに挿入して半田付を行う。One end of each of the lead wires 3a to 3c is formed in the shape of the portion A, which is cut at the point B after the printed circuit board is assembled.
This is for connecting with other lead wires and the like (not shown) from the printed circuit board. After mounting the lead wires 3a to 3c and other parts (not shown) on the collective printed circuit board 1 as shown in FIGS.
【０００４】[0004]
【発明が解決しようとする課題】従来のプリント基板構
造は以上のように構成されているので、１台分のプリン
ト基板２の中に部分２ａと２ｂとが必要となる。そのう
ち部分２ａはリード線３ａ〜３ｃと共に本体に組込みす
るが、部分２ｂは半田付完了後リード線３ａ〜３ｃをＢ
点でカットの上切り離すため本体には組込みをせず、捨
て基板となる。この捨て基板となる部分２ｂにわざわざ
リード線３ａ〜３ｃの一端を挿入する理由は、リード線
３ａ〜３ｃはある長さ以上になると、リード線の３ａ〜
３ｃの一端をプリント基板２に挿入しただけではもう一
端が倒れ、プリント基板２上の他のパターンと混触した
り、また半田そうに挿入してそう内を流れていく過程の
中で、倒れた部分がそう内の一部に引掛かってリード線
３ａ〜３ｃが抜け落ちたりするという、トラブルを生じ
る。従って、プリント基板２にある長さ以上のリード線
３ａ〜３ｃを実装する際には、必ず両端をプリント基板
２の穴４に挿入する必要が生じる。以上の理由により、
プリント基板２にリード線３ａ〜３ｃを実装する場合に
は、捨て基板となる部分２ｂを設ける必要が生じ、コス
トアップになるという問題点があった。Since the conventional printed circuit board structure is constructed as described above, portions 2a and 2b are required in one printed circuit board 2. The part 2a is assembled into the main body together with the lead wires 3a to 3c, but the part 2b is connected to the lead wires 3a to 3c after the soldering is completed.
Since it is cut off at the point and cut off, it is not incorporated into the main body and is a discarded board. The reason why the ends of the lead wires 3a to 3c are purposefully inserted into the portion 2b to be the discarded substrate is that when the lead wires 3a to 3c become longer than a certain length,
Just inserting one end of 3c into the printed circuit board 2 causes the other end to fall down, causing contact with other patterns on the printed circuit board 2 and also falling down in the process of inserting into the solder and flowing through it. This causes a trouble that the lead wires 3a to 3c fall off due to the portion being caught in a part of the inside. Therefore, when mounting the lead wires 3a to 3c that are longer than a certain length on the printed board 2, both ends must be inserted into the holes 4 of the printed board 2 without fail. For the above reasons
When the lead wires 3a to 3c are mounted on the printed circuit board 2, it is necessary to provide the portion 2b to be a discarded substrate, which causes a problem of cost increase.
【０００５】この発明はかかる問題点を解消するために
なされたもので、プリント基板にリード線を配線作業す
る場合に不要な捨て基板となる部分を必要としなくなる
プリント基板構造を得ることを目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to obtain a printed circuit board structure which does not require an unnecessary waste board portion when wiring lead wires to the printed circuit board. To do.
【０００６】[0006]
【課題を解決するための手段】この発明に係るプリント
基板構造は、１シート多数台取り構成のものにおいて、
互いに隣に位置する各プリント基板上の同一仕様のリー
ド線２本を一体化するものである。A printed circuit board structure according to the present invention has a structure in which a large number of one sheet is taken in,
Two lead wires of the same specifications on each printed circuit board located adjacent to each other are integrated.
【０００７】[0007]
【作用】この発明においては、互いに隣に位置する各プ
リント基板上の同一仕様のリード線を一体化したことに
より、リード線の数を半分とできる。In the present invention, the number of lead wires can be halved by integrating lead wires of the same specifications on the respective printed circuit boards located adjacent to each other.
【０００８】[0008]
【実施例】実施例１．この発明の一実施例を図１〜図３
について説明する。図中従来のものと同一または相当部
分には同一符号を付して説明を省略する。図において、
５ａ〜５ｃは一体化されたリード線で、互いに隣に位置
する２枚のプリント基板２にまたがる形で実装される。
そして、半田付完了後、リード線５ａ〜５ｃの各中間点
Ｙで切断し、各プリント基板２ごとに本体に組込む構成
とする。従って、リード線５ａ〜５ｃの長さは各プリン
ト基板２の１台分に必要な長さの２倍となるように構成
されている。このようにすれば集合プリント基板１に捨
て基板となる部分が不要となる。EXAMPLES Example 1. 1 to 3 of an embodiment of the present invention
Will be described. In the figure, the same or corresponding parts as those of the conventional one are designated by the same reference numerals and the description thereof will be omitted. In the figure,
Reference numerals 5a to 5c are integrated lead wires, which are mounted so as to extend over two printed circuit boards 2 adjacent to each other.
After the soldering is completed, the lead wires 5a to 5c are cut at the respective intermediate points Y and incorporated into the main body for each printed circuit board 2. Therefore, the length of the lead wires 5a to 5c is configured to be twice the length required for one printed circuit board 2. This eliminates the need for a portion of the collective printed circuit board 1 that becomes a waste substrate.
【０００９】実施例２．上記実施例では隣同士の二つの
プリント基板２にまたがるようにリード線５ａ〜５ｃを
配線したが、図４〜図６に示すように二つ隣に位置する
２枚のプリント基板２にまたがるように配線してもよ
い。Example 2. In the above-mentioned embodiment, the lead wires 5a to 5c are arranged so as to extend over the two adjacent printed circuit boards 2. However, as shown in FIGS. 4 to 6, the lead lines 5a to 5c may extend over the two adjacent printed circuit boards 2. You may wire to.
【００１０】[0010]
【発明の効果】以上のように、この発明によれば１シー
ト多数台取り構成のプリント基板において互いに隣に位
置する各プリント基板上の同一仕様のリード線２本を一
体化するように構成したので、捨て基板を設けて各リー
ド線を実装させる必要がなくなり、プリント基板のコス
トダウンが図れると共に、リード線の数も半分となるの
でプリント基板へのリード線配線作業時間を短縮できる
という効果が得られる。As described above, according to the present invention, two lead wires having the same specifications on adjacent printed circuit boards adjacent to each other are integrated in a printed circuit board having a single-sheet multi-cavity construction. Therefore, it is not necessary to provide a waste board to mount each lead wire, the cost of the printed board can be reduced, and the number of lead wires is halved, so that the lead wire wiring work time to the printed board can be shortened. can get.
【図１】この発明の実施例１を示すプリント基板構造の
部分平面図である。FIG. 1 is a partial plan view of a printed circuit board structure showing a first embodiment of the present invention.
【図２】図１を左からみた図である。FIG. 2 is a diagram of FIG. 1 viewed from the left.
【図３】図１のリード線を示す図である。FIG. 3 is a diagram showing the lead wire of FIG. 1;
【図４】この発明の実施例２を示すプリント基板構造の
部分平面図である。FIG. 4 is a partial plan view of a printed circuit board structure showing Embodiment 2 of the present invention.
【図５】図４を左からみた図である。FIG. 5 is a view of FIG. 4 as viewed from the left.
【図６】図４のリード線の示す図である。FIG. 6 is a diagram showing a lead wire of FIG. 4;
【図７】従来のプリント基板構造を示す部分平面図であ
る。FIG. 7 is a partial plan view showing a conventional printed circuit board structure.
【図８】図７を左からみた図である。FIG. 8 is a diagram of FIG. 7 viewed from the left.
【図９】図７のリード線を示す図である。9 is a diagram showing a lead wire of FIG. 7. FIG.
１ 集合プリント基板 ２ １台分に相当するプリント基板 ５ａ リード線 ５ｂ リード線 ５ｃ リード線 1 Assembly printed circuit board 2 Printed circuit board equivalent to 1 unit 5a Lead wire 5b Lead wire 5c Lead wire
Claims (1)
を多数集合させて１シート当り多数台取りに構成した集
合プリント基板に、リード線を実装するものにおいて、 前記リード線を前記集合プリント基板の中で隣に位置す
る各々の前記プリント基板２枚にまたがるように配線し
たことを特徴とするプリント基板構造。1. A method of mounting a lead wire on a collective printed circuit board in which a large number of printed circuit boards printed with one pattern are assembled to form a plurality of printed circuit boards per sheet, wherein the lead wire is included in the collective printed circuit board. The printed circuit board structure is characterized in that wiring is provided so as to straddle the two printed circuit boards located next to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4225548A JP2822802B2 (en) | 1992-08-25 | 1992-08-25 | Collective printed circuit board composed of multiple units |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4225548A JP2822802B2 (en) | 1992-08-25 | 1992-08-25 | Collective printed circuit board composed of multiple units |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0677619A true JPH0677619A (en) | 1994-03-18 |
| JP2822802B2 JP2822802B2 (en) | 1998-11-11 |
Family
ID=16831024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4225548A Expired - Lifetime JP2822802B2 (en) | 1992-08-25 | 1992-08-25 | Collective printed circuit board composed of multiple units |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2822802B2 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5619695A (en) * | 1980-07-02 | 1981-02-24 | Sony Corp | Printed board unit |
| JPS56154181U (en) * | 1980-04-16 | 1981-11-18 | ||
| JPS61276287A (en) * | 1985-05-30 | 1986-12-06 | 松下電工株式会社 | Printed circuit board |
| JPS622272U (en) * | 1985-06-20 | 1987-01-08 | ||
| JPH0428466U (en) * | 1990-06-29 | 1992-03-06 |
-
1992
- 1992-08-25 JP JP4225548A patent/JP2822802B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56154181U (en) * | 1980-04-16 | 1981-11-18 | ||
| JPS5619695A (en) * | 1980-07-02 | 1981-02-24 | Sony Corp | Printed board unit |
| JPS61276287A (en) * | 1985-05-30 | 1986-12-06 | 松下電工株式会社 | Printed circuit board |
| JPS622272U (en) * | 1985-06-20 | 1987-01-08 | ||
| JPH0428466U (en) * | 1990-06-29 | 1992-03-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2822802B2 (en) | 1998-11-11 |
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