JPH0677256U - Lead wire forming device for electronic parts - Google Patents

Abstract

(57) [Summary] [Purpose] The lead wire of the IC is
Moreover, it enables easy bending without requiring skill. A support member provided on a base, which is movably provided in an up-and-down direction and is always urged upward, and a lead wire directed upward, which receives and supports a part of an IC. A recess provided at the tip of the member and an inner diameter when a circle formed by placing a plurality of lead wires on the circumference is expanded, and provided on the peripheral side of the recess,
There is a gap between the outer cylinder connected to the base of the upper opening and the inner side wall of the outer cylinder, and a gap into which the lead wire can be inserted is provided in the movable member so that the outer cylinder can be put in and out from above. The inner cylinder and a plurality of lead wires that partially project from the lower part of the inner cylinder and are movably provided in the vertical direction and are always urged downward and before the lead wires are expanded A guide pin with a diameter smaller than the diameter of the circle formed on the
And a movable mechanism for moving the movable member up and down.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a lead wire forming device for an electronic component for bending a lead wire of an electronic component such as an IC so as to be easily connected to a printed circuit board.

[0002]

[Prior art]

 Conventionally, an electronic component such as an IC (hereinafter sometimes referred to as an IC) has a plurality of lead wires L, L ... As shown in FIG. 3A, and these lead wires L, L ... Are provided in a vertical direction from the bottom a'of the IC and parallel to each other.

Then, when the IC B is mounted on a printed circuit board (not shown), as shown in FIG. 3B, each lead wire L is inserted into a hole (not shown) provided in the printed circuit board. , L ... are bent using a tool such as radio pliers so that the positions of the lower ends (the ends of the lead wires L, L ... In FIG. 3) are aligned.

[0004]

[Problems to be solved by the device]

 However, since the bending of the lead wire of the conventional IC is manually performed by using a tool such as radio pliers, not only is it inefficient, but in the case of an inexperienced worker, it takes a predetermined shape. Since it is bent many times, stress is generated in the lead wire, which leads to poor IC performance and scratches on the lead wire.

Therefore, the present invention has been made in order to solve the above-mentioned drawbacks, and an object of the present invention is to provide a lead wire forming device for an electronic component, which can easily form a lead wire into a predetermined shape. To provide.

[0006]

In order to achieve the above object, a lead wire forming device for electronic parts according to the present invention is provided so as to be movable in the vertical direction, and is always urged upward. A support member provided on the base, a recess provided at the tip of the support member for receiving and supporting a part of the electronic component with the lead wire of the electronic component facing upward, and a plurality of the electronic components. An outer cylinder having an inner diameter when the circle formed by placing the lead wire on the circumference is expanded and being provided on the peripheral side of the recess and coupled to the base of the upper opening, An inner cylinder is provided between the inner wall of the outer cylinder and the movable member so that the lead wire of the electronic component can be inserted into the outer cylinder so that the lead wire can be inserted into and removed from the upper cylinder, and the lower portion of the inner cylinder. Partly protruding from the , A guide pin having a diameter smaller than the diameter of a circle formed by placing a plurality of lead wires before expansion of the lead wires of the electronic component on the circumference, which are always urged downward, and the movable member. It has a movable mechanism for moving up and down.

[0007]

[Action]

 In the above structure, when the IC is inserted into the recess with the lead wire facing upward, and the movable member is lowered by the movable mechanism, first, the guide pin is inserted into the circle formed by the plurality of lead wires, and then the inner cylinder is enter. The inner cylinder expands the lead wire outward, and the outer cylinder holds the expansion within a certain range. As a result, the lead wire is bent into a predetermined shape.

[0008]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view showing a part of an apparatus of one embodiment in a cross section.

The movable member 1 is provided so as to be movable from a base 2 to a column 3 provided upright, that is, to be vertically movable. A pinion (not shown) rotated by the handle 4 is provided on the upper portion of the support column 3, and this pinion is provided on the rear side of the support column 3 of the drive shaft 5 integrally provided with the movable member 1. It is meshed with the rack 5a. Therefore, when the pinion rotates, the drive shaft 5 moves upward or downward corresponding to the rotation direction of the pinion.

In FIG. 1, reference numeral 6 denotes a coil spring, which is provided at the end of the base shaft 4a of the handle 4 and is attached so that the handle 4 is always clockwise, that is, the movable member 1 is located above. I am energetic.

A stopper 7 provided in the central portion of the lower surface of the movable member 1 abuts a stopper 8 on the base 2 which is provided so as to face the stopper 7 to move the handle 4 in the counterclockwise direction, that is, the front side. Even if it is turned to, it is regulated so that it cannot descend further. The upper end position of the stopper 8 on the base 2 can be adjusted by a screw mechanism (not shown).

The lower surface of the movable member 1 is provided with inner cylinders 10 and 10 provided with a plurality of (two in the illustrated example) guide pins 9 so as to be vertically movable. Outer cylinders 12, 12 each having a support member 11 vertically movable so as to oppose the cylinders 10, 10 are provided via an auxiliary base 2a.

The inner diameters of the inner cylinder 10 and the outer cylinder 12 are determined so that the outer cylinder 12 has a predetermined gap, that is, a gap in which the lead wires L, L ... The amount of insertion of the inner cylinder 10 into the outer cylinder 12 is determined according to the degree of bending of the lead wires L, L ....

The guide pin 9 has a diameter smaller than the diameter of a circle formed by arranging a plurality of IC L lead wires L, L ... On the circumference, and is constantly urged downward by a spring 13. Then, it is projected from the lower end of the inner cylinder 10 in a certain amount.

The support member 11 has a recessed portion 14 whose upper end portion substantially coincides with the upper surface position of the outer cylinder 12 and which can receive a part of the IC B having the lead line L upward. The support member 11 is provided so as to be constantly urged upward by the spring 15.

Next, the operation of the apparatus of this embodiment will be described with reference to FIG. 2 which is an enlarged sectional view when the movable member 1 is lowered.

First, the IC B is inserted into the recess 14 with the lead wire L facing upward (see FIG. 1). Next, when the handle 4 is rotated counterclockwise and the movable member 1 is lowered until the stoppers 7 and 8 come into contact with each other, the guide pins 9 enter the lead wires L, L ... And the inner cylinder. 10 enters the outer cylinder 12. At this time, the lead wires L, L ... Are once bent outward and then bent inward by the outer cylinder 12 (see FIG. 2). As a result, the lead wires L, L ... Of IC B are bent into a predetermined shape as shown in FIG.

After that, the handle 4 is rotated clockwise to move the movable member 1 upward, and the processed IC B is taken out from the recess 14. Then, the next IC is set in the recess 14 and the bending process is performed again.

As described above, according to the apparatus of this embodiment, when the IC is set in the recess 14 and the handle 4 is rotated, the lead wires L, L ... Of the IC are bent into a predetermined shape. Since it is possible, it is possible to easily perform the bending process without requiring skill, unlike the conventional method.

Further, since the lead wires L, L ... Are not bent with a tool such as radio pliers, the IC is not damaged.

In the above embodiment, two ICs can be bent at the same time, but it is possible to further increase the number of inner cylinders and outer cylinders to increase the number of simultaneously processed ICs.

[0022]

【The invention's effect】

 An electronic component lead wire forming device according to the present invention is provided so as to be movable in the vertical direction and is always urged upward. A support member provided on a base and an electronic component lead wire are directed upward. A part of the electronic component is received and supported, and a recess formed at the tip of the supporting member and a circle formed by placing a plurality of lead wires of the electronic component on the circumference are expanded. The lead wire of the electronic component can be inserted between the outer cylinder having the inner diameter of the outer cylinder, which is provided on the peripheral side of the recess and is coupled to the base of the upper opening, and the inner side wall of the outer cylinder. An inner cylinder that has a gap and is installed in the outer cylinder so that it can be moved in and out from above, and an inner cylinder that partially protrudes from the lower part of the inner cylinder and that is movable in the vertical direction. Energized lead wire of the electronic component Since it has a guide pin having a diameter smaller than the diameter of a circle formed by placing a plurality of lead wires on the circumference before expansion and a movable mechanism for moving the movable member up and down, it requires skill. Without this, the lead wire can be bent easily. Moreover, since no tool such as radio pliers is used, the IC is not damaged.

[Brief description of drawings]

FIG. 1 is a front view showing a part of an apparatus according to an embodiment of the present invention in section.

FIG. 2 is a partially enlarged cross-sectional view when a movable member descends.

FIG. 3 is an explanatory diagram showing a shape of a lead wire of an IC.

[Explanation of symbols]

 1 Movable Member 2 Base 4 Handle (Movable Mechanism) 9 Guide Pin 10 Inner Cylinder 11 Supporting Member 12 Outer Cylinder 14 Recess

Claims (1)

[Scope of utility model registration request] 1. A vertically movable unit, which is always
A supporting member provided on the base, which is biased upward, and a concave portion provided at the tip of the supporting member for receiving and supporting a part of the electronic component with the lead wire of the electronic component facing upward. And a plurality of lead wires of the electronic component, which are formed on the circumference of the circle, have an expanded inner diameter and are provided on the peripheral side of the recess, and are coupled to the base of the upper opening. An inner cylinder provided in the movable member so that a lead wire of the electronic component can be inserted between the outer cylinder and the inner wall of the outer cylinder, and the movable member can be inserted into and removed from the outer cylinder from above. , A plurality of lead wires, which partially protrude from the lower part of the inner cylinder, are movably provided in the vertical direction, and are always urged downward, before the lead wires of the electronic component are expanded A guide pin with a diameter smaller than the diameter of the circle formed on top, Serial forming device lead of an electronic component and having a movable mechanism for vertically moving the movable member.