JPS58103158A - Island down device - Google Patents
Island down deviceInfo
- Publication number
- JPS58103158A JPS58103158A JP20282081A JP20282081A JPS58103158A JP S58103158 A JPS58103158 A JP S58103158A JP 20282081 A JP20282081 A JP 20282081A JP 20282081 A JP20282081 A JP 20282081A JP S58103158 A JPS58103158 A JP S58103158A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- island
- heater
- frame
- descends
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
発明の技術分野
この発明は、リードフレームのアイランド（半導体チッ
プ支持用ベッド）部に塑性変形を生じさせ、アイランド
部をインナーリードの端子−より低くするアイランドダ
ウン装置に関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to an island down device that causes plastic deformation in an island (semiconductor chip supporting bed) portion of a lead frame to lower the island portion below the terminals of inner leads.
発明の技術的背景
第１図は半導体製品の製造に用いられる一般的なり一ド
フレームの平面形状を示すものである。このデートフレ
ーＡ１は、アイ１ランド部２及びインナーリード部Ｓか
らなり、このアイランド部１とインナーリード部１とは
第２図に示すように崗−の高さとなっている。このリー
ドフレーム１は、アイランド＠Ｘに半導体チップが固着
され、このチップの電極とインナーラード−１とが複数
のボンディングワイヤで一読された壷は、アイランド部
１とインナーリード部１とが切り離される。TECHNICAL BACKGROUND OF THE INVENTION FIG. 1 shows the planar shape of a general horizontal frame used in the manufacture of semiconductor products. The date fly A1 consists of an eye 1, a land portion 2, and an inner lead portion S, and the island portion 1 and the inner lead portion 1 are at the same height as shown in FIG. In this lead frame 1, a semiconductor chip is fixed to the island @X, and the electrode of this chip and the inner lead 1 are read together with a plurality of bonding wires.The island part 1 and the inner lead part 1 are separated. .
背景技術の間融点
しかしながら、このリードフレーム１においては、アイ
ランド部２とインナーリード部１とが同一の高さである
ため、１ｇ３図に示すようにボンディング後のワイヤ４
の形状によって、核ワイヤ４がアイランド部２に接触し
、製品不良が生じることが多かった。However, in this lead frame 1, since the island portion 2 and the inner lead portion 1 have the same height, the wire 4 after bonding as shown in Figure 1g3
Due to the shape of the core wire 4, the core wire 4 often came into contact with the island portion 2, resulting in product defects.
このような不良製品の発生を防止するためには、第４図
に示すように、リードフレーム１のアイランド部２をイ
ンナーリード部３より低くする必要がある。In order to prevent the occurrence of such defective products, it is necessary to make the island portion 2 of the lead frame 1 lower than the inner lead portion 3, as shown in FIG.
発明の目的
この発明は上記実情に鑑みてなされたもので、その目的
は、リードフレームのアイランド部をインナーリード部
より低くすることができ、製品の歩積りを同上させるこ
との可能なアイランドダウン装置を提供することにある
。Purpose of the Invention This invention has been made in view of the above circumstances, and its purpose is to provide an island down device that can lower the island portion of a lead frame than the inner lead portion and increase the yield of the product. Our goal is to provide the following.
発明の概要
この発明のアイランドダウン＊ｔは、マウント装置ある
いはボンディング装置に取付けられ、これら装置の上下
運動機構を利用し、リードフレームのアイランド部を強
制的に塑性変形させ、アイランド部をインナーリードの
端子部よりも低くなるようにするものである。
′発明の実施例
以下、図面を参照してこの発明の一実施例を説明する。Summary of the Invention The island down*t of the present invention is attached to a mounting device or a bonding device, and utilizes the vertical movement mechanism of these devices to forcibly plastically deform the island portion of the lead frame, thereby deforming the island portion of the inner lead. It is designed to be lower than the terminal section.
'Embodiment of the Invention Hereinafter, an embodiment of the invention will be described with reference to the drawings.
１ノ５図はアイランドダウン装置ｋ置を取付ける前のボ
ンディング装置の構成を示すものである。同図において
、１１は固定台で、この固定台１１には上端にヒータ固
定台１２が取付けられたヒータ駆動軸１３が設けられて
いる。Figure 1-5 shows the configuration of the bonding device before installing the island down device K position. In the figure, reference numeral 11 denotes a fixed base, and the fixed base 11 is provided with a heater drive shaft 13 having a heater fixing base 12 attached to its upper end.
このヒータ駆動軸１３は図示しない駆動手段例えばモー
タにより上下方向に移動自在となっている。ヒータ固定
台１２には凹部が設けられ、この凹部には加熱用のヒー
タ１４が嵌合され。This heater drive shaft 13 is movable in the vertical direction by a drive means (not shown), such as a motor. The heater fixing base 12 is provided with a recess, and a heater 14 for heating is fitted into this recess.
締付けねじにより固定されている。ヒータ固定台１１の
両側にはフレーム支持台１１．１６が配置され、このフ
レーム支持台１１５．１６上面にはそれぞれフレーム押
え部材１７．１８が取付けられている。フレーム支持台
１１１．１ｇの上−の高さはそれぞれヒータ１４の上面
の高さと一部している。また、フレーム支持台ＩＩ。It is fixed with a tightening screw. Frame support stands 11.16 are arranged on both sides of the heater fixing stand 11, and frame holding members 17.18 are attached to the upper surfaces of the frame support stands 115.16, respectively. The height of the upper part of the frame support stand 111.1g is a part of the height of the upper surface of the heater 14, respectively. Also, frame support II.
ノーとフレーム押え部材ＪＰ、ＩＩとの間には、半鴫体
テップ５が固着されたリードフレーム１を水平方向に挿
入するためのフレーム挿入口１ｍ、２０が設けられてい
る。なお、ヒータ１４はリードフレーム載置台な兼ねて
おり、その上面には、第６図に示すように、リードフレ
ーム１におけるアイランド部２の平面形状に対応した…
１部２ノが形成されている。Frame insertion openings 1m and 20 for horizontally inserting the lead frame 1 to which the half-cylindrical body tip 5 is fixed are provided between the nozzle and the frame holding members JP and II. Note that the heater 14 also serves as a lead frame mounting table, and its upper surface is provided with a plate corresponding to the planar shape of the island portion 2 of the lead frame 1, as shown in FIG.
One part and two parts are formed.
第７図は上記ボンディング装置にアイランドダウン装［
ＪＪを取付けた状態を示す斜視図、１１８図は第７図の
Ｙ−Ｙ’線に沿った一部断面図で、フレーム挿入口１９
．１０にリードフレーム１を挿入した状態を示している
。３２はこのアイランドダウン装置３−１の支持体であ
る。Figure 7 shows the island down mounting [
Figure 118, a perspective view showing the state in which the JJ is installed, is a partial sectional view taken along the Y-Y' line in Figure 7, showing the frame insertion slot 19.
．． 10 shows a state in which the lead frame 1 is inserted. 32 is a support body of this island down device 3-1.
この支持体３１は中空の四角柱状になっており、その下
部において固定手段例えば締付けねじ（図示せず）によ
り、マウント装置の固定台１１に取付けられている。こ
の支持体３２の中空部内には摺動杆３３が上下方向に移
動自在に嵌挿されている。この摺動杆１３の上端部には
掛止部材１４が取付けられ、この掛止部材Ｊ４にスプリ
ングＪＪの一端が掛止されている。一方、支持体３ｊの
下端部にはＬ字形に折曲形成された掛止片ｊ６が取付け
られ、この掛止片Ｊｄにスプリング３５の他端が掛止さ
れている。This support 31 has a hollow square column shape, and is attached to the fixing base 11 of the mounting device at its lower part by fixing means, such as a tightening screw (not shown). A sliding rod 33 is fitted into the hollow portion of the support body 32 so as to be movable in the vertical direction. A latching member 14 is attached to the upper end of the sliding rod 13, and one end of the spring JJ is latched to this latching member J4. On the other hand, a latch piece j6 bent into an L-shape is attached to the lower end of the support body 3j, and the other end of the spring 35 is hooked to this latch piece Jd.
また、摺動杆１３の上端部には、水平方間に延在するア
ーム３１の一端部が締付けねじ３８により締付は固定さ
れている。このアーム３１の先端部には前述のヒータ１
４の上面に形成された凹部２１の両端部（第１図のム
Ａ／点に対応する位置）に対応するようにフレーム押え
ビン１９，４１２が取付けられている。支持体１ｚの側
面のと−！１４に対向する面には、突出部ＪＪｍが設け
られており、この突出部３２１において、回動部材４ノ
が回動自在に軸４２支されている。この回動部材４１の
先端部には、該回動部材４１“の魅在方向に対し直角方
向にビン４Ｊが取付けられ、このビン４Ｊの先端部がヒ
−タ固装置１２の下１ｉｉＩｉ！ｈに当接している。Furthermore, one end of an arm 31 extending horizontally is fixed to the upper end of the sliding rod 13 by a tightening screw 38. The above-mentioned heater 1 is attached to the tip of this arm 31.
Both ends of the recess 21 formed on the top surface of 4 (
Frame presser bins 19, 412 are attached so as to correspond to the position corresponding to point A). On the side of support 1z -! A protruding portion JJm is provided on the surface facing the member 14, and the rotating member 4 is rotatably supported on a shaft 42 in this protruding portion 321. A bottle 4J is attached to the tip of the rotating member 41 in a direction perpendicular to the direction of attraction of the rotating member 41'', and the tip of the bottle 4J is located below the heater fixing device 121iiiIi!h. is in contact with.
また、支持体ＳＸの側面部にはその長手方向に沿って１
１４４が形成されており、このＭ４４部から摺動杆１１
に設けられた突出部３３１が突出している。そして、こ
の突出部ＪＪａの下端部は、回動部材４１の後端部にお
いて、その−ト面に当接している。すなわち、このａｌ
ｌにおいては、スプリングａＳの引張力により、摺動杆
３３の窄出部ＪＪａと回動部材４１の後端部、同勢部材
４ノの先端部のピン４３とヒータ固定台１ｚが常特当接
しており、これらが一体向に動作するものである。Further, on the side surface of the support body SX, one
144 is formed, and the sliding rod 11 is formed from this M44 part.
A protruding portion 331 provided at is protruding. The lower end of the protrusion JJa is in contact with the bottom surface of the rotating member 41 at its rear end. That is, this al
1, due to the tensile force of the spring aS, the narrowed portion JJa of the sliding rod 33, the rear end of the rotating member 41, the pin 43 at the tip of the coercive member 4, and the heater fixing base 1z are They are in contact with each other and operate in unison.
次に、このアイランドダウン装置の動４．を説明する。Next, the operation of this island down device 4. Explain.
まず、リードフレーム１がフレーム挿入口１９．２０に
一人された後、図示しないモータによりヒータ駆動軸１
３が上昇すると、これによりヒータ１４が上昇する。こ
のヒータ１４の上昇と同時に、ビン４Ｊが上昇し、回動
部材４１は軸４２を支点として、第８図に矢印１で示す
方ＩＩ（−同勢する。しかして、回動部材４Ｉが回動す
ると、その後端部が下降し、これ１二より摺動杆ＪＪが
スプリングＪ５の引張力により下降し、アームｓｒも下
降する。従って、フレーム押えビン１９．４０が下降し
、リードフレーム１（：おけるアイランド部２の両端部
（Ａ、Ａ２点）−二当接する。ここで、アイランド部１
の下のヒータ１４には凹部２１が形成されているので、
フレーム押えピンＩ１．４０の押圧力によりアイランド
部２に塑性変形が生じ。First, after the lead frame 1 is placed in the frame insertion slot 19.20, the heater drive shaft 1 is driven by a motor (not shown).
3 rises, this causes the heater 14 to rise. Simultaneously with the rise of the heater 14, the bottle 4J rises, and the rotating member 41 uses the shaft 42 as a fulcrum to move in the direction II (-) shown by the arrow 1 in FIG. When the rear end moves, the sliding rod JJ is lowered by the tensile force of the spring J5, and the arm sr is also lowered.Therefore, the frame holding pin 19.40 is lowered, and the lead frame 1 ( :Both ends of the island part 2 (points A and A)-2 contact each other.Here, the island part 1
Since a recess 21 is formed in the heater 14 below,
Plastic deformation occurs in the island portion 2 due to the pressing force of the frame holding pin I1.40.
アイランド部２がインナーリード部３よりも低くなる。The island portion 2 is lower than the inner lead portion 3.
逆に、ヒータ駆動軸１３が下降すると、ヒータＩ４が下
降し、これＣ二より回動部材４１が矢印す方向４二回動
する。従って、摺動杆３Ｊ及びアームＪｒがスプリング
Ｊ５の引張力≦：抗して上昇する。この間、リードフレ
ーム１が送り出され、次のリードフレームが送り込まれ
る。以下、この動作が繰り返えされる。Conversely, when the heater drive shaft 13 is lowered, the heater I4 is lowered, and the rotating member 41 is rotated 42 times in the direction indicated by the arrow. Therefore, the sliding rod 3J and the arm Jr rise against the tensile force of the spring J5. During this time, lead frame 1 is fed out, and the next lead frame is fed in. This operation is repeated thereafter.
第９図（ａ）〜（Ｃ）はそれぞれボンディング工程イニ
おけるリードフレーム１の形状を示している。FIGS. 9A to 9C each show the shape of the lead frame 1 at the initial stage of the bonding process.
第９５！Ｊ（ｍ＋はボンディング位置の一箇所前、第９
図（ｂ）はボンディング位置、第９図（Ｃ）はボンディ
ング後のアイランドダウン装置ｉ１取付位置の状態をそ
れぞれ示す。95th! J (m+ is one place before the bonding position, the 9th
FIG. 9(b) shows the bonding position, and FIG. 9(c) shows the state of the island down device i1 mounting position after bonding.
上記実施例においては、アイランドダウン装Ｗをボンデ
ィング装置に取付ける構成としたが。In the above embodiment, the island down mounting W is attached to the bonding device.
１Ｊ１０図（ａ）〜（＠）に示すよう（ニボンディング
工程の前のマクント装＃／ｌ（こ取付けるよう６二して
もよい。この場合、ボンディング装置におけるヒータ１
４に全てアイランド部２を下げた分に応じた凹部２１を
形成する必要がある。第１０図（１）〜−）はそれぞれ
マウント工程、第１０図（ｄ） （ｅ）はボンディング
工程を示している。第１０図（耐はマウント付着の一箇
所前で、リードフレーム１のアイランド部１にＡｇペー
スト４５が塗布される。なお、リードフレーム１はリー
ドフレーム載置台４＃上に載置される。＄１０ｂ！Ｊ（
ｂ）はマウント位置、第１０図（ｃ）はマウント後にお
けるアイランドダウン装置の取付位置の状態をそれぞれ
示す、 ｉｌｌ ０図（ｇ）においては、′ｓ６図に示
した凹部２１と同様の凹部４７を有するリードフレーム
載置台４８が用いられる。As shown in Figures 1J10 (a) to (@), the heater 1 in the bonding device may be installed as follows:
4, it is necessary to form a recess 21 corresponding to the lowering of the island portion 2. 10(1) to 10-) respectively show the mounting process, and FIGS. 10(d) and 10(e) show the bonding process. FIG. 10 (Ag paste 45 is applied to the island portion 1 of the lead frame 1 at one point before the mount is attached.The lead frame 1 is placed on the lead frame mounting table 4#.$ 10b!J(
b) shows the mounting position, and FIG. 10(c) shows the mounting position of the island down device after mounting. In FIG. 0(g), a recess 47 similar to the recess 21 shown in FIG. A lead frame mounting table 48 having a lead frame mounting table 48 is used.
発明の効果
以上のようにこの発明によれば、フラットタイプのリー
ドフレームであってもボンディング後（：は、アイラン
ド部がインナーリード部より低くなっているため、ボン
ディングワイヤのアイランド部への接触を防止でき、部
品の歩留りが同上する。また、ボンディング装置若しく
はマウント位置に取付けてその機構を利用することが可
能であるため、経済的である、Effects of the Invention As described above, according to the present invention, even if the lead frame is a flat type, after bonding, the island part is lower than the inner lead part, so it is possible to prevent the bonding wire from contacting the island part. It can be prevented and the yield of parts is the same as above.It is also economical because it can be installed in a bonding device or a mounting position and use the mechanism.
１８１図はフラットタイプのリードフレームの平面図、
第２図は第１図のｘ−ｘ’線に沿った断面図、第３図は
従来の半導体簑破の構成図、第４図はアイランド部に段
差を有する半導体装置の構成図、！Ｊ５図はボンディン
グ装置の構成図、第６図は上記ボンディング装置におけ
るヒータの平面図、８７図は上記ボンディング装置にこ
の発明の一実施例Ｃ：係るアイランドダウン装置を取付
けた状態を示す斜視図、第８図は第７図のＹ−Ｙ’線に
沿った一部断一図、第９図（−）〜（Ｃ）はそれぞれボ
ンディング工程を示す断面図、第１Ｏ図（ａ）〜（ｅ）
はそれぞれマウント工程及びそれに続くボンディング工
程を示す断面図である。
１１・・・固定台、１３・・・ヒータ駆動軸、１４°・
・ヒータ（リードフレーム載置台）、１９゜２０・・・
フレーム押入口、２１・・・凹部、３１−・・アイラン
ドダウン装置、３２・・・支持体、３３・・・摺動杆、
３５・・・スプリング、３１・・・アーム、３９．４０
出軸人代理人 弁理士 鈴 江 武 門弟１図
第３図 第４図
第５図
第６図
第７図
第９図
第１０図
（ｄ） （ｅ）
（Ｃ）
（Ｃ）Figure 181 is a plan view of a flat type lead frame.
FIG. 2 is a sectional view taken along the line xx' in FIG. 1, FIG. 3 is a block diagram of a conventional semiconductor shredder, and FIG. 4 is a block diagram of a semiconductor device having a step in an island portion. Fig. J5 is a configuration diagram of the bonding device, Fig. 6 is a plan view of the heater in the bonding device, and Fig. 87 is a perspective view showing a state in which an island down device according to Embodiment C of the present invention is attached to the bonding device. FIG. 8 is a partially cutaway view taken along the Y-Y' line in FIG. 7, FIGS. 9(-) to (C) are sectional views showing the bonding process, and FIGS. )
2A and 2B are cross-sectional views showing a mounting process and a subsequent bonding process, respectively. 11...Fixed base, 13...Heater drive shaft, 14°
・Heater (lead frame mounting stand), 19°20...
Frame entry port, 21--recessed portion, 31--island down device, 32--support body, 33--sliding rod,
35...Spring, 31...Arm, 39.40
Patent attorney Takeshi Suzue Disciple 1 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 9 Figure 10 (d) (e) (C) (C)
Claims (1)
吠の凹部を有し、譲り−ドフレームが截置されるリード
フレーム載置台と、このリードフレーム載置台な上下移
動さ着る駆動機構と、前記一定置に取付けられる中空の
支持体と、この支持体で軸支され、前記リードフレーム
載置台の上下移動に応じて回動する回動部材と、この回
動部材の回動運動に応じて前記支持体の中空内を上下方
向に摺動する摺動部材と、この摺動部材に対し下方向に
向けて引張力を与えるスプリング部材と、前記凹部に対
応した位置にリードフレーム押えビンが取付けられ、前
記摺動部材と共に上下移動するアームとを具備し。 前記スプリング部材の引張力による前記リードフレーム
押えビｙの押圧力により、前記リードフレームのアイラ
ンド部に塑性変形な庄じ亦せへることを特徴とするアイ
ランドダウン装置。[Scope of Claims] A fixed stand, a lead frame mounting stand having a carved concave portion corresponding to the island portion of the lead frame and on which a yield frame is placed, and a lead frame mounting stand that can be moved up and down. A driving mechanism for attaching the lead frame, a hollow support body attached to the fixed position, a rotating member that is pivotally supported by the support body and rotates in accordance with the vertical movement of the lead frame mounting table, and rotation of the rotating member. a sliding member that slides vertically in the hollow of the support according to the dynamic movement; a spring member that applies a downward tensile force to the sliding member; and a lead at a position corresponding to the recess. and an arm to which a frame presser pin is attached and which moves up and down together with the sliding member. An island down device characterized in that the island portion of the lead frame is plastically deformed by the pressing force of the lead frame presser y due to the tensile force of the spring member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20282081A JPS58103158A (en) | 1981-12-16 | 1981-12-16 | Island down device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20282081A JPS58103158A (en) | 1981-12-16 | 1981-12-16 | Island down device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58103158A true JPS58103158A (en) | 1983-06-20 |
Family
ID=16463731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20282081A Pending JPS58103158A (en) | 1981-12-16 | 1981-12-16 | Island down device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58103158A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04362302A (en) * | 1991-06-07 | 1992-12-15 | Res Dev Corp Of Japan | Control mechanism of servo valve |
-
1981
- 1981-12-16 JP JP20282081A patent/JPS58103158A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04362302A (en) * | 1991-06-07 | 1992-12-15 | Res Dev Corp Of Japan | Control mechanism of servo valve |
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