JPH067265U - Printed circuit board equipment - Google Patents

Abstract

(57) [Summary] [Purpose] A single-sided mounting board is folded and stacked to form a double-sided mounting board, thereby reducing the component mounting process. [Structure] A thin printed circuit board with components mounted on one side is cut or bent so that the component non-mounting surfaces face each other, and they are stacked. The printed circuit board portions that are overlapped with each other are fixed to each other by a mechanical coupling means such as a rivet through an opening that penetrates these printed circuit board portions to form a double-sided mounted printed circuit board. In addition, it is convenient to perform through-hole plating on the openings penetrating each printed circuit board portion.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a printed circuit board device, and more particularly to a double-sided printed circuit board in which a component mounting process is reduced by bending a single-sided printed circuit board and fixing it by using a superposition mechanical coupling means.

[0002]

[Prior art]

 Conventionally, when a component is mounted on a double-sided printed circuit board having conductive patterns on both sides, the same component mounting process is performed twice on each side of the printed circuit board.

That is, as shown in FIG. 3, first, a double-sided printed circuit board is prepared, and cream solder is printed on one surface of the double-sided printed circuit board in correspondence with soldering points. Next, an adhesive is applied as needed to fix the chip component, and the chip component is mounted in a predetermined position. Next, the mounting state of the components is checked, and if they are mounted correctly, soldering is performed by reflow processing. This completes the component mounting on one side of the printed circuit board. Next, the substrate is turned over, and cream solder printing, adhesive application, chip component mounting, component mounting state checking, and reflow soldering processing are performed in the same manner as described above. In this way, the substrate with the components mounted on both sides is completed as a double-sided mounting substrate through the cleaning and inspection steps.

[0004]

[Problems to be solved by the device]

 However, in such a conventional double-sided mounting board, it is necessary to perform the component mounting process twice on each side, which makes the component mounting process complicated and requires a long time.

In view of the problems in the above-described conventional double-sided mounting board, an object of the present invention is to simplify the component mounting process on the double-sided mounting board based on the concept of bending and stacking one-sided mounting boards. It is about speeding up.

[0006]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, the printed circuit board device according to the present invention is formed by cutting or bending a thin printed circuit board on which components are mounted on one surface so that the non-component mounting surfaces face each other, and stacking them. It is characterized in that each printed circuit board portion is fixed to each other by mechanical coupling means to form a double-sided mounting board.

[0007]

[Action]

 In the above configuration, the component mounting is performed only on one side of the printed circuit board, and the printed circuit board mounted on one side is bent and overlapped, and the printed circuit board parts which are superposed by the mechanical coupling means are fixed to each other. The mounting board is completed. Therefore, it is not necessary to mount the components on both sides of the board as in the conventional case, so that the component mounting process can be greatly simplified and quickly performed. Further, since the printed circuit board parts that are folded and overlapped are mechanically fixed to each other, the printed circuit board parts can be fixed easily and quickly. A rivet or the like is used as the mechanical coupling means. Further, it is also possible to electrically connect the respective printed circuit board parts via the mechanical coupling means.

[0008]

【Example】

 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows the structure and manufacturing process of a double-sided mounting printed circuit board according to an embodiment of the present invention. As shown in FIG. 1A, the printed circuit board device according to the present invention is formed based on a thin single-sided printed circuit board 1. The chip component 3 and other components 5 are mounted on the surface of the printed circuit board 1 having a conductive pattern (not shown). This implementation method may be the same as the conventional method. In addition, such a printed circuit board 1 is provided with a fixing hole 7 which serves as a through hole when bent and superposed. However, the fixing hole 7 may be, for example, a notch provided at the edge of the printed board 1.

Next, such a single-sided printed circuit board is bent and overlapped, for example, along the dotted line 9 in FIG. 1A so that the component mounting surfaces are located outside each other. FIG. 1 (b) shows a state in which they are superposed in this way. When the printed circuit board 1 is not a flexible substrate, the printed circuit board 1 may be cut or folded along the dotted line 9 in FIG. The fixing holes 7 of the respective substrate portions 11 and 13 thus overlapped with each other overlap each other to form a through hole passing through both substrate portions.

Next, as shown in FIG. 1C, a mechanical connection such as a rivet passing through both fixing holes 7 in a state where the respective substrate parts 11 and 13 are pressed and fixed to each other by a jig or the like not shown. Both board parts 11 and 13 are fixed to each other by means 15. In this case, by fixing each fixing hole 7 by so-called through-hole plating, electrical connection between the conductive parts of both substrate parts 11 and 13 can be made more surely. In FIG. 1C, the through holes of the respective substrate parts 11 and 13 are shown as being plated with through holes.

As shown in (c ′) of FIG. 1, a rubber or other cushion member is inserted between the board portions 11 and 13 to ensure a more reliable connection between the board portions 11 and 13. Can be firmly fixed. Further, the mechanical coupling means 15 is not limited to a rivet, but bolts and nuts and various other types can be used.

Note that FIG. 1D shows a side view of the double-sided mounting substrate formed by the base plates 11 and 13 mutually fixed by the coupling means 15 in this way.

FIG. 2 shows a manufacturing process of such a double-sided mounting printed circuit board according to the present invention in comparison with FIG. As shown in the figure, in the manufacture of the printed circuit board device according to the present invention, first, a single-sided mounting board is prepared, and cream solder is printed corresponding to the parts connection part of the conductive pattern. Next, if necessary, an adhesive for fixing the chip component or the like is applied, and then the chip component is mounted. Then, the mounting state is checked, and if the mounting is properly performed, the soldering is performed by the reflow process. Next, the printed circuit board thus mounted on one side is washed and inspected for proper component mounting. After confirming that the components are properly mounted, fold or cut the printed circuit boards with the components mounted on one side and stack them, and then through the through holes that penetrate both board parts as described above. Fix both board parts with rivets. As a result, the double-sided mounting board is completed.

Comparing the process of FIG. 2 with the process of FIG. 3, it is apparent that the component mounting process including the component mounting check and the like is halved, and a double-sided mounted printed circuit board can be rapidly produced.

[0015]

[Effect of device]

 As described above, according to the present invention, it is not necessary to repeat the same component mounting process for each surface of the double-sided printed circuit board as in the conventional case, so that the printed circuit board assembly process is greatly simplified and the assembly process is improved. The speed is also greatly improved. Therefore, the cost of the double-sided printed board is reduced and the reliability is improved.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a structure and an assembling procedure of a printed circuit board device according to an embodiment of the present invention.

FIG. 2 is a process diagram showing an outline of a manufacturing process of a printed circuit board device according to the present invention.

FIG. 3 is a process drawing showing a manufacturing process of a conventional double-sided printed circuit board.

[Explanation of symbols]

 1 Single-sided mounting thin board 3 Chip parts 5 Other parts 7 Fixing hole 9 Bending part 11, 13 Board part 15 Rivet 17 Through hole plating part 21 Cushion member

Claims (2)

[Scope of utility model registration request] 1. A thin printed circuit board having a component mounted on one side thereof is cut or bent so that the component non-mounting surfaces face each other so as to be superposed, and the superposed printed circuit board portions are fixed to each other by a mechanical coupling means. A printed circuit board device characterized by being used as a mounting board. 2. The printed circuit board device according to claim 1, wherein the mechanical coupling means is a rivet.