JPH0669627A - Integrated circuit package assembly - Google Patents

Integrated circuit package assembly

Info

Publication number
JPH0669627A
JPH0669627A JP22111592A JP22111592A JPH0669627A JP H0669627 A JPH0669627 A JP H0669627A JP 22111592 A JP22111592 A JP 22111592A JP 22111592 A JP22111592 A JP 22111592A JP H0669627 A JPH0669627 A JP H0669627A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit package
pad
wiring board
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22111592A
Other languages
Japanese (ja)
Other versions
JP2783075B2 (en
Inventor
Katsuhiko Yabe
勝彦 矢部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP4221115A priority Critical patent/JP2783075B2/en
Publication of JPH0669627A publication Critical patent/JPH0669627A/en
Application granted granted Critical
Publication of JP2783075B2 publication Critical patent/JP2783075B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To prevent connection failure without reducing the wiring performance of a printed wiring board, by soldering the connecting pads of the board and the straight outer leads of a quad-flat integrated circuit package. CONSTITUTION:A multilayer wiring board 5 has a hollow part 5a, and connecting pads 3 are provided in the vicinity of the edge portion adjacent to the hollow part. In addition, auxiliary pads 4 are provided in the vicinity of the outer periphery of the surface, and they are connected to the connecting pads 3 by a conductor wiring 6a provided in the multilayer wiring board 5. On the rear of the multilayer wiring board 5 provided are solder pads 8 for external connection, which are connected to the connecting pads 3 by a conductor wiring 6b. A quad-flat integrated circuit package 1 has straight outer leads. By inserting the quad-flat integrated circuit package 1 formed thus into the hollow part 5a and soldering the straight leads 2 to the connecting pads 3 of the multilayer wiring board 5, an integrated circuit package assembly is formed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、多層配線基板に集積回
路パッケージを接続した集積回路パッケージ組立体に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit package assembly in which an integrated circuit package is connected to a multilayer wiring board.

【０００２】[0002]

【従来の技術】図５は従来の集積回路パッケージ組立体
の一例を示す断面図、図６は従来の集積回路パッケージ
組立体の他の例を示す断面図である。2. Description of the Related Art FIG. 5 is a sectional view showing an example of a conventional integrated circuit package assembly, and FIG. 6 is a sectional view showing another example of a conventional integrated circuit package assembly.

【０００３】多層配線基板に集積回路パッケージを接続
した従来の集積回路パッケージ組立体は、図５にその一
例を示すように、クワッドフラット型集積回路パッケー
ジ（ＱＦＰ型集積回路パッケージ）３１の容器の側面か
ら外方に延長している外部リード３２を、２段に折曲げ
たいわゆるガルウィング型の形状とし、その先端部分を
プリント配線基板４０の接続用パッド４１に直接にはん
だ付けして接続する構成となっている。A conventional integrated circuit package assembly in which an integrated circuit package is connected to a multilayer wiring board is shown in FIG. 5 as an example, and a side surface of a container of a quad flat type integrated circuit package (QFP type integrated circuit package) 31. The external lead 32 extending outwardly from is formed in a so-called gull wing shape in which the external lead 32 is bent in two stages, and the tip end portion thereof is directly soldered to the connection pad 41 of the printed wiring board 40 to be connected. Has become.

【０００４】また、他の例として集積回路パッケージの
外部リードのピッチが微小な場合は、図６に示すよう
に、ＱＦＰ型集積回路パッケージ５１の外部リードの形
状を、容器の側面から水平方向に直線状に延長している
直線状外部リード５２とし、一方、これに対応するプリ
ント配線基板６０に中空部を設け、この中空部の中にＱ
ＦＰ型集積回路パッケージ５１を挿入して直線状外部リ
ード５２をプリント配線基板６０の接続用パッド４１に
はんだ付けしている。ガルウィング型の外部リードを有
するＱＦＰ型集積回路パッケージ３１に対しては、図５
の例と同じように、外部リード３２をプリント配線基板
６０の接続用パッド６２に直接にはんだ付けして接続し
ている。これらのはんだ付けは、リフロー工法等によ
り、一括して行っている。As another example, when the pitch of the external leads of the integrated circuit package is very small, the shape of the external leads of the QFP type integrated circuit package 51 is set horizontally from the side surface of the container as shown in FIG. A linear outer lead 52 extending in a straight line is formed, and on the other hand, a hollow portion is provided in the corresponding printed wiring board 60, and Q is provided in the hollow portion.
The FP type integrated circuit package 51 is inserted and the linear external leads 52 are soldered to the connection pads 41 of the printed wiring board 60. For a QFP type integrated circuit package 31 having gull wing type external leads, FIG.
In the same manner as in the above example, the external leads 32 are directly soldered and connected to the connection pads 62 of the printed wiring board 60. These solderings are collectively performed by a reflow method or the like.

【０００５】[0005]

【発明が解決しようとする課題】上述したような従来の
集積回路パッケージ組立体は、図５に例示したガルウィ
ング型の外部リードを有するＱＦＰ型集積回路パッケー
ジの場合は、外部リードに２段に折曲げる加工を施さな
ければならないため、加工後の外部リードの先端部分の
位置精度を確保するのが困難であり、このため、図５に
示すように、正しく折曲げ加工が行われた外部リード３
２ａはプリント配線基板４０の接続パッド４１ａと良好
に接続することができるが、折曲げ加工の精度が悪い外
部リード３２ｂの場合は、接続パッド４１ｂとの間に間
隔が生ずるため、接続不良となるという欠点を有してい
る。In the case of the QFP type integrated circuit package having the gull-wing type external leads illustrated in FIG. 5, the conventional integrated circuit package assembly as described above is folded in two stages on the external leads. Since the bending process must be performed, it is difficult to secure the positional accuracy of the tip portion of the external lead after the processing. Therefore, as shown in FIG. 5, the external lead 3 that is correctly bent is processed.
2a can be satisfactorily connected to the connection pad 41a of the printed wiring board 40, but in the case of the external lead 32b whose bending accuracy is poor, a gap is generated between the external lead 32b and the connection pad 41b, resulting in poor connection. It has the drawback of

【０００６】これを回避するために外部リードを直線状
としたＱＦＰ型集積回路パッケージの場合は、プリント
配線基板に中空部を設けなければならないため、その分
だけプリント配線基板の配線領域を減少させ、プリント
配線の配線性能を大幅に低下させるという問題点を有し
ている。In order to avoid this, in the case of the QFP type integrated circuit package in which the external leads are linear, the printed wiring board must be provided with a hollow portion, and the wiring area of the printed wiring board is reduced accordingly. However, there is a problem that the wiring performance of the printed wiring is significantly reduced.

【０００７】[0007]

【課題を解決するための手段】本発明の集積回路パッケ
ージ組立体は、中央部に中空部を有し表面の前記中空部
に隣接する縁部の近傍に接続用パッドを有し、表面の外
周部の近傍に内部導体配線を介して前記接続用パッドと
接続している補助パッドを有し、裏面に内部導体配線を
介して前記接続用パッドと接続している外部接続用ハン
ダパッド、または、裏面に内部導体配線を介して前記接
続用パッドと接続しており前記接続用パッドのピッチよ
りも大きいピッチで配設した外部リードを有する基板
と、容器の側面から水平方向に直線状に延長している直
線状外部リードを有するクワッドフラット型集積回路パ
ッケージとを備え、前記基板の前記接続用パッドと前記
クワッドフラット型集積回路パッケージの前記直線状外
部リードとをはんだ接続したものである。SUMMARY OF THE INVENTION An integrated circuit package assembly of the present invention has a hollow portion in the center and a connecting pad near the edge of the surface adjacent to the hollow portion, and has an outer periphery of the surface. An external connection solder pad having an auxiliary pad connected to the connection pad via an internal conductor wiring in the vicinity of the portion, and an external connection solder pad connected to the connection pad on the back surface via an internal conductor wiring, or A substrate having external leads connected to the connection pads via an internal conductor wiring on the back surface and having external leads arranged at a pitch larger than the pitch of the connection pads, and extending linearly in a horizontal direction from the side surface of the container. A quad flat integrated circuit package having a linear external lead that is soldered to the connection pad of the substrate and the linear external lead of the quad flat integrated circuit package. It is intended to continue the.

【０００８】[0008]

【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.

【０００９】図１は本発明の第一の実施例を示す断面
図、図２は図１の実施例の表面を示す部分拡大平面図、
図３は図１の実施例の裏面を示す部分拡大底面図であ
る。FIG. 1 is a sectional view showing a first embodiment of the present invention, and FIG. 2 is a partially enlarged plan view showing the surface of the embodiment of FIG.
FIG. 3 is a partially enlarged bottom view showing the back surface of the embodiment of FIG.

【００１０】図１〜図３において、多層配線基板５は、
中央部に中空部５ａを有し、表面の中空部５ａに隣接す
る縁部の近傍に接続用パッド３を設けてある。また表面
の外周部の近傍には補助パッド４が設けてあり、補助パ
ッド４は、多層配線基板５の内部に設けてある導体配線
６ａによって接続用パッド３と接続されている。1 to 3, the multilayer wiring board 5 is
A hollow portion 5a is provided in the central portion, and a connecting pad 3 is provided near the edge portion adjacent to the hollow portion 5a on the surface. An auxiliary pad 4 is provided near the outer peripheral portion of the surface, and the auxiliary pad 4 is connected to the connecting pad 3 by a conductor wiring 6a provided inside the multilayer wiring board 5.

【００１１】多層配線基板５の裏面には、外部接続用ハ
ンダパッド８が設けてあり、外部接続用ハンダパッド８
は、多層配線基板５の内部に設けてある導体配線６ｂに
よって接続用パッド３と接続されている。An external connection solder pad 8 is provided on the back surface of the multilayer wiring board 5, and the external connection solder pad 8 is provided.
Are connected to the connection pads 3 by conductor wiring 6b provided inside the multilayer wiring board 5.

【００１２】ＱＦＰ型集積回路パッケージ１は、容器の
側面から水平方向に直線状に延長している直線状外部リ
ード２を有している。The QFP type integrated circuit package 1 has a linear outer lead 2 which extends linearly in the horizontal direction from the side surface of the container.

【００１３】このように構成したＱＦＰ型集積回路パッ
ケージ１を多層配線基板５の中空部５ａの中に挿入し、
直線状外部リード２を多層配線基板５の接続用パッド３
にはんだ付けすることによって集積回路パッケージ組立
体を構成する。The QFP type integrated circuit package 1 thus constructed is inserted into the hollow portion 5a of the multilayer wiring board 5,
The linear external lead 2 is connected to the connection pad 3 of the multilayer wiring board 5.
An integrated circuit package assembly is constructed by soldering to.

【００１４】上述のように構成した集積回路パッケージ
組立体をプリント配線基板に接続するときは、多層配線
基板５の裏面の外部接続用ハンダパッド８を、プリント
配線基板の接続用パッドにはんだ付けすることによって
行う。When connecting the integrated circuit package assembly constructed as described above to the printed wiring board, the external connection solder pads 8 on the back surface of the multilayer wiring board 5 are soldered to the connection pads of the printed wiring board. By doing.

【００１５】なお、補助パッド４は、電気的機能テスト
や改造布線等を行うとき、直線状外部リード２を使用す
る代りにこの補助パッド４を使用する。これによって電
気的機能テストや改造布線等の実行が容易になる。The auxiliary pad 4 is used in place of using the linear external lead 2 when conducting an electrical function test or modified wiring. This facilitates the execution of electrical function tests and modified wiring.

【００１６】図４は本発明の第二の実施例を示す断面図
である。FIG. 4 is a sectional view showing a second embodiment of the present invention.

【００１７】図４の実施例は、ＱＦＰ型集積回路パッケ
ージ１１の構成は図１の実施例と同じであるが、多層配
線基板１５の裏面に、図１の実施例の外部接続用ハンダ
パッドの代りに、内部の導体配線１６ａを介して接続用
パッド１３と接続している外部リード１９を設けたもの
である。外部リード１９のピッチは、接続用パッド１３
のピッチ、すなわちＱＦＰ型集積回路パッケージ１１の
直線状外部リード１２のピッチ（０．５ｍｍ）の１．３
倍のピッチ（０．６５ｍｍ）となっており、この外部リ
ード１９をプリント配線基板２０の接続用パッド２１に
はんだ付けして接続する。In the embodiment of FIG. 4, the construction of the QFP type integrated circuit package 11 is the same as that of the embodiment of FIG. 1, but the external connection solder pad of the embodiment of FIG. Instead, the external lead 19 connected to the connection pad 13 through the internal conductor wiring 16a is provided. The pitch of the external leads 19 is equal to that of the connection pads 13
Of the linear external leads 12 of the QFP type integrated circuit package 11 (0.5 mm).
The pitch is doubled (0.65 mm), and the external leads 19 are soldered and connected to the connection pads 21 of the printed wiring board 20.

【００１８】[0018]

【発明の効果】以上説明したように、本発明の集積回路
パッケージ組立体は、中央部に中空部を設けた多層配線
基板の中空部の中にＱＦＰ型集積回路パッケージを挿入
し、その直線状外部リードを多層配線基板の表面に設け
た接続用パッドに接続し、この接続用パッドを内部導体
配線によって多層配線基板の裏面に設けた外部接続用ハ
ンダパッドまたは外部リードと接続しておき、外部接続
用ハンダパッドまたは外部リードをプリント配線基板の
接続用パッドと接続するように構成することにより、プ
リント配線基板に搭載して接続するとき、プリント配線
基板の配線性能を低下させずに接続不良を防止すること
ができるという効果がある。As described above, according to the integrated circuit package assembly of the present invention, the QFP type integrated circuit package is inserted into the hollow portion of the multi-layer wiring board having the hollow portion at the center, and the linear shape is obtained. External leads are connected to connection pads provided on the surface of the multilayer wiring board, and these connection pads are connected to external connection solder pads or external leads provided on the back surface of the multilayer wiring board by internal conductor wiring. By configuring the connection solder pads or external leads to connect with the connection pads of the printed wiring board, when mounting and connecting to the printed wiring board, the wiring performance of the printed wiring board is not deteriorated and connection failure is prevented. The effect is that it can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の第一の実施例を示す断面図である。FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

【図２】図１の実施例の表面を示す部分拡大平面図であ
る。FIG. 2 is a partially enlarged plan view showing the surface of the embodiment of FIG.

【図３】図１の実施例の裏面を示す部分拡大底面図であ
る。FIG. 3 is a partially enlarged bottom view showing the back surface of the embodiment of FIG.

【図４】本発明の第二の実施例を示す断面図である。FIG. 4 is a sectional view showing a second embodiment of the present invention.

【図５】従来の集積回路パッケージ組立体の一例を示す
断面図である。FIG. 5 is a sectional view showing an example of a conventional integrated circuit package assembly.

【図６】従来の集積回路パッケージ組立体の他の例を示
す断面図である。FIG. 6 is a cross-sectional view showing another example of a conventional integrated circuit package assembly.

【符号の説明】[Explanation of symbols]

１・１１・３１・５１ ＱＦＰ型集積回路パッケー
ジ ２・１２ 直線状外部リード ３・１３ 接続用パッド ４ 補助パッド ５・１５ 多層配線基板 ５ａ 中空部 ６ａ・６ｂ・１６ａ 導体配線 ８ 外部接続用ハンダパッド １９・３２（３２ａ・３２ｂ） 外部リード ２０・４０・６０ プリント配線基板 ２１・４１（４１ａ・４１ｂ）・６１・６２ 接続用
パッド1.11.31.51 QFP type integrated circuit package 2.12 Linear external leads 3.13 Connection pad 4 Auxiliary pad 5.15 Multilayer wiring board 5a Hollow part 6a, 6b, 16a Conductor wiring 8 Solder pad for external connection 19/32 (32a / 32b) External lead 20/40/60 Printed wiring board 21/41 (41a / 41b) / 61/62 Connection pad

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 中央部に中空部を有し表面の前記中空部
に隣接する縁部の近傍に接続用パッドを有し表面の外周
部の近傍に内部導体配線を介して前記接続用パッドと接
続している補助パッドを有し裏面に内部導体配線を介し
て前記接続用パッドと接続している外部接続用ハンダパ
ッドを有する基板と、容器の側面から水平方向に直線状
に延長している直線状外部リードを有するクワッドフラ
ット型集積回路パッケージとを備え、前記基板の前記接
続用パッドと前記クワッドフラット型集積回路パッケー
ジの前記直線状外部リードとをはんだ接続したことを含
むことを特徴とする集積回路パッケージ組立体。1. A connection pad is provided in the vicinity of an edge portion of the surface having a hollow portion in the central portion and adjacent to the hollow portion of the surface, and the connection pad is provided in the vicinity of an outer peripheral portion of the surface via internal conductor wiring. A substrate having auxiliary pads connected thereto and a solder pad for external connection which is connected to the connection pads on the back surface through internal conductor wiring, and extends linearly in a horizontal direction from the side surface of the container. A quad flat type integrated circuit package having a linear external lead, wherein the connection pad of the substrate and the linear external lead of the quad flat type integrated circuit package are connected by soldering. Integrated circuit package assembly. 【請求項２】 中央部に中空部を有し表面の前記中空部
に隣接する縁部の近傍に接続用パッドを有し表面の外周
部の近傍に内部導体配線を介して前記接続用パッドと接
続している補助パッドを有し裏面に内部導体配線を介し
て前記接続用パッドと接続しており前記接続用パッドの
ピッチよりも大きいピッチで配設した外部リードを有す
る基板と、容器の側面から水平方向に直線状に延長して
いる直線状外部リードを有するクワッドフラット型集積
回路パッケージとを備え、前記基板の前記接続用パッド
と前記クワッドフラット型集積回路パッケージの前記直
線状外部リードとをはんだ接続したことを含むことを特
徴とする集積回路パッケージ組立体。2. A connecting pad is provided in the vicinity of an edge portion of the surface adjacent to the hollow portion having a hollow portion in the central portion, and the connecting pad is provided in the vicinity of an outer peripheral portion of the surface via internal conductor wiring. A substrate having an auxiliary pad connected to it, which is connected to the connecting pad via an internal conductor wiring on the back surface and has external leads arranged at a pitch larger than the pitch of the connecting pad, and a side surface of the container. And a quad flat type integrated circuit package having a linear external lead extending in a straight line in a horizontal direction from the connecting pad of the substrate and the linear external lead of the quad flat type integrated circuit package. An integrated circuit package assembly including a solder connection.
JP4221115A 1992-08-20 1992-08-20 Integrated circuit package assembly Expired - Fee Related JP2783075B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4221115A JP2783075B2 (en) 1992-08-20 1992-08-20 Integrated circuit package assembly

Applications Claiming Priority (1)

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JP4221115A JP2783075B2 (en) 1992-08-20 1992-08-20 Integrated circuit package assembly

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100373100C (en) * 2004-07-14 2008-03-05 三星电子株式会社 Outdoor unit of air-conditioner

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895580U (en) * 1981-12-21 1983-06-29 カシオ計算機株式会社 Connection structure between electronic components and connectors
JPH01104731U (en) * 1987-12-28 1989-07-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895580U (en) * 1981-12-21 1983-06-29 カシオ計算機株式会社 Connection structure between electronic components and connectors
JPH01104731U (en) * 1987-12-28 1989-07-14

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100373100C (en) * 2004-07-14 2008-03-05 三星电子株式会社 Outdoor unit of air-conditioner

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