JPH0666539B2 - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPH0666539B2 JPH0666539B2 JP5541187A JP5541187A JPH0666539B2 JP H0666539 B2 JPH0666539 B2 JP H0666539B2 JP 5541187 A JP5541187 A JP 5541187A JP 5541187 A JP5541187 A JP 5541187A JP H0666539 B2 JPH0666539 B2 JP H0666539B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tin
- solder
- soldering
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Chemically Coating (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔技術分野〕 本発明は、プリント回路基板のパッド部に電子部品のリ
ード部を半田付けする方法に係り、特にロジン酸錫−鉛
塩を用いた比較的低温での半田付け方法に関するもので
ある。Description: TECHNICAL FIELD The present invention relates to a method for soldering a lead part of an electronic component to a pad part of a printed circuit board, and in particular, it uses tin rosin acid-lead salt at a relatively low temperature. The present invention relates to a soldering method.
従来、プリント回路基板に電子部品を実装する場合に
は、プリント回路基板に電子部品を搭載したものを、溶
融半田浴に浸漬するか、あるいはリフロー炉に通して予
めパッド部等に付着させてある半田を溶融させることに
より、半田付けを行っている。Conventionally, when an electronic component is mounted on a printed circuit board, the electronic component mounted on the printed circuit board is immersed in a molten solder bath or passed through a reflow furnace to be attached to a pad portion or the like in advance. Soldering is performed by melting the solder.
しかしこのような従来の方法では、錫−鉛の6:4共晶半
田（融点183℃）の場合でも260℃前後に加熱する必要が
あり、電子部品が熱により損傷を受ける危険性が大き
い。このためさらに低い温度で半田付けをする方法が望
まれている。However, in such a conventional method, even in the case of tin-lead 6: 4 eutectic solder (melting point: 183 ° C.), it is necessary to heat it to around 260 ° C., and there is a high risk that the electronic component will be damaged by heat. Therefore, a method of soldering at a lower temperature is desired.
本発明は、上記のような従来技術の問題的を解決した新
しい半田付け方法を提供するものである。The present invention provides a new soldering method that solves the above-mentioned problems of the prior art.
従来、ロジン酸（松やにに含まれている有機酸で、アビ
エチン酸などが主成分）と金属との有機金属塩を適当な
有機溶媒に溶かし、加熱した状態で、その中に上記金属
より卑な金属を浸漬すると、その卑な金属の表面に有機
金属塩中の貴な金属が析出することが知られている。Conventionally, an organic metal salt of rosin acid (an organic acid contained in pine and is the main component, such as abietic acid) and a metal is dissolved in an appropriate organic solvent, and in a heated state, it is less noble than the above metal. It is known that when a metal is dipped, the noble metal in the organic metal salt is deposited on the surface of the base metal.
本発明者等は、この方法をさらに発展させ、ロジン酸と
錫・鉛との塩を作り、同様の処理を行ったところ、錫や
鉛より卑な亜鉛や錫の表面に半田（錫−鉛合金）が析出
することを見出した。ちなみに錫や鉛より卑な金属であ
ってもニッケルやアルミニウムには析出しないことから
半田の析出は亜鉛や錫に限って生じる特異な現象であ
る。そして半田を析出させるときのロジン酸錫・鉛塩溶
液の加熱温度は半田の融点付近の温度でよいことも確認
された。The inventors of the present invention further developed this method, made a salt of rosin acid and tin / lead, and performed the same treatment, and found that solder (tin-lead) was applied to the surface of zinc or tin, which is baser than tin or lead. Alloy) was found to precipitate. By the way, since even metals that are baser than tin and lead do not deposit on nickel and aluminum, solder deposition is a unique phenomenon that occurs only on zinc and tin. It was also confirmed that the heating temperature of the tin rosin acid / lead salt solution for depositing the solder may be around the melting point of the solder.
ところでプリント回路基板の導体や電子部品のリード部
は一般に銅または銅合金製であるが、パッド部やリード
部には通常、錫メッキが施されている場合が多い。そこ
で、上記の方法でプリント回路基板の導体と電子部品の
リード部を半田付け出来るか否かを検討した。錫の表面
に半田が析出するとはいっても平面上ではわずかな厚さ
でしかないので、半田付けまでは不可能と考えられた
が、次のような興味ある結果が得られた。By the way, the conductor of the printed circuit board and the lead part of the electronic component are generally made of copper or copper alloy, but the pad part and the lead part are usually tin-plated in many cases. Therefore, it was examined whether or not the conductor of the printed circuit board and the lead portion of the electronic component can be soldered by the above method. Although the solder was deposited on the surface of tin, it was considered to be impossible until soldering because it had a very small thickness on the plane, but the following interesting results were obtained.
すなわち、銅平板に厚さ１μｍ以上の錫メッキを施した
面上に、裸の銅線または錫メッキ銅線を垂直に接触させ
たものを、加熱したロジン酸錫・鉛塩溶液の中に浸漬す
ると、錫メッキした平坦な面と線材の表面とが交わる凹
角部分（凹んだ角の部分）にフィレット状に半田が析出
し、半田付けが可能であることが判明したのである。That is, a bare copper wire or a tin-plated copper wire is vertically contacted with a tin-plated surface having a thickness of 1 μm or more on a copper flat plate, and immersed in a heated tin rosinate / lead salt solution. Then, it was revealed that solder was deposited in the form of fillet in the concave portion (the concave corner portion) where the flat surface plated with tin and the surface of the wire intersect, and soldering was possible.
また、ロジン酸鉛塩溶液を使用した場合についても同様
の実験を行ったところ、これでも半田付けが可能である
ことが判明した。これはロジン酸鉛塩の鉛と錫メッキの
錫とが合金化することによるものと考えられる。Further, when the same experiment was carried out when the lead rosin acid salt solution was used, it was found that soldering was possible even with this. It is considered that this is due to the alloying of lead of the rosin acid lead salt and tin of tin plating.
本発明は、以上のような知見に基づいてなされたもの
で、プリント回路基板のパッド部に電子部品のリード部
を半田付け方法において、上記パッド部およびリード部
のうち少なくとも一方に錫メッキを施し、上記パッド部
にリード部を接触させた状態で、ロジン酸錫・鉛塩また
はロジン酸鉛塩を有機溶媒に溶かして加熱した溶液中に
浸漬することにより、上記パッド部の表面とリード部の
表面が交わる凹角部分に半田を析出させることを特徴と
するものである。The present invention has been made based on the above findings, and in a method of soldering a lead part of an electronic component to a pad part of a printed circuit board, at least one of the pad part and the lead part is tin-plated. In the state where the lead portion is in contact with the pad portion, the tin rosin acid / lead salt or the lead rosin acid salt is dissolved in an organic solvent and immersed in a heated solution. It is characterized in that the solder is deposited on the concave portion where the surfaces intersect.
ロジン酸錫・鉛塩溶液の加熱温度は170〜210℃程度でよ
い。これは6:4共晶半田の融点に近い温度でよいという
ことである。ロジン酸錫・鉛塩を溶かす有機溶媒として
は、上記の加熱温度で蒸発しない高沸点のものを使用す
ることが好ましく、具体的にはスクワレンなどが適当で
ある。The heating temperature of the tin rosinate / lead salt solution may be about 170 to 210 ° C. This means that the temperature close to the melting point of the 6: 4 eutectic solder is sufficient. As the organic solvent for dissolving the tin rosinate / lead salt, it is preferable to use one having a high boiling point that does not evaporate at the above heating temperature, and specifically, squalene or the like is suitable.
以下、本発明の実施例を図面を参照して詳細に説明す
る。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例を示す。図において、11はプ
リント回路基板、12はそのパッド部、13はパッド部12の
表面に設けた錫メッキ、14はソルダーレジスト、15は電
子部品、16はそのリード部である。また17は容器、18は
ロジン酸錫・鉛塩の溶液、19はその溶液18内でプリント
回路基板11を支持する治具、20は溶液18を加熱するマグ
ネチックホットプレート、21は溶液18を攪拌するスター
ラーである。FIG. 1 shows an embodiment of the present invention. In the figure, 11 is a printed circuit board, 12 is a pad portion thereof, 13 is a tin plating provided on the surface of the pad portion 12, 14 is a solder resist, 15 is an electronic component, and 16 is a lead portion thereof. Further, 17 is a container, 18 is a solution of tin rosin acid / lead salt, 19 is a jig for supporting the printed circuit board 11 in the solution 18, 20 is a magnetic hot plate for heating the solution 18, and 21 is the solution 18. It is a stirring stirrer.
この例では、図示のように錫メッキしたパッド部12上
に、同じく錫メッキしたリード部16の先端をほぼ垂直に
接触させた状態とした。In this example, as shown in the figure, the tip of the tin-plated lead portion 16 is in contact with the tin-plated pad portion 12 almost vertically.
溶液18は、ロジン酸（アビエチン酸が主成分）と錫・鉛
（6:4）の有機金属塩をスクワレンに溶かしたもので、
ロジン酸錫・鉛塩5gに対しスクワレン16gの割合であ
る。約200℃に加熱した溶液18の中に、上記のように接
触させたパッド部12とリード部16を約10分間浸漬して、
引き上げた。その結果、パッド部12とリード部16の接触
部には第２図に示すようにフィレット状に半田22が析出
し、両者の半田付けがなされていた。半田付け部のフィ
レット高さは約0.6mm、引張強さは平均で5.4kgであっ
た。これは通常の半田付けと同様の強さである。Solution 18 is a solution of rosin acid (mainly abietic acid) and an organometallic salt of tin and lead (6: 4) dissolved in squalene.
The ratio is 16 g of squalene to 5 g of tin rosinate / lead salt. In the solution 18 heated to about 200 ° C., the pad portion 12 and the lead portion 16 contacted as described above are immersed for about 10 minutes,
Raised. As a result, fillet-like solder 22 was deposited on the contact portion between the pad portion 12 and the lead portion 16 as shown in FIG. 2, and both were soldered. The fillet height of the soldered portion was about 0.6 mm, and the tensile strength was 5.4 kg on average. This is as strong as normal soldering.
パッド部12に錫メッキ13を施した面（平面）をそのまま
同じ溶液18に浸漬してもほとんど半田の析出はみられな
いのに対し、上記のようにリード部16の先端を突き当て
ておくと、パッド部12の表面とリード部の表面が交わる
凹角部分に集中的に半田22が析出するのである。Even if the surface (flat surface) on which the tin plating 13 is applied to the pad portion 12 is immersed in the same solution 18 as it is, almost no solder deposition is observed, but the tip of the lead portion 16 is abutted as described above. Then, the solder 22 is concentratedly deposited on the concave portion where the surface of the pad portion 12 and the surface of the lead portion intersect.
第３図は本発明の他の実施例を示す。第３図において第
１図と同一部分には同一符号を付してある。この実施例
では、電子部分15のリード部16の先端をＬ形に屈曲して
リード部16がパッド部12の錫メッキ13面に線接触するよ
うにしたものである。それ以外は第１図の実施例と同じ
である。FIG. 3 shows another embodiment of the present invention. In FIG. 3, the same parts as those in FIG. 1 are designated by the same reference numerals. In this embodiment, the tip of the lead portion 16 of the electronic portion 15 is bent in an L shape so that the lead portion 16 makes line contact with the surface of the tin plating 13 of the pad portion 12. Other than that is the same as the embodiment of FIG.
このような状態で溶液18内に浸漬すると、第４図に示す
ようにパッド部12の平坦な表面とリード部16の円弧状の
表面が交わる凹角部分に集中して半田22が析出し、半田
付けがなされる。When immersed in the solution 18 in such a state, as shown in FIG. 4, the solder 22 is concentrated in the concave portion where the flat surface of the pad portion 12 and the arcuate surface of the lead portion 16 intersect, and the solder 22 is deposited. It is attached.
以上説明したように本発明によれば、プリント回路基板
のパッド部と電子部分のリード部を比較的低い温度で半
田付けすることができ、電子部分の熱的損傷を防止でき
る利点がある。また本発明の方法では溶融半田浴へ浸漬
した場合のように半田が表面張力で盛り上がるほど大量
に析出することがないので、隣合うパッド部の間隔がか
なり狭くても半田によるブリッジが発生しないという利
点もある。As described above, according to the present invention, the pad portion of the printed circuit board and the lead portion of the electronic portion can be soldered at a relatively low temperature, and there is an advantage that thermal damage to the electronic portion can be prevented. Further, according to the method of the present invention, unlike the case where the solder is immersed in the molten solder bath, a large amount of solder is not deposited so as to rise due to surface tension, so that a bridge due to solder does not occur even if the interval between adjacent pad portions is considerably narrow. There are also advantages.
第１図は本発明の一実施例に係る半田付け方法を示す断
面図、第２図はそれによって得られた半田付け部の説明
図、第３図は本発明の他の実施例に係る半田付け方法を
示す断面図、第４図はそれによって得られた半田付け部
の説明図である。 11〜プリント回路基板、12〜パッド部、13〜錫メッキ、
14〜電子部品、16〜リード部、18〜ロジン酸錫・鉛塩の
溶液、22〜半田。FIG. 1 is a sectional view showing a soldering method according to an embodiment of the present invention, FIG. 2 is an explanatory view of a soldering portion obtained thereby, and FIG. 3 is a solder according to another embodiment of the present invention. FIG. 4 is a cross-sectional view showing a soldering method, and FIG. 4 is an explanatory view of a soldering portion obtained thereby. 11-printed circuit board, 12-pad, 13-tin plating,
14 ~ electronic parts, 16 ~ lead part, 18 ~ tin rosin acid / lead salt solution, 22 ~ solder.
Claims (1)
リード部を半田付けする方法において、上記パッド部お
よびリード部のうち少なくとも一方に錫メッキを施し、
上記パッド部にリード部を接触させた状態で、ロジン酸
錫・鉛塩またはロジン酸鉛塩を有機溶媒に溶かして加熱
した溶液中に浸漬することにより、上記パッド部の表面
とリード部の表面が交わる凹角部分に半田を析出させる
ことを特徴とする半田付け方法。1. A method for soldering a lead portion of an electronic component to a pad portion of a printed circuit board, wherein at least one of the pad portion and the lead portion is tin-plated,
With the lead portion in contact with the pad portion, the surface of the pad portion and the surface of the lead portion can be obtained by dissolving tin rosin acid / lead salt or lead rosin acid salt in an organic solvent and immersing it in a heated solution. A soldering method, characterized in that solder is deposited on a reentrant portion where the points intersect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5541187A JPH0666539B2 (en) | 1987-03-12 | 1987-03-12 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5541187A JPH0666539B2 (en) | 1987-03-12 | 1987-03-12 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63224291A JPS63224291A (en) | 1988-09-19 |
| JPH0666539B2 true JPH0666539B2 (en) | 1994-08-24 |
Family
ID=12997816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5541187A Expired - Lifetime JPH0666539B2 (en) | 1987-03-12 | 1987-03-12 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0666539B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2618398B2 (en) * | 1987-07-06 | 1997-06-11 | 古河電気工業株式会社 | Electroless solder plating method |
| JPS6417494A (en) * | 1987-07-13 | 1989-01-20 | Furukawa Electric Co Ltd | Surface mounting method of electronic component |
| JP3390245B2 (en) * | 1993-06-01 | 2003-03-24 | 富士通株式会社 | Cleaning liquid and cleaning method |
-
1987
- 1987-03-12 JP JP5541187A patent/JPH0666539B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63224291A (en) | 1988-09-19 |
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