JPH0821769B2 - Electronic component soldering method - Google Patents
Electronic component soldering methodInfo
- Publication number
- JPH0821769B2 JPH0821769B2 JP17299787A JP17299787A JPH0821769B2 JP H0821769 B2 JPH0821769 B2 JP H0821769B2 JP 17299787 A JP17299787 A JP 17299787A JP 17299787 A JP17299787 A JP 17299787A JP H0821769 B2 JPH0821769 B2 JP H0821769B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- lead
- solder
- electronic component
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔技術分野〕 本発明は、プリント回路基板のパッド部に電子部品の
リード部を半田付けする方法に係り、特にロジン酸鉛塩
またはロジン酸錫・鉛塩を用いた比較的定温での半田付
け方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method of soldering a lead portion of an electronic component to a pad portion of a printed circuit board, and particularly uses a rosin acid lead salt or a tin rosin acid lead salt. The present invention relates to a soldering method at a relatively constant temperature.
従来、プリント回路基板に電子部品を実装する場合に
は、プリント回路基板に電子部品を搭載したものを、溶
融半田浴に浸漬するか、あるいはプリント回路基板のパ
ッド部に予め半田を付着させておき、電子部品を搭載し
たのちリフロー炉に通して半田を溶融させることによ
り、半田付けを行っている。Conventionally, when mounting an electronic component on a printed circuit board, the electronic component mounted on the printed circuit board is immersed in a molten solder bath or solder is previously attached to the pad portion of the printed circuit board. After mounting the electronic components, the solder is melted by passing through a reflow furnace to perform soldering.
しかしこのような従来の方法では、錫−鉛の6:4共晶
半田（溶融183℃）の場合でも260℃前後に加熱する必要
があり、電子部品が熱により損傷を受ける危険性が大き
い。このため、さらに低い温度で半田付けする方法が望
まれている。However, in such a conventional method, even in the case of tin-lead 6: 4 eutectic solder (melting 183 ° C.), it is necessary to heat it to around 260 ° C., and there is a high risk that the electronic component will be damaged by heat. Therefore, a method of soldering at a lower temperature is desired.
本発明の目的は、上記のような従来技術の問題点に鑑
み、新しい電子部品半田付け方法を提供することにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a new electronic component soldering method in view of the above problems of the prior art.
従来、ロジン酸（松脂に含まれる有機酸で、アビエチ
ン酸などが主成分）と金属との有機金属塩を適当な有機
溶媒（スクワレン等）に溶かし、加熱した状態で、その
中に上記金属より卑な金属を浸漬すると、その卑な金属
の表面に有機金属塩中の貴な金属が析出することが知ら
れている。Conventionally, rosin acid (organic acid contained in pine resin, the main component of which is abietic acid) and an organic metal salt of a metal are dissolved in a suitable organic solvent (squalene, etc.) It is known that when a base metal is dipped, the noble metal in the organic metal salt is deposited on the surface of the base metal.
本発明者等は、この方法をさらに発展させ、ロジン酸
と錫・鉛との塩を作り、同様の処理を行ったところ、亜
鉛や錫の表面に半田（錫−鉛合金）が析出することを見
出した。そして半田を析出させるときのロジン酸錫・鉛
塩溶液の加熱温度は半田の融点付近の温度でよいことも
確認された。なお同じ処理でもニッケルやアルミニウム
には半田が析出しないことから、半田の析出は亜鉛と錫
に限って生じる特異な現象と見られる。The present inventors have further developed this method to form a salt of rosin acid and tin / lead and perform the same treatment, whereby solder (tin-lead alloy) is deposited on the surface of zinc or tin. Found. It was also confirmed that the heating temperature of the tin rosin acid / lead salt solution for depositing the solder may be around the melting point of the solder. Since solder does not deposit on nickel or aluminum even with the same treatment, it is considered that solder deposition is a unique phenomenon occurring only on zinc and tin.
ただ亜鉛と錫を比較すると、亜鉛面にはかなりの量の
半田が析出するが、錫面に析出する半田の量はわずかで
あった。一般にプリント回路基板のパッド部や電子部品
のリード部は銅または銅合金製で、その表面に錫メッキ
が施されているため、錫面に半田付けに十分な量の半田
が析出するか否かが問題である。これまでの検討による
と、錫上への半田の析出は錫の置換が主反応であること
が判ってきた。すなわち錫上に析出する半田は、錫面に
鉛が析出して、その鉛中に被析出面の錫メッキが拡散し
て得られるものである。したがって長時間の処理を行う
と、置換により錫がほとんど液中に溶出し、錫のみが析
出金属として残るようになるのである。However, comparing zinc with tin, a considerable amount of solder was deposited on the zinc surface, but the amount of solder deposited on the tin surface was small. Generally, the pads of printed circuit boards and the leads of electronic components are made of copper or copper alloy, and the surface of the pads is tin-plated. Is a problem. According to the studies so far, it has been found that the substitution of tin is the main reaction for the deposition of solder on tin. That is, the solder deposited on tin is obtained by depositing lead on the tin surface and diffusing the tin plating on the deposition target surface into the lead. Therefore, when the treatment is carried out for a long time, most of the tin is eluted in the liquid due to the substitution, and only tin remains as the deposited metal.
このようにロジン酸錫・鉛塩溶液（ロジン酸鉛塩溶液
でも同じ）を用いて、錫メッキ面に半田を析出させ、半
田付けを行おうとすると、析出する半田の量は被析出面
の錫メッキの量により規制され、半田付けに十分な量の
半田を析出させることが困難である。In this way, when tin rosinate / lead salt solution (the same applies to the lead rosinate salt solution) is used to deposit solder on the tin-plated surface and soldering is attempted, the amount of solder deposited is the tin on the surface to be deposited. It is limited by the amount of plating, and it is difficult to deposit a sufficient amount of solder for soldering.
本発明は、以上のような知見に基づいてなされたもの
で、プリント回路基板のパッド部に電子部品のリード部
を半田付けする方法において、上記パッド部およびリー
ド部のうち少なくとも一方に錫メッキを施し、上記パッ
ド部にリード部を接触させた状態で、その接触部を、ロ
ジン酸鉛塩またはロジン酸錫・鉛塩を溶剤に溶かして加
熱した溶液で、錫粉末を混入したものに浸漬することに
より、上記接触部に半田を析出させることを特徴とする
ものである。The present invention has been made based on the above findings, and in a method of soldering a lead portion of an electronic component to a pad portion of a printed circuit board, at least one of the pad portion and the lead portion is tin-plated. The lead portion is contacted with the pad portion, and the contact portion is dipped in a solution obtained by dissolving a lead rosin acid salt or a tin rosin acid / lead salt salt in a solvent and heating the mixture with tin powder. Thus, the solder is deposited on the contact portion.
これを第１図および第２図を参照してさらに詳述する
と、図において、11はプリント回路基板、12は絶縁基
板、13は銅箔よりなるパッド部、14は錫メッキ、15は銅
−錫合金層、16はソルダーレジストである。また17は電
子部品のリード部、18は185〜210℃程度に加熱されたロ
ジン酸鉛塩溶液、19は錫粉末である。This will be described in more detail with reference to FIGS. 1 and 2. In the figure, 11 is a printed circuit board, 12 is an insulating substrate, 13 is a pad portion made of copper foil, 14 is tin plating, and 15 is copper-. The tin alloy layer 16 is a solder resist. Further, 17 is a lead portion of an electronic component, 18 is a lead rosin acid salt solution heated to about 185-210 ° C., and 19 is tin powder.
このように錫メッキ14を施したパッド部13に電子部品
のリード部17を接触させ、それを、錫粉末19を混入した
ロジン酸鉛塩溶液18中に浸漬すると、まず錫メッキ14上
に鉛が析出し、その中に錫メッキ14の錫が拡散して半田
合金ができ、融点が下がって液化するため、融液の溜ま
りやすいパッド部13とリード部17の接触部にフィレット
状に半田20が析出する（第１図）。析出した半田20の表
面には溶液18中の錫粉末19が付着するから（溶液18を撹
拌するとよい）、その後ロジン酸鉛塩溶液18から析出す
る鉛と付着した錫粉末19とが接触して合金化が進行し、
フィレット状の半田20が成長していく（第２図）。この
ようにして錫メッキ14の錫量に規制されることなく半田
付けに十分な量の半田20を析出させることができる。As described above, the lead portion 17 of the electronic component is brought into contact with the pad portion 13 having the tin plating 14 applied thereto, and the lead portion 17 is immersed in the lead rosin acid salt solution 18 mixed with the tin powder 19. Is deposited, and tin of the tin plating 14 is diffused therein to form a solder alloy, which lowers the melting point and is liquefied, so that the fillet-like solder 20 is applied to the contact portion between the pad portion 13 and the lead portion 17 where the melt tends to accumulate. Are deposited (Fig. 1). Since the tin powder 19 in the solution 18 adheres to the surface of the deposited solder 20 (the solution 18 may be stirred), the lead deposited from the lead rosin acid salt solution 18 and the adhered tin powder 19 may contact each other. Alloying progresses,
Fillet-shaped solder 20 grows (Fig. 2). In this way, a sufficient amount of solder 20 for soldering can be deposited without being restricted by the amount of tin in the tin plating 14.
なお高温において錫粉末とロジン酸鉛塩との置換反応
が進行するのを適度に遅らせるためには、錫粉末を構成
する錫粒子の表面に融点150〜200℃のプラスチックをコ
ーティングしておくとよい。In order to moderately delay the progress of the substitution reaction between the tin powder and the lead rosin acid salt at high temperature, it is advisable to coat the surface of the tin particles constituting the tin powder with a plastic having a melting point of 150 to 200 ° C. .
以下、本発明の一実施例を第３図および第４図を参照
して詳細に説明する。An embodiment of the present invention will be described in detail below with reference to FIGS. 3 and 4.
まず第３図に示すようにプリント回路基板11上に電子
部品21を載置し、錫メッキしたパッド部13と錫メッキし
たリード部17を接触させる。なおプリント回路基板11の
部品搭載位置には予め接着剤22を塗着しておき、電子部
品21を接着固定するようにする。First, as shown in FIG. 3, the electronic component 21 is placed on the printed circuit board 11, and the tin-plated pad portion 13 and the tin-plated lead portion 17 are brought into contact with each other. An adhesive 22 is applied in advance to the component mounting position of the printed circuit board 11 so that the electronic component 21 is adhesively fixed.
次に第４図に示すようにプリント回路基板11と電子部
品21を治具23で上下から挟み付けて、これらを錫粉末19
を混入したロジン酸鉛塩溶液18中に浸漬する。治具23
は、プリント回路基板11の下に当てる受け治具24と、電
子部品21の上に当てる押さえ治具25と、これらを挟み付
けるロックレバー26等からなり、特に押さえ治具25には
個々の電子部品21をほぼ均等に押さえるためのシリコン
ゴム等で出来た弾性押し付け部材２が設けられている。
錫粉末19を混入したロジン酸鉛塩溶液18は、容器28に入
れられ、ホットプレート29上に設置されて180〜200℃の
温度に加熱され、かつスターラー30により撹拌されてい
る。なおロジン酸鉛塩溶液はロジン酸鉛塩約3gを溶剤で
あるスクワレン約16gに溶かしたものであるまた錫粉末
は析出させる半田の種類にもよるが、例えば６−４共晶
半田であれば、溶液中の鉛含有量とほぼ等量、すなわち
1.3〜1.4重量％になるように混入すればよい。Next, as shown in FIG. 4, the printed circuit board 11 and the electronic component 21 are sandwiched by the jig 23 from above and below, and the tin powder 19
It is immersed in a lead rosin acid salt solution 18 mixed with. Jig 23
Is composed of a receiving jig 24 that is placed under the printed circuit board 11, a holding jig 25 that is placed over the electronic component 21, and a lock lever 26 that sandwiches these members. An elastic pressing member 2 made of silicon rubber or the like is provided for pressing the parts 21 almost uniformly.
A lead rosin acid salt solution 18 mixed with tin powder 19 is placed in a container 28, placed on a hot plate 29, heated to a temperature of 180 to 200 ° C., and stirred by a stirrer 30. The lead rosin acid salt solution is obtained by dissolving about 3 g of lead rosin acid salt in about 16 g of squalene, which is a solvent. Tin powder depends on the kind of solder to be deposited. , About the same as the lead content in the solution, ie
It may be mixed so as to be 1.3 to 1.4% by weight.
このようにして約１〜３分浸漬すると、パッド部13と
リード部17の接触部に半田付けに十分な量の半田が析出
するから、その後全体を溶液18外に取り出し、半田を冷
却固化させれば、パッド部13とリード部17の半田付けが
行える。治具23はその後で取り外される。By soaking for about 1 to 3 minutes in this way, a sufficient amount of solder is deposited on the contact portion between the pad portion 13 and the lead portion 17, so that the whole is taken out of the solution 18 and the solder is cooled and solidified. Then, the pad portion 13 and the lead portion 17 can be soldered. The jig 23 is then removed.
第５図はプリント回路基板11の両面に電子部品を実装
する場合を示したもので、この場合は、プリント回路基
板11の両面に電子部品21を仮固定したのち、上下に、そ
れぞれ内面に弾性押し付け部材27A・27Bを有する押さえ
治具25A・25Bを当て、個々の電子部品21をプリント回路
基板11に押し付けた状態でロジン酸鉛塩溶液中への浸漬
を行う。FIG. 5 shows a case where electronic components are mounted on both sides of the printed circuit board 11. In this case, after the electronic components 21 are temporarily fixed on both sides of the printed circuit board 11, the upper and lower parts are elastically attached to the inner surfaces respectively. The holding jigs 25A and 25B having the pressing members 27A and 27B are applied, and the individual electronic components 21 are pressed against the printed circuit board 11 and immersed in the lead rosin acid salt solution.
以上説明したように本発明によれば、プリント回路基
板のパッド部に電子部品のリード部を比較的低い温度で
半田付けすることができ、電子部品の熱的損傷を防止で
きる。またロジン酸鉛塩またはロジン酸錫・鉛塩溶液に
錫粉末を混入して半田を析出させるようにしたので、半
田付け部に錫が供給され、半田付えに十分な量の半田を
析出させることが可能となり、半田付けを確実に行うこ
とができる。As described above, according to the present invention, the lead portion of the electronic component can be soldered to the pad portion of the printed circuit board at a relatively low temperature, and the thermal damage to the electronic component can be prevented. Further, since tin powder is mixed in the lead rosinate salt or tin rosinate / lead salt solution to deposit the solder, tin is supplied to the soldering portion to deposit a sufficient amount of solder for soldering. As a result, soldering can be reliably performed.
【図面の簡単な説明】 第１図および第２図は本発明の半田付け方法における半
田析出のメカニズムを示す説明図、第３図および第４図
は本発明の方法によりプリント回路基板の片面に電子部
品を実装する実施例を示す断面図、第５図は同じくプリ
ント回路基板の両面に電子部品を実装する実施例を示す
断面図である。 11……プリント回路基板、13……パッド部、14……錫メ
ッキ、17……リード部、18……ロジン酸鉛塩溶液、19…
…錫粉末、20……半田、21……電子部品。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 2 are explanatory views showing the mechanism of solder deposition in the soldering method of the present invention, and FIGS. 3 and 4 are on one side of a printed circuit board by the method of the present invention. FIG. 5 is a sectional view showing an embodiment for mounting electronic components, and FIG. 5 is a sectional view showing an embodiment for mounting electronic components on both surfaces of a printed circuit board. 11 ... Printed circuit board, 13 ... Pad, 14 ... Tin plating, 17 ... Lead, 18 ... Lead rosin acid salt solution, 19 ...
… Tin powder, 20… Solder, 21… Electronic parts.
フロントページの続き (72)発明者 中嶋 久雄 神奈川県平塚市東八幡５−１−９ 古河電 気工業株式会社平塚電線製造所内 (72)発明者 河野 政直 兵庫県加古川市新神野４丁目10番２号 (72)発明者 入江 久夫 兵庫県高砂市米田町神爪423番地 (72)発明者 井上 良 兵庫県姫路市別所町佐土845番地Front page continuation (72) Inventor Hisao Nakajima 5-1-9 Higashi-Hachiman, Hiratsuka-shi, Kanagawa Furukawa Electric Co., Ltd. Hiratsuka Cable Works (72) Inventor Masanao Kono 4-10-2 Shinjinno, Kakogawa-shi, Hyogo (72) Inventor Hisao Irie 423 Kamizume, Yoneda-cho, Takasago-shi, Hyogo Prefecture (72) Inoue Ryo 845 Sado, Bessho-cho, Himeji-shi, Hyogo Prefecture
Claims (1)
リード部を半田付けする方法において、上記パッド部お
よびリード部のうち少なくとも一方に錫メッキを施し、
上記パッド部にリード部を接触させた状態で、その接触
部を、ロジン酸鉛塩またはロジン酸錫・鉛塩を溶剤に溶
かして加熱した溶液で、錫粉末を混入したものに浸漬す
ることにより、上記接触部に半田を析出させることを特
徴とする電子部品の半田付け方法。1. A method for soldering a lead portion of an electronic component to a pad portion of a printed circuit board, wherein at least one of the pad portion and the lead portion is tin-plated,
While the lead portion is in contact with the pad portion, by immersing the contact portion in a solution in which a tin powder is mixed with a solution obtained by dissolving a lead rosin acid salt or a tin rosin acid lead salt in a solvent. A soldering method for an electronic component, wherein solder is deposited on the contact portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17299787A JPH0821769B2 (en) | 1987-07-13 | 1987-07-13 | Electronic component soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17299787A JPH0821769B2 (en) | 1987-07-13 | 1987-07-13 | Electronic component soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6417496A JPS6417496A (en) | 1989-01-20 |
| JPH0821769B2 true JPH0821769B2 (en) | 1996-03-04 |
Family
ID=15952270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17299787A Expired - Lifetime JPH0821769B2 (en) | 1987-07-13 | 1987-07-13 | Electronic component soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0821769B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3390245B2 (en) * | 1993-06-01 | 2003-03-24 | 富士通株式会社 | Cleaning liquid and cleaning method |
-
1987
- 1987-07-13 JP JP17299787A patent/JPH0821769B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6417496A (en) | 1989-01-20 |
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