JPH0666046B2 - Resistive pressure sensitive tablet - Google Patents

Description

TECHNICAL FIELD The present invention relates to a resistance pressure-sensitive tablet.

"Prior Art" Generally, a tablet has an X-axis resistance plate (2) having electrodes (1) and (1) at both ends in the X-axis direction and both ends in the Y-axis direction, as shown in Figs. The Y-axis resistance plate (4) having the electrodes (3) and (3) face each other, and the dot spacers (5) of small insulating projections are provided on one resistance plate (4) at predetermined intervals. Then, they are arranged with a slight gap.

Then, in order to obtain the position information of the X-axis resistance plate (2), first, the changeover switch (6) is switched to the X contact (X ₁ ) (X ₂ ) (X ₃ ) side, and the pen (7) is used to set a predetermined point. By pressing (P), both resistance plates (2) and (4) are short-circuited. Voltage divided at that point (P) Is measured from the y ₂ side of the Y axis resistance plate (4) through the contact (X ₃ ) as X axis position information by the voltmeter (V) and output.

Next, when the changeover switch (6) was switched to the Y contacts (Y ₁ ) (Y ₂ ) (Y ₃ ) side while the point (P) was being pressed by the pen (7), the Y axis pressure was also divided. Voltage Is measured from the x ₂ side of the X axis resistance plate (2) through the contact (Y ₃ ) as Y axis position information by the voltmeter (V) and output.

Since the voltmeter (V) has a high resistance, the resistance values of x ₂ and y ₂ have almost no effect on the measured values.

The tablet as described above has been conventionally manufactured by the method shown in FIG.

(A) A resistive layer (9) having a constant thickness is formed on a substrate (8) such as a poyester sheet by vapor deposition.

(B) A resistance layer (9) having a predetermined shape by mask etching
Just leave.

(C) The electrodes (10) (10) and the wiring (11) on both ends of the resistance layer (9) are formed by printing.

(D) Insulating printing of dot spacers (12) is performed on the resistance layer (9) between the electrodes (10) and (10), and the resistance layer (9) and the wiring (11) are externally connected (17). Insulation printing of overcoat (13) is applied to the part except.

(E) Cut into a predetermined shape.

Assuming that the Y-axis resistance plate (14) is formed as described above, the X-axis resistance plate (15) is (a) (b).
The steps are (c ') (d') (e '). Here, the X-axis resistance plate (15) is different from the Y-axis resistance plate (14) in that
The position of the axis electrode (16) (16) is the Y axis electrode (10) (10)
Are orthogonal to each other, the positions of the wiring (11) and the external connection portion (17) are different, and the dot spacers (12) are not provided, and the others are the same as described above.

(F) A tablet is formed by superposing the X-axis resistance plate (14) and the Y-axis resistance plate (15) so as to face each other.

The most problematic part of the above process is the (b) mask etching process. This step (b) is a work in which the mask is removed only after the unnecessary portion of the resistance layer is removed by masking only the necessary portion and immersing it in an etching solution.
Since only the step (b) occupies about half of the total steps, there is a problem that workability is extremely poor. Further, since the resistance layer is masked in the mask etching process, the resistance layer is affected when the mask is peeled off, the resistance value becomes non-uniform, and correct position information cannot be obtained.

Therefore, a tablet manufacturing method that can obtain accurate information by a simple method instead of mask etching can be considered. Instead of the mask etching step (b) in FIG. 4, in the step (b) in FIG. 2, other portions of the resistance layer (9) are exposed to about 30 μm so that only the necessary portions are exposed. Insulation printing of the undercoat (18) is performed according to the thickness, and in the step (c ') of FIG. 2, both side edges of the exposed resistance layer (9) at the boundary with the undercoat (18). These resistive layer (9) and undercoat (1
This is a method in which the electrodes (10) (10) of silver paste are formed by printing so as to straddle 8) and the wiring (11) for leading to the outside is formed by printing.
The other steps are substantially the same as in FIG. 4 and FIG.

"Problem to be Solved by the Invention" The step (b) of FIG. 2 is characterized in that it has better workability than the step (b) of FIG. However, it turned out that some problems remained. That is, the insulation printing of the undercoat (18) requires a thickness of at least about 30 μm as shown in FIG. 3 in order to have good insulation. However, when the undercoat (18) becomes thicker, the electrode (1) in the step (c) or (c ') is increased.
When printing 0) or (16), the electrode (10) or (16) is not sufficiently formed at the rising edge portion at the boundary between the resistance layer (9) and the undercoat (18), and the undercoat (18) If the thickness of) becomes thick, a problem occurs that pinholes are generated inside and insulation resistance deteriorates.

It is an object of the present invention to obtain a tablet that simultaneously solves the problem of electrode formation at the edge part and the problem of insulation due to pinholes.

"Means for Solving the Problems" The present invention relates to an X-axis resistor plate having X-axis electrodes formed on both ends of a resistance layer on an insulating substrate, and a Y-axis electrode having Y-axis electrodes formed on both ends of a resistance layer on an insulating substrate. In a tablet obtained by polymerizing an axial resistance plate with a slight insulating gap, a non-detection portion which is not used for detecting the surface of the resistance layers of the X-axis resistance plate and the Y-axis resistance plate is covered with a large number of insulating layers. The plurality of insulating layers are formed stepwise at the edge of the boundary with the resistance layer, and the X-axis electrode is formed by exposing the resistance layer of the X-axis resistance plate and the plurality of insulation layers. The Y-axis electrode is formed so as to straddle both edges of the boundary with the stepped portion, and the Y-axis electrode straddles both edges of the boundary between the exposed portion of the resistance layer of the Y-axis resistor plate and the stepped portions of the multiple insulating layers. It is characterized by being formed by.

"Function" A resistance layer is formed with a constant thickness on an insulating substrate, and the non-detection part of this resistance layer that is not used for detection is covered with multiple layers of undercoating insulation layer that is thin enough to prevent pinholes. Then, the X-axis and the Y-axis are formed. Both edges of the boundary between the insulating layer and the exposed resistance layer have stepwise portions of multiple insulating layers, and the X-axis electrode and the Y-axis electrode are provided so as to straddle the end portions of the resistance layer of the stepwise portion. Wiring is formed on the insulating layer to lead it to the outside. Either one of them, for example, the exposed resistance layer for the Y-axis is subjected to the insulation printing of the dot spacers, and the other is subjected to the insulation printing of the overcoat. The unnecessary portion is cut to form a Y-axis resistance plate.

Regarding the X-axis resistance plate, the X-axis electrode is formed at a position orthogonal to the Y-axis electrode, and the exposed resistance layer on the X-axis side is not subjected to insulating printing of dot spacers. Other than that, it is substantially the same as the Y-axis resistance plate. The X-axis resistance plate and the Y-axis resistance plate thus formed face each other and are polymerized to form a tablet.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.

The Y-axis resistance plate (14) has the following steps (a) (b) (c)
(D) Made by (e). Here, the steps (a) and (d)
The process (e) is the process itself of FIG. 2, and the present invention is characterized by the processes (b) and (c).

Step (a): Insulating substrate such as polyester sheet (8)
A resistive layer (9) having a uniform thickness of about 10 μm is formed on the upper surface by vapor deposition or the like.

Step (b): Insulating the undercoat (18) with a thickness of about 30 μm in the resistive layer (9) so as to expose only the substantially central portion used for position detection. Print. Assuming that the undercoat (18) requires a thickness of about 30 μm to obtain the desired insulation characteristics, this process requires many thin layers of about 10 μm so that pinholes cannot be formed as shown in FIG. Apply layers (3-4 times). At this time, the resistance layer (9) is attached to the undercoater (18).
Laminate by gradually narrowing according to the upper layer so that a stepped portion (20) is formed at the boundary position between and.

Step (c): A step portion (20) of the undercoat (18) and an exposed resistance layer (9) are covered with a boundary portion between both side edges of the resistance layer (9) and the undercoat (18). Thus, the electrodes (10) (10) of the silver paste are formed by printing in a stepwise manner, and the wiring (11) for leading out to the outside is formed by printing.

Step (d): Fresh dot spacers (12) are formed at predetermined intervals on the exposed portion used for position detection of the resistance layer (9) by insulating printing. An overcoat (19) is formed on the surface where the electrodes (10) (10) and the wiring (11) are formed except for the portion used for this position detection and the external connection portion (17) of the wiring (11). Are formed by insulation printing.

Step (e): The external connection portion (17) is cut into a predetermined shape so that the external connection portion (17) slightly protrudes and remains, and unnecessary portions on the outer periphery are removed to form a Y-axis resistance plate (14).

Next, the X-axis resistance plate (15) is processed in the following steps (a) and (b).
(C ') (d') (e ').

Steps (e) and (b) are the same as above.

Step (c ′): The positions of the X-axis electrodes (16) and (16) are orthogonal to the Y-axis electrodes (10) and (10) and do not overlap the external connection portion (17) and the Y-axis side wiring (11). Print so that

Step (d '): The exposed surface used for detecting the position of the resistance layer (9) and the surface of the wiring (11) excluding the external connection part (17) are covered with an insulating coat of an overcoat (19). .
Dot spacers (12) are not printed on the exposed surface of the resistance layer (9).

Step (e '): The whole external part (17) is cut into a predetermined shape so that the external connecting part (17) protrudes slightly upward and remains, and unnecessary portions on the outer periphery are removed to form an X-axis resistance plate (15).

Step (f): On the Y-axis resistance plate (14) obtained by the step (e),
The X-axis resistance plate (15) obtained in the step (e ') is polymerized to form a tablet.

"Effects of the Invention" The resistance pressure-sensitive tablet according to the present invention, as described above,
The non-detection part that is not used for detection of the surface of the resistance layer is covered with a large number of insulating layers, and the edges of the large number of insulation layers with the resistance layer are formed in a stepwise manner, and the exposed parts of the resistance layer and the large number of layers are formed. The electrodes are formed so as to straddle both edges of the boundary between the insulating layer and the stepped portion. Therefore, it is possible to produce a desired tablet in a printing process with good workability by eliminating the etching process with poor workability, prevent deterioration of insulating properties such as pinholes in the insulating layer, and prevent defective rising parts of the electrodes. You can eliminate parts.

[Brief description of drawings]

FIG. 1 is an enlarged sectional view of a tablet according to the present invention, FIG. 2 is an explanatory diagram of a tablet manufacturing process, FIG. 3 is an enlarged sectional view of a tablet, and FIG. 4 is an explanatory diagram of a conventional tablet manufacturing process. FIG. 5 is an operation explanatory view of the tablet, and FIG. 6 is a sectional view of the tablet. (8) ... Substrate, (9) ... Resistive layer, (10) ... Electrode,
(11) …… wiring, (12) …… dot spacers, (14)…
… Y-axis resistance plate, (15) …… X-axis resistance plate, (16) …… X-axis electrode, (17) …… External connection, (18) …… Undercoat, (19) …… Overcoat.

Claims (1)

[Claims] 1. A slight insulation between an X-axis resistance plate having X-axis electrodes formed on both ends of a resistance layer on an insulating substrate and a Y-axis resistance plate having Y-axis electrodes formed on both ends of a resistance layer on an insulating substrate. A tablet formed by polymerizing with voids, wherein the X-axis resistance plate and Y
A non-detection portion that is not used for detecting the surface of the resistance layer of the axial resistance plate is covered with a large number of insulating layers, and the plurality of insulating layers are formed stepwise at the edge of the boundary with the resistance layer. The X-axis electrode is formed over both edges of the boundary between the exposed portion of the resistance layer of the X-axis resistance plate and the stepped portions of the multiple insulating layers, and the Y-axis electrode is formed of the Y-axis resistance. A tablet formed by straddling both edges of a boundary between an exposed portion of a resistance layer of a plate and a stepped portion of a plurality of insulating layers.