JPH0660171U - Flux applicator - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a flux coating apparatus which has good workability and does not require cleaning work of the flux coating apparatus. [Structure] A solder surface 3a and a finger 4 of a printed circuit board 3 are provided in the vicinity of an end of a flux tank 2 of a flux coating apparatus 1.
An air nozzle 6 for removing the flux 5 attached to is provided, and the position of the air nozzle 6 is changed with the change of the position of the finger 4.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a flux applying device used in a flux applying process before a soldering process of a printed circuit board.

[0002]

[Prior art]

 For mass-produced printed circuit boards, electronic components with lead wires are mounted on the circuit board, and automation is used to immerse only the solder side of the printed circuit board in a solder bath for soldering work. Even after soldering immediately after mounting the electronic components, the soldering surface of the printed circuit board and the leads of the electronic components are not warmed up to the temperature suitable for soldering, so there is a drawback that soldering is difficult Before soldering work, flux was applied to the solder surface to make it easier for heat to be applied to the solder surface of the printed circuit board and the leads of electronic components, and then the soldering work was performed. Therefore, when applying flux to a generally mass-produced printed circuit board, a flux applying device is used.

The flux coating device sets the position of the finger to the width of the printed circuit board on which electronic components are mounted, and clamps both ends of the printed circuit board with fingers. The printed circuit board clamped by the fingers is transported to the flux tank by a conveyor equipped with fingers. The foamed flux injected into the flux tank becomes foam when pressure is applied, and the flux adheres to the solder surface of the printed circuit board conveyed by the conveyor.

[0004]

[Problems to be solved by the device]

 However, when the flux coating device as in the above-mentioned conventional example is used for a printed circuit board having a narrow width, the flux in the flux tank adheres to the bottom surface of the finger provided on the conveyor and sometimes to the pinching portion. Since the flux is sticky and the amount of flux applied cannot be adjusted, excess flux will adhere to the fingers, and the flux that adheres to the fingers must be cleaned during the next use. However, there is a drawback that this work is troublesome.

Therefore, the present invention is to provide a flux coating apparatus which has good workability and does not require cleaning work of the flux coating apparatus.

[0006]

[Means for Solving the Problems]

 In order to solve the above problems, the flux coating apparatus of the present invention is provided with an air nozzle for removing the flux adhering to the solder surface of the printed circuit board and the fingers near the end of the flux tank of the flux coating apparatus, and changing the position of the fingers. Due to this, the position of the air nozzle will be changed.

[0007]

[Action]

 An electronic component equipped with a lead wire was mounted on the printed circuit board, and both ends of the printed circuit board were clamped by the fingers of the flux coating device, and it was provided near the end of the flux coating device when the printed circuit board was transported by a conveyor. Air is ejected from the air nozzle, and the flux attached to the solder surface and fingers of the printed circuit board is blown away and removed.

[0008]

【Example】

 An embodiment of the flux coating device according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a top view of a flux coating apparatus according to the present invention, and FIG. 2 is a sectional view taken along the line AA in FIG. 1, showing a solder surface 3 a of a printed circuit board 3 near the end of a flux tank 2 of the flux coating apparatus 1. Also, an air nozzle 6 for removing the flux 5 attached to the fingers 4 is provided, and the position of the air nozzle 6 is changed with the change of the position of the fingers 4.

An electronic component 7 having a lead wire is mounted on the printed circuit board 3, both ends 3b, 3b of the printed circuit board 3 are clamped by fingers 4, and the printed circuit board 3 is mounted on a conveyor 8 equipped with the fingers 4. At the time of transportation, air is jetted from the air nozzle 6, and the flux 5 attached to the solder surface 3a of the printed board 3 and the fingers 4 is blown away and removed.

FIG. 3 is an explanatory view of a modified embodiment of the flux coating apparatus according to the present invention, in which the variable ranges of the fingers 4 and 4 at the left and right ends and the print substrate 3 of FIG. An air nozzle 9 whose ejection port is movable is provided on the solder surface 3a.

[0012]

[Effect of device]

 As described above, the flux coating apparatus of the present invention is provided with an air nozzle for removing the flux adhering to the solder surface and fingers of the printed circuit board near the end of the flux tank of the flux coating apparatus. Since it is variable, flux can be removed efficiently even if excess flux adheres, so workability is easy and the number of cleaning operations of the flux applicator can be reduced. It has an excellent effect.

[Brief description of drawings]

FIG. 1 is a top view of a flux applicator according to the present invention.

FIG. 2 is a sectional view taken along line AA in FIG.

FIG. 3 is an explanatory view of a modified embodiment of the flux coating device according to the present invention.

[Explanation of symbols]

1 ... Flux coating device, 2 ... Flux tank,
3 ... Printed circuit board, 3a ... Solder surface, 3b ...
Both ends, 4 ... Fingers, 5 ... Flux,
6, 9 ... Air nozzle, 7 ... Electronic component, 8 ...
Conveyor.

Claims (1)

[Scope of utility model registration request] 1. A conveyor provided with fingers for clamping a printed circuit board and changing the clamping position depending on the lateral width of the printed circuit board, and a flux tank for injecting foaming flux. In the flux applying device before the step of soldering the printed circuit board, an air nozzle for removing flux attached to the solder surface of the printed circuit board and the fingers is provided near the end of the flux tank of the flux applying device, and the position of the finger is provided. The flux applying device is characterized in that the position of the air nozzle is changed in accordance with the change.