JP2009212107A - Method and device for removing residual dross - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and device for removing a residual dross capable of satisfactorily removing a flux residual dross in a short period of time. <P>SOLUTION: A heating part 13 for spurting a gas to the flux residual dross 20 so as to be able to heat the surface of the flux residual dross 20 is arranged. The flux residual dross 20 is melted by heating the flux residual dross 20 with the use of the heating part 13 so that the temperature of the surface of it exceeds 250°C, and the melted flux residual dross 20 is flowed by the gas. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a flux residue removal method and a flux residue removal device, and more particularly to a flux residue removal method and a flux residue removal device that removes a flux residue generated when soldering using a flux.

  Generally, in the soldering process, a flux is used to remove an oxide film on the surface of the substrate to be soldered. When heating is performed to melt the solder, a solid component (for example, rosin) in the flux is vaporized. When the temperature of the atmosphere is lowered, the vaporized flux is solidified and becomes a white flux residue, which adheres to, for example, a pedestal or a substrate to be soldered. This adhered flux residue has adhesiveness. For this reason, when a flux residue adheres to at least one of the pedestal and the substrate that are in contact with the substrate, the flux residue adheres the substrate and the pedestal.

  When the flux residue adheres to at least one of the substrate and the pedestal, the following three problems arise. First, when the board is fragile, there is a problem that the board is damaged when the board is transferred after soldering. Secondly, there is a problem in that the appearance of the substrate is deteriorated by transferring the flux residue from the pedestal to the substrate as a foreign substance. The third problem is that it is necessary to periodically remove the flux residue adhering to the pedestal manually, which causes a reduction in substrate productivity.

  For example, Japanese Patent Application Laid-Open No. 6-326444 (Patent Document 1) discloses a technique for suppressing a decrease in appearance defect due to adhesion of a flux residue to a substrate. This Patent Document 1 discloses a method of using a hot air blower to heat and melt a white turbid residue remaining on a printed circuit board to remove the white turbid state from the white turbid residue.

A technique for removing the flux residue adhering to the pedestal is disclosed in, for example, Japanese Patent Application Laid-Open No. 10-173333 (Patent Document 2). In this Patent Document 2, an electric heater is installed in a cooling zone or an inlet / outlet where the temperature of the reflow furnace is low, and after adhering to the electric heater, the attached flux is heated to 150 to 250 ° C. and melted to lower the temperature. A method for receiving the flux in the reservoir is disclosed.
JP-A-6-326444 Japanese Patent Laid-Open No. 10-173333

  However, the reason why the cloudy residue is heated and melted in Patent Document 1 is intended to smooth the surface of the flux residue and destroy the encapsulated bubbles. For this reason, there was a problem that the flux residue itself could not be sufficiently removed from the printed circuit board.

  In Patent Document 2, the flux heated and melted by the electric heater moves to the flux reservoir by its own weight. For this reason, there has been a problem that the flux residue cannot be sufficiently removed from the upper surface (surface on which the substrate is placed) of the pedestal installed horizontally.

  Moreover, the flux residue obtained by remelting the attached flux generally has a high viscosity of 1000 cP or more. For this reason, the method of dripping molten flux residue downward using its own weight has a problem that it takes a long time to remove the flux residue.

  The present invention has been made to solve the above problems, and provides a flux residue removal method and a flux residue removal device that can sufficiently remove flux residues in a short time.

  The flux residue removing method of the present invention is a method for removing flux residue generated when soldering is performed using a flux, and includes the following steps. First, a heating unit is arranged so that the surface of the flux residue can be heated and gas is ejected toward the flux residue. And using a heating part, the flux residue is melted by heating so that the surface of the flux residue exceeds 250 ° C., and the flux residue melted by gas flows.

  The flux residue removal apparatus of the present invention is an apparatus for removing flux residue generated when soldering a substrate using a flux, and includes a pedestal and a heating unit. The pedestal has a mounting surface for mounting a substrate to be soldered. The heating unit heats the surface of the flux residue adhering to at least one of the mounting surface of the pedestal and the substrate so that the temperature exceeds 250 ° C., and flows the molten flux residue toward the bottom of the pedestal. A gas is blown out.

  According to the flux residue removing method and the flux residue removing apparatus of the present invention, the surface of the flux residue is heated to a temperature exceeding 250 ° C. When the flux residue exceeds 250 ° C., decomposition into hydrocarbons and carbon dioxide begins. In the flux residue, carbon that has not been decomposed into hydrocarbons and carbon dioxide becomes a fixing component. If the flux residue is before producing this fixing component, the flux residue viscosity can be lowered by heating the surface of the flux residue to a temperature exceeding 250 ° C. The lower the viscosity of the flux residue, the easier it is for the flux residue to flow. For this reason, by blowing the gas to the flux residue in a state where the viscosity is lowered, the melted flux residue can be moved to a predetermined position such as below the pedestal before the flux residue generates a fixing component. . Therefore, the flux residue can be sufficiently removed in a short time.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a side view schematically showing a flux residue removing apparatus according to an embodiment of the present invention. Initially, with reference to FIG. 1, the flux residue removal apparatus in this Embodiment is demonstrated. As shown in FIG. 1, a flux residue removing apparatus 10a in the present embodiment is an apparatus for removing flux residues generated when soldering a substrate using a flux.

  The flux residue removing apparatus 10 a includes a pedestal 11 and a heating unit 13. The heating unit 13 is disposed above the pedestal 11 so that gas can be ejected toward the placement surface 11 a of the pedestal 11.

  The pedestal 11 has a mounting surface 11a for mounting a substrate to be soldered. The mounting surface 11a is configured to hold the substrate when performing soldering, or to hold the substrate when transporting the substrate before and after performing soldering.

  The heating unit 13 disposed above the pedestal 11 is heated and melted so that the temperature of the surface of the flux residue 20 attached on at least one of the mounting surface 11a of the pedestal 11 and the substrate exceeds 250 ° C. It is comprised so that a gas may be ejected so that a flux residue may flow toward the downward direction of the base 11. FIG. That is, the heating unit 13 has a function of heating the flux residue 20 and a function of causing the flux residue 20 to flow with the pressure of the gas to be ejected or the air volume.

  The heating unit 13 of the present embodiment is composed of a single member that has both a function of heating the flux residue 20 and a function of flowing the flux residue with gas pressure. For example, an air heater can be used as the heating unit 13. The gas ejected from the heating unit 13 toward the mounting surface 11a of the base 11 is not limited to air, and may be an inert gas such as nitrogen, for example.

  The heating unit 13 has an ejection port 13a for ejecting gas. The ejection port 13a is configured to eject gas toward at least one of the mounting surface 11a of the base 11 and the substrate. A gas having a temperature capable of being heated so that the surface 20a of the flux residue 20 exceeds 250 ° C. is ejected from the ejection port 13a. The temperature of the gas is determined according to the shape of the ejection port 13a, the distance between the ejection port 13a and the surface of the flux residue 20, and the like. The temperature of such a gas is, for example, more than 250 ° C. and 700 ° C. or less.

  The heating unit 13 is configured to be able to eject a gas having an air volume and a wind pressure that allows the flux residue to flow in a shorter time than the mounting surface 11a of the base 11 (in the present embodiment, the side surface of the base 11). It is preferable that An example of the configuration of the heating unit 13 is a configuration in which a gas having an air volume of about 15 L / min can be ejected at a wind pressure of about 0.3 MPa, for example.

  It is preferable that the flux residue removing apparatus 10a further includes a measurement unit (not shown) for measuring the temperature of the surface of the flux residue 20. A thermocouple, an infrared thermography, etc. can be used for a measurement part, and an infrared thermography is used suitably. Infrared thermography can be measured without contact with the flux residue. For this reason, the temperature of the surface of the flux residue 20 can be measured accurately.

  In addition, although the heating part 13 of this Embodiment is comprised by the one member which has the function to heat the flux residue 20 and the function to flow a flux residue with the pressure of gas, especially this It is not limited to. Thus, when the heating part 13 is comprised with one member, the structure of the flux residue removal apparatus 10a can be simplified and the space required for installation can be reduced. For example, the heating unit 13 may include a member having a function of heating the flux residue and a member having a function of causing the melted flux residue to flow with a gas pressure as separate members.

  FIG. 2 is a diagram for explaining a flux residue removing method in the present embodiment. Next, the flux residue removal method in the present embodiment will be described with reference to FIG. The flux residue removal method in the present embodiment is a method of removing flux residue generated when soldering is performed using a flux. In the present embodiment, the flux residue 20 attached to the mounting surface 11a of the pedestal 11 is removed.

  First, the heating unit 13 is arranged so that the surface of the flux residue 20 can be heated and gas is ejected toward the flux residue 20 (step S1). In the present embodiment, for example, a flux residue removing apparatus 10a shown in FIG. 1 is used.

  Next, the flux residue 20 is melted by heating so that the surface of the flux residue 20 exceeds 250 ° C. by using the heating unit 13, and the flux residue 20 melted by the gas is caused to flow (step S2). In this step S2, the flux residue 20 is moved downward from the same plane as the mounting surface 11a of the base 11.

  Specifically, in the heating unit 13, the gas ejected from the heating unit 13 is adjusted so that the surface 20 a of the flux residue 20 has a temperature exceeding 250 ° C. and the flux residue 20 flows. Next, the spout 13a of the heating unit 13 is brought close to the substrate mounting surface 11a of the base 11 to which the flux residue 20 is attached.

  Thereafter, gas is ejected from the ejection port 13a toward the surface 20a of the flux residue 20 with the ejection port 13a of the heating unit 13 directed toward the surface 20a of the flux residue 20. This gas is at a temperature at which the temperature of the surface 20a of the flux residue 20 can be heated so as to exceed 250 ° C., and has an air pressure or an air volume that causes the flux residue 20 to flow. For this reason, the flux residue 20 is melted by being heated. Since the viscosity of the flux residue 20 melted at a temperature exceeding 250 ° C. is low, the flux residue 20 is easy to flow. Since the gas is ejected toward the lower part of the pedestal 11 in the flux residue 20 in a state of being easy to flow, the flux residue 20 easily moves downward. As described above, the flux residue 20 attached to the mounting surface 11a of the pedestal 11 can be removed from the mounting surface 11a.

  The surface 20a of the flux residue 20 is an exposed surface that does not contact the mounting surface 11a of the pedestal 11 and the substrate. The temperature of the surface 20a of the flux residue 20 is a temperature measured by, for example, infrared thermography.

  In this step S2, a gas having a temperature that can be heated so that the flux residue 20 exceeds 250 ° C. is ejected. The gas temperature is, for example, more than 250 ° C. and 700 ° C. or less.

  Moreover, it is preferable to eject a gas having an air volume and a wind pressure that allows the flux residue to flow toward the side surface of the base 11 in a short time. For example, a gas having an air volume of about 15 L / min is blown toward the surface 20 a of the flux residue 20 at a wind pressure of about 0.3 MPa.

  As described above, the flux residue removal method according to the present embodiment is a method for removing flux residue generated when soldering using a flux, and includes the following steps. First, the heating unit 13 is arranged so that the surface 20a of the flux residue 20 can be heated and the gas is ejected toward the flux residue 20 (step S1). And the flux residue 20 is melt | dissolved by heating so that the surface 20a of the flux residue 20 may exceed 250 degreeC using the heating part 13, and the flux residue 20 fuse | melted with gas is made to flow (step S2).

  Moreover, the flux residue removal apparatus 10a in this Embodiment is an apparatus for removing the flux residue 20 generated when soldering to a board | substrate using a flux, Comprising: The base 11 and the heating part 13 are made. I have. The pedestal 11 has a mounting surface 11a for mounting a substrate to be soldered. The heating unit 13 heats the surface 20a of the flux residue 20 attached on at least one of the mounting surface 11a of the pedestal 11 and the substrate so that the temperature exceeds 250 ° C., and the molten flux residue 20 is below the pedestal 11. A gas is generated to flow toward

In general, the flux is obtained by dissolving a solid component such as an activator in one of rosin and synthetic resin in an alcohol-based organic solvent that is a main solvent. By heating at the time of soldering, the alcoholic organic solvent volatilizes and the solid component is vaporized, and then touches a peripheral member having a low temperature to solidify and adhere as a flux residue. The solid component adhering as the flux residue is in a state of being flowable by heating to 150 to 250 ° C. or less (see, for example, paragraph 0016 of Patent Document 2 above). For example, rosin contained in rosin flux generally softens around 80 ° C. and dissolves above 100 ° C. When rosin is heated to 250 ° C. or higher, it is decomposed into hydrocarbons (CH _x : x is an arbitrary positive number) and carbon dioxide (CO ₂ ), but carbon that has not been decomposed into hydrocarbons and oxygen dioxide is decomposed. Start to carbonize. And this carbon adheres and stops flowing at the end. For this reason, conventionally, the flux residue could not be heated at a temperature exceeding 250 ° C.

  However, according to the flux residue removal method and the flux residue removal apparatus 10a in the present embodiment, unlike the conventional flux residue heating temperature (150 to 250 ° C.), the surface of the flux residue 20 is heated to a temperature exceeding 250 ° C. is doing. As described above, when the temperature of the flux residue 20 exceeds 250 ° C., the flux residue 20 starts to decompose, and the carbon that has not been decomposed into hydrocarbons and carbon dioxide becomes a fixing component. If the flux residue 20 is before producing this fixing component, the surface of the flux residue 20 is heated to a temperature exceeding 250 ° C., whereby the viscosity of the flux residue 20 can be lowered. The lower the viscosity of the flux residue 20, the easier it is for the flux residue 20 to flow. For this reason, before the flux residue 20 produces | generates an adhering component by blowing out gas to the flux residue 20 of the state where the viscosity fell, the molten flux residue 20 is below the base 11 (in this embodiment, a side surface). You can move at once. In other words, the flux residue 20 is removed by causing the flux residue 20 to flow when the flux residue 20 is easy to flow before the flux residue 20 is fixed. Therefore, the flux residue 20 can be sufficiently removed from the mounting surface 11a of the substrate and the base 11 in a short time.

  Even if the surface 20a of the flux residue 20 is brought into contact with the surface 20a of the flux residue 20 and solidification of the surface 20a of the flux residue 20 starts, the interface between the mounting surface 11a of the base 11 and the flux residue 20 is assumed. The existing flux residue 20 is softened or melted. For this reason, the flux residue 20 at this interface is in a molten state sufficient to flow. Therefore, the flux residue 20 moves below the pedestal 11 by spraying the flux residue 20 with a gas having a predetermined wind pressure or air volume. When only the surface 20a of the flux residue 20 starts to be carbonized, the flux residue 20 can be moved below the pedestal 11 in a certain size. For this reason, it is possible to prevent the flux residue 20 from scattering in a wide range.

  Thus, by removing the flux residue 20 from the mounting surface 11 a of the pedestal 11, when the substrate is placed on the pedestal 11, adhesion between the substrate and the pedestal 11 can be suppressed. For this reason, damage to the substrate can be suppressed. Moreover, it can suppress that the flux residue 20 is transcribe | transferred to a board | substrate from the base 11. FIG. Furthermore, the flux residue 20 can be reliably removed in a short time compared to the removal of the flux residue that has been performed manually. For this reason, since the time required for removing the flux residue 20 can be reduced and the board can be soldered, the productivity of the board can be improved. Furthermore, since the flux residue 20 can be prevented from adhering to the substrate, the appearance of the substrate can be maintained well.

(Embodiment 2)
The flux residue removal apparatus in the present embodiment is the same as the flux residue removal apparatus 10a of the first embodiment shown in FIG. 1 described above.

  FIG. 3 is a diagram for explaining the flux residue removal method in the present embodiment. The flux residue removal method in the present embodiment basically has the same configuration as the flux residue removal method in Embodiment 1, but differs in that the flux residue 20 attached to the substrate 30 is removed.

  First, similarly to the first embodiment, the heating unit 13 that ejects gas toward the flux residue 20 is arranged so that the surface 20a of the flux residue 20 can be heated (step S1).

  Next, the heating unit 13 is used to heat the surface 20a of the flux residue 20 to exceed 250 ° C., thereby melting the flux residue 20 and causing the flux residue 20 melted by the gas to flow (step S2). As shown in FIG. 3, when the flux residue 20 adheres to the surface of the substrate 30, the flux residue 20 is removed as follows, for example.

  Specifically, the spout 13a of the heating unit 13 is brought close to the surface of the substrate 30 to which the flux residue 20 is attached. Gas is jetted from the jet port 13a toward the surface 20a of the flux residue 20 with the jet port 13a of the heating unit 13 directed toward the surface 20a of the flux residue 20. This gas is at a temperature at which the temperature of the surface 20a of the flux residue 20 can be heated so as to exceed 250 ° C., and has an air pressure or an air volume that causes the flux residue 20 to flow. Thereby, the flux residue 20 is melted by being heated. Further, since the gas is ejected toward the lower part of the pedestal 11 to the flux residue 20 which has been melted to a state where it can easily flow, the flux residue 20 easily passes through the side surface of the substrate 30 and the mounting surface 11a of the pedestal 11. Move to the side of the base 11.

  In addition, when moving the flux residue 20 to the side surface of the substrate 30 and the mounting surface 11a of the pedestal 11, the direction in which the gas is ejected from the ejection port 13a of the heating unit 13, the wind pressure, the air volume, and the like may be appropriately changed. .

  As described above, the flux residue 20 attached to the surface of the substrate 30 can be removed from the surface of the substrate 30.

  Since the configuration other than this is substantially the same as the configuration of the first embodiment described above, the same components are denoted by the same reference numerals, and description thereof will not be repeated.

  As described above, according to the flux residue removing method in the present embodiment, even if the flux residue 20 is attached to the substrate 30, the flux residue 20 is removed from the substrate 30 and the mounting surface 11 a of the pedestal 11. Can be sufficiently removed in a short time.

(Embodiment 3)
FIG. 4 is a side view schematically showing a flux residue removing apparatus according to an embodiment of the present invention. Initially, with reference to FIG. 4, the flux residue removal apparatus in this Embodiment is demonstrated.

  As shown in FIG. 4, the flux residue removing apparatus 10 b in the present embodiment basically has the same configuration as that of the first embodiment, but the heating unit 13 includes the laser oscillation unit 14 and the gas ejection unit 15. And is different in that it includes.

  The laser oscillating unit 14 is configured to oscillate laser light that is heated so that the temperature of the surface 20a of the flux residue 20 exceeds 250 ° C. The laser oscillation unit 14 is disposed above the pedestal 11 so that a laser can be oscillated from the laser oscillation unit 14 on the surface 20 a of the flux residue 20.

  The gas ejection part 15 is configured to eject gas. The gas ejection part 15 is configured to eject a gas having an air volume and a wind pressure that can easily flow the melted flux residue 20. The gas ejection part 15 is disposed above the pedestal 11 so that gas can be ejected from the gas ejection part 15 toward the surface 20 a of the flux residue 20. As in the first embodiment, an inert gas such as air or nitrogen can be used as the gas ejected from the gas ejection section 15.

  The flux residue removing apparatus 10b may further include a control unit (not shown) that controls the gas ejection unit 15 to eject gas when the laser oscillation unit 14 oscillates a laser.

  Next, the flux residue removal method in the present embodiment will be described. The flux residue removal method according to the present embodiment basically has the same configuration as the flux residue removal method according to Embodiment 1, but the surface 20a of the flux residue 20 is heated by the laser oscillation unit 14 to generate gas. The point which makes the flux residue 20 flow below the base 11 by the ejection part 15 is different.

  First, the heating unit 13 that heats the surface of the flux residue 20 to exceed 250 ° C. and ejects gas is disposed (step S1). In the present embodiment, for example, a flux residue removing apparatus 10b shown in FIG. 4 is used.

  Next, the heating unit 13 is used to heat the surface of the flux residue 20 so as to exceed 250 ° C., thereby melting the flux residue 20 and causing the flux residue 20 melted by the gas to flow (step S2). As shown in FIG. 4, when the flux residue 20 has adhered to the mounting surface 11a of the base 11, for example, the flux residue 20 is removed as follows.

  Specifically, the laser power of the laser oscillation unit 14 is adjusted so that the surface 20a of the flux residue 20 exceeds 250 ° C. The air volume and the wind pressure are adjusted so that the flux residue 20 melted in the gas ejection portion 15 flows. Next, the laser oscillation unit 14 and the gas ejection unit 15 constituting the heating unit 13 are brought close to the substrate placement surface 11a of the base 11 on which the flux residue 20 is adhered.

  Thereafter, a laser is oscillated from the laser oscillation unit 14 to the surface 20a of the flux residue 20 to heat the surface 20a of the flux residue 20 to a temperature exceeding 250 ° C. Thereby, the flux residue 20 melts. Further, gas is ejected from the gas ejection part 15 toward the surface 20 a of the flux residue 20. Thereby, the melted flux residue 20 flows toward the lower side of the base 11.

  As described above, the flux residue 20 attached to the mounting surface 11a of the pedestal 11 can be removed from the mounting surface 11a.

  Since the configuration other than this is substantially the same as the configuration of the first embodiment described above, the same components are denoted by the same reference numerals, and description thereof will not be repeated.

  Further, the flux residue removing method and the flux residue removing apparatus 10b of the present embodiment can be applied not only to the first embodiment but also to the second embodiment.

  As described above, in the flux residue removal method and the flux residue removal apparatus 10b in the present embodiment, the heating unit 13 oscillates the laser beam that heats the surface 20a of the flux residue 20 so that the temperature exceeds 250 ° C. The laser oscillation part 14 for this and the gas ejection part 15 for ejecting gas are included.

  According to the flux residue removal method and the flux residue removal apparatus 10b in the present embodiment, the heating unit 13 includes the laser oscillation unit 14 having a function of heating the flux residue 20 and the pressure of the gas that ejects the melted flux residue 20 Or it has the gas ejection part 15 which has the function made to flow with an air volume as a separate member. For this reason, the member which is easy to adjust the temperature of the surface 20a of the flux residue 20 and the pressure of the gas for flowing the flux residue 20 or an air volume can be used, respectively. Therefore, the flow state of the flux residue 20 can be easily controlled. Therefore, the flux residue 20 can be sufficiently removed from the mounting surface 11a of the substrate and the base 11 in a short time.

  In this example, the effect of flowing the flux residue by heating the surface of the flux residue to exceed 250 ° C. to melt the flux residue and jetting gas toward the melted flux residue was examined.

  Specifically, the substrate was soldered using a rosin flux mainly composed of rosin. After completion of the soldering, as shown in FIG. 3, the flux residue 20 mainly composed of rosin adhered to the surface of the substrate 30. The flux residue 20 adhered on the substrate 30 had a rectangular planar shape having a long side of 15 mm and a short side of 8 mm.

  Therefore, a heating unit that ejects gas toward the flux residue 20 is arranged so that the surface 20a of the flux residue 20 can be heated (step S1). In step S1, the flux residue removal apparatus 10a shown in FIG. 1 in Embodiments 1 and 2 was used. The diameter of the ejection port 13a of the heating unit 13 was 4 mm.

  Next, by using the heating unit 13, the flux residue 20 was melted by heating so that the surface 20a of the flux residue 20 exceeded 250 ° C., and the melted flux residue 20 was made to flow (step S2).

  In step S2, the jet nozzle 13a of the heating unit 13 was brought close to the surface of the substrate 30 to which the flux residue 20 was adhered. At this time, the distance between the surface 20a of the flux residue 20 and the spout 13a of the heating unit 13 was 5 mm. The outlet 13 a of the heating unit 13 was directed to the surface 20 a of the flux residue 20. A gas having a temperature of 700 ° C., a pressure of 0.3 MPa, and an air volume of 15 L / min was ejected from the ejection port 13 a toward the surface 20 a of the flux residue 20 at the ejection port 13 a of the heating unit 13.

  In addition, the temperature of the surface 20a of the flux residue 20 exceeded 250 ° C. from the distance between the ejection port 13a of the heating unit 13 and the flux residue 20 and the temperature, pressure, and air volume of the gas ejected from the heating unit 13. It is clear.

  As a result, the flux residue 20 can be moved to the side surface of the base 11, and no flux residue remains on the substrate 30 and the mounting surface 11 a of the base 11. The viscosity when the flux residue was melted by the heating unit was 1000 cP. Further, the time required for the flux residue to flow to the side surface of the base 11 was 3 seconds.

  As described above, according to the present embodiment, the flux residue 20 is melted to a state in which the flux residue 20 is easy to flow by heating so that the surface 20a of the flux residue 20 exceeds 250 ° C. It was confirmed that the flux residue 20 can be sufficiently removed from the substrate 30 and the mounting surface 11a of the base 11 in a short time by flowing.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is shown not by the above-described embodiment but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

It is a side view which shows roughly the flux residue removal apparatus in Embodiment 1 of this invention. It is a figure for demonstrating the flux residue removal method in Embodiment 1 of this invention. It is a figure for demonstrating the flux residue removal method in Embodiment 2 of this invention. It is a side view which shows roughly the flux residue removal apparatus in Embodiment 3 of this invention.

Explanation of symbols

  10a, 10b Flux residue removal device, 11 pedestal, 11a mounting surface, 13 heating unit, 13a ejection port, 14 laser oscillation unit, 15 gas ejection unit, 20 flux residue, 20a surface, 30 substrate.

Claims (4)

A method for removing flux residue generated when soldering using flux,
A step of arranging a heating unit so that the surface of the flux residue can be heated and a gas is ejected toward the flux residue;
A flux residue comprising a step of using the heating unit to melt the flux residue by heating so that the surface of the flux residue exceeds 250 ° C., and causing the flux residue melted by the gas to flow. Removal method.   The said heating part contains the laser oscillation part for oscillating the laser beam heated so that the temperature of the surface of the said flux residue exceeds 250 degreeC, and the gas ejection part for ejecting the said gas. The flux residue removal method as described in 1 .. An apparatus for removing a flux residue generated when soldering a substrate using a flux,
A pedestal having a mounting surface for mounting a substrate to be soldered;
The temperature of the surface of the flux residue adhering to at least one of the mounting surface and the substrate of the pedestal is heated so as to exceed 250 ° C., and the melted flux residue flows downwardly of the pedestal. The flux residue removal apparatus provided with the heating part which ejects gas like this.   The said heating part contains the laser oscillation part for oscillating the laser beam heated so that the temperature of the surface of the said flux residue exceeds 250 degreeC, and the gas ejection part for ejecting the said gas. The flux residue removal apparatus described in 1.

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