JPH0653623A - Formation of positioning pattern for mounting parts on printed circuit board - Google Patents

Abstract

PURPOSE:To conduct automatic mounting of parts without fail by identifying appropriately a positioning pattern. CONSTITUTION:A positioning pattern 1 of a printed circuit board 4 to be used at the time of automatic mounting of parts on the printed circuit board 4 is formed. At the same time, a protecting pattern 2 surrounding the external periphery of the positioning pattern 1 is formed. The protecting pattern 2 prevents distortion of the positioning pattern 1 at the time of polishing the pattern surface with a cylindrical brush or other tools during the manufacturing process of the printed circuit board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a positioning pattern of a printed circuit board used when automatically mounting mounted components on the printed circuit board, and designing a positioning pattern capable of improving the automatic mounting efficiency of parts. The present invention relates to a method of forming according to a dimension value.

[0002]

2. Description of the Related Art FIG. 2 is a plan view of a printed circuit board having a positioning pattern, FIG. 3 (A) is an enlarged plan view of a conventional positioning pattern, and FIG. 3 (B) is a side sectional view of a conventional positioning pattern after polishing. Is. In FIG. 2, 4 is a printed circuit board having the positioning pattern 1, and 3 is a range used as an electric circuit. Conventionally, the positioning pattern 1 of the printed circuit board used when the mounted components are automatically mounted on the electric circuit of the printed circuit board 4 is used as an electric circuit on the entire surface of the printed circuit board as shown in FIGS. 2 and 3A. It is formed outside the range 3 to be formed, for example, at four corners independently.

Since the printed circuit board 4 is subjected to solder resist, gold plating, etc. after the pattern formation, after the pattern formation, the printed circuit board 4 is fed and conveyed on the conveyer 5 as shown in FIG. As shown in FIG. 4B, both sides of the printed circuit board are polished by the cylindrical brush 6,
As shown in (c) of FIG.

[0004]

However, in the conventional positioning pattern 1, surface polishing after pattern formation is
As shown in FIG. 3 (B), the front and rear corners are scraped off, and the shape as the positioning pattern 1 differs from the design dimension value, causing recognition failure during automatic positioning of the printed circuit board 4 during automatic component mounting. However, there was a problem that automatic mounting of parts was impossible.

[0005]

According to the present invention, when a mounted component is automatically mounted on a printed circuit board, a positioning pattern for positioning the printed circuit board by automatic recognition is formed according to a design dimension value. The object is to solve the problem of component mounting failure caused by the unrecognizable shape of the automatic mounting machine caused by the unclear shape. That is, according to the method of the present invention, the protective pattern 2 surrounding the outer periphery of the positioning pattern 1 is formed simultaneously with the formation of the positioning pattern 1 of the printed circuit board 4, and the protective pattern 2 is used to form a pattern surface by a cylindrical brush or the like which is used in the printed circuit board manufacturing process. It is characterized in that the positioning pattern 1 is prevented from being deformed during polishing.

[0006]

In the above structure, the patterns on both surfaces of the printed circuit board 4 after pattern formation are polished. In the method of the present invention, since the protective pattern 2 surrounding the outer periphery of the positioning pattern 1 is applied, the protective pattern 2, the positioning pattern 1 and the protective pattern 2 are surface-polished in this order, and the corner portion before the first protective pattern 2 is polished. Then, the corner after the next protection pattern 2 is scraped off, but the surface of the positioning pattern 1 is evenly polished, and the shape as the positioning pattern 1 becomes the same as the design dimension value. When the printed circuit board 4 is automatically positioned, the positioning pattern 1 is accurately recognized, and the automatic mounting of components can be surely performed.

[0007]

1A is an enlarged plan view of a positioning pattern portion of the present invention, and FIG. 1B is a side sectional view of the positioning pattern portion after polishing of the present invention. In this embodiment, the positioning pattern portions are individually formed at four corners of the entire surface of the printed circuit board 4 other than the area (inner portion surrounded by the two-dot chain line) 3 used as an electric circuit.

The positioning pattern portion is composed of a positioning pattern 1 of the printed circuit board 4 used for automatic mounting of mounted components, and a protective pattern 2 surrounding the outer periphery thereof. The distance between the positioning pattern 1 and the protection pattern 2 is the minimum distance that does not affect the identification of the automatic recognition, and the width of the protection pattern 2 is the maximum width that does not electrically affect the electric circuit of the printed circuit board.

In the above structure, the printed circuit board 4 on which the pattern is formed has a cylindrical brush 6 as shown in FIG.
4 is supplied and conveyed on the conveyor 5 of the surface polishing machine, and both sides of the printed circuit board 4 are polished by the cylindrical brush 6 as shown in FIG. 4 (b) and conveyed as shown in FIG. 4 (c). It is discharged by the conveyor 5. During polishing of the positioning pattern portion, the positioning pattern portion is composed of the positioning pattern 1 and the protective pattern 2 surrounding the outer periphery thereof, so that the surface of the protective pattern 2, the positioning pattern 1 and the protective pattern 2 is polished in this order, and the first Protection pattern 2
1 and the corner after the next protection pattern 2 are shown in FIG.
Although it is shaved off as shown in (B), the surface of the positioning pattern 1 is uniformly polished, and the deformation of the positioning pattern 1 by the cylindrical brush 6 is prevented.

The printed circuit board 4 that has been polished is supplied to the automatic mounting machine, and the positioning pattern 1 of the printed circuit board 4 is automatically recognized. Since the positioning pattern 1 is not deformed, the automatic recognition is appropriately performed and the recognized printed circuit board 4 is positioned. After that, automatic mounting of components on the printed circuit board 4 is surely performed.

[0011]

As described above, according to the present invention, the protective pattern 2 surrounding the outer periphery of the positioning pattern 1 is formed simultaneously with the formation of the positioning pattern 1 of the printed circuit board 4 used when the mounted components are automatically mounted on the printed circuit board 4. Positioning pattern 1 formed and protected by pattern 2 during polishing of the pattern surface by a cylindrical brush or the like performed in the printed circuit board manufacturing process
Since the deformation of the positioning pattern is prevented, the positioning pattern becomes the same as the design dimension value, the positioning pattern can be recognized accurately, and the automatic component mounting can be surely performed.

[Brief description of drawings]

FIG. 1A is an enlarged plan view of a positioning pattern portion of the present invention. FIG. 3B is a side sectional view of the positioning pattern portion after polishing according to the present invention.

FIG. 2 is a plan view of a printed circuit board having a positioning pattern.

FIG. 3A is an enlarged plan view of a conventional positioning pattern. (B) is a side sectional view of a conventional positioning pattern after polishing.

FIG. 4 is an explanatory diagram of a surface polishing operation of a printed circuit board.

[Explanation of symbols]

 1 Positioning pattern 2 Protective pattern 3 Range used as electric circuit 4 Printed circuit board

Claims (1)

[Claims] 1. A positioning pattern (1) for a printed circuit board (4), which is used during automatic mounting of mounting components on the printed circuit board (4), is independently placed outside the range used as an electric circuit on the entire printed circuit board. In the forming method, a protective pattern (2) surrounding the outer periphery of the positioning pattern (1) is formed at the same time when the positioning pattern (1) is formed, and the protective pattern (2) is used to form a pattern by a cylindrical brush or the like in a printed circuit board manufacturing process. A method of forming a positioning pattern for mounting a component on a printed circuit board, which prevents deformation of the positioning pattern (1) during polishing of the surface.