JPH0653373A - Ic carrier and method of testing and mounting ic - Google Patents

Abstract

PURPOSE:To eliminate the cutting of a lead when mounting an IC while the IC can be used to test concerning an IC carrier for protecting the lead of the IC packaged in the narrow pitch lead. CONSTITUTION:The present device comprises a plurality of first pads 2 arranged so as to connect each lead 21 of an IC separately on the surface of an insulating board 1, second pads 3 having the same number of pads as the first pads 2 arranged at intervals capable of separately contacting IC connecting contacts 31 of a test apparatus for testing the IC on the rear of the insulating board 1, and third pads 4 having the same number of pads as the first pads 2 arranged in alignment with the arrangement of connecting terminals 42 for mounting the IC of a mounting substrate 41 for mounting the IC. Each one of the first pads 2, the second pads 3 and the third pads 4 is made as one set, and interconnection of the pads in each set is formed by printed wirings 5 and through holes 6. An IC mounting to the mounting substrate 41 is performed by interposing an IC carrier.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an IC carrier and an IC.
The present invention relates to a test method and an IC mounting method, and more particularly, to an IC carrier for protecting leads of an IC (semiconductor integrated circuit device) packaged in a narrow pitch lead and a method of using the IC carrier.

QFP (Quad-Flat-Package) and PGA (Pin)
-Grid-Array) and other packages with narrow pitch leads I
For the purpose of protecting the delicate lead, C uses an IC carrier for fixing the tip of the lead by soldering at the time of testing or shipping for each individual IC.

[0003]

2. Description of the Related Art FIG. 4 is a side view for explaining a conventional example of an IC carrier. In the figure, this IC carrier has the same number of first pads 12 arranged on the surface of the insulating plate 11 so that the leads 21 of the IC can be individually connected, and a test for testing the IC. A first pad 12 and a second pad, each of which has a second pad 13 arranged outside the first pad 12 at an interval such that an IC connection contact 31 (a spring contactor called a pogo pin or the like) of the device can be individually contacted. The pads in each set are connected to each other by the printed wiring 15 as one set for each of the first pad 1 and the first pad 1.
A slit 17 is provided on the inner side of 2.

Then, the ends of the leads 21 of the manufactured IC are fixed to the first pad 12 by soldering to form the leads 2
The deformation of 1 is prevented, and it is sent to the test department together with the IC. The test department tests the IC by bringing the IC connection contact 31 into contact with the second pad 13. After the test, I
It is shipped to the user while being integrated with C. The user
I cut the tip of the lead 21 at the slit 17
C is separated from the IC carrier and the IC is mounted on a mounting board. The IC carrier is used when the IC is separated.

[0005]

By the way, since the user does not have a technique for protecting the leads of the IC separated from the IC carrier, it is often impossible to mount the IC due to handling before mounting. In addition, since a special technique is required to cut the above leads, such an IC
Many users cannot accept ICs whose leads are protected by carriers.

Therefore, the present invention relates to an IC carrier for protecting the leads of an IC packaged in a narrow pitch lead, which can be used for testing the IC, and makes it unnecessary to cut the leads when mounting the IC. The purpose is to do.

[0007]

In order to achieve the above-mentioned object, an IC carrier according to the present invention is provided with I on the surface of an insulating plate.
It has a plurality of first pads arranged so that each lead of C can be individually connected, and the contact for IC connection of a testing device for testing the IC is provided on the back surface of the insulating plate in the same number as the first pads. Second pads in which the children are arranged at intervals allowing individual contact with each other, and third pads in the same number as the first pads and arranged in alignment with the arrangement of the IC mounting connection terminals of the mounting substrate on which the IC is mounted. And each of the first pad, the second pad and the third pad is set as one set, and the pads in each set are connected by a printed wiring and a through hole. There is.

With this IC carrier, the IC can be tested by bringing the IC connection contact of the tester into contact with the second pad while the IC is connected to the first pad. In addition, when the IC is connected to the first pad,
The IC can be mounted on the mounting board by connecting the pad to the IC connection terminal of the mounting board.

[0009]

The above-mentioned first pad can protect the leads of the IC by the arrangement thereof like the first pad of the conventional example. Further, the second pad can be brought into contact with the IC connection contact of the test apparatus due to the distance between the second pads.
Allows testing of the IC connected to the first pad. The third pad can be connected to the mounting board by its arrangement, and the IC connected to the first pad can be mounted on the mounting board by the interposition of the present IC carrier.

Therefore, the present IC carrier can protect the leads of the IC for use in testing the IC and can eliminate the need for cutting the leads when mounting the IC.

[0011]

Embodiments of the present invention will be described below with reference to FIGS. 1 is a side view, a top view and a bottom view of an embodiment of an IC carrier, FIG. 2 is a side view for explaining an embodiment of an IC test method, and FIG. 3 is a side view for explaining an embodiment of an IC mounting method. Fig.

In FIG. 1, this IC carrier has a first pad 2 arranged on the surface of an insulating plate 1 so that each lead 21 of the IC can be individually connected, and on the back surface of the insulating plate 1, a first pad 2 is formed. The same number as 1 pad 2 and I of the above-mentioned test device
The second pads 3 in which the C connection terminals 31 are arranged at intervals so that they can be individually contacted with each other, and the second pads 3 having the same number as the first pads 2 are aligned with the arrangement of the IC mounting connection terminals 42 of the mounting board 41 on which the ICs are mounted. The third pad 4 is arranged, and each one of the first pad 2, the second pad 3, and the third pad 4 is set as one set, and the printed wiring 5 and the through hole 6 are provided between the pads in each set. It is connected with. The thickness of the insulating plate is about 1m
It is about m.

Then, the tips of the leads 21 of the manufactured IC are fixed to the first pad 2 by soldering to form the leads 21.
Deformation is prevented, and it is sent to the testing department together with the IC. As shown in FIG. 2, the testing department brings the IC connection contact 31 into contact with the second pad 3 on the back surface side of the insulating plate 1 and I
Test C. After the test, it is shipped to the user while being integrated with the IC.

As shown in FIG. 3, the user mounts the IC by connecting the third pad 4 to the IC mounting connection terminal 42 of the mounting substrate 41 without cutting the tip portions of the leads 21. In this connection, the bumps 43 are interposed so that the second pad 3 and the like do not come into contact with the surface of the mounting substrate 41. As a result, the protection of the leads 21 is maintained even during mounting, and troubles that occur in the case of the conventional example are prevented. Also, a user who does not have a technique for cutting the leads 21 can accept this IC.

Further, as is apparent from the above, since the second pad 3 used for contact in the test can be arranged immediately below the IC, the insulating plate 1 is the insulating plate 11 of the conventional example.
Can be smaller than. Further, on the user side, the arrangement of the IC mounting connection terminals 42 is such that the leads 21 of the IC are arranged.
Is not restricted by the arrangement, and the degree of freedom in designing the mounting board 41 is increased. It should be noted that a user having a technique of cutting the leads 21 can also adopt a conventional form of mounting the IC without interposing the IC carrier.

[0016]

As described above, the present invention relates to an IC carrier for protecting the leads of an IC packaged in a narrow pitch lead, which can be used for testing the IC, and at the time of mounting the IC. It is possible to eliminate the need for disconnecting the lead wire, eliminate the mounting troubles caused by bending the lead wire after lead cutting, and allow the user who does not have lead cutting technology to accept the IC. In addition, the configuration of the IC carrier has an effect of reducing the size of the IC carrier and increasing the degree of freedom in designing the mounting board.

[Brief description of drawings]

FIG. 1 is a side view, a top view, and a bottom view of an embodiment of an IC carrier.

FIG. 2 is a side view for explaining an example of an IC test method.

FIG. 3 is a side view for explaining an example of an IC mounting method.

FIG. 4 is a side view for explaining a conventional example of an IC carrier.

[Explanation of symbols]

 1, 11 Insulating plate 2, 12 First pad (for fixing IC lead) 3,13 Second pad (for test) 4 Third pad (for mounting) 5,15 Printed wiring 6 Through hole 17 Slit 21 IC lead 31 IC connection contact for test equipment 41 Mounting board 42 IC mounting connection terminal 43 Bump

Claims (3)

[Claims] 1. A plurality of first pads arranged on the surface of an insulating plate so as to be able to individually connect the leads of the IC,
On the back surface of the insulating plate, the second pads in which the IC connection contacts of the test device for testing the IC are arranged at intervals so that they can be individually contacted, and the IC mounting connection terminals of the mounting board on which the IC is mounted. A third pad arranged so as to match the arrangement, and each one of the first pad, the second pad and the third pad is set as one set, and printed wiring is provided between the pads in each set. An IC carrier characterized by being connected through through holes. 2. A test of the IC by contacting an IC connection contact of the test device with a second pad of the IC carrier with the IC connected to the first pad of the IC carrier according to claim 1. An IC test method comprising: 3. The IC is connected to the first pad of the IC carrier according to claim 1, and the third pad of the IC carrier is connected to the IC connection terminal of the mounting substrate to connect the IC. An IC mounting method comprising mounting on a mounting board.