JPH0653002A - Electronic element - Google Patents

Abstract

PURPOSE:To directly recognize whether mounting is normal by forming through holes from electrode terminals to the opposite surface side, in the electrode terminals and a main body. CONSTITUTION:In a main body 11 and electrode terminals 12a, 12b, through holes 14 are formed from the electrode terminals 12a, 12b to the opposite surface of the main body 11. When a chip element is mounted on a circuit board 15, the electrode terminals 12a, 12b of the chip element are made to correspond with land electrodes 16a, 16b of the circuit board 15 by face down, the chip element is mounted on a circuit board 15, and soldering process is performed. Next the soldering state is visually observed from above. When the connection is perfect like the soldering part 13a between the electrode terminal 12a and the land electrode 16a, solder does not creep up in the through hole 14a. On the contrary, when the connection is imperfect like the soldering part 13b between the electrode terminal 12b and the land electrode 16b, the soldering part 13b creeps up as far as the upper part of the through hole 14b. Thereby whether mounting is normal can be discrimated and confirmed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic element such as a chip resistor, a chip capacitor and a semiconductor element whose main body is plate-shaped.

[0002]

2. Description of the Related Art A chip element (electronic element) mounted on a circuit board or the like by a face-down method has conventionally been provided with an electrode terminal 52 provided on a lower surface of a plate-shaped element body 51 as shown in FIG.
Solder bumps 53 are further formed on the
The three parts are placed face down on the land electrodes 55 on the circuit board 54, soldered, and mounted on the circuit board 54.

[0003]

In the above-mentioned conventional chip element, the electrode terminal 52 is soldered to the land electrode 54 in the solder state after being mounted on the circuit board, like the chip element 51a shown in FIG. And the land electrode 5 is connected to the land electrode 5 like the chip element 51b.
There is a case where it is not connected to 4. It is preferable that the chip element 51a is correctly mounted and the chip element 51b is defectively mounted and that after mounting, it can be surely visually identified.
The conventional chip element has a problem in that the soldering portion is covered by the main body, so that normal mounting and defective mounting cannot be directly confirmed.

The present invention has been made in view of the above problems, and an object thereof is to provide an electronic element capable of directly confirming whether the mounting is normal or defective when mounted on a circuit board or the like. I am trying.

[0005]

In order to solve the above-mentioned problems, the electronic element according to claim 1 is one in which an electrode terminal having a solder bump is provided on one surface of a plate-shaped main body. Through holes are provided in the electrode terminal and the main body from the electrode terminal to the other surface side of the main body. In this electronic element, when it is mounted on a circuit board and the electrode terminal and the land electrode of the circuit board are normally connected by solder, the solder hardly enters the through hole in the main body. On the other hand, when the solder connection is poor, the solder enters the through hole and reaches the vicinity of the upper surface of the main body. By visually observing the through hole from the top surface of the main body, it is possible to confirm normal / defective mounting by the degree of solder rising in the through hole.

According to another aspect of the present invention, in the electronic element, the electrode terminal is provided on one surface of the plate-shaped main body, and the through hole is provided on the electrode terminal and the main body on the other surface side of the main body. . In this electronic element, solder bumps are formed on the land electrode side of the circuit board, and after mounting, the mounting is directly performed from the upper surface of the element body for the same reason as the electronic element according to claim 1. The normality / abnormality of can be confirmed.

[0007]

The present invention will be described in more detail with reference to the following examples. FIG. 1 is a side view showing an embodiment of the present invention. In FIG. 1, a chip element 10 has an electrode terminal 12 provided on one surface (lower surface) of a plate-shaped main body 11,
Solder bumps 13 are further formed on the surfaces of the electrode terminals 12. The above structure is not different from that of the chip element shown in FIG.

A feature of the chip element 10 of this embodiment is that a through hole 14 is provided in the main body 11 and the electrode terminal 12 from the electrode terminal 12 to the other surface (upper surface) of the chip element main body 11. To mount such a chip element 10 on a circuit board, the electrode terminal 12 portion of the chip element 10 is placed face down on the circuit board 15 so as to correspond to the land electrode 16 of the circuit board 15. , Perform soldering processing.

After performing the soldering process, the chip element 10
When viewed from above as shown in FIG. 2, the solder portion 13a of the electrode terminal 12a and the land electrode 16a on the left side of FIG.
As described above, the solder does not rise in the through hole 14a when the connection is completely established. Therefore, when viewed from above, the solder portion 13a looks like a deep portion of the through hole 14a. On the other hand, unlike the solder portion 13b of the electrode terminal 12b and the land electrode 16b on the right side of FIG. 2, when the solder portion 13b is vertically separated from each other without being completely connected.
In this case, the solder part 13b has risen to the upper part of the through hole 14b. Therefore, when viewed from above, the solder portion 13b appears as a shallow portion near the upper opening of the through hole 14b. When these two are compared, there is a difference L in the visible depths of the solder portions 13a and 13b, and it is possible to visually confirm which one is the solder portion, that is, the solder portion 1
If 3 is in the deep part of the through hole 14, it can be confirmed that the mounting is normal, and if it is in the shallow part, the mounting is defective.

FIG. 3 is a sectional view showing another embodiment of the present invention. In FIG. 3, the chip element 20 has an electrode terminal 22 provided on one surface (lower surface) of a plate-shaped main body 21, and the chip element main body 21 and the electrode terminal 22 are connected from the electrode terminal 22 to the other of the chip element main body 21. A through hole 24 is provided on the surface (upper surface). The above configuration is shown in FIG.
It is similar to the chip element shown in FIG. However, the chip element of this embodiment is different from that shown in FIG. 1 in that no solder bump is formed on the electrode terminal 22.

This chip element 20 does not have solder bumps on its own. Instead, when it is mounted on the circuit board 25, solder bumps 27 are formed on the upper surfaces of the land electrodes 26 of the circuit board 25, and the chip element 20 is formed. 20 electrode terminals 22
Corresponding to the solder bumps 27 of the circuit board 25, is placed face down on the circuit board 25, and a soldering process is performed.

After performing the soldering process, the chip element 20
As shown in FIG. 4, when viewed from above, the solder does not rise in the through hole 24a when the connection is made completely like the left side electrode terminal 22a of FIG. 4 and the solder portion 27a of the land electrode 26a. . Therefore, when viewed from above, the solder portion 27a looks like a deep portion of the through hole 24a. On the other hand, when the solder portion 27b is not completely connected and the solder portion 27b is vertically separated like the solder portion 27b of the electrode terminal 22b and the land electrode 26b on the right side in FIG. 27b has risen to the upper part of the through hole 24b. Therefore, when viewed from above, the solder portion 27b can be seen near the upper opening of the through hole 14b.
Therefore, as in the case of the embodiment shown in FIG. 1, after the soldering process, the through hole is visually inspected from above the chip element, and the normal mounting or the defective mounting is discriminated depending on how much the solder portion is in the through hole. You can check.

[0013]

According to the present invention, since the electrode terminal and the main body are provided with through holes on the other surface side of the main body from the electrode terminal, after the soldering process, from the upper side of the chip element,
By visually observing the through holes and checking if the through holes are clogged with solder, immediately after mounting,
The normality / abnormality of mounting can be identified and confirmed.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining identification / confirmation of normality / abnormality in a mounting state of the embodiment.

FIG. 3 is a sectional view showing another embodiment of the present invention.

FIG. 4 is a cross-sectional view for explaining confirmation of normality / abnormality of mounting state of the embodiment.

FIG. 5 is a side view for explaining mounting of a conventional chip element.

FIG. 6 is a side view for explaining a problem of a mounting state of the conventional chip element.

[Explanation of symbols]

 10 chip element 11 chip element body 12 electrode terminal 14 through hole

Claims (2)

[Claims] 1. An electronic device having electrode terminals having solder bumps formed on one surface of a plate-shaped main body, wherein through holes are provided on the electrode terminals and the main body from the electrode terminals to the other surface side of the main body. Characteristic electronic device. 2. An electronic element in which an electrode terminal is provided on one surface of a plate-shaped body, wherein the electrode terminal and the body are provided with through holes on the other surface side of the body from the electrode terminal. .