JPH0652198U - Board positioning carrier - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a substrate positioning carrier that prevents the mounted substrate from falling off. A base is provided on at least one of positioning members 5 to 7 for engaging with and positioning the substrate 2 and biasing members 9 and 10 for biasing the substrate 2 toward the positioning member. The above effects are obtained by providing the restriction portions 6c, 9b, and 10b that restrict the movement of the substrate 2 in the direction perpendicular to the mounting surface 3a of the substrate 3.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a substrate positioning carrier that positions and mounts a substrate for carrying out a bonding process such as die bonding or wire bonding.

[0002]

[Prior art]

 A die bonding process of mounting an IC chip on a substrate with an adhesive or the like, or connecting an electrode part of the IC chip mounted on the substrate and a lead formed on the substrate using a conductive thin wire. When performing bonding in the wire bonding process, it is often the case that the substrate to be bonded is mounted on a flat carrier and the carrier is transported.

FIG. 3 shows a conventional wire bonding apparatus that handles a substrate positioning carrier. In the wire bonding apparatus, the carriers 22 housed in the loader-side magazine 21 are sequentially taken out and transferred to the bonding position by the bonding means 23, and the bonding means 23 causes the substrates 24 on the respective carriers 2 to move. After being bonded to the unloader, it is housed in the magazine 25 on the unloader side. Incidentally, such a wire bonding device is disclosed in Japanese Utility Model Laid-Open No. 58-475.

Details of the carrier 22 are shown in FIG. As shown in the figure, the carrier 22 is formed in a rectangular plate shape and has a base 27 on which the substrate 4 is mounted, and a carrier 24 provided on the base 27 for positioning the substrate 24 in a direction parallel to the mounting surface of the base 27. Of the three positioning members 28, 29 and 30 and leaf springs 31 and 32 provided on the base 27 as biasing members for biasing the substrate 24 toward these positioning members 28, 29 and 30. It has and. That is, the board 24 is pressed in the lateral direction by the leaf spring 31 and positioned by the positioning members 28 and 29, and is also pressed in the longitudinal direction by the other plate bars 32 and positioned by the positioning member 30. . When the substrate 24 is attached to or detached from the carrier 22, this is done by pushing the leaf springs 31 and 32 outward.

It is said that by using the carrier 22, the substrate 24 is transported in a highly accurately positioned state, and the quality and productivity of bonding are improved.

[0006]

[Problems to be solved by the device]

 However, in the above-described conventional substrate positioning carrier, there is a concern that the substrate 24 may fall off the base 27 due to warping of the base 27 and the substrate 24 due to heating during bonding, vibration during transportation, and the like.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a base plate positioning carrier that prevents a substrate from falling off.

[0008]

[Means for Solving the Problems]

 The present invention provides a base for mounting a substrate, a positioning member provided on the base for positioning the substrate in a direction parallel to a mounting surface of the base, and a substrate provided on the base for directing the substrate to the positioning member. In a substrate positioning carrier including a biasing member that biases the substrate, at least one of the positioning member and the biasing member regulates the movement of the substrate in a direction perpendicular to the mounting surface. It is configured so as to have a regulation unit that operates.

[0009]

【Example】

 Next, a substrate positioning carrier according to an embodiment of the present invention will be described with reference to the accompanying drawings.

As shown in FIGS. 1 and 2, the carrier according to the present invention has a base 3 which is formed in a rectangular plate shape and on which the substrate 2 is mounted. In order to position the board 2 in one direction X parallel to the mounting surface 3a of the base 3 (see FIG. 2) by engaging one side 2a of the long side of the board 2 near one side of the base 3. Two positioning members 5 and 6 are provided. Also, one positioning member 7 is provided near one end of the base 3 in the longitudinal direction, and engages with one side 2b of the short side of the substrate 2 to place the substrate 2 on the base 3. Positioning is performed in another direction Y, which is parallel to the mounting surface 3a and is perpendicular to the direction X. Since these positioning members 5, 6 and 7 have the same structure, the structure of one positioning member 6 will be described in detail.

As is apparent from FIG. 2, the positioning member 6 has a cylindrical portion 6a, and is rotatably attached to the support pin 6b implanted in the base 3 by the cylindrical portion 6a. A disc-shaped restricting portion 6c is integrally formed on the upper end of the cylindrical portion 6a, and the restricting portion 6c allows the substrate in the direction perpendicular to the mounting surface 3a of the base 3 (indicated by an arrow N). 2 movement is regulated.

On the other hand, two leaf springs 9 and 10 as biasing members are provided on the base 3 at positions where the substrate 2 is sandwiched between the positioning members 5, 6 and 7. The long side and the short side of the base plate 2 are engaged with the sides 2c and 2d, respectively. The board 2 is biased toward the positioning members 5, 6 and 7 by the leaf springs 9 and 10 and positioned with high precision. The leaf springs 9 and 10 have the same configuration as each other, and one leaf spring 9 and its mounting state will be described in detail.

As shown in FIG. 1, the leaf spring 9 is formed by bending a U-shape in the vicinity of one end thereof, and is attached to a fixed pin 11 fixedly mounted on the base 3 at this bent portion, The part is locked by the non-rotating pin 12. Then, the free end portion 9a is curved, and the convex portion of the curved portion presses the substrate 2.

As shown in FIG. 2, the free end portion 9 a of the leaf spring 9 has a tongue-like shape that restricts the movement of the substrate 2 in a direction perpendicular to the mounting surface 3 a of the base 3. The restricting portion 9b is integrally formed. In addition, in FIG. 1, reference numerals 10b are attached to the restriction portions formed on the other leaf springs 10. By providing the restricting portions 9b and 10b, the substrate 2 is prevented from falling off the base 3.

When the substrate 2 is attached to and detached from the carrier 1 having the above-described structure, the leaf springs 9 and 10 may be bent in a direction opposite to the direction of the biasing forces P and Q.

In FIG. 1, reference numeral 1 a indicates a large number of holes arranged side by side on one side of the carrier 1. These holes 1a are used for applying a carrier force to the carrier 1 or for positioning the carrier 1 at the bonding position when the carrier 1 is carried along the carrying path so as to use the substrate 2 for bonding. is there.

By the way, in the present embodiment, two positioning members indicated by reference numerals 5 to 7 are provided along one side 2a on the long side of the base plate 2 and one positioning member corresponding to one side 2b on the short side. Although provided, the number of positioning members can be appropriately determined. In addition to the substantially cylindrical shape of the positioning member, the positioning member is formed into, for example, an L shape, and both sides thereof are engaged with both sides 2a and 2b of the substrate 2 at one corner of the substrate 2. It is possible to make various changes such as changing the setting.

Further, in this embodiment, as the leaf spring for urging the substrate 2, one having one end bent in a U shape is adopted, but the structure and shape of the spring can be freely selected. can do. Further, instead of the leaf spring, rubber, sponge or the like can be used as the biasing member.

Further, in the present embodiment, the restricting portion for preventing the substrate 2 from falling off is provided on both the positioning members 5 to 7 and the leaf springs 9 and 10. However, on either one of them. Only the regulation portion may be provided.

Further, as shown in FIG. 2, there is a slight gap between each of the restricting portions 6 c and 7 b of the positioning member 6 (similar to 5 and 7) and the leaf spring 9 (similar to 10) and the upper surface of the substrate 2. Since the gap e is provided, the warp of the substrate 2 can be absorbed.

[0021]

[Effect of device]

 As described above, in the present invention, at least one of the positioning member and the urging member is provided with the restriction portion for restricting the movement of the substrate in the direction perpendicular to the mounting surface of the base. Therefore, there is an effect that the substrate does not drop off from the base even if the base or substrate warps due to heating during bonding or vibration during transportation, and the bonding work can be performed reliably.

[Brief description of drawings]

FIG. 1 is a plan view of a substrate positioning carrier according to an embodiment of the present invention.

2 is a cross-sectional view taken along the line AA of FIG.

FIG. 3 is a plan view showing the outline of a conventional wire bonding apparatus that handles a substrate positioning carrier.

FIG. 4 is a plan view of a conventional substrate positioning carrier.

[Explanation of sign]

 DESCRIPTION OF SYMBOLS 1 carrier 2 board 3 base 3a mounting surface 5, 6, 7 positioning member 6c restricting portion 9, 10 leaf spring (biasing member) 9b, 10b restricting portion

Claims (1)

[Scope of utility model registration request] 1. A base on which a substrate is mounted, a positioning member provided on the base for positioning the substrate in a direction parallel to a mounting surface of the base, and a substrate provided on the base facing the positioning member. A substrate positioning carrier including a biasing member for biasing, wherein at least one of the positioning member and the biasing member regulates movement of the substrate in a direction perpendicular to the mounting surface. A substrate positioning carrier characterized in that a regulating portion is provided.