JPS59150438A - Semiconductor bonding apparatus - Google Patents
Semiconductor bonding apparatusInfo
- Publication number
- JPS59150438A JPS59150438A JP58022791A JP2279183A JPS59150438A JP S59150438 A JPS59150438 A JP S59150438A JP 58022791 A JP58022791 A JP 58022791A JP 2279183 A JP2279183 A JP 2279183A JP S59150438 A JPS59150438 A JP S59150438A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- lead
- bonding
- lead frame
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
仁の発明は半導体ボンディング装置に関し、Ｌｌでキャ
スティングタイプのディスプレイのマウント・、ボンデ
ィングに適用される。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] Jin's invention relates to a semiconductor bonding device, and is applied to mounting and bonding of a casting type display in Ll.
従来のリードフレームは方形の金属板にパターンが形成
され、その両側縁から所定幅にリード部が形成されてお
り、このリード部を例えばリードフレーム板の同じ側に
ほぼ直角に折曲げ、側縁の延長上からみてまきがまえ型
（平行部分がリード部）に形成されたものの中央部（水
平部）のみに７セター７があり、これにグイボンディン
グ、ワイヤボンディングが施でれていた。このため、ボ
ンディング装置はボンディングのための加熱用ヒータブ
ロック上面にリードフレームがその中央部を密接させ、
リードがヒータブロックの側方にあるいわゆる、跨乗型
に据えてボンディングを達成するようになっていた。In a conventional lead frame, a pattern is formed on a rectangular metal plate, and lead parts are formed at a predetermined width from both sides of the metal plate.The lead parts are bent, for example, at a nearly right angle to the same side of the lead frame plate, and the side edges are Although it was formed in a windward shape (the parallel part is the lead part) when viewed from the extension, there was a 7 setter 7 only in the center part (horizontal part), and wire bonding and wire bonding were applied to this. For this reason, in the bonding device, the lead frame is placed in close contact with the center of the top surface of the heater block for bonding.
Bonding was accomplished by placing the lead on the side of the heater block in a so-called straddling type.
斜上の背景技術によるボンディング装置はリードフレー
ムが加熱用ヒータブロックに跨乗できる形状のものに対
し、そのヒ−タブロック上のパターンにボンディングを
施すには適するも、この発明に係るリードフレームに対
するボンディングには次に述べるように不具合な点があ
る。すなわち、リードフレームは方形の金属板にノミタ
ーンが形成叡れ、その両側縁からθｆ定幅の域内に形成
されたリード部を折り曲げ、前記域内の・ξターンにボ
ンディングが施されるものであり、域内６ノξターンは
リードよりも側方へ翼状に張り出してπの字型を彦すの
で、中央部だけをヒータブロック上に跨乗させてもボン
ディング時には変型しあるいは踊ってボンディングが良
好に施せ々い。これは、グイボンディング、ワイヤボン
ディング時にフレームには静荷重で３０〜２００ｇ程度
、超音波振動で６２ ｋｌ−１ｚ、 Ｏ〜３μ振幅、お
よび加熱が４００ ’Ｃ；程度加える必要があるが、こ
のような外力が印加された場合、リードフレーム、が踊
り、あるいは変形しテ４′ンゲイングエネルギが逃げ、
ボンブイノブ強度にばらつきを生ずるなどの重大な問題
点がある。The bonding device according to the background art of the diagonal top is suitable for bonding a pattern on a heater block for a lead frame having a shape that allows it to straddle the heater block, but it is not suitable for the lead frame according to the present invention. Bonding has some drawbacks as described below. That is, the lead frame has a chisel turn formed on a rectangular metal plate, the lead portion formed within a constant width θf from both sides of the lead frame is bent, and bonding is performed on the ξ turns within the area. The six ξ turns in the area protrude laterally from the lead in a π-shape, so even if only the center part is placed over the heater block, it will deform or dance during bonding, making it difficult to bond properly. Many. This means that during wire bonding and wire bonding, it is necessary to apply a static load of about 30 to 200 g, ultrasonic vibration of 62 kl-1z, an amplitude of 0 to 3 μ, and heating of about 400'C; When an external force is applied, the lead frame dances or deforms, causing the 4'-gaining energy to escape.
There are serious problems such as variations in the strength of the bomb knob.
捷だ、上記に関して単に固定された受けを設けただけで
Ｈ’Ｊ−ドフレームの搬送上障害となるので適用できな
い。However, the above cannot be applied because simply providing a fixed receiver would cause an obstacle in transporting the H'J-do frame.
この発明は上記従来の問題点に鑑み、これを改良するた
めに改良されたボンディング装置を提供する。In view of the above-mentioned conventional problems, the present invention provides an improved bonding device to solve the problems.
この発明のボッディング装置は、四辺形の金属板にパタ
ーンが形成され、その両側縁から所定幅の域内の一部に
形成されたリード部を折り曲げ。In the bodding device of the present invention, a pattern is formed on a quadrilateral metal plate, and lead parts formed in a part of a predetermined width area from both sides of the metal plate are bent.
前記域内のパターンにグイボンディング卦よびリードボ
ンディングが施されるリードフレームに対し、リードフ
レームの中央部下側に加熱用ヒータブロックと上側から
下降してリードフレームを前記ヒータブロックとの間に
挟持するフレーム押さえ部材とでリードフレームを定位
させ、指定されたタイミングでリードの外側下方から斜
に上昇させて前記域内のパターンの下面に接触し支持す
るフレーム受はブロックを備えたことを特徴とする。For a lead frame in which Gui bonding and lead bonding are applied to the pattern in the area, a heater block is provided below the center of the lead frame, and a frame descends from above to sandwich the lead frame between the heater block and the heater block. The frame holder is characterized in that it is provided with a block that positions the lead frame with the holding member and raises the lead frame obliquely from below the outside of the lead at a specified timing to come into contact with and support the lower surface of the pattern in the area.
次にこの発明を１実施例′につき図面を参照して詳細に
説明する。Next, one embodiment of the present invention will be explained in detail with reference to the drawings.
第１図に１個が示されるリードフレーム（１）は、一般
のＩＣ用リードフレームと同様に金属条に所定のパター
ンが連接して例えば打抜き形成されたものである。そし
て、このリードフレームが一般の上記リードフレームと
異なる点は金属条の両側線から所定幅（Ｌ）の域内の一
部に形成きれたリード部＋２１ 、 （２’）が折シ曲
げられ、前記域内で折シ曲げきれずに残されたパターン
部（３）が中央部のパター７部（３′）と同一平面上に
あってリード部＋２１．（２’）から翼状に外方に突出
た形態になっている。上記パター７部（３）に対するグ
イボンディング、ワイヤボッディングを施すのに有効な
１例の装置を第１図と併せ第２図によって説明する。The lead frame (1), one of which is shown in FIG. 1, is formed by, for example, punching, with a predetermined pattern connected to a metal strip, like a general IC lead frame. The difference between this lead frame and the above-mentioned general lead frame is that the lead portions +21 and (2') formed in a part of a predetermined width (L) from both sides of the metal strip are bent. The pattern part (3) left without being completely bent within the area is on the same plane as the putter part 7 (3') in the center, and the lead part +21. It has a wing-like shape that protrudes outward from (2'). An example of an apparatus effective for applying wire bonding and wire bonding to the putter 7 portion (3) will be described with reference to FIG. 2 together with FIG. 1.
第２図はボンディング施行時のクラ７プされた状態を示
し、このボンディング装置旧）は図示の如きユニット単
位でボッディングを施し、１個に対して完了するとフレ
ームに設けられている送り孔ｔ／１１ 、 ＋４１・・
・（第１図）によって送シ出し、新しいユニットをボッ
ディフグツールの可動範囲に装填しボンディングを繰返
すようになっている。図示の装置について、（ｌ榎はカ
ートリッジヒータ（１３）を内装したヒータブロックで
リードフレーム（１）のリード部（２）、 （２’）が
側面に対向し、上面にリードフレームのパターン部（３
′）・を密接させる。−また、［４１はフレーム受はブ
ロックで、リードの外側に突出（７たパターン部（３）
にボンディングを施するためにリードの外側−Ｆ方から
斜めに一上昇し上ｉ己・ぞターン部（３）の下面に接触
支持させる次の機構によって動作する。Figure 2 shows the clamped state at the time of bonding.This bonding machine (older version) performs bodding in unit units as shown in the figure, and when it is completed for one piece, the feed hole t/ 11, +41...
・The unit is fed out as shown in Figure 1, a new unit is loaded within the movable range of the body puffer tool, and bonding is repeated. Regarding the illustrated device, (l Enoki is a heater block containing a cartridge heater (13), the lead portions (2) and (2') of the lead frame (1) face each other on the side, and the pattern portion of the lead frame ( 3
′)・to be brought into close contact. - Also, [41] The frame holder is a block that protrudes outside the lead (7 pattern part (3)
In order to perform bonding on the lead, it is operated by the following mechanism which raises the lead diagonally from the outside -F side and supports it in contact with the lower surface of the upper I/Z turn part (3).
すなわち、上記フレーム受はブロック（１重はスライド
軸受（１ω、０籾 ・により、かつこのスライド軸受を
支持するスライド軸受ハウジング０（５）によって斜め
に支持され、スライド軸受はスプリング０７）で弾力を
もって引き上げられこの軸受の下端に取着されたローラ
ホルダ（１樽でフレーム受ストッパＵ→に価接し定位す
る。なお、このフレーム受ストッパハスライド軸受ハウ
ジングにねじ対偶（１９’）で数層されスライド軸受の
上昇高さを制限しｆ９ｉ定にする１、また、このスライ
ドｒｌｌ−＋受の押下げはクレーム受七Ｆカム（２０）
に係合して動作する′Ｖパー（２υによつ゛Ｃ上記スプ
リング（１７）の弾力に抗して施される１、次に、（ｚ
２）はフレーム押さえ部材で、下降して、リードフレー
ムをヒータブロック（（２）の上面、およびこの上面と
同一平面上に上面が位置するように斜上の機構によって
配置された上記フレーム受はブロック０４）の上面の間
にリードフレームのパターン部を挟持して定位させる。That is, the frame bearing is supported diagonally by a block (one layer is a slide bearing (1ω, 0 paddy) and a slide bearing housing 0 (5) that supports this slide bearing, and the slide bearing is elastically supported by a spring 07). The roller holder (one barrel) that is pulled up and attached to the lower end of this bearing is attached to the frame holder stopper U → and positioned in place.This frame holder stopper is attached to the slide bearing housing in several layers with screw pairs (19') and slides. Limit the rising height of the bearing and make it constant f9i 1. Also, this slide rll- + push down of the receiver is the claim receiver 7 F cam (20)
1 applied against the elasticity of the spring (17), then (z
2) is a frame holding member that descends and holds the lead frame on the top surface of the heater block ((2), and the frame holder is arranged by an inclined mechanism so that its top surface is on the same plane as the top surface of the heater block (2). The pattern portion of the lead frame is sandwiched between the upper surfaces of block 04) and positioned.
そして、こめ間にボンディングを施したのち、フレーム
受はブロック（１４）の下降とフレーム送りの各タイミ
ングに同期して上昇させる。上記同期をとるには上記フ
レーノ、受止ドカム（１０）と同軸のカムで行なっても
よく１．またはフレーム受上下カムを別のエヤシリンダ
で駆動させてもよい。After bonding is performed between the temples, the frame receiver is raised in synchronization with the lowering of the block (14) and the timing of frame feeding. The synchronization may be achieved using a cam coaxial with the Freno and receiving cam (10).1. Alternatively, the frame receiving upper and lower cams may be driven by a separate air cylinder.
なお・、カム＋２１におけるＨｌは小径、Ｈ２は大径で
、カムの回転によってＨ２−Ｈ，のストロークが発生し
、カムフォロワ（２１ａ）が矢印方向に移動（−上昇）
する。この移動分はレパーシυによって反転しローラホ
ルダ（１樽のローラ（１８ａ ）を押し丁げ、フレーム
受ブロック旧）に−ト述の運動を与えるようになる。In addition, in cam +21, Hl is a small diameter and H2 is a large diameter, and the rotation of the cam generates a stroke of H2-H, and the cam follower (21a) moves in the direction of the arrow (-rise).
do. This amount of movement is reversed by the repercussion υ, and the roller holder (one barrel roller (18a) is pressed and the frame receiving block is old) is given the movement described above.
また、図のフレーム受はブロックはパターン部を所定温
度に加熱するためにミニヒータ（ト）を内装させている
。In addition, the block of the frame holder shown in the figure has a mini-heater (g) built into it to heat the pattern part to a predetermined temperature.
し発明の効果］
この発明の装置によれば、リードフレームのパターンに
対し折曲げ形成されたリード部より側方に翼状に突出し
たパターン部にボンディングをｌｌ０ｉす必要のある、
たとえばＬｌのリードフレームにボンディングにあたシ
次にあげる著効を奏する１、まず、フレーム受はブロッ
クが前進後退し、ボンディングの必要時期にのみパター
ン部の下面に定位して支持して良好なボンディングを達
成する。[Effects of the Invention] According to the apparatus of the present invention, it is necessary to perform bonding on the pattern portion that protrudes laterally in a wing-like manner from the lead portion that is bent and formed with respect to the pattern of the lead frame.
For example, when bonding is applied to an Ll lead frame, the following effects are achieved: 1. Firstly, the block of the frame holder moves forward and backward, and is positioned and supported on the lower surface of the pattern part only when bonding is necessary. Achieve bonding.
したがって、フレームと全くｆ渉せず、その搬送に全く
障害を及ぼさない。Therefore, it does not interfere with the frame at all and does not impede its transportation at all.
次に、フレーム受はブロックが斜めに動作するので、リ
ードフレーム（ｔ＋！ｊに折曲げしたリード部）の折曲
げ部を回避することなく上下動できるので、そのストロ
ークが短縮できる１、これにより、装置の高速運動に適
し、装置の保守が容易となり耐用期間に利益がある。Next, since the block of the frame holder moves diagonally, it can move up and down without avoiding the bent part of the lead frame (the lead part bent at t+!j), so the stroke can be shortened1. , suitable for high-speed movement of the device, easy maintenance of the device, and benefits in service life.
さらに装置の自動化かは”かれる利点があり、従来のマ
ウント、ボンディングの能率が１０００個あたυ１１．
ＩＨ１６，３Ｈを要したものが２．６Ｈ以丁に低減さす
ることができた。Furthermore, there is the advantage that the equipment can be automated, and the efficiency of conventional mounting and bonding is υ11.
What required 16.3 hours of IH was able to be reduced to less than 2.6 hours.
第１図はリードフレームの斜視図、第２図はこの発明の
１実施例のボンディング装置の断面図である。
ユ リードフレーム
２．２′ リードフレームのリード部３
リードフレームの残されたノゼターン部３′（リ
ードフレームの中央部の）・Ｚター゛・′部す
ボンディング装置＃
１２ 加熱用のヒータブロック１４
フレーム受はブロック
１８ ローラホルダ
１９ フレーム受はストッパ
２０（フレーム受は上ド）カム
２１ しＩに
２２ フレーム押さえ部材
代理人 弁理士 井 上 −男
第 １ 図FIG. 1 is a perspective view of a lead frame, and FIG. 2 is a sectional view of a bonding apparatus according to an embodiment of the present invention. U Lead frame 2.2' Lead part 3 of lead frame
Remove the remaining nose turn part 3' (at the center of the lead frame), Z turn part, and
Bonding device #12 Heater block 14 for heating
Frame holder is block 18 Roller holder 19 Frame holder is stopper 20 (Frame holder is upper door) Cam 21 and I 22 Frame holding member representative Patent attorney Inoue - Male Figure 1
Claims (1)
所定幅の域内の一部に形成されたリード部を折り曲げ、
前記域内のパターンにグイポンディングおよびリードボ
ンディングが施されるリードフレームに対し、リードフ
レームの中央部下側に加熱用ヒータブロックと上側から
下降してリードフレームを前記ヒータブロックとの間に
挟持するフレーム押さえ部材とでリードフレームを定位
させ、指定されたタイミングでリードの外側下方から斜
めに上昇させて前記域内のパターンの下面に接触し支持
するフレーム受はブロックを備えたことを特徴とする半
導体ボンディング装置。A pattern is formed on a quadrilateral metal plate, and lead parts formed in a part of a predetermined width area from both sides of the plate are bent.
For a lead frame in which lead bonding and lead bonding are applied to the pattern in the area, a heater block is provided below the center of the lead frame, and a frame that descends from above to sandwich the lead frame between the heater block and the heater block is provided. Semiconductor bonding characterized in that the frame support is provided with a block, the frame support for positioning the lead frame with a holding member and raising the lead frame obliquely from below the outside of the lead at a specified timing to contact and support the lower surface of the pattern in the area. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58022791A JPS59150438A (en) | 1983-02-16 | 1983-02-16 | Semiconductor bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58022791A JPS59150438A (en) | 1983-02-16 | 1983-02-16 | Semiconductor bonding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59150438A true JPS59150438A (en) | 1984-08-28 |
Family
ID=12092499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58022791A Pending JPS59150438A (en) | 1983-02-16 | 1983-02-16 | Semiconductor bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59150438A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007126763A (en) * | 2005-11-01 | 2007-05-24 | Uni Charm Corp | Mother's milk breast pad |
-
1983
- 1983-02-16 JP JP58022791A patent/JPS59150438A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007126763A (en) * | 2005-11-01 | 2007-05-24 | Uni Charm Corp | Mother's milk breast pad |
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