JPH0651032Y2 - Chip-shaped electronic component mounting device template - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a template in which a chip-shaped electronic component is mounted on a substrate, and a storage container for receiving the chip-shaped electronic component is arranged in the template.

[Prior Art] Conventionally, when a chip-shaped electronic component is mounted at a predetermined position on a circuit board, it has been carried out in the following manner by an apparatus as shown in FIG. That is, the chip-shaped electronic components stored in bulk in the plurality of storage containers 1 are taken out one by one by the guide means 2 composed of the pipe-shaped chute 21 and the base plate 3, and the lower part of the base plate 3 is taken out. Each of them is sent to and received in the storage container 61 provided at a predetermined position on the template 6 inserted in the. The storage container 61 is arranged according to the position where each chip-shaped electronic component is mounted on the circuit board 9. Subsequently, the template 6 is moved from below the base plate 3 to below the suction unit 8, and the chip-shaped electronic components a, a ... Stored in the storage containers 61, 61. The suction head (not shown) provided on the lower surface of the suction unit 8 sucks and holds the suction unit. After the suction unit 8 moves up and the template 6 retracts from below, the suction unit 8 moves down and the chip-shaped electronic component a sucked and held by the tip of the suction head is mounted on the circuit board 9. As a result, the chip-shaped electronic components are mounted on the circuit board 9 at predetermined positions. In FIG. 5, reference numeral 7 denotes a conveyer for carrying the circuit board 9.

It should be noted that the circuit board is preliminarily coated with an adhesive at a position where the chip-shaped electronic component is to be mounted, and the mounted electronic component is soldered while the electronic component is temporarily fixed with the adhesive.

The fourth example of the template 6 used in such a device is
Shown in the figure. As can be seen from this drawing, the conventional template has pin holes 68 at predetermined positions on the base plate 60.
68 is provided and the pin protruding from the bottom of the storage container 61
The storage container 61 was fixed on the base plate 6 by fitting the 67, 67 into the pin holes 68, 68.

[Problems to be Solved by the Invention] As described above, in the conventional template 6, the storage container 61,
A baseboard in which pin holes 68, 68 for fitting the containers 61, 61 ... In advance are formed in a pattern for arranging 61 ..., That is, a pattern for mounting a chip-shaped electronic component on the circuit board 9. You need 60.

However, such a base board 60 must be individually manufactured in accordance with the mounting position of the chip-shaped electronic component on the circuit board 9, and the one in which the pin holes 68, 68 have already been opened is arranged in another container. It was completely impossible to transfer to a template with a pattern. For this reason, in the case of a circuit board of high-mix low-volume production, it is necessary to individually prepare various types of base boards 60 together with the circuit boards that are produced only in small quantities. In addition, the mounting position cannot be changed due to some design changes of the circuit board 9, and a new base board 60 has to be prepared separately, which is a problem that the base board 60 is wasted. It was

Furthermore, the conventional template has a pattern in which a chip-shaped electronic component is to be mounted on the circuit board 9 in advance.
Base board 6 with pin holes 68, 68 for fitting 1, 61 ...
Since it had to be drilled into 0, the manufacturing of the baseboard 60 was laborious. That is, based on the pattern diagram of the circuit board 9, the positions where the pin holes 68, 68 are punched are marked on the base board 60, and the pin holes 68, 68 are punched one by one, or an NC drilling machine is used. Then, based on the pattern diagram of the circuit board 9, the coordinates of the positions for forming the pin holes 68, 68 on the base board 60 must be input to form the pin holes 68, 68. Therefore, it takes a lot of time and effort to manufacture the template, and it is difficult to cope with the small-lot production of many kinds.

The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a template which is easy to manufacture and can easily cope with a change in a mounting position of an electronic component on a substrate.

[Means for Solving the Problems] That is, in order to achieve the above-mentioned object, the gist of the means adopted in the present invention is that the chip-shaped electronic component is adjusted according to the position where the chip-shaped electronic component is to be mounted on the substrate. A template in which a storage container for receiving components is arranged, which is a base board 60 and is attached to the surface of the base board 60, and the container mounting position 65 is aligned with the mounting position of the chip-shaped electronic component on the substrate. Has a pattern sheet 64 marked, and a storage container 61 having a flat bottom surface and an open top surface, at the container mounting position 65 of the pattern sheet 64 attached to the base board 60, the bottom surface of the storage container 61. 3 is a template for a chip-shaped electronic component mounting device obtained by bonding

[Operation] In the template, the baseboard 60 has a storage container 61,
No need to drill pin holes to attach 61 ...
The pattern sheet 64 with the container mounting position 65 marked according to the mounting position of the chip-shaped electronic component on the substrate is attached to the surface of the base board 60, and the container 61 is adhered to the marked container mounting position 65. You can make it just by attaching it. The pattern sheet 64 is in the form of a sheet, and based on a pattern diagram of the circuit board, a screen plate for printing electrodes on the circuit board, and the like, the component mounting position 65 can be easily adjusted by printing or copying. Moreover, since the marking can be performed accurately, the mounting positions of the storage containers 61, 61 ... Can be set easily and accurately as compared with the case where the base board 60 is provided with pin holes. Therefore, the template in which the storage container is accurately attached to the predetermined position can be easily manufactured with a small number of steps.

Then, when there is a partial change in the mounting position of the chip-shaped electronic component on the substrate, the corresponding storage container 61 is replaced with the pattern sheet.
64, remove and re-glue it in another position, or store it in a storage container.
It can be easily dealt with by adding 61 and adhering. In addition, when changing the entire mounting position of the chip-shaped electronic components on the board, use the pattern sheet 64 as the base board.
The template can be peeled off and reassembled using another pattern sheet 64, and the base board 60 and the storage container 61 can be reused as they are.

[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the template according to the present invention is constructed by attaching a pattern sheet 64 on the surface of a base board 60 and adhering the bottom surface of a storage container 61 to a container mounting position 65 set on the sheet 64. Has been done. Pattern sheet 64
The container mounting position 65 set above is set according to the mounting position of the chip-shaped electronic component on the substrate. Storage container 61
Has a box-like shape whose bottom surface is flat and whose top surface is open to receive falling chip-shaped electronic components.

An example of the method of manufacturing this template will be described with reference to FIG. 2. First, as shown in FIG. 2 (a), a base board 60 and a pattern sheet 64, which are rectangular plates having a flat main surface, are prepared. . In the pattern sheet 64, a container mounting position 65 is marked on a thin resin film by means such as photoengraving and copying. The arrangement pattern of the container mounting position 65 is formed according to the mounting position of the electronic component on the substrate. Next, the pattern sheet 64 can be attached to the main surface of the base board 60. Further, as shown in FIG. 7B, the storage container 61 is attached to the container mounting position 65 of the pattern sheet 64.
Temporarily bond. After temporarily adhering all the storage containers 61 to the container attachment positions 65 on the pattern sheet 64 by the temporary adhesion means 66,
The storage container 61 is permanently bonded to the pattern sheet 64 with an instant adhesive. The temporary adhesion means 66 is generally a double-sided adhesive sheet or a magnet sheet, and in the latter case, a magnetic material is used as the base board 60.

[Advantages of the Invention] As described above, according to the template of the present invention, it is possible to easily manufacture the template with a small number of templates in which a storage container is accurately attached at a predetermined position. Furthermore, not only can a partial change of the mounting position of the chip-shaped electronic component be easily handled, but also in the case of a full change, the base board and the storage container can be used as they are by simply changing the pattern sheet. As a result, it is possible to provide a template that can easily handle high-mix low-volume production.

[Brief description of drawings]

FIG. 1 is a perspective view from the bottom side of a template according to an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are perspective views from the bottom side illustrating a method of manufacturing the template, and FIG. FIG. 4 is a sectional view of a main part of the template, FIG. 4 is a sectional view of a main part of a conventional template, and FIG. 5 is a perspective view showing an example of a chip-shaped electronic component automatic mounting apparatus. 60 …… Base board, 61 …… Storage container, 64 …… Pattern sheet, 65 …… Pattern sheet mounting position

Claims (1)

[Scope of utility model registration request] 1. A template in which a storage container for receiving the chip-shaped electronic component is arranged in accordance with a position where the chip-shaped electronic component is to be mounted on a substrate, the baseboard 60 and the baseboard. It has a pattern sheet 64 attached to the surface of 60 and having a container mounting position 65 marked according to the mounting position of the chip-shaped electronic component on the substrate, and a storage container 61 having a flat bottom surface and an open top surface. The chip-shaped electronic component mounting device template is characterized in that the bottom surface of the storage container 61 is adhered to the container attachment position 65 of the pattern sheet 64 attached to the base board 60.