JPH0650302U - Chip resistor parts - Google Patents

Abstract

(57) [Abstract] [Purpose] Insulating a plurality of resistors without reducing the size of the resistors arranged on the insulating substrate, even if the insulating substrate is made small by downsizing the chip resistor component. Provided is a chip resistance component that can be arranged on a substrate at high density. An electrode that reaches the back surface from the front surface of the insulating substrate by providing a first resistor 3 on the front surface of the insulating substrate 4 and a second resistor 7 on the back surface at a position intersecting with the first resistor 3. 1 and 2 are formed at both ends of the first resistor 3, and a pair of notches are provided at edges of the insulating substrate 4 that face each other with the first resistor 3 interposed therebetween. Both end electrodes 5 and 6 of the second resistor are formed in the pair of notches.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip resistor component having a plurality of resistors.

[0002]

[Prior art]

 A chip resistor component having a plurality of resistors is formed by arranging a plurality of resistors side by side on the same surface of an insulating substrate so as to be insulated from each other. Then, for example, the chip resistance component having two resistors is connected in series or in parallel by a conductive pattern which is connected to the printed wiring board by soldering. In this case, generally, the resistance value of one resistor is fixed and the resistance value of the other resistor is adjusted by trimming.

[0003]

[Problems to be solved by the device]

 Recently, as printed wiring boards have become smaller, high-density chip resistance components are required, and further improvements to smaller structures are desired. However, although the insulating substrate is made smaller by downsizing the chip resistor component, if the resistor placed on the insulating substrate is made smaller, trimming to the resistor becomes difficult. Therefore, there is a problem that the workability of trimming becomes poor.

Therefore, according to the present invention, even if the insulating base is made small by downsizing the chip resistor component, a plurality of resistors are insulated without reducing the size of the resistor arranged on the insulating base so much. An object of the present invention is to provide a chip resistance component that can be arranged on a substrate with high density.

[0005]

[Means for Solving the Problems]

 In the present invention, the first resistor is provided on the front surface of the insulating substrate, the second resistor is provided on the back surface at a position intersecting with the first resistor, and the electrode reaching from the front surface to the back surface of the insulating substrate is provided as the first resistor. A pair of notches are formed at both ends of the first resistor, and a pair of notches are provided at edges of the insulating base that face each other with the first resistor interposed therebetween, and the second notch is provided at the pair of notches on the surface of the insulating base. Both ends of the resistor are formed.

[0006]

[Action]

 In the present invention, even if the insulating base is made small by downsizing the chip resistor component having a plurality of resistors, it is not necessary to make the size of the resistor arranged on the insulating base much smaller. The workability of trimming the resistor is not worse than that of the chip resistor component before miniaturization.

[0007]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. 1 (a) is a front view of the chip resistor component of the present invention, FIG. 1 (b) is a bottom view of FIG. 1 (a), and FIG. 1 (c) is a right-hand side view of FIG. 1 (a). 1 (d) is a rear view of FIG. 1 (a). The same reference numerals in FIG. 1 indicate the same items.

In FIGS. 1A, 1B, 1C and 1D, reference numerals 1 and 2 denote electrodes formed on both ends of a rectangular resistor 3, and the resistor 3 is an insulating substrate formed by printing. It is formed on the surface of No. 4. The electrodes 1 and 2 are formed so as to reach the back surface from the front surface of the insulating substrate 4 with both ends of the insulating substrate 4 sandwiched therebetween. On the back surface of the insulating substrate 4, a rectangular resistor 7 is formed by printing at a position intersecting with the resistor 3. A pair of cutouts are formed in the insulating base 4 at opposite edges with a rectangular resistor sandwiched between them. 6, the resistor 3 on the front surface and the resistor 7 on the back surface constitute a chip resistor component. In this chip resistance component, the electrodes 1, 2, 5, 6 provided on the back surface of the insulating substrate 4 are used by being connected to a conductive pattern provided on the same surface of a printed wiring board (not shown) by soldering. For example, connecting electrodes 2 to 5 or one of electrodes 1 to 6 with a conductive pattern forms a series circuit of resistors 3 and 7, or with a conductive pattern between electrodes 2 to 5 and electrode 1 to electrode 6. If both are connected, a parallel circuit of the resistors 3 and 7 is formed. In this chip resistor component, the resistance value of one resistor 3, (7) is fixed regardless of whether it is connected in series or in parallel, and the resistance value of the other resistor 7, (3) is adjusted by trimming to make it fine. Adjustments are made.

[0009]

[Effect of device]

 As described above, according to the present invention, even if the insulating substrate 4 is made small by downsizing the chip resistor component having a plurality of resistors, the resistors 3 and 7 are provided on the upper and lower surfaces of the insulating substrate 4. Since the resistors 3 and 7 are separately arranged, each of the resistors 3 and 7 is independently assigned to one surface of the insulating substrate 4, so that it is not necessary to reduce the size of the resistors 3 and 7, and the size can be reduced. The workability of trimming the resistors 3 and (7) is not deteriorated as compared with the chip resistance component before. Further, since it is possible to identify the shape of the pair of notches provided on the edge of the insulating substrate 4 and to recognize the front surface and the back surface of the chip resistor component, the resistor provided on the surface of the chip resistor component is recognized. Since the antibody 3 provided on the back side and the antibody 3 provided on the back side can be identified, the chip resistance component can be automatically attached to the printed wiring board without making a mistake in the back side and the front side. Also, during trimming work, it is possible to automatically recognize the notch of the chip resistance component and perform the work automatically without making a mistake in the resistor to be trimmed.

[Brief description of drawings]

1 shows an embodiment of the present invention, FIG. 1 (a) is a front view of a chip resistor component of the present invention, and FIG. 1 (b) is FIG.
1A is a bottom view, FIG. 1C is a right side view of FIG. 1A, and FIG. 1D is a back view of FIG. 1A.

[Explanation of symbols]

 1 electrode 2 electrode 3 resistor 4 insulating substrate 5 electrode 6 electrode 7 resistor

Claims (1)

[Scope of utility model registration request] 1. A first resistor is provided on a front surface of an insulating substrate, and a second resistor is provided on a rear surface of the insulating substrate at a position intersecting with the first resistor. Formed on both ends of the first resistor, and
A pair of notches are provided at the opposite edges with the resistor of
A chip resistor component, wherein both end electrodes of the second resistor are formed in the pair of notches on the surface of the insulating substrate.