JPH0649185B2 - Flexible printed wiring board manufacturing method - Google Patents
Flexible printed wiring board manufacturing methodInfo
- Publication number
- JPH0649185B2 JPH0649185B2 JP63334101A JP33410188A JPH0649185B2 JP H0649185 B2 JPH0649185 B2 JP H0649185B2 JP 63334101 A JP63334101 A JP 63334101A JP 33410188 A JP33410188 A JP 33410188A JP H0649185 B2 JPH0649185 B2 JP H0649185B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- coater
- polyimide precursor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はポリイミド樹脂を導体上に直接塗布してなるフ
レキシブルプリント配線用基板の製造方法に関するもの
である。TECHNICAL FIELD The present invention relates to a method for producing a flexible printed wiring board, which is obtained by directly coating a conductor with a polyimide resin.
銅箔等の導体上にポリイミド前駆体樹脂溶液を直接塗布
し、乾燥および硬化してフレキシブルプリント配線用基
板を製造することは特開昭６２−２１２１４０号公報等
で知られている。この方法は接着剤を使用しないため、
カール発生の低減、耐熱性の向上等の利点を有するが、
使用するポリイミド前駆体樹脂の種類によっては多少の
カール発生、接着力の不足などの問題が生ずることがあ
ることが認められた。そして、これらの問題点の多くは
複数のポリイミド前駆体樹脂を使用することにより解決
できることが見出された。It is known from JP-A-62-212140 that a polyimide precursor resin solution is directly applied onto a conductor such as copper foil, dried and cured to produce a flexible printed wiring board. This method does not use glue,
It has advantages such as curl reduction and heat resistance improvement.
It was recognized that problems such as some curling and insufficient adhesive strength may occur depending on the type of polyimide precursor resin used. It has been found that many of these problems can be solved by using a plurality of polyimide precursor resins.
本発明の目的は複数のポリイミド前駆体樹脂溶液を塗
布、乾燥、硬化を行うに当たり、比較的簡易な装置を用
い、操作を簡易にしてフレキシブルプリント配線用基板
を連続的に製造することである。An object of the present invention is to continuously manufacture a flexible printed wiring board by applying a plurality of polyimide precursor resin solutions, using a relatively simple apparatus, and simplifying the operation when applying, drying and curing.
本発明は導体上にポリイミド前駆体樹脂溶液を直接塗布
し、乾燥および硬化させてなるフレキシブルプリント配
線用基板を製造するに当たり、複数のポリイミド前駆体
樹脂溶液を用いて、複数回塗布と乾燥を行うことによっ
て複数のポリイミド樹脂層を有するフレキシブルプリン
ト配線用基板を製造する方法である。In the present invention, when a polyimide precursor resin solution is directly applied onto a conductor, and a flexible printed wiring board is dried and cured, a plurality of polyimide precursor resin solutions are used to perform application and drying a plurality of times. This is a method of manufacturing a flexible printed wiring board having a plurality of polyimide resin layers.
導体は金属箔であり、好ましくは５〜１５０μｍの厚み
の銅箔である。ポリイミド前駆体樹脂は加熱硬化させる
ことによりイミド結合を生ずるものであり、代表的には
ポリアミック酸である。好ましくは、少なくとも１種の
ポリイミド前駆体樹脂が線膨張係数３×１０-5以下の樹
脂を与えるものであり、このような樹脂は前記特開昭６
２−２１２１４０号公報等に記載されているが、より好
ましくは特開昭６３−２４５９８８号公報、特開昭６３
−８４１８８号公報等に記載されたようなジアミノベン
ズアニリド又はその誘導体を含むジアミン類と芳香族テ
トラカルボン酸とを反応させて得られる樹脂である。The conductor is a metal foil, preferably a copper foil having a thickness of 5 to 150 μm. The polyimide precursor resin is one that produces an imide bond by being heated and cured, and is typically a polyamic acid. Preferably, at least one polyimide precursor resin gives a resin having a linear expansion coefficient of 3 × 10 −5 or less.
No. 2,212,140, etc., but more preferably, JP-A-63-245988, JP-A-63
A resin obtained by reacting a diamine containing diaminobenzanilide or a derivative thereof with an aromatic tetracarboxylic acid as described in JP-A-84188.
ポリイミド前駆体樹脂はジメチルアセトアミド、Ｎ−メ
チル−２−ピロリドン等の溶媒に溶解した溶液して使用
される。そして、ポリイミド前駆体樹脂溶液は直接導体
上に塗布されると共に、２種以上使用しされ、層状に塗
布される。すなわち、１又は２以上のポリイミド前駆体
樹脂溶液が塗布、乾燥されたのち、次の１又は２以上の
ポリイミド前駆体樹脂溶液が塗布、乾燥される。この塗
布、乾燥は３層以上のポリイミド樹脂層を導体上に設け
る場合は３回以上行ってもよいし、少なくとも１回の塗
布を多層ダイを用いるなどして１度の塗布で同時に２層
以上塗布してもよい。塗布、乾燥が終了したのち、硬化
してイミド化してフレキシブルプリント配線用基板とす
る。The polyimide precursor resin is used as a solution dissolved in a solvent such as dimethylacetamide or N-methyl-2-pyrrolidone. Then, the polyimide precursor resin solution is directly applied on the conductor, and two or more kinds are used and applied in layers. That is, one or more polyimide precursor resin solutions are applied and dried, and then the following one or more polyimide precursor resin solutions are applied and dried. This coating and drying may be performed three times or more when three or more polyimide resin layers are provided on the conductor, or at least one coating is performed by using a multi-layer die, and two or more layers are simultaneously coated by one coating. You may apply. After the coating and drying are completed, it is cured and imidized to obtain a flexible printed wiring board.
塗布は任意の塗工機を用いて行うことができるが、好ま
しくはグラビアコーター、リバースロールコーター、バ
ーリバースロールコーター、バーコーター、ドクターブ
レードコーター、ダイコーターおよび多層ダイコーター
である。塗工機は少なくとも２つ用いるが、これは同種
であっても、２種以上であっても差し支えない。The coating can be performed using any coating machine, but a gravure coater, a reverse roll coater, a bar reverse roll coater, a bar coater, a doctor blade coater, a die coater and a multi-layer die coater are preferable. At least two coaters are used, but these may be of the same type or of two or more types.
また、ポリイミド前駆体樹脂溶液の粘度が１００〜５０
００ｃｐのときは、グラビアコーター、リバースロール
コーター、バーリバースロールコーターが好ましく、５
００００〜１５００００ｃｐのときは、バーコーター、
ドクターブレードコーター、ダイコーターが好ましい。Further, the viscosity of the polyimide precursor resin solution is 100 to 50.
When it is 00 cp, a gravure coater, a reverse roll coater, and a bar reverse roll coater are preferable.
When it is 0000 to 150,000 cp, a bar coater,
A doctor blade coater and a die coater are preferable.
乾燥に用いる装置としては、任意のものを使用すること
ができるが、塗布された導体（以下、基体という）が、
装置に接触しないフローティング形式のものを使用する
ことが好ましい。フローティング形式とは、基体を気流
中に浮遊させた状態で乾燥および硬化を行うものであ
り、基体を連続的に走行させつつ、基体面に対して上又
は下に配置したノズルから均一に気流を基体面に向けて
吹き出し、走行する基体を浮遊させると共に、波を打つ
ように湾曲しながら走行させるものである。このような
フローティング形式のものを使用することにより、より
カールの少ない製品を得ることができる。加熱は熱風を
気流として吹き出すことにより行うことが好ましいが、
赤外線加熱、電磁誘導加熱等を使用又は併用してもよ
い。As an apparatus used for drying, any apparatus can be used, but a coated conductor (hereinafter referred to as a base) is
It is preferable to use a floating type which does not come into contact with the device. The floating type is a method in which the substrate is dried and cured in a state of being suspended in the air flow, and while the substrate is continuously running, the air flow is evenly distributed from the nozzles arranged above or below the substrate surface. It blows out toward the surface of the base body to float the running base body, and causes the base body to run while curving so as to undulate. By using such a floating type, a product with less curl can be obtained. Heating is preferably performed by blowing hot air as an air stream,
Infrared heating, electromagnetic induction heating, etc. may be used or used in combination.
乾燥は通常、１５０℃以下、好ましくは９０〜１３０℃
で行われるが、硬化が多少進行しても差支えない。硬化
はイミド化が生ずる温度以上、通常１３０℃以上、好ま
しくは２００〜４００℃、より好ましくは２５０〜３６
０℃で行われるが、この硬化も同様にフローティング形
式とすることが好ましい。乾燥および硬化は順次温度を
高めるようにして行うことが好ましいので、複数の乾燥
室および硬化室を設け、基体の走行方向に従って順次そ
の温度を高くすることが望ましい。また、乾燥器と硬化
器は一体の連続したものであっても何ら差支えない。Drying is usually 150 ° C. or lower, preferably 90 to 130 ° C.
However, it does not matter if the curing proceeds to some extent. Curing is carried out at a temperature at which imidization occurs or higher, usually 130 ° C. or higher, preferably 200 to 400 ° C., more preferably 250 to 36.
Although it is carried out at 0 ° C., it is preferable that the curing is also performed in the floating type. Since it is preferable to perform the drying and curing by sequentially increasing the temperature, it is desirable to provide a plurality of drying chambers and curing chambers and sequentially increase the temperature according to the traveling direction of the substrate. Further, the drier and the curing device may be integrated and continuous to each other.
塗布するポリイミド前駆体樹脂溶液については、均一な
塗膜を得るため、および塗膜の絶縁性を向上させるため
には、溶液中に混入した異物を取り除くことが好まし
く、溶液装入ラインにフィルターを入れることがよい。Regarding the polyimide precursor resin solution to be applied, in order to obtain a uniform coating film and to improve the insulating property of the coating film, it is preferable to remove foreign substances mixed in the solution, and to install a filter in the solution charging line. Good to put in.
フィルターとしてはステンレススチール製の焼結フィル
ター又は不織布が適している。フィルターはその寿命を
長くするため、２段階以上の多段階に配置することがよ
く、その場合は順次フィルターの孔径を小さくすること
がよい。孔径は１００〜１μｍが好ましい。また、ポリ
イミド前駆体樹脂溶液の装入ラインを複数設け、並列に
配置するとフィルター交換の作業性が向上する。また、
塗布するポリイミド前駆体樹脂溶液は予め脱泡器で脱泡
しておくことが好ましい。A stainless steel sintered filter or a non-woven fabric is suitable as the filter. In order to prolong the service life of the filter, it is preferable to arrange the filter in two or more stages, and in that case, it is preferable to successively reduce the pore size of the filter. The pore size is preferably 100 to 1 μm. Further, if a plurality of charging lines for the polyimide precursor resin solution are provided and arranged in parallel, the workability of filter replacement is improved. Also,
The polyimide precursor resin solution to be applied is preferably defoamed with a defoamer in advance.
以下、実施例に基づいて、本発明を具体的に説明する。 Hereinafter, the present invention will be specifically described based on Examples.
線膨張係数は、イミド化反応が十分終了した試料を用
い、サーモメカニカルアナライザー（ＴＭＡ）を用い
て、２５０℃に昇温後に１０℃／min で冷却して２４０
℃から１００℃までの平均の線膨張係数を算出して求め
た。The coefficient of linear expansion was determined by using a sample in which the imidization reaction was sufficiently completed, using a thermomechanical analyzer (TMA), heating to 250 ° C., then cooling at 10 ° C./min, and
The average linear expansion coefficient from ℃ to 100 ℃ was calculated and obtained.
接着力は、テンションテスターを用い、幅１０mmの銅張
品の樹脂側を両面テープによりアルミ板に固定し、銅を
１８０゜方向に５mm/minの速度で剥離して求めた。The adhesive strength was determined by using a tension tester to fix the resin side of a copper-clad product having a width of 10 mm to an aluminum plate with a double-sided tape and peeling the copper in a 180 ° direction at a speed of 5 mm / min.
加熱収縮率は、幅１０mm、長さ２００mmの導体をエッチ
ングした後のフィルムを用い、２５０℃の熱風オーブン
中で３０分間熱処理し、その前後の寸法変化率により求
めた。The heat shrinkage was determined by using the film after etching a conductor having a width of 10 mm and a length of 200 mm for 30 minutes in a hot air oven at 250 ° C. and measuring the dimensional change before and after the heat treatment.
エッチング後のフィルムのカールは、導体を塩化第二鉄
水溶液で全面エッチングした後、縦１０cm×横１０cm×
厚さ２５μｍの大きさのフィルムを１００℃で１０分間
乾燥した後、発生したカールの曲率半径を求めて数値化
した。The curl of the film after etching is 10 cm in length × 10 cm in width after etching the entire surface of the conductor with an aqueous solution of ferric chloride.
After the film having a thickness of 25 μm was dried at 100 ° C. for 10 minutes, the radius of curvature of the generated curl was calculated and quantified.
エッチング後のフィルムの強度及び弾性率は、ＪＩＳ
Ｚ−１７０２、ＡＳＴＭ Ｄ−８８２−６７に準じて測
定した。The strength and elastic modulus of the film after etching are measured according to JIS
It was measured according to Z-1702, ASTM D-882-67.
なお、各例における略号は以下のとおりである。The abbreviations in each example are as follows.
ＰＭＤＡ：ピロメリット酸二無水物 ＢＴＤＡ：３，３′，４，４′−ベンゾフェノンテトラ
カルボン酸二無水物 ＤＤＥ：４，４′−ジアミノジフェニルエーテル ＭＡＢＡ：２′−メチル−４，４′−ジアミノベンズア
ニリド ＢＡＰＰ：２，２−ビス〔４−（４−アミノフェノキ
シ）フェニル〕プロパン ＤＭＡＣ：ジメチルアセトアミド 合成例１ ＢＡＰＰ６モルをＤＭＡＣ４４kgに溶解した後、１０℃
に冷却し、ＢＴＤＡ６モルを徐々に加えて、反応させ、
粘稠なポリイミド前駆体樹脂溶液（ポリアミック酸Ａ）
を得た。PMDA: pyromellitic dianhydride BTDA: 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride DDE: 4,4'-diaminodiphenyl ether MABA: 2'-methyl-4,4'-diaminobenz Anilide BAPP: 2,2-bis [4- (4-aminophenoxy) phenyl] propane DMAC: dimethylacetamide Synthesis Example 1 6 mol of BAPP was dissolved in 44 kg of DMAC, and then 10 ° C.
And slowly add 6 mol of BTDA to react.
Viscous polyimide precursor resin solution (polyamic acid A)
Got
合成例２ ＭＡＢＡ３２モルとＤＤＥ８モルをＤＭＡＣ１２４kgに
溶解した後、１０℃に冷却し、ＰＭＤＡ４０モルを徐々
に加えて、反応させ、粘稠なポリイミド前駆体樹脂溶液
（ポリアミック酸Ｂ）を得た。Synthesis Example 2 32 mol of MABA and 8 mol of DDE were dissolved in 124 kg of DMAC, cooled to 10 ° C., and 40 mol of PMDA was gradually added and reacted to obtain a viscous polyimide precursor resin solution (polyamic acid B).
実施例１ 第１図の装置にて、銅箔１に第１層がポリアミック酸
Ａ、第２層がポリアミック酸Ｂ、第３層がポリアミック
酸Ａでそれぞれのフィルム厚さが８、１７、２μｍにな
るようにグラビアコーター２１、ダイコーター３、リバ
ースロールコーター２２を用いて塗布し、第１層と第２
層は１００℃で２分間、フローティング形式の乾燥機４
１と４２でそれぞれ乾燥した。その後、第３層を塗布
し、１３０〜３６０℃まで順次温度が高められた複数の
フローティング形式の乾燥器４３および硬化器５を２２
分かけて走行させることにより、乾燥および硬化を行
い、樹脂層の厚み２７μｍの銅張品を巻取り機５で巻取
った。得られた銅張品すなわち、フレキシブルプリント
配線用基板は接着力１．８kg／cm、カールは略平ら、加
熱収縮率０．１％、熱膨張係数が１１×１０-6（１／
Ｋ）と良好なものであった。Example 1 In the apparatus shown in FIG. 1, the copper foil 1 had a first layer of polyamic acid A, a second layer of polyamic acid B, and a third layer of polyamic acid A, each having a film thickness of 8, 17, 2 μm. The gravure coater 21, die coater 3 and reverse roll coater 22 are applied so that
Layer is 100 ° C for 2 minutes, floating dryer 4
Dried at 1 and 42 respectively. After that, the third layer is applied, and a plurality of floating type dryers 43 and curing devices 5 whose temperatures are sequentially increased to 130 to 360 ° C. are used.
It was dried and cured by traveling for minutes, and a copper-clad product having a resin layer thickness of 27 μm was wound by the winding machine 5. The obtained copper-clad product, that is, the flexible printed wiring board had an adhesive force of 1.8 kg / cm, a curl that was substantially flat, a heat shrinkage ratio of 0.1%, and a thermal expansion coefficient of 11 × 10 -6 (1 /
K) was good.
実施例２ 第２図の装置にて、実施例１と同じ層構造をもつよう
に、リバースロールコーター２２、多層ダイコーター８
を用いで塗布した。第１層を１００℃で２分間、フロー
ティング形式の乾燥機４１で乾燥後、第２層と第３層を
同時に塗布し、１３０〜３６０℃まで順次温度が高めら
れた複数のフローティング形式の乾燥器４３および硬化
器５を２２分かけて走行させることにより、乾燥および
硬化を行い、厚み２７μｍの銅張品を巻取り機５で巻取
った。取られた銅張品すなわち、フレキシブルプリント
配線用基板は接着力１．８kg／cm、カールは略平ら、加
熱収縮率０．１％、熱膨張係数が１１×１０-6（１／
Ｋ）と良好なものであった。Embodiment 2 In the apparatus shown in FIG. 2, the reverse roll coater 22 and the multi-layer die coater 8 have the same layer structure as in Embodiment 1.
Was used for coating. After drying the first layer at 100 ° C. for 2 minutes by the floating type drier 41, the second layer and the third layer are simultaneously coated, and a plurality of floating type drier in which the temperature is sequentially increased to 130 to 360 ° C. The copper-clad product having a thickness of 27 μm was wound up by the winding machine 5 by running 43 and the curing device 5 for 22 minutes. The taken copper clad product, that is, the flexible printed wiring board has an adhesive force of 1.8 kg / cm, a curl that is substantially flat, a heat shrinkage rate of 0.1%, and a thermal expansion coefficient of 11 × 10 -6 (1 /
K) was good.
本発明の製造方法によれば、比較的簡易な装置および簡
易な操作で、カールのない、耐熱性や接着性に優れた高
品質のフレキシブルプリント配線用基板を製造すること
ができる。According to the manufacturing method of the present invention, it is possible to manufacture a high-quality flexible printed wiring board that is curl-free and has excellent heat resistance and adhesiveness with a relatively simple device and simple operation.
第１図および第２図は本発明の実施例のフローシートを
示すものである。 １……銅箔、3、8、21、22……コーター 41、42、43……乾燥器、５……硬化器、 ６……巻取り機1 and 2 show a flow sheet of an embodiment of the present invention. 1 ... Copper foil, 3, 8, 21, 22 ... Coater 41, 42, 43 ... Dryer, 5 ... Curing device, 6 ... Winding machine
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−224771（ＪＰ，Ａ) 特開 昭62−234575（ＪＰ，Ａ) 特開 昭62−227473（ＪＰ，Ａ) 特開 昭62−160173（ＪＰ，Ａ) 特開 昭61−257271（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-63-224771 (JP, A) JP-A-62-234575 (JP, A) JP-A-62-227473 (JP, A) JP-A-62- 160173 (JP, A) JP-A-61-257271 (JP, A)
Claims (5)
布、乾燥したのち、連続的に次のポリイミド前駆体樹脂
溶液を塗布、乾燥し、最後に一括して硬化することを特
徴とするフレキシブルプリント配線用基板の製造方法。1. A flexible print characterized in that a polyimide precursor resin solution is applied onto a conductor and dried, then the next polyimide precursor resin solution is applied continuously, dried, and finally cured collectively. Wiring board manufacturing method.
フレキシブルプリント配線用基板の製造方法。2. The method for manufacturing a flexible printed wiring board according to claim 1, wherein coating and drying are performed three times or more.
ミド前駆体樹脂溶液を２層以上に塗布するものである請
求項１又は２記載のフレキシブルプリント配線用基板の
製造方法。3. The method for producing a flexible printed wiring board according to claim 1, wherein at least one application is performed by applying two or more kinds of polyimide precursor resin solutions in two or more layers.
コーター、バーリバースロールコーター、バーコータ
ー、ドクターブレードコーター、ダイコーターおよび多
層ダイコーターからなる群れから選ばれた１種又は２種
以上の塗工機を２つ以上用いて行う請求項１〜３いずれ
かに記載のフレキシブルプリント配線用基板の製造方
法。4. A coating machine comprising one or more coating machines selected from the group consisting of a gravure coater, a reverse roll coater, a bar reverse roll coater, a bar coater, a doctor blade coater, a die coater and a multi-layer die coater. The method for manufacturing a flexible printed wiring board according to claim 1, which is performed by using two or more.
う請求項１〜４いずれかに記載のフレキシブルプリント
配線用基板の製造方法。5. The method for producing a flexible printed wiring board according to claim 1, wherein the drying and curing are performed in a floating manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63334101A JPH0649185B2 (en) | 1988-12-29 | 1988-12-29 | Flexible printed wiring board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63334101A JPH0649185B2 (en) | 1988-12-29 | 1988-12-29 | Flexible printed wiring board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02180682A JPH02180682A (en) | 1990-07-13 |
| JPH0649185B2 true JPH0649185B2 (en) | 1994-06-29 |
Family
ID=18273537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63334101A Expired - Lifetime JPH0649185B2 (en) | 1988-12-29 | 1988-12-29 | Flexible printed wiring board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0649185B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05245433A (en) * | 1992-03-05 | 1993-09-24 | Mitsui Toatsu Chem Inc | Manufacture of flexible metal-polyimide laminated plate |
| JP2005015596A (en) | 2003-06-25 | 2005-01-20 | Shin Etsu Chem Co Ltd | Polyimide-based precursor resin solution composition sheet |
| JP4684566B2 (en) * | 2004-03-25 | 2011-05-18 | 新日鐵化学株式会社 | Laminate for ultrasonic bonding and ultrasonic bonding method using the same |
| JP4684601B2 (en) * | 2004-08-26 | 2011-05-18 | 新日鐵化学株式会社 | Manufacturing method of flexible laminated substrate |
| KR101490400B1 (en) | 2007-03-20 | 2015-02-05 | 가부시키가이샤 가네카 | Film and flexible metal-clad laminate |
| JP5444659B2 (en) * | 2007-08-09 | 2014-03-19 | 東洋紡株式会社 | Processing method for long objects |
| KR101599081B1 (en) | 2007-12-11 | 2016-03-02 | 가부시키가이샤 가네카 | Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit board |
| CN114335404B (en) * | 2021-12-20 | 2023-11-28 | 深圳市华星光电半导体显示技术有限公司 | Preparation method of flexible substrate, flexible substrate and flexible display panel |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5474762A (en) * | 1977-11-28 | 1979-06-15 | Fuji Photo Film Co Ltd | Production of heat-sensitive recording sheet |
| JPS60133787A (en) * | 1983-12-21 | 1985-07-16 | 日立化成工業株式会社 | Method of producing flexible printed circuit board |
| DE3424232A1 (en) * | 1984-06-30 | 1986-01-23 | Akzo Gmbh, 5600 Wuppertal | Flexible polyimide multilayer laminates |
| JPH0741206B2 (en) * | 1985-05-08 | 1995-05-10 | 三菱化学株式会社 | Method for producing cured polyimide resin coating |
| JPS6223475A (en) * | 1985-07-22 | 1987-01-31 | Mitsubishi Electric Corp | Apparatus for forming film |
| JPS62160173A (en) * | 1986-01-08 | 1987-07-16 | Dainippon Screen Mfg Co Ltd | Method for applying polyimide resin |
| JPS62227473A (en) * | 1986-03-28 | 1987-10-06 | Hitachi Chem Co Ltd | Method for improving adhesiveness of polyimide resin |
| JPS63224771A (en) * | 1987-03-16 | 1988-09-19 | Tamura Kaken Kk | Formation of polyimide resin film |
| JP2621880B2 (en) * | 1987-09-25 | 1997-06-18 | 三井東圧化学株式会社 | Flexible metal plastic laminate |
| JP2783389B2 (en) * | 1988-12-22 | 1998-08-06 | 三井化学株式会社 | Method of manufacturing flexible metal foil laminate |
-
1988
- 1988-12-29 JP JP63334101A patent/JPH0649185B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02180682A (en) | 1990-07-13 |
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