JPH0648841Y2 - チップシール供給ノズル - Google Patents
チップシール供給ノズルInfo
- Publication number
- JPH0648841Y2 JPH0648841Y2 JP15592787U JP15592787U JPH0648841Y2 JP H0648841 Y2 JPH0648841 Y2 JP H0648841Y2 JP 15592787 U JP15592787 U JP 15592787U JP 15592787 U JP15592787 U JP 15592787U JP H0648841 Y2 JPH0648841 Y2 JP H0648841Y2
- Authority
- JP
- Japan
- Prior art keywords
- tip seal
- nozzle
- tip
- supply nozzle
- seal supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001154 acute effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 13
- 229910001873 dinitrogen Inorganic materials 0.000 description 13
- 239000007789 gas Substances 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 230000005496 eutectics Effects 0.000 description 8
- 238000007664 blowing Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592787U JPH0648841Y2 (ja) | 1987-10-12 | 1987-10-12 | チップシール供給ノズル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592787U JPH0648841Y2 (ja) | 1987-10-12 | 1987-10-12 | チップシール供給ノズル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0160536U JPH0160536U (en, 2012) | 1989-04-17 |
| JPH0648841Y2 true JPH0648841Y2 (ja) | 1994-12-12 |
Family
ID=31433996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15592787U Expired - Lifetime JPH0648841Y2 (ja) | 1987-10-12 | 1987-10-12 | チップシール供給ノズル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648841Y2 (en, 2012) |
-
1987
- 1987-10-12 JP JP15592787U patent/JPH0648841Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0160536U (en, 2012) | 1989-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5961064B2 (ja) | 吸着テーブルの製造方法並びに吸着テーブル | |
| JPH0982718A (ja) | 微細金属バンプの製造方法および製造装置 | |
| JP2002246347A (ja) | ウェーハの平面加工装置及びその平面加工方法 | |
| JPH0648841Y2 (ja) | チップシール供給ノズル | |
| JP5549399B2 (ja) | 振動子デバイスの作製方法および振動子デバイス | |
| JPH05208390A (ja) | 吸着ノズル | |
| KR200460715Y1 (ko) | 반도체 칩 픽업 장치 | |
| CN112077830B (zh) | 机器人手臂 | |
| JPH0196935A (ja) | チップシール供給装置 | |
| JPH11111740A (ja) | 微小チップの搬送装置 | |
| JP2004152858A (ja) | 半導体製造装置及び方法 | |
| JP2830694B2 (ja) | 半導体装置の実装装置及びその実装方法 | |
| JP2002373919A (ja) | チップ実装装置及びチップ実装方法 | |
| JPH10308431A (ja) | 半導体素子搭載装置 | |
| JP2809066B2 (ja) | 半導体装置の実装装置及びそれに用いられるマウントコレット | |
| JPH10256312A (ja) | ボール吸着ヘッド及びボール実装装置 | |
| JPH11135574A (ja) | 超音波ボンディング用コレットおよびボンディング方法 | |
| JPH1012639A (ja) | ボンディングコレット | |
| JP2550057B2 (ja) | ペレツトボンデイング装置 | |
| JPH0912161A (ja) | 真空吸着機構 | |
| JP4053940B2 (ja) | 微細導電性ボールの収容容器及び収容方法、微細導電性ボールの配列搭載装置及び配列搭載方法 | |
| TW202527177A (zh) | 晶片保持裝置、晶片保持方法、半導體裝置的製造裝置 | |
| JP2008018501A (ja) | ホルダ装置 | |
| JPH03178142A (ja) | ワイヤボンディング装置 | |
| KR101060429B1 (ko) | 초음파 혼 및 이를 구비하는 플립칩 접합 장치 |