JPH0648299U - Surface mount sound generator - Google Patents
Surface mount sound generatorInfo
- Publication number
- JPH0648299U JPH0648299U JP8505192U JP8505192U JPH0648299U JP H0648299 U JPH0648299 U JP H0648299U JP 8505192 U JP8505192 U JP 8505192U JP 8505192 U JP8505192 U JP 8505192U JP H0648299 U JPH0648299 U JP H0648299U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- solder
- legs
- solder connection
- sounding body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
(57)【要約】
【目的】 発音体の表面実装を可能とする。
【構成】 半田接続用端子5を有する発音体1のケーシ
ング2の一面に、脚9を設ける。脚9は、ケーシング2
を実装面上の一定高さ位置に支える立上り高さを有する
ものであり、半田接続用端子5を実装面のクリーム半田
に接続し、脚9を配線基板10上に支持させてケーシン
グ2の支持の安定化を図る。
(57) [Summary] [Purpose] Enables surface mounting of a sounding body. [Structure] A leg 9 is provided on one surface of a casing 2 of a sounding body 1 having a solder connection terminal 5. Leg 9 is casing 2
Has a rising height to support the solder connection terminal 5 on the mounting surface, and the legs 9 are supported on the wiring board 10 to support the casing 2. To stabilize.
Description
【0001】[0001]
本案は、配線基板上に、電気部品の一つとして表面実装する表面実装用発音体 の構造に関する。 The present invention relates to the structure of a surface-mounted sounding body that is surface-mounted as one of electric components on a wiring board.
【0002】[0002]
表面実装は、配線基板上の部品接続位置にクリーム半田を塗布し、次いで、各 位置に抵抗,コンデンサ,半導体素子などの電子部品を搭載し、クリーム半田を 加熱溶融させて各配線に部品を電気的に接続する手法であり、表面実装用部品は 、図3に示すように通常、部品11の底面,側面に半田接続用端子12を有して いる。部品11の側面に半田接続用端子12を有するものは、部品の底面と同一 平面に設けられ、底面に半田接続用端子12を有するものは、端子の厚み分だけ 部品11の底面に段差が形成されることになる。 In surface mounting, cream solder is applied to the component connection positions on the wiring board, then electronic components such as resistors, capacitors, and semiconductor elements are mounted at each position, and the cream solder is heated and melted to electrically connect the components to each wiring. As shown in FIG. 3, the surface mounting component usually has solder connection terminals 12 on the bottom and side faces of the component 11. The component 11 having the solder connection terminal 12 on the side surface is provided on the same plane as the bottom surface of the component, and the component 11 having the solder connection terminal 12 on the bottom surface has a step on the bottom surface of the component 11 by the thickness of the terminal. Will be done.
【0003】 発音体は、振動子を内蔵した電気部品であり、圧電型と電磁型とに大別される が、いずれの発音体も機能上の制約から抵抗器,コンデンサなどの部品に比して 大型とならざるを得ない。従来、発音体の配線基板への取付けは、専ら、配線基 板に開口した孔内に端子を差し込んで半田接続を行うのが通例であり、表面実装 される例はほとんどなかった。The sounding body is an electric component having a built-in vibrator, and is roughly classified into a piezoelectric type and an electromagnetic type. However, both sounding units are more functional than the resistors and capacitors because of functional restrictions. Inevitably becomes large. Conventionally, it has been customary to attach a sounding body to a wiring board only by inserting a terminal into a hole opened in a wiring board for solder connection, and there has been almost no case where surface mounting is performed.
【0004】[0004]
発音体は、通常ケーシングが円筒形であり、図4のように、そのケーシング2 の底面に半田接続用端子5を設けたときには、ケーシング2の底面と、半田接続 用端子5間に約0.2mm程度の段差が形成されることになり、この端子5を配 線基板10上に実装して半田接続したときには、図4に示すように支持の安定性 が得られない。殊に、表面実装では、配線基板10上に盛り付けたクリーム半田 上に端子5を接続するものであるため、ケーシング2の底面全面が基板上に安定 に着座するとは限らないから、半田接続用端子5をケーシング2の側方に張り出 して底面と端子面とを同一平面にしても安定に表面実装されるという保証はない 。発音体1が基板10上に安定に支持されないときには、発音した音圧が不安定 になる。 The sounding body usually has a cylindrical casing, and when the solder connecting terminal 5 is provided on the bottom surface of the casing 2 as shown in FIG. Since a step of about 2 mm is formed, when this terminal 5 is mounted on the wiring board 10 and soldered, the stability of support cannot be obtained as shown in FIG. Particularly, in the surface mounting, since the terminals 5 are connected to the cream solder put on the wiring board 10, the entire bottom surface of the casing 2 does not always sit on the board in a stable manner. There is no guarantee that the surface mounting will be stable even if 5 is extended to the side of the casing 2 and the bottom surface and the terminal surface are flush with each other. When the sounding body 1 is not stably supported on the substrate 10, the sound pressure generated is unstable.
【0005】 本案の目的は、配線基板上に安定に実装しうる表面実装用発音体を提供するこ とにある。An object of the present invention is to provide a surface mount sounding body that can be stably mounted on a wiring board.
【0006】[0006]
上記目的を達成するため、本案による表面実装用発音体においては、半田接続 用端子と、脚とをケーシングに有し、振動子を内蔵した表面実装用発音体であっ て、 半田接続用端子は、振動子を外部回路に接続するものであり、対をなしてケー シングの一面に設けられ、 脚は、ケーシングを実装面上の一定の高さ位置に支える立上り高さを有し、半 田接続用端子と同じ面に形成され、 脚の立上り高さは、半田接続用端子を実装面の配線上に盛り付けられたクリー ム半田の立上り高さの範囲内に設定したものである。 In order to achieve the above-mentioned object, the surface-mounting speaker according to the present invention is a surface-mounting speaker that has a solder connecting terminal and legs in a casing and has a built-in vibrator. , Which connects the oscillator to an external circuit, is provided in pairs on one side of the casing, and the legs have a rising height that supports the casing at a fixed height position on the mounting surface. It is formed on the same surface as the connection terminals, and the rising height of the legs is set within the range of the rising height of the cream solder placed on the wiring on the mounting surface.
【0007】[0007]
ケーシングの脚を配線基板上に設置すると、脚の立上り高さ分だけ、基板とケ ーシング間に隙間が形成され、この隙間内に半田接続用端子が位置する。配線基 板と半田接続用端子との間隔は、0.05〜0.15mmの範囲に設定するのが 適当である。配線基板上に盛り付けられたクリーム半田は、半田接続用端子に付 着して固化定着し、ケーシングは、脚に支えられて配線基板上に安定に実装され る。 When the legs of the casing are installed on the wiring board, a gap is formed between the substrate and the casing by the rising height of the legs, and the solder connection terminals are located in this gap. The distance between the wiring board and the solder connection terminal is suitably set in the range of 0.05 to 0.15 mm. The cream solder placed on the wiring board is attached to the solder connection terminals and solidified and fixed, and the casing is supported by the legs and stably mounted on the wiring board.
【0008】[0008]
以下に本案を圧電型発音体に適用した例について、実施例を図によって説明す る。図1において、発音体1は、ケーシング2内に圧電振動子3を収容し、接触 子4に設けた半田接続用端子5の対をケーシング2の底面に有するものである。 ケーシング2は、筒体6と底板7との組合せであり、圧電振動子3は、筒体6の 環状縁6aに周縁部が支持され、接触子4の対は、圧電振動子3の振動板3aと 、該振動板3aの下面に設けた圧電素子3bとにそれぞれ接触させて底板7に支 持させ、その端子を底板7の下面に折返して定着させたものである。接触子の端 子は、半田接続用端子5である。筒体6の上面には発音用の放音孔8が開口され ている。 An example in which the present invention is applied to a piezoelectric speaker will be described below with reference to the drawings. In FIG. 1, a sounding body 1 has a casing 2 in which a piezoelectric vibrator 3 is housed, and a pair of solder connection terminals 5 provided on a contact 4 is provided on the bottom surface of the casing 2. The casing 2 is a combination of a tubular body 6 and a bottom plate 7, the piezoelectric vibrator 3 has a peripheral edge portion supported by an annular edge 6a of the tubular body 6, and the pair of contacts 4 is a vibration plate of the piezoelectric vibrator 3. 3a and a piezoelectric element 3b provided on the lower surface of the vibrating plate 3a are brought into contact with each other and supported by the bottom plate 7, and their terminals are folded and fixed to the lower surface of the bottom plate 7. The terminal of the contactor is the solder connection terminal 5. A sound emitting hole 8 for sounding is opened on the upper surface of the cylindrical body 6.
【0009】 本案は、半田接続用端子5を設けたケーシング2の底面を形成する底板7の周 縁部に、脚9を突設したものである。脚9は、ケーシング2を安定に支えるもの であり、その数,大きさは限定されるものではないが、2以上に分割し、さらに 図2のように底板7の周縁要所に分散させて一体形成するのが好ましい。In the present invention, legs 9 are provided so as to protrude from the peripheral portion of a bottom plate 7 forming the bottom surface of the casing 2 provided with the solder connection terminals 5. The legs 9 support the casing 2 in a stable manner, and the number and size of the legs 9 are not limited, but the legs 9 are divided into two or more, and further dispersed on the peripheral portion of the bottom plate 7 as shown in FIG. It is preferably formed integrally.
【0010】 脚9の立上り高さは、配線基板10上に盛り付けられるクリーム半田の盛り付 け高さとの関係で自ずから制約がある。半田接続用端子5は、約0.2mmの薄 板であり、ケーシング2の底板7の底面に重ねて設けられるものであるため、ケ ーシング2の底と、半田接続用端子5との間には約0.2mmの段差が形成され る。一方、配線基板10の配線上に盛り付けられるクリーム半田の高さは約0. 25〜0.3mm程度であるため、脚9の立上り高さは、実装面と、半田接続用 端子5との間隔が0.05〜0.15mmになるようにその高さを設定する。The rising height of the leg 9 is naturally limited in relation to the height of the cream solder applied on the wiring board 10. Since the solder connection terminal 5 is a thin plate of about 0.2 mm and is provided so as to overlap the bottom surface of the bottom plate 7 of the casing 2, the solder connection terminal 5 is provided between the bottom of the casing 2 and the solder connection terminal 5. Has a step of about 0.2 mm. On the other hand, the height of the cream solder placed on the wiring of the wiring board 10 is about 0. Since it is about 25 to 0.3 mm, the rising height of the leg 9 is set so that the distance between the mounting surface and the solder connection terminal 5 is 0.05 to 0.15 mm.
【0011】 実施例において、配線基板10の配線上の所定位置に発音体1を搭載し、配線 上に盛り付けられたクリーム半田に半田接続用端子5を位置させ、加熱処理によ りクリーム半田を溶融させて該端子5を浸し、半田の固化を待って実装を完了す る。その要領は、一般の電気部品の表面実装の要領と全く同じである。本案によ れば、発音体1は、端子5が基板10上に配線に半田接続され、且つケーシング 2は、脚9上に支えられて基板10上に安定に固定される。In the embodiment, the sounding body 1 is mounted at a predetermined position on the wiring of the wiring board 10, the solder connection terminal 5 is positioned on the cream solder arranged on the wiring, and the cream solder is heated by the heat treatment. The terminal 5 is melted and dipped, and the solder is solidified to complete the mounting. The procedure is exactly the same as the procedure for surface mounting general electrical components. According to the present invention, in the sounding body 1, the terminals 5 are solder-connected to the wiring on the substrate 10, and the casing 2 is supported on the legs 9 and stably fixed on the substrate 10.
【0012】 以上、実施例においては、圧電型発音体に適用した例を説明したが、電磁型な どの他の発音体にも全く同様に適用できる。In the above, the example applied to the piezoelectric type sounding body has been described, but the same can be applied to other sounding type such as electromagnetic type.
【0013】[0013]
以上のように本案によるときには、発音体は、脚に支えられて配線基板上に安 定に固定され、半田接続用端子は、配線上に盛り付けられたクリーム半田の立上 り高さの範囲内に支持させたため、実装時に溶融半田の盛り上り内に埋め込むこ とが可能となり、半田の固化後は、確実に接触させて配線と電気的に接続するこ とができ、半田接続用端子に重量をかけずに発音体を基板上に安定に固定できる ため、発音時の音圧を安定に保って発音体の表面実装を実現できる効果を有する 。 As described above, according to the present proposal, the sounding body is supported by the legs and stably fixed on the wiring board, and the solder connection terminals are within the rising height range of the cream solder arranged on the wiring. Since it is supported on the solder connection terminal, it can be embedded in the swell of the molten solder during mounting, and after solidification of the solder, it can be surely contacted and electrically connected to the wiring. Since the sounding body can be stably fixed on the board without applying pressure, the sound pressure during sounding can be stably maintained and the surface mounting of the sounding body can be realized.
【図1】本案の一実施例を示す断面正面図である。FIG. 1 is a sectional front view showing an embodiment of the present invention.
【図2】本案の一実施例を示す平面図である。FIG. 2 is a plan view showing an embodiment of the present invention.
【図3】表面実装部品の例を示す図である。FIG. 3 is a diagram showing an example of surface mount components.
【図4】発音体を表面実装する場合の問題点を示す図で
ある。FIG. 4 is a diagram showing a problem when a sounding body is surface-mounted.
1 発音体 2 ケーシング 3 圧電振動子 4 接触子 5 半田接続用端子 6 筒体 7 底板 8 放音孔 9 脚 10 配線基板 1 Sounding body 2 Casing 3 Piezoelectric vibrator 4 Contact 5 Solder connection terminal 6 Cylindrical body 7 Bottom plate 8 Sound emission hole 9 Leg 10 Wiring board
Claims (1)
有し、振動子を内蔵した表面実装用発音体であって、 半田接続用端子は、振動子を外部回路に接続するもので
あり、対をなしてケーシングの一面に設けられ、 脚は、ケーシングを実装面上の一定の高さ位置に支える
立上り高さを有し、半田接続用端子と同じ面に形成さ
れ、 脚の立上り高さは、半田接続用端子を実装面の配線上に
盛り付けられたクリーム半田の立上り高さの範囲内に設
定したものであることを特徴とする表面実装用発音体。1. A surface mount sounding body having a solder connecting terminal and legs in a casing, and a vibrator incorporated therein, the solder connecting terminal connecting the vibrator to an external circuit. , The pair of legs are provided on one surface of the casing, and the legs have a rising height that supports the casing at a certain height position on the mounting surface and are formed on the same surface as the solder connection terminals. The surface-mounted sound-producing body is characterized in that the solder connection terminals are set within the rising height range of the cream solder placed on the wiring of the mounting surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992085051U JP2599075Y2 (en) | 1992-12-10 | 1992-12-10 | Sound generator for surface mounting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992085051U JP2599075Y2 (en) | 1992-12-10 | 1992-12-10 | Sound generator for surface mounting |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0648299U true JPH0648299U (en) | 1994-06-28 |
JP2599075Y2 JP2599075Y2 (en) | 1999-08-30 |
Family
ID=13847868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1992085051U Expired - Fee Related JP2599075Y2 (en) | 1992-12-10 | 1992-12-10 | Sound generator for surface mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2599075Y2 (en) |
-
1992
- 1992-12-10 JP JP1992085051U patent/JP2599075Y2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2599075Y2 (en) | 1999-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |