JP3270016B2 - Piezoelectric sounding body for surface mounting and method of manufacturing piezoelectric sounding body - Google Patents
Piezoelectric sounding body for surface mounting and method of manufacturing piezoelectric sounding bodyInfo
- Publication number
- JP3270016B2 JP3270016B2 JP02594499A JP2594499A JP3270016B2 JP 3270016 B2 JP3270016 B2 JP 3270016B2 JP 02594499 A JP02594499 A JP 02594499A JP 2594499 A JP2594499 A JP 2594499A JP 3270016 B2 JP3270016 B2 JP 3270016B2
- Authority
- JP
- Japan
- Prior art keywords
- solder connection
- connection terminals
- casing
- bottom plate
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Piezo-Electric Transducers For Audible Bands (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、圧電振動子がケー
シングの内部に配置された表面実装用圧電型発音体及び
その製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounted piezoelectric sounding body in which a piezoelectric vibrator is disposed inside a casing, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来の一般的な圧電型発音体は、ケーシ
ングの内部に配置された圧電振動子の振動板と圧電素子
の電極とにそれぞれ一端が接続された一対のリード線
が、ケーシングの外部に引き出された構造を有してい
る。またケーシングに端子が固定されたものもあるが、
圧電振動子と端子とはリード線を利用して接続されてい
る。2. Description of the Related Art In a conventional general piezoelectric sounding body, a pair of lead wires, one ends of which are respectively connected to a vibration plate of a piezoelectric vibrator and an electrode of a piezoelectric element arranged inside a casing, are formed by a pair of lead wires. It has a structure drawn out. In some cases, the terminals are fixed to the casing,
The piezoelectric vibrator and the terminal are connected using a lead wire.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら従来は、
表面実装される圧電型発音体はほとんどなかった。また
従来の構造では、圧電振動子に対してリード線を半田付
けしなければならず、製造が面倒であった。However, conventionally,
There were almost no piezoelectric sounders mounted on the surface. Further, in the conventional structure, the lead wire has to be soldered to the piezoelectric vibrator, and the production is troublesome.
【０００４】本発明の目的は、製造が容易な表面実装用
圧電型発音体を提供することにある。An object of the present invention is to provide a surface-mounting piezoelectric sounding body which is easy to manufacture.
【０００５】[0005]
【課題を解決するための手段】本発明は、振動板に圧電
素子が設けられた圧電振動子がケーシングの内部に収納
されている表面実装用圧電型発音体である。本発明にお
いては、ケーシングを放音孔、振動板及び圧電素子を有
する筒体と、該筒体と組み合わされる底板とから構成
し、ケーシングの外部に一対の半田接続用端子を設け
る。そしてケーシングの内部には、一端が振動板と接触
し他端が一対の半田接続用端子の一方に接続された第１
の接触子と、一端が圧電素子と接触し他端が一対の半田
接続用端子の他方に接続された第２の接触子とを配置す
る。更に一対の半田接続用端子と第１及び第２の接触子
を連結する連結部分を筒体と底板との間に挟持する。そ
して半田接続用端子と連結部分とで底板の周縁部の一部
を挟むようにしている。SUMMARY OF THE INVENTION The present invention is a surface-mounted piezoelectric sounding body in which a piezoelectric vibrator having a piezoelectric element provided on a diaphragm is housed inside a casing. In the present invention, the casing is constituted by a cylinder having a sound emission hole, a diaphragm and a piezoelectric element , and a bottom plate combined with the cylinder, and a pair of solder connection terminals is provided outside the casing. In the inside of the casing, a first end is in contact with the diaphragm and the other end is connected to one of a pair of solder connection terminals.
And a second contact having one end in contact with the piezoelectric element and the other end connected to the other of the pair of solder connection terminals. Further, a connecting portion for connecting the pair of solder connection terminals and the first and second contacts is sandwiched between the cylindrical body and the bottom plate. Then, a part of the peripheral portion of the bottom plate is sandwiched between the solder connection terminal and the connection portion.
【０００６】このような構成にすると、半田接続用端子
と圧電振動子との電気的な接続に半田付けを用いる必要
がなくなるため、製造が容易になる。特に本発明では、
半田接続用端子と連結部分との間で底板の周縁部を挟む
構造にしているので、製品の組立の際に端子を底板に仮
固定することができ、製品の組立が容易になる利点があ
る。[0006] With this configuration, it is not necessary to use soldering for the electrical connection between the solder connection terminal and the piezoelectric vibrator, thereby facilitating the manufacture. In particular, in the present invention,
Since the peripheral portion of the bottom plate is sandwiched between the solder connection terminal and the connection portion, the terminal can be temporarily fixed to the bottom plate at the time of assembling the product, and there is an advantage that the product is easily assembled. .
【０００７】[0007]
【発明の実施の形態】以下に本発明の実施の形態の一例
を詳細に説明する。図１に示すように、実施の形態の圧
電型発音体１では、ケーシング２内部に圧電振動子３が
収容されている。そして一対の接触子４にそれぞれ一体
に設けられた一対の半田接続用端子５が、ケーシング２
の外部の底面に配置されている。ケーシング２は、上壁
部を有する筒体６と底壁部を有する底板７とが組合され
て構成されている。圧電振動子３は、筒体６の環状の周
壁部６ａの内部に形成された環状のリブに周縁部が支持
された状態でケーシング２内に配置されている。一対の
接触子４，４の一端は、圧電振動子３の振動板３ａと、
該振動板３ａの下面に設けた圧電素子３ｂとにそれぞれ
接触しており、他端は半田接続用端子５と一体に連結さ
れている。一対の半田接続用端子５，５と第１及び第２
の接触子４，４を連結する連結部分は、筒体６の周壁部
６ａの開口部側端面と底板７との間に挟持された状態に
なっていて、底板７に支持されている。そして半田接続
用端子５は、底板７の外面に沿って折返されてその下面
に沿って定着している。その結果、図に示されるよう
に、半田接続用端子５，５と前述の連結部分との間に底
板７の周縁部の一部が挟まれた状態になって、端子が底
板７に対して固定されている。端子が固定された底板７
に対して組み合わされる筒体６の上壁部には発音用の放
音孔８が開口している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an example of an embodiment of the present invention will be described in detail. As shown in FIG. 1, in the piezoelectric sounding body 1 of the embodiment, a piezoelectric vibrator 3 is housed inside a casing 2. Then, a pair of solder connection terminals 5 provided integrally with the pair of contacts 4, respectively,
It is located on the bottom surface outside. The casing 2 includes a cylindrical body 6 having an upper wall and a bottom plate 7 having a bottom wall. The piezoelectric vibrator 3 is arranged in the casing 2 in a state where the peripheral edge is supported by an annular rib formed inside the annular peripheral wall 6 a of the cylindrical body 6. One end of the pair of contacts 4, 4 is connected to the diaphragm 3a of the piezoelectric vibrator 3,
The other end is in contact with the piezoelectric element 3b provided on the lower surface of the vibration plate 3a, and the other end is integrally connected to the solder connection terminal 5. A pair of solder connection terminals 5, 5 and first and second
The connecting portion for connecting the contacts 4, 4 is sandwiched between the end face on the opening side of the peripheral wall portion 6a of the cylindrical body 6 and the bottom plate 7, and is supported by the bottom plate 7. The solder connection terminal 5 is folded back along the outer surface of the bottom plate 7 and is fixed along the lower surface. As a result, as shown in the figure, a part of the peripheral portion of the bottom plate 7 is sandwiched between the solder connection terminals 5 and 5 and the above-described connection portion, and the terminal is moved with respect to the bottom plate 7. Fixed. Bottom plate 7 with fixed terminals
A sound emission hole 8 for sound generation is opened in the upper wall portion of the cylindrical body 6 combined with.
【０００８】半田接続用端子５を設けたケーシング２の
底面を形成する底板７の下面には、４つの脚９が突設さ
れている。これらの脚９は、ケーシング２を安定に支え
るものであり、その数，大きさは限定されるものではな
い。この例のように、２以上に分割し、さらに図２のよ
うに底板７の下面の周縁に沿って要所に分散させて底板
７と一体形成するのが好ましい。On the lower surface of the bottom plate 7 forming the bottom surface of the casing 2 provided with the solder connection terminals 5, four legs 9 are protruded. These legs 9 support the casing 2 stably, and the number and size thereof are not limited. As in this example, it is preferable to divide into two or more parts and further disperse them at important points along the periphery of the lower surface of the bottom plate 7 as shown in FIG.
【０００９】脚９の立上り高さは、配線基板上に盛り付
けられるクリーム半田の盛り付け高さとの関係で自ずか
ら制約がある。半田接続用端子５は、約０．２ｍｍの薄
板であり、ケーシング２の底板７の底面に重ねて設けら
れるものであるため、ケーシング２の底と、半田接続用
端子５との間には約０．２ｍｍの段差が形成される。一
方、配線基板の配線上に盛り付けられるクリーム半田の
高さは約０．２５〜０．３ｍｍ程度であるため、脚９の
立上り高さは、実装面と、半田接続用端子５との間隔が
０．０５〜０．１５ｍｍになるようにその高さを設定す
る。このようにケーシングの脚の先端を配線基板上に接
触させると、脚の立上り高さ分だけ、基板とケーシング
間に隙間が形成され、この隙間内に半田接続用端子が位
置することになる。その結果、配線基板上に盛り付けら
れたクリーム半田は、半田接続用端子に付着して固化定
着し、ケーシングは、脚に支えられて配線基板上に安定
に実装される。The rising height of the legs 9 is naturally limited by the relationship with the height of the cream solder to be mounted on the wiring board. The solder connection terminal 5 is a thin plate having a thickness of about 0.2 mm and is provided so as to overlap the bottom surface of the bottom plate 7 of the casing 2. A step of 0.2 mm is formed. On the other hand, since the height of the cream solder applied on the wiring of the wiring board is about 0.25 to 0.3 mm, the rising height of the leg 9 is determined by the distance between the mounting surface and the solder connection terminal 5. The height is set so as to be 0.05 to 0.15 mm. When the ends of the legs of the casing are brought into contact with the wiring board in this manner, a gap is formed between the board and the casing by the rising height of the legs, and the solder connection terminal is located in this gap. As a result, the cream solder applied on the wiring board adheres to the solder connection terminals and solidifies and fixes, and the casing is supported on the legs and stably mounted on the wiring board.
【００１０】この例において、配線基板の配線上の所定
位置に発音体１を搭載し、配線上に盛り付けられたクリ
ーム半田に半田接続用端子５を位置させ、加熱処理によ
りクリーム半田を溶融させて該端子５を浸し、半田の固
化を待って実装を完了する。その要領は、一般の電気部
品の表面実装の要領と全く同じである。本発明によれ
ば、発音体１は、端子５が基板１０上の配線に半田接続
され、且つケーシング２は、脚９上に支えられて基板１
０に安定に固定される。In this example, the sounding body 1 is mounted at a predetermined position on the wiring of the wiring board, the solder connection terminal 5 is positioned on the cream solder provided on the wiring, and the cream solder is melted by a heat treatment. The terminals 5 are immersed and the mounting is completed after the solidification of the solder. The procedure is exactly the same as the procedure for surface mounting of general electric components. According to the present invention, in the sounding body 1, the terminal 5 is soldered to the wiring on the board 10, and the casing 2 is supported on the legs 9 and
It is stably fixed to 0.
【００１１】以上のように本発明によると、発音体は、
脚に支えられて配線基板上に安定に固定され、半田接続
用端子は、配線上に盛り付けられたクリーム半田の立上
り高さの範囲内に支持させたため、実装時に溶融半田の
盛り上り内に埋め込むことが可能となり、半田の固化後
は、確実に接触させて配線と電気的に接続することがで
き、半田接続用端子に重量をかけずに発音体を基板上に
安定に固定できるため、発音時の音圧を安定に保って発
音体の表面実装を実現できる効果を有する。As described above, according to the present invention, the sounding body is:
It is supported on the legs and fixed stably on the wiring board, and the solder connection terminals are supported within the range of the rising height of the cream solder placed on the wiring, so they are embedded in the rise of the molten solder during mounting After solidification of the solder, it can be securely contacted and electrically connected to the wiring, and the sounding body can be stably fixed on the board without putting weight on the solder connection terminals, This has the effect that the surface mounting of the sounding body can be realized while keeping the sound pressure at the time stable.
【００１２】[0012]
【発明の効果】本発明によれば、半田接続用端子と圧電
振動子との電気的な接続に半田付けを用いる必要がなく
なるため、製造が容易になる。特に本発明では、半田接
続用端子と連結部分との間で底板の周縁部の一部を挟む
構造にしているので、製品の組立の際に端子を底板に仮
固定することができ、製品の組立が容易になる利点があ
る。According to the present invention, it is not necessary to use soldering for the electrical connection between the solder connection terminal and the piezoelectric vibrator, thereby facilitating the manufacture. Particularly, in the present invention, since a part of the peripheral edge of the bottom plate is sandwiched between the solder connection terminal and the connection portion, the terminal can be temporarily fixed to the bottom plate at the time of assembling the product, and There is an advantage that the assembly is easy.
【図１】本発明の実施の形態の一例を示す断面正面図で
ある。FIG. 1 is a sectional front view showing an example of an embodiment of the present invention.
【図２】実施の形態の底面図である。FIG. 2 is a bottom view of the embodiment.
１ 発音体 ２ ケーシング ３ 圧電振動子 ４ 接触子 ５ 半田接続用端子 ６ 筒体 ７ 底板 ８ 放音孔 ９ 脚 REFERENCE SIGNS LIST 1 sounding body 2 casing 3 piezoelectric vibrator 4 contactor 5 terminal for solder connection 6 cylinder 7 bottom plate 8 sound emission hole 9 leg
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−215300（ＪＰ，Ａ) 実開 昭62−10598（ＪＰ，Ｕ) 実開 昭61−21199（ＪＰ，Ｕ) 実開 平３−28825（ＪＰ，Ｕ) 実開 昭62−141213（ＪＰ，Ｕ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-215300 (JP, A) JP-A 62-10598 (JP, U) JP-A 61-21199 (JP, U) JP-A 3-21 28825 (JP, U) Japanese Utility Model Showa 62-141213 (JP, U)
Claims (2)
けられた圧電振動子（３）がケーシング（２）の内部に
収納されている表面実装用圧電型発音体であって、 前記ケーシング（２）は、放音孔（８）、振動板（３
ａ）及び圧電素子（３ｂ）を有する筒体（６）と、該筒
体（６）と組み合わされる底板（７）とから構成され、 前記ケーシングの外部には一対の半田接続用端子（５，
５）が設けられ、 前記ケーシングの内部には、一端が前記振動板（３ａ）
と接触し他端が前記一対の半田接続用端子（５，５）の
一方に接続された第１の接触子（４）及び一端が前記圧
電素子（３ｂ）と接触し他端が前記一対の半田接続用端
子（５，５）の他方に接続された第２の接触子（４）が
配置され、 前記一対の半田接続用端子（５，５）と前記第１及び第
２の接触子（４，４）とを連結する連結部分が前記筒体
（６）と前記底板（７）との間に挟持され、 前記半田接続用端子（５，５）と前記連結部分とで前記
底板（７）の周縁部の一部を挟んでいることを特徴とす
る表面実装用圧電型発音体。1. A surface mounted piezoelectric sounding body in which a piezoelectric vibrator (3) having a piezoelectric element (3b) provided on a vibration plate (3a) is housed inside a casing (2). The casing (2) has a sound emission hole (8) and a diaphragm (3).
a) and a cylindrical body (6) having a piezoelectric element (3b) , and a bottom plate (7) combined with the cylindrical body (6). A pair of solder connection terminals (5, 5) are provided outside the casing.
5) is provided, and one end of the diaphragm (3a) is provided inside the casing.
And the other end is connected to one of the pair of solder connection terminals (5, 5) and the other end is in contact with the piezoelectric element (3b), and the other end is connected to the pair of solder connection terminals (5, 5). A second contact (4) connected to the other of the solder connection terminals (5, 5) is disposed, and the pair of solder connection terminals (5, 5) and the first and second contacts (5). 4, 4) is sandwiched between the cylindrical body (6) and the bottom plate (7), and the solder connection terminals (5, 5) and the connection portion are connected to the bottom plate (7). 2.) A piezoelectric sounding body for surface mounting, characterized by sandwiching a part of the peripheral edge of (1).
けられた圧電振動子（３）がケーシング（２）の内部に
収納されている圧電型発音体の製造方法であって、 前記ケーシング（２）は、放音孔（８）、振動板（３
ａ）及び圧電素子（３ｂ）を有する筒体（６）と、該筒
体（６）と組み合わされる底板（７）とから構成され、 前記ケーシングの外部には一対の半田接続用端子（５，
５）が設けられ、 前記ケーシングの内部には、一端が前記振動板（３ａ）
と接触し他端が前記一対の半田接続用端子（５，５）の
一方に接続された第１の接触子（４）及び一端が前記圧
電素子（３ｂ）と接触し他端が前記一対の半田接続用端
子（５，５）の他方に接続された第２の接触子（４）が
配置され、 前記一対の半田接続用端子（５，５）と前記第１及び第
２の接触子（４，４）とを連結する連結部分が前記筒体
（６）と前記底板（７）との間に挟持され、 前記半田接続用端子（５，５）と前記連結部分とが、前
記底板（７）の周縁部の一部を挟む構造を構成してお
り、 前記半田接続用端子（５，５）と前記連結部分とで前記
底板（７）の周縁部の一部を挟んだ状態で、前記底板に
前記筒体を組み合わせることを特徴とする圧電発音体の
製造方法。2. A method for manufacturing a piezoelectric sounding body, wherein a piezoelectric vibrator (3) in which a piezoelectric element (3b) is provided on a vibration plate (3a) is housed inside a casing (2). The casing (2) has a sound emission hole (8) and a diaphragm (3).
a) and a cylindrical body (6) having a piezoelectric element (3b) , and a bottom plate (7) combined with the cylindrical body (6). A pair of solder connection terminals (5, 5) are provided outside the casing.
5) is provided, and one end of the diaphragm (3a) is provided inside the casing.
And the other end is connected to one of the pair of solder connection terminals (5, 5) and the other end is in contact with the piezoelectric element (3b), and the other end is connected to the pair of solder connection terminals (5, 5). A second contact (4) connected to the other of the solder connection terminals (5, 5) is disposed, and the pair of solder connection terminals (5, 5) and the first and second contacts (5). 4, 4) is sandwiched between the cylindrical body (6) and the bottom plate (7), and the solder connection terminals (5, 5) and the connection portion are connected to the bottom plate (5). constitute a structure sandwiching a portion of the periphery of the 7), in a state sandwiching the part of the peripheral portion of the solder connection terminals (the bottom plate at 5,5) and the connecting portion (7), A method for manufacturing a piezoelectric sounding body, comprising combining the cylindrical body with the bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02594499A JP3270016B2 (en) | 1999-02-03 | 1999-02-03 | Piezoelectric sounding body for surface mounting and method of manufacturing piezoelectric sounding body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02594499A JP3270016B2 (en) | 1999-02-03 | 1999-02-03 | Piezoelectric sounding body for surface mounting and method of manufacturing piezoelectric sounding body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000023287A JP2000023287A (en) | 2000-01-21 |
| JP3270016B2 true JP3270016B2 (en) | 2002-04-02 |
Family
ID=12179877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02594499A Expired - Fee Related JP3270016B2 (en) | 1999-02-03 | 1999-02-03 | Piezoelectric sounding body for surface mounting and method of manufacturing piezoelectric sounding body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3270016B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102761812A (en) * | 2012-08-06 | 2012-10-31 | 东莞思威特电子有限公司 | Piezoelectric squealer structure for improving sound pressure value |
-
1999
- 1999-02-03 JP JP02594499A patent/JP3270016B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000023287A (en) | 2000-01-21 |
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