JPH0646637Y2 - ペースト状はんだ - Google Patents
ペースト状はんだInfo
- Publication number
- JPH0646637Y2 JPH0646637Y2 JP1990045396U JP4539690U JPH0646637Y2 JP H0646637 Y2 JPH0646637 Y2 JP H0646637Y2 JP 1990045396 U JP1990045396 U JP 1990045396U JP 4539690 U JP4539690 U JP 4539690U JP H0646637 Y2 JPH0646637 Y2 JP H0646637Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- solder
- solder particles
- paste
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 136
- 239000002245 particle Substances 0.000 claims description 88
- 238000002844 melting Methods 0.000 claims description 79
- 230000008018 melting Effects 0.000 claims description 76
- 230000004907 flux Effects 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045396U JPH0646637Y2 (ja) | 1990-04-28 | 1990-04-28 | ペースト状はんだ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045396U JPH0646637Y2 (ja) | 1990-04-28 | 1990-04-28 | ペースト状はんだ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH046392U JPH046392U (enrdf_load_stackoverflow) | 1992-01-21 |
| JPH0646637Y2 true JPH0646637Y2 (ja) | 1994-11-30 |
Family
ID=31559534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990045396U Expired - Lifetime JPH0646637Y2 (ja) | 1990-04-28 | 1990-04-28 | ペースト状はんだ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0646637Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020046627A1 (en) | 1998-06-10 | 2002-04-25 | Hitoshi Amita | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01271094A (ja) * | 1988-04-20 | 1989-10-30 | Aiwa Co Ltd | ペースト状ハンダ |
-
1990
- 1990-04-28 JP JP1990045396U patent/JPH0646637Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH046392U (enrdf_load_stackoverflow) | 1992-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |