JPH0646014Y2 - 発光表示装置 - Google Patents

発光表示装置

Info

Publication number
JPH0646014Y2
JPH0646014Y2 JP1988103719U JP10371988U JPH0646014Y2 JP H0646014 Y2 JPH0646014 Y2 JP H0646014Y2 JP 1988103719 U JP1988103719 U JP 1988103719U JP 10371988 U JP10371988 U JP 10371988U JP H0646014 Y2 JPH0646014 Y2 JP H0646014Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting display
light
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988103719U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0225119U (enrdf_load_stackoverflow
Inventor
正信 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takiron Co Ltd
Original Assignee
Takiron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takiron Co Ltd filed Critical Takiron Co Ltd
Priority to JP1988103719U priority Critical patent/JPH0646014Y2/ja
Publication of JPH0225119U publication Critical patent/JPH0225119U/ja
Application granted granted Critical
Publication of JPH0646014Y2 publication Critical patent/JPH0646014Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP1988103719U 1988-08-04 1988-08-04 発光表示装置 Expired - Lifetime JPH0646014Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988103719U JPH0646014Y2 (ja) 1988-08-04 1988-08-04 発光表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988103719U JPH0646014Y2 (ja) 1988-08-04 1988-08-04 発光表示装置

Publications (2)

Publication Number Publication Date
JPH0225119U JPH0225119U (enrdf_load_stackoverflow) 1990-02-19
JPH0646014Y2 true JPH0646014Y2 (ja) 1994-11-24

Family

ID=31334800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988103719U Expired - Lifetime JPH0646014Y2 (ja) 1988-08-04 1988-08-04 発光表示装置

Country Status (1)

Country Link
JP (1) JPH0646014Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008007473A1 (fr) * 2006-07-12 2008-01-17 Sharp Kabushiki Kaisha Élément optique, dispositif d'éclairage pour dispositif d'affichage, et dispositif d'affichage

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
US10475372B2 (en) * 2016-12-28 2019-11-12 Mitsubishi Electric Corporation Light-emitting unit, display device, and multi-display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008007473A1 (fr) * 2006-07-12 2008-01-17 Sharp Kabushiki Kaisha Élément optique, dispositif d'éclairage pour dispositif d'affichage, et dispositif d'affichage

Also Published As

Publication number Publication date
JPH0225119U (enrdf_load_stackoverflow) 1990-02-19

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