JPH0645738A - Electrical connecting method of semiconductor device - Google Patents
Electrical connecting method of semiconductor deviceInfo
- Publication number
- JPH0645738A JPH0645738A JP3198813A JP19881391A JPH0645738A JP H0645738 A JPH0645738 A JP H0645738A JP 3198813 A JP3198813 A JP 3198813A JP 19881391 A JP19881391 A JP 19881391A JP H0645738 A JPH0645738 A JP H0645738A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- electrical connection
- external leads
- distance
- electrically connecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、外部リード間の距離が
0.3mm以下である半導体装置をショートさせないように
電気接続することのできる半導体装置の電気接続方法に
関する。BACKGROUND OF THE INVENTION The present invention is designed to reduce the distance between external leads.
The present invention relates to a method for electrically connecting a semiconductor device having a size of 0.3 mm or less so that the semiconductor device can be electrically connected without short-circuiting.
【０００２】[0002]
【従来の技術】従来から、ＩＣやＬＳＩなどの複数の外
部リード２を有する半導体装置１（図３、図４参照）の
電気接続方法としては、図５または図６に示すように、
たとえば、配線基板４の各配線端子５上に導電性接着剤
からなる電気接続部３を印刷により半導体装置１側面に
対して平行な一直線状に並ぶように形成し、半導体装置
１を配線基板４上に搭載して電気接続部３に半導体装置
１を電気接続させる方法があった。2. Description of the Related Art Conventionally, as a method of electrically connecting a semiconductor device 1 (see FIGS. 3 and 4) having a plurality of external leads 2 such as IC and LSI, as shown in FIG. 5 or FIG.
For example, the electrical connection portions 3 made of a conductive adhesive are formed on each wiring terminal 5 of the wiring board 4 by printing so as to be aligned in a straight line parallel to the side surface of the semiconductor device 1, and the semiconductor device 1 is wired. There is a method of mounting the semiconductor device 1 on the upper surface and electrically connecting the semiconductor device 1 to the electric connection portion 3.
【０００３】また、配線基板４の各配線端子５上にクリ
ーム状のハンダからなる電気接続部３を印刷により半導
体装置１側面に対して平行な一直線状に並ぶように形成
し、半導体装置１を配線基板４上に搭載した後、加熱に
よりハンダを溶融させて、半導体装置１を電気接続させ
る方法があった。On the wiring terminals 5 of the wiring board 4, the electric connection portions 3 made of cream-like solder are formed by printing so as to be aligned in a straight line parallel to the side surface of the semiconductor device 1. After mounting on the wiring board 4, there was a method of melting the solder by heating to electrically connect the semiconductor device 1.
【０００４】[0004]
【発明が解決しようとする課題】しかし、最近の半導体
装置が、高集積度化にともなって外部リードの数を増や
し、外部リード間の距離を0.3mm以下にしてきたのに対
し、従来の半導体装置の電気接続方法では、電気接続部
を半導体装置側面に対して平行な一直線状に並ばせるた
め、隣接する電気接続部どうしが電気接続部形成時また
は加熱時に接触してショートすることがあっった。However, in recent semiconductor devices, the number of external leads has been increased and the distance between the external leads has been reduced to 0.3 mm or less in accordance with the increase in integration density. In the electrical connection method of the device, since the electrical connection parts are arranged in a straight line parallel to the side surface of the semiconductor device, adjacent electrical connection parts may come into contact with each other during formation of the electrical connection parts or during heating to cause a short circuit. It was
【０００５】したがって、本発明の半導体装置の電気接
続方法は、外部リード間の距離が0.3mm以下の半導体装
置をショートさせないように電気接続することを目的と
する。Therefore, an object of the present invention is to electrically connect a semiconductor device so that a semiconductor device having a distance between external leads of 0.3 mm or less is electrically connected so as not to be short-circuited.
【０００６】[0006]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明の半導体装置の電気接続方法は、配線基板
の各配線端子上に印刷により形成された電気接続部に外
部リード間の距離が0.3mm以下の間隔で複数の外部リー
ドを有する半導体装置を電気接続させる方法において、
隣接する電気接続部間の最短距離が隣接する外部リード
間の距離よりも大きくなるように構成した。In order to achieve the above object, a method of electrically connecting a semiconductor device according to the present invention includes an electrical connection portion formed by printing on each wiring terminal of a wiring board, between external leads. In a method of electrically connecting a semiconductor device having a plurality of external leads at a distance of 0.3 mm or less,
The shortest distance between the adjacent electrical connection portions is configured to be larger than the distance between the adjacent external leads.
【０００７】以下、図を参照しながら本発明の半導体装
置の電気接続方法を説明する。図１は本発明の半導体装
置の電気接続方法の一実施例を示す斜視図、図２は本発
明の半導体装置の電気接続方法の他の実施例を示す斜視
図である。１は半導体装置、２は外部リード、３は電気
接続部、４は配線基板、５は配線端子をそれぞれ示す。The method for electrically connecting the semiconductor device of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of an electric connection method for a semiconductor device of the present invention, and FIG. 2 is a perspective view showing another embodiment of an electric connection method for a semiconductor device of the present invention. Reference numeral 1 is a semiconductor device, 2 is an external lead, 3 is an electrical connection portion, 4 is a wiring board, and 5 is a wiring terminal.
【０００８】電気接続部３は、クリーム状ハンダまたは
導電性接着剤を用い、印刷により配線基板４の各配線端
子５上に形成される。The electric connecting portion 3 is formed on each wiring terminal 5 of the wiring board 4 by printing using a cream solder or a conductive adhesive.
【０００９】電気接続部３は、隣接する電気接続部３間
の最短距離が隣接する外部リード２間の距離よりも大き
くなればどのような配置で形成されてもよい。たとえ
ば、電気接続部３を図１や図２のようにジグザグ状に配
置したり、半導体装置１側面に対して角度を持った直線
状に配置する。また、孤を描くよう電気接続部３を配置
してもよい。The electrical connecting portions 3 may be formed in any arrangement as long as the shortest distance between the adjacent electrical connecting portions 3 is larger than the distance between the adjacent external leads 2. For example, the electrical connection portions 3 are arranged in a zigzag shape as shown in FIGS. 1 and 2, or are arranged in a linear shape having an angle with respect to the side surface of the semiconductor device 1. Moreover, you may arrange | position the electrical connection part 3 so that it may draw an arc.
【００１０】また、電気接続部３の形成範囲は、半導体
装置１本体下部の外側のみあるいは内側のみに限定され
ず、図１のように両側に渡ってもよい。Further, the formation range of the electrical connection portion 3 is not limited to only the outer side or the inner side of the lower portion of the main body of the semiconductor device 1 and may extend to both sides as shown in FIG.
【００１１】以上のように形成された電気接続部３に半
導体装置１を電気接続させる。電気接続部３として導電
性接着剤を用いる場合は、半導体装置１の各外部リード
２を電気接続部３上に載せ、接着乾燥させて電気接続す
る。また、電気接続部３としてクリーム状ハンダを用い
る場合は、半導体装置１の各外部リード２を電気接続部
３上に載せた後、リフロー炉などによりハンダを加熱
し、溶融固化させて電気接続する。The semiconductor device 1 is electrically connected to the electrical connecting portion 3 formed as described above. When a conductive adhesive is used as the electrical connection portion 3, each external lead 2 of the semiconductor device 1 is placed on the electrical connection portion 3 and adhesively dried for electrical connection. When cream-like solder is used as the electrical connection part 3, after placing each external lead 2 of the semiconductor device 1 on the electrical connection part 3, the solder is heated by a reflow furnace or the like to be melted and solidified for electrical connection. .
【００１２】[0012]
【発明の効果】本発明の半導体装置の電気接続方法は、
配線基板の各配線端子上に印刷により形成された電気接
続部に外部リード間の距離が0.3mm以下の間隔で複数の
外部リードを有する半導体装置を電気接続させる方法に
おいて、隣接する電気接続部間の最短距離が隣接する外
部リード間の距離よりも大きくなるように構成した。The method for electrically connecting a semiconductor device according to the present invention comprises:
In a method of electrically connecting a semiconductor device having a plurality of external leads with an interval between external leads of 0.3 mm or less to an electrical connection part formed by printing on each wiring terminal of a wiring board, between adjacent electrical connection parts. The minimum distance is larger than the distance between adjacent external leads.
【００１３】したがって、隣接する電気接続部間の最短
距離が長くなるため、外部リード間の距離が0.3mm以下
の半導体装置をショートさせないように電気接続するこ
とができる。Therefore, since the shortest distance between the adjacent electric connection portions becomes long, it is possible to electrically connect the semiconductor devices having the distance between the external leads of 0.3 mm or less so as not to short-circuit.
【図１】本発明の半導体装置の電気接続方法の一実施例
を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of a method for electrically connecting a semiconductor device of the present invention.
【図２】本発明の半導体装置の実電気接続方法の他の実
施例を示す斜視図である。FIG. 2 is a perspective view showing another embodiment of the actual electrical connection method for a semiconductor device of the present invention.
【図３】半導体装置を示す斜視図である。FIG. 3 is a perspective view showing a semiconductor device.
【図４】半導体装置を示す斜視図である。FIG. 4 is a perspective view showing a semiconductor device.
【図５】従来の半導体装置の電気接続方法を示す斜視図
である。FIG. 5 is a perspective view showing a conventional method for electrically connecting a semiconductor device.
【図６】従来の半導体装置の電気接続方法を示す斜視図
である。FIG. 6 is a perspective view showing a conventional method for electrically connecting a semiconductor device.
１ 半導体装置 ２ 外部リード ３ 電気接続部 ４ 配線基板 ５ 配線端子 1 semiconductor device 2 external lead 3 electrical connection part 4 wiring board 5 wiring terminal
Claims (1)
成された電気接続部に外部リード間の距離が０．３ｍｍ
以下の間隔で複数の外部リードを有する半導体装置を電
気接続させる方法において、隣接する電気接続部間の最
短距離が隣接する外部リード間の距離よりも大きいこと
を特徴とする半導体装置の電気接続方法。1. A distance between external leads is 0.3 mm in an electric connection portion formed by printing on each wiring terminal of a wiring board.
In the method of electrically connecting a semiconductor device having a plurality of external leads at the following intervals, the shortest distance between adjacent electrical connection portions is larger than the distance between adjacent external leads. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3198813A JPH0645738A (en) | 1991-07-11 | 1991-07-11 | Electrical connecting method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3198813A JPH0645738A (en) | 1991-07-11 | 1991-07-11 | Electrical connecting method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0645738A true JPH0645738A (en) | 1994-02-18 |
Family
ID=16397342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3198813A Withdrawn JPH0645738A (en) | 1991-07-11 | 1991-07-11 | Electrical connecting method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645738A (en) |
-
1991
- 1991-07-11 JP JP3198813A patent/JPH0645738A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981008 |