JPH0645513A - Thick film hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce a circuit pattern when the substrate surface is electrically connected with the rear via a capacitor, in a hybrid IC device. CONSTITUTION:A hole 5a is bored in the substrate 5 of a hybrid IC device so as to penetrate the substrate 5. A capacitor 1 of a column type or a prism type is inserted into the hole. The electrode 2a of the capacitor 1 is, directly or via a gold wire 8, connected with a circuit pattern 3 on the substrate 1 surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film hybrid integrated circuit device (hereinafter simply referred to as a hybrid IC device),
In particular, the present invention relates to an electric circuit formed on the thick film hybrid integrated circuit substrate, in which electric coupling performed through a capacitor is improved.

[0002]

2. Description of the Related Art FIG. 7 is a configuration diagram showing a state of electrical coupling of a circuit pattern on a substrate in a conventional hybrid IC device through a capacitor. In the figure,
Reference numeral 1 denotes a chip type multilayer capacitor which is one of the components mounted on the surface of the substrate 5, and has a size of, for example, 2 mm × 1 mm and a height of 0.5 to 0.8 mm. 20a, 20
b is electrodes formed on both ends of this capacitor 1, 3a,
3b is a conductor pattern provided on the surface of the substrate 5 for mounting the capacitor 1, and the electrode 2 of the capacitor 1
The land portion to which 0a and 20b are soldered has a size of, for example, 2 mm square, and the land portion connected to the through hole 4 has a size of, for example, 1 mm square. The portion connecting the through hole 4 of the conductor pattern 3a and the electrode 20a has a length of 1 to 2 mm.

Reference numeral 4 is a through hole for electrically connecting the conductor pattern 3a and the ground electrode 6, and 5 is a substrate of a thick film hybrid integrated circuit formed of an insulator such as alumina ceramic, for example, 4 cm × It has a size of 2 cm and is 1-2
It has a thickness of mm. Reference numeral 6 denotes a ground electrode formed on the back surface of the substrate 5, which also serves as a fin for heat dissipation.
It has the same size as, and has a thickness of 2 to 3 mm, for example. Reference numeral 7 denotes an electrode lead for electrically connecting the hybrid IC device and its external circuit, which is electrically connected to the conductor pattern 3b.

The substrate 5 of this conventional device is obtained by forming a through hole to be a through hole in a mold before the firing, and then firing. Next, when the conductor patterns 3a and 3b made of silver or the like are formed on the surface of the substrate 5, the conductor is poured into the through holes to form the conductor pattern 3
The a and 3b and the through hole 4 are simultaneously formed. next,
The ground electrode 6 made of copper or the like is soldered to the back surface of the substrate 5, and the electrode lead 7 is soldered to the conductor pattern 3 to complete the process.

Further, the conductor pattern 3 on the substrate 5
The capacitor 1 is mounted by soldering the capacitor 1 to a and 3b, whereby the electrode lead 7 is electrically connected to the ground electrode 6 through the conductor pattern 3b, the capacitor 1, the conductor pattern 3a, and the through hole 4. Connected.

[0006]

[Problems to be Solved by the Invention] Conventional Hybrid I
Since the C device is configured as described above, in order to electrically connect the electrode lead 7 and the ground electrode 6 via the capacitor 1, the conductor patterns 3a and 3b for mounting the capacitor 1 and the through-holes are provided. The hole 4 must be formed on the substrate 5, resulting in a large circuit pattern.

The present invention has been made in order to solve the above problems, and provides a hybrid IC device capable of reducing the circuit pattern when electrically connecting via a capacitor. With the goal.

[0008]

In a hybrid IC device according to the present invention, a capacitor is inserted into a hole penetrating a substrate to embed it, and an electrode of the capacitor and a circuit pattern of the substrate are electrically connected by a gold wire or the like. They are connected to each other.

Further, the hybrid IC device according to the present invention is configured such that the capacitor and the circuit pattern of the substrate are directly electrically connected by the plate-like electrode integrally formed with the capacitor.

Further, the hybrid IC according to the present invention
The device uses a multi-layer substrate as its substrate.

[0011]

In the hybrid IC device according to the present invention, the electrical connection between the electrode of the capacitor and the circuit pattern of the substrate and the ground electrode is achieved by mounting the capacitor itself by embedding it in a through hole formed in the substrate. Therefore, the conductor pattern for mounting the capacitor in the conventional structure becomes unnecessary, and the circuit pattern can be reduced.

The hybrid IC according to the present invention
In the apparatus, the plate-shaped electrodes are used as the electrodes of the capacitors, so that the wiring process for connecting the capacitors to the wiring pattern on the surface of the substrate is not required.

Further, the hybrid I according to the present invention
In the C device, since the substrate is a multi-layer substrate, even in a thick film hybrid integrated circuit device using the multi-layer substrate, it is possible to reduce the circuit pattern when connecting the uppermost layer and the lowermost layer of the substrate via a capacitor. Become.

[0014]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a thick film hybrid integrated circuit device according to an embodiment of the present invention. In the figure, reference numeral 1 denotes a cylindrical capacitor embedded in a substrate 5, which has a diameter of, for example, 1 to 2 mm and a height of 1 to 1.5 mm, which is approximately the same as the thickness of the substrate 5. 2a and 2b are round electrodes formed on both ends of the capacitor 1, 3 is a conductor pattern provided on the surface of the substrate 5, which is electrically connected to the electrode 2a on the surface side of the capacitor 1, A thick film hybrid integrated circuit substrate 5a on which various electronic components such as the capacitor 1 are mounted is formed so as to reach from the front surface to the back surface of the substrate 5, a hole for burying the capacitor 1 in the substrate 5, and 6 The ground electrode 7 soldered to the back surface of the substrate 5 is the hybrid I
It is an electrode lead for electrically connecting the C device and its external circuit, and is electrically connected to the conductor pattern 3. Reference numeral 8 is a gold wire for electrically connecting the one electrode 2a of the capacitor 1 and the conductor pattern 3 to each other. It should be noted that although a cylindrical capacitor is used in this embodiment, a similar effect can be obtained with a polygonal capacitor.

The substrate 5 of this embodiment is obtained by forming a through hole to be a hole for burying a capacitor in a mold before the firing, and then firing. Next, the conductor pattern 3 made of silver or the like is formed on the front surface of the substrate 5, the ground electrode 6 made of copper or the like is soldered on the back surface of the substrate 5, and further the electrode lead 7 is soldered to the conductor pattern 3. Is completed by.

Further, a solder material is embedded in a hole 5a for burying a capacitor formed in the substrate 5, the capacitor 1 is inserted and the whole is heated, so that the solder material is melted and the electrode 2b of the capacitor 1 and ground. Welding with the electrode 6 is performed. After that, the capacitor 1 embedded in the substrate 5
By connecting the electrode 2a on the side exposed on the substrate surface to the pattern 3 with a gold wire 8 or the like, the electrode lead 7 and the ground electrode 6 are electrically connected via the capacitor 1.

Since the solder for welding the capacitor 1 and the solder for soldering the ground electrode have different melting points,
The ground electrode 6 is heated by heating when welding the capacitor 1.
Does not come off.

Further, the soldering for welding the capacitor is
It may be performed at the same time as soldering for mounting the ground substrate.

As described above, in the present embodiment, the electrical connection between the electrode lead 7 and the ground electrode 6 via the capacitor 1 is performed by inserting the electrode pattern 3 with the gold wire 8 into the hole 5a penetrating the substrate 5. This is realized by connecting the upper electrode 2a of the capacitor 1 and the lower electrode 2b of the capacitor 1 connected to the ground electrode 6 by soldering or the like.

Therefore, according to this embodiment, of the electrode patterns, the through hole for electrically connecting the front surface and the back surface of the substrate and the electrode pattern for connecting the electrode of the capacitor are unnecessary. When connecting the front surface and the back surface of the substrate in the thick film hybrid integrated circuit device via a capacitor, the circuit pattern can be reduced.

Example 2. Another embodiment of the present invention will be described with reference to FIG. In the structure shown in FIG. 2, the shape of the upper electrode of the capacitor 1 in the first embodiment is elongated in a plate shape so that the conductor pattern and the capacitor 1 are electrically connected without using a gold wire or the like. It is a thing.

That is, in this embodiment, a solder material is embedded in a hole 5a for burying a capacitor, which is formed in the substrate 5 completed in the same manner as in the first embodiment, and the capacitor 1 is attached to its plate electrode. By inserting 2c until it comes into contact with the surface of the substrate 5 and heating the whole, the solder material is melted and the electrode 2b of the capacitor 1 and the ground electrode 6 are welded. As a result, the plate electrode 2c of the capacitor 1 and the pattern 3 are automatically connected, and the electrode lead 7
And the ground electrode 6 are electrically connected via the capacitor 1.

The plate-shaped electrode 2c is used in the first embodiment.
The circular electrode 2a of the capacitor 1 can be formed by previously soldering a plate-shaped electrode, which is a separate body, from the circular electrode 2a.

In this embodiment, since the capacitor 1 having the plate-shaped electrode 2c having a size of 2 mm × 1 mm is used, the gold wire 8 in the first embodiment becomes unnecessary.
Further, since the plate-like electrode serves as a stopper when inserting the capacitor, there is also an effect that the assembling thereof becomes easy.

Example 3. Still another embodiment of the present invention will be described with reference to FIG. In the structure shown in FIG. 3, the ground electrode is removed from the substrate in the second embodiment, and the capacitor 1 with the plate electrode 2c in the second embodiment is inserted from the back surface of the substrate 5, while the substrate of the plate electrode 2c is inserted. The solder is placed on the surface on the side of 5 and the entire plate is heated to weld the plate-like electrode 2c and the ground pattern on the back surface of the substrate 5 with the solder, and then the conductor pattern on the surface of the substrate 5 and the circle of the capacitor 1 are welded. The mold electrode 2b is connected by a gold wire 8 or the like.

According to this embodiment, even in the case where the back surface of the substrate does not have the ground electrode, the circuit pattern can be reduced when the front surface and the back surface of the substrate are connected via the capacitor. In addition, since the plate electrode of the capacitor serves as a stopper when inserting the capacitor, there is also an effect that the assembling thereof becomes easy.

In this embodiment as well, the ground electrode may be provided on the back surface of the substrate. In this case, since there is a step of soldering the back surface of the substrate and the ground electrode after inserting the capacitor, the plate electrode is formed. This can be omitted in the step of soldering the substrate and the back surface of the substrate.

Example 4. Still another embodiment of the present invention will be described with reference to FIG. In the structure of FIG. 4, the substrate in the first to third embodiments is a multilayer substrate 5 including a top layer 51, an intermediate layer 52, and a bottom layer 53 in which the holes 5a for burying capacitors are formed in advance. The ground electrode 6 is soldered to the back surface, the solder material is embedded in the capacitor embedding hole 5a formed in the substrate 5, the capacitor 1 is inserted, and the whole is heated. The electrode 2b and the ground electrode 6 are welded.
After that, by connecting the electrode 2a on the side exposed on the substrate surface of the capacitor 1 embedded in the substrate 5 and the pattern 3 with a gold wire 8 or the like, the electrode lead 7 and the ground electrode 6 are connected via the capacitor 1. It is electrically connected.

In the figure, the substrates 51, 52, 53 of each layer are shown.
Is a multilayer substrate 5 having a thickness similar to that of FIGS. 1 to 3, and the circuit pattern of the uppermost layer portion 51 is the capacitor 1
Is electrically connected to the electrode 2a of
The ground electrode 6 soldered to the lowermost layer portion 53 of the above is connected to the circular electrode 2b of the capacitor 1 by soldering, whereby the circuit pattern of the uppermost layer portion 51 of the multilayer substrate 5 and the lowermost portion 53 are soldered. The grounded electrode 6 is electrically connected to the grounded electrode 6 through the capacitor 1.

According to this embodiment, the capacitor can be embedded in the through hole and mounted even in a multi-layer substrate in which the circuit pattern of the uppermost layer and the circuit pattern of the lowermost layer can be connected in a complicated manner. Therefore, the through hole that connects the circuit pattern of the uppermost layer and the circuit pattern of the lowermost layer, which is necessary when the capacitor is surface-mounted on the uppermost layer, and this throughhole and the capacitor are connected. The electrode pattern for doing so becomes unnecessary, and the circuit pattern can be reduced.

The intermediate layer substrate 52 of the multilayer substrate 5
Is for electrically connecting the circuit patterns of the uppermost layer portion 51 of the substrate 5 or the circuit pattern of the uppermost layer portion and the circuit pattern of the lowermost layer portion 53 through through holes, and corresponds to the hole 5a. No circuit pattern is formed in the part to be filled.

Example 5. Still another embodiment of the present invention will be described with reference to FIG. In the structure shown in FIG. 5, the board in each of the first to third embodiments has a multi-layered structure, and the ground electrode 6 is soldered to the lowermost board, and in this state, one end face has a plate shape. The capacitor 1 having the electrode 2c is inserted into the hole 5a from the uppermost layer substrate 51 side of the multilayer substrate 5 toward the lowermost layer substrate 53. The hole 5a is filled with a solder material in advance. By heating the whole in this state, the solder material is melted and the electrode 2b of the capacitor 1 is melted.
And the ground electrode 6 are welded. As a result, the conductor pattern on the surface of the uppermost substrate 51 and the plate electrode 2c of the capacitor 1 are automatically connected.

In the figure, the substrates 51, 52, 53 of each layer are shown.
Is a multilayer substrate 5 having a thickness similar to that of FIGS. 1 to 3, and the circuit pattern of the uppermost layer portion 51 is the capacitor 1
And the plate-shaped electrode 2c thereof are directly electrically connected to each other, and the ground electrode 6 soldered to the lowermost layer portion 53 of the substrate 5 is electrically connected to the round electrode 2b of the capacitor 1, whereby the multilayer substrate 5 The circuit pattern of the uppermost layer 51 and the ground electrode 6 soldered to the lowermost portion 53 are electrically connected to each other via the capacitor 1.

According to this embodiment, the capacitor can be embedded in the through hole and mounted even in a multi-layer substrate in which the circuit pattern of the uppermost layer and the circuit pattern of the lowermost layer can be connected in a complicated manner. Therefore, the through hole that connects the circuit pattern of the uppermost layer and the circuit pattern of the lowermost layer, which is necessary when the capacitor is surface-mounted on the uppermost layer, and this throughhole and the capacitor are connected. The electrode pattern for doing so becomes unnecessary, and the circuit pattern can be reduced.

Further, since the circuit pattern of the uppermost layer and the electrode of the capacitor are connected by the plate electrode of the capacitor, special wiring for connecting the both is applied to the uppermost layer. This eliminates the need for steps, and since the plate electrode serves as a stopper when inserting the capacitor, there is an effect that the assembly becomes easy.

Example 6. Still another embodiment of the present invention will be described with reference to FIG. In the structure shown in FIG. 6, the substrates in the above-described first to third embodiments have a multi-layer structure, and the capacitor 1 having the plate-shaped electrode 2c on one end face is formed as the uppermost layer from the lowermost substrate 53 side of the multilayer substrate 5. It is inserted into the hole 5a toward the substrate 51, and at that time, the solder is placed on the lowermost layer substrate 53 side of the plate electrode 2c, and the whole is heated to ground the plate electrode 2c and the back surface of the substrate 5. The pattern is welded with solder, and the conductor pattern on the surface of the substrate 5 and the round electrode 2b of the capacitor 1 are connected by a gold wire 8 or the like.

In the figure, the substrates 51, 52, 53 of each layer are shown.
Is a multilayer substrate 5 having a thickness similar to that of FIGS. 1 to 3, and the circuit pattern of the uppermost layer portion 51 is the capacitor 1
Of the substrate 5 electrically connected to the electrode 2b of
Is electrically connected to the plate electrode 2c of the capacitor 1, so that the circuit pattern of the uppermost layer 51 and the circuit pattern of the lowermost part 53 of the multilayer substrate 5 are connected via the capacitor 1. The structure is such that they are electrically connected to each other.

According to this embodiment, the capacitor can be embedded in the through hole and mounted even in the multi-layer substrate in which the circuit pattern of the uppermost layer and the circuit pattern of the lowermost layer can be connected in a complicated manner. Therefore, the through hole that connects the circuit pattern of the uppermost layer and the circuit pattern of the lowermost layer, which is necessary when the capacitor is surface-mounted on the uppermost layer, and this throughhole and the capacitor are connected. The electrode pattern for doing so becomes unnecessary, and the circuit pattern can be reduced.

Further, since the circuit pattern of the lowermost layer portion and the electrode of the capacitor are connected by the plate electrode of the capacitor, the special wiring for the connection between the lowermost layer portion and the electrode of the capacitor is made. This eliminates the need for steps, and since the plate electrode serves as a stopper when inserting the capacitor, there is an effect that the assembly becomes easy.

The middle-layer substrate of the multi-layer substrate 5 is electrically connected to the circuit patterns of the uppermost layer of the substrate 5 or to the circuit patterns of the uppermost layer and the lowermost circuit pattern through through holes. The circuit pattern is not formed in the portion corresponding to the hole 5a.

Also in this embodiment, the ground electrode may be provided on the back surface of the substrate. In this case, since there is a step of soldering the back surface of the substrate and the ground electrode after inserting the capacitor, there is a plate shape. This can be omitted in the step of soldering the electrode and the back surface of the substrate.

[0042]

As described above, according to the thick film hybrid integrated circuit device of the present invention, the capacitor is embedded in the through hole formed in the thick film hybrid integrated circuit board, and its electrode is formed by using a gold wire or the like. Since it is connected to the conductor, the conductor pattern for mounting the capacitor is not necessary, and the circuit pattern can be reduced.

Further, according to the thick film hybrid integrated circuit device of the present invention, the capacitor and the conductor are brought into direct contact with each other by making the electrode of the capacitor large enough to reach the conductor of the substrate. Therefore, the step of connecting a gold wire or the like is unnecessary.

Further, according to the thick film hybrid integrated circuit device of the present invention, since the substrate is a multi-layer substrate,
Also in a thick film hybrid integrated circuit device using a multilayer substrate, it is possible to reduce the circuit pattern when connecting the uppermost layer and the lowermost layer of the substrate via a capacitor.

[Brief description of drawings]

FIG. 1 is a structural diagram showing a hybrid IC device according to an embodiment of the present invention.

FIG. 2 is a hybrid IC according to another embodiment of the present invention.
It is a structural diagram which shows an apparatus.

FIG. 3 is a structural diagram showing a hybrid IC device using a multilayer substrate according to still another embodiment of the present invention.

FIG. 4 is a structural diagram showing a hybrid IC device using a multilayer substrate according to still another embodiment of the present invention.

FIG. 5 is a structural diagram showing a hybrid IC device using a multilayer substrate in still another embodiment of the present invention.

FIG. 6 is a structural diagram showing a hybrid IC device using a multilayer substrate according to still another embodiment of the present invention.

FIG. 7 is a structural diagram showing a conventional hybrid IC device.

[Explanation of symbols]

 1 Capacitor 2a, 2b, 2c Capacitor Electrode 3 Conductor Pattern 4 Through Hole 5, 51, 52, 53 Substrate 6 Earth Electrode 7 Electrode Lead 8 Gold Wire

Claims (3)

[Claims] 1. A thick film hybrid integrated circuit substrate, wherein a conductor is formed on each of a front surface and a back surface of the thick film hybrid integrated circuit device, and a through hole reaching from the substrate surface to the back surface is formed in the vicinity thereof, Electrodes are formed at both ends and are embedded in the substrate by being inserted into the through holes of the substrate, and a conductor that connects the electrode of the capacitor and the conductor of the substrate on the side corresponding to the electrode. Thick film hybrid integrated circuit device comprising a conductive wire. 2. The electrode of the capacitor and the conductor of the substrate are electrically connected by an electrode of the capacitor having a size reaching the conductor instead of the conductive wire. Item 3. The thick film hybrid integrated circuit device according to item 1. 3. The thick film hybrid integrated circuit device according to claim 1, wherein the substrate is a multi-layer substrate.