JPH0644102Y2 - ウエハ−の支持治具 - Google Patents
ウエハ−の支持治具Info
- Publication number
- JPH0644102Y2 JPH0644102Y2 JP11491287U JP11491287U JPH0644102Y2 JP H0644102 Y2 JPH0644102 Y2 JP H0644102Y2 JP 11491287 U JP11491287 U JP 11491287U JP 11491287 U JP11491287 U JP 11491287U JP H0644102 Y2 JPH0644102 Y2 JP H0644102Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- support member
- groove
- supporting
- lower support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 95
- 239000012535 impurity Substances 0.000 description 22
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11491287U JPH0644102Y2 (ja) | 1987-07-27 | 1987-07-27 | ウエハ−の支持治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11491287U JPH0644102Y2 (ja) | 1987-07-27 | 1987-07-27 | ウエハ−の支持治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6420723U JPS6420723U (en, 2012) | 1989-02-01 |
| JPH0644102Y2 true JPH0644102Y2 (ja) | 1994-11-14 |
Family
ID=31356087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11491287U Expired - Lifetime JPH0644102Y2 (ja) | 1987-07-27 | 1987-07-27 | ウエハ−の支持治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644102Y2 (en, 2012) |
-
1987
- 1987-07-27 JP JP11491287U patent/JPH0644102Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6420723U (en, 2012) | 1989-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05102056A (ja) | ウエハー支持具 | |
| JPH0342821A (ja) | 半導体ウエハの熱処理方法およびそのためのウエハハンガーならびに半導体ウエハ | |
| KR940005702B1 (ko) | 웨이퍼 이재구(Wafer 移載具) | |
| JPH0644102Y2 (ja) | ウエハ−の支持治具 | |
| EP0137209A3 (en) | Silicon wafer and its application in producing integrated circuit devices | |
| JPH0110921Y2 (en, 2012) | ||
| US3043726A (en) | Method of producing semi-conductor electrode systems | |
| JPH04304652A (ja) | 熱処理装置用ボート | |
| JPS6234439Y2 (en, 2012) | ||
| JPH05234925A (ja) | ウェーハ支持ボート | |
| JP3098251B2 (ja) | ウェーハ支持装置 | |
| JP2967895B2 (ja) | 半導体ウェーハの保持装置 | |
| JPH0220830Y2 (en, 2012) | ||
| JPH0621245Y2 (ja) | 逆置防止装置付キャリヤ支持台 | |
| JPS5831403Y2 (ja) | 半導体装置の製造装置 | |
| JP2620765B2 (ja) | 縦型拡散炉用ボート | |
| US3988763A (en) | Isolation junctions for semiconductors devices | |
| US2805369A (en) | Semi-conductor electrode system | |
| US3234440A (en) | Semiconductor device fabrication | |
| JPH089643Y2 (ja) | 血沈管置台 | |
| JPH0590392A (ja) | 縦型拡散炉用ウエハボート | |
| JP2701809B2 (ja) | シリコン単結晶基板 | |
| JPS6428861A (en) | Cmos integrated circuit with connection parts from upper surface to substrate | |
| KR0113531Y1 (ko) | 웨이퍼 카세트의 안착장치 | |
| JP2955965B2 (ja) | 単結晶製造用突出パレット |