JPH0643657A - Method for applying photosensitive resist to deformed substrate - Google Patents

Abstract

PURPOSE:To enable desired photoetching to be executed by using a spray system in order to apply a photosensitive resist on a deformed insulating substrate deposited with a resistance film, etc., so that the uniform thickness of the photosensitive resist film is obtd. CONSTITUTION:This method enables the mass production of thin-film attenuators having a T shape and a bored and deformed ceramic substrate 3 which has a prescribed size and has the holes of a prescribed size is used as the insulating substrate 3. The resistance film of a nickel chromium system and a primary electrode film are deposited by a vapor deposition method on this substrate 3. The photosensitive resist 2 is then applied on the substrate 3 at a prescribed film thickness by a spraying system and is patterned by a photoetching method; thereafter, the resist is subjected to a heat treatment for a prescribed period of time at a prescribed temp. The resistance value of the film is adjusted by laser trimming. Further, the substrate 3 is divided to a module unit along snaps, by which the products are obtd. As a result, the uniform application of the photosensitive resist on the surface of the insulating film 3 consisting of the deformed ceramics, etc., is possible.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film resistor used in electronic equipment.

[0002]

2. Description of the Related Art A general method for uniformly coating a photosensitive resist on a film-formed smooth substrate surface is a spin coating method.

[0003]

A spin coating method is generally used as a method for uniformly coating a photosensitive resist on a film-formed smooth substrate, but a spin coating method is used for a modified insulating substrate such as a perforated substrate. If this is done, the photosensitive resist film becomes uneven and a uniform film thickness cannot be obtained, making it impossible to carry out the desired photoetching.

[0004]

The present invention uses a spray method shown in FIG. 1 to apply a photosensitive resist to a deformed insulating substrate having a resistance film or the like formed thereon.

By using the spray method, it is possible to obtain a uniform photosensitive resist film thickness and perform desired photoetching.

[0006]

[Embodiment 1] A T-shaped thin film attenuator as shown in FIG. 3 can be mass-produced. The insulating substrate is 50 mm × 40 mm × 0.4 mm shown in FIG. 2, and the hole size is 4 mm × 2.5.
A perforated deformed ceramic substrate of mm was used. A nickel-chrome-based resistance film and a primary electrode film are deposited on the substrate by vapor deposition.

Next, a photosensitive resist is applied to the substrate by a spray method to a film thickness of about 2 μm, a pattern is formed by a photo-etching method, and then heat treatment is performed at 350 ° C. for 1 hour.
The resistance value was adjusted by laser trimming.

Next, the substrate was divided into modules along the snap to complete the product shown in FIG.

The specifications of this product are: R ₁ = 427Ω, R ₂ = R
₃ = 2.5Ω, ± 25 ppm / ° C.

[0010]

[Second Embodiment] A heat dissipation plate itself is used in order to optimize the heat conduction of a protection circuit for preventing thermal runaway of a semiconductor such as a transistor and a temperature sensor used for temperature compensation for stabilizing an operating point and to simplify mounting. A thin film temperature sensor is directly formed into a film, and the insulating substrate is 30 mm × 15 mm × shown in Fig. 4.
A 15 mm block type aluminum radiation plate was used.

After forming an insulating layer on the substrate by a sputtering method, nickel is deposited as a temperature sensitive film by a vapor deposition method.

Next, a photosensitive resist was applied on the substrate by a spray method to a film thickness of about 2 μm, a pattern was formed by a photo-etching method, and then heat treatment was performed at 320 ° C. for 1 hour to complete the product shown in FIG.

The specification of this product is about 10 kΩ, about +500
It is 0 ppm / ° C.

[0014]

According to the present invention, it becomes possible to uniformly apply a photosensitive resist to the surface of an insulating substrate such as a deformed ceramic.

[0015]

[Brief description of drawings]

FIG. 1 is a side view showing a method of the present invention.

FIG. 2 is a top view showing a substrate used to manufacture a thin film attenuator according to the method of the present invention.

FIG. 3 is a top view showing a thin film attenuator manufactured by the method of the present invention.

FIG. 4 is a perspective view showing a substrate used to manufacture a thin film resistance temperature sensor for a protection circuit according to the method of the present invention.

FIG. 5 is a front view showing a thin film resistance temperature sensor for a protection circuit manufactured by the method of the present invention.

FIG. 6 is an overall view showing a thin film resistance temperature sensor for a protection circuit and a transistor substrate manufactured by the method of the present invention.

[Explanation of symbols]

 1 Spray Nozzle 2 Photosensitive Resist 3 Substrate 4 Nickel Chromium Resistive Film 5 Electrode Film 6 Nickel Film 7 Transistor

Claims (2)

[Claims] 1. A method which enables a photosensitive resist for photo-etching to be uniformly applied to an insulating substrate such as a perforated ceramic substrate in order to etch the film deposited on the substrate. 2. A method which enables a photosensitive resist for photo-etching to be uniformly applied to the surface of an insulating substrate such as an uneven ceramic to etch a film deposited on the substrate.