CA1059208A - Thin film thermal print head - Google Patents
Thin film thermal print headInfo
- Publication number
- CA1059208A CA1059208A CA233,178A CA233178A CA1059208A CA 1059208 A CA1059208 A CA 1059208A CA 233178 A CA233178 A CA 233178A CA 1059208 A CA1059208 A CA 1059208A
- Authority
- CA
- Canada
- Prior art keywords
- layer
- thin film
- print head
- heater elements
- thermal print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3351—Electrode layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33515—Heater layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33525—Passivation layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3353—Protective layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33535—Substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3355—Structure of thermal heads characterised by materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33555—Structure of thermal heads characterised by type
- B41J2/3357—Surface type resistors
Abstract
Abstract of the Disclosure The thermal print head disclosed herein comprises resistive heating elements deposited on mesas of glass glaze over an aluminum oxide substrate for more efficient marking of thermally sensitive recording material. After the mesas are formed in the glass glaze by etching, resistive and conductive materials are deposited over the mesas by thin film techniques.
Thereafter, the raised heater elements and conductors are delineated chemically, then heat-treated to upwardly adjust the resistance of and to grow a protective oxide over the individual heater elements. Since the resistance value of the heater ele-ments can be controllably increased as a function of the temper-ature and time of heat treatment, external trimming resistors are eliminated. The protective oxide which forms over the resistors during heat treatment provides better adhesion to wear-resistant materials and an effective barrier to migration of ions from the recording material into the heater elements causing degration of performance and shortened element life.
Thereafter, the raised heater elements and conductors are delineated chemically, then heat-treated to upwardly adjust the resistance of and to grow a protective oxide over the individual heater elements. Since the resistance value of the heater ele-ments can be controllably increased as a function of the temper-ature and time of heat treatment, external trimming resistors are eliminated. The protective oxide which forms over the resistors during heat treatment provides better adhesion to wear-resistant materials and an effective barrier to migration of ions from the recording material into the heater elements causing degration of performance and shortened element life.
Description
. 105~Z08 ...... ..
Backqround & Summarv of the Invention Thin film thermal print heads havin~ resistive heating elements are known in the prior art as disclosed in U. S. Patent ~o. ~,609,291, THER~L P~INTING HEAD WITH THIN FILM PRINTING
ELEMENTS, issued to Richard C. Cady, Jr. et al. on September 28, 1971. In this printing head, planar resistive heater elemenis are covered by a protective layer of material having substantia' ~ -thermal conductivity and electrical resistivity. ~e protective -layer is shaped to provide a raised area over each of the heater 28 elements. Thcse raised mesa-like areas are merely thicker . -l~9ZO~
portions of the overcoating which protects the entire structure.
The mesa-like areas provide concentrations of heat in close proximity to the thermally sensitive recording material. However, since the material is selected for high thermal conductivity, conduction of heat generated by the resistive heater elements to the surface of the recording material is dissipated by transmission of some of that heat into the thinner portions of the overcoating layer. Thus the thermal efficiency of this system is necessarily low. In the present invention, the resistive elements are formed over a mesa of glass glaze which places the source of heat itself in close proximity with the thermally sensitive recording material and reduces the heat dissipated throughout a protective overcoating layer. The thermal efficiency of the present invention is therefore much higher.
Ion migration barriers are also known in the prior art as disclosed in U. S. Patent ~o. 3,598,956, IO~ MIGR~TION
BARRIER, issued to Richard C. Cady, Jr. et al. on August 10, 1971. The ion migration barrier disclosed therein comprises ; an electrically conductive shield which isolates the resistive heater elements from ions which shortened heater element life.
The migration barrier is insulated from the heater elements and from the thermally sensitive recording material by layers of glass, and is most effective when electrically biased or grounded.
The ion barrier of the present invention is effective without electrical biasing or grounding, and does not require an insu-lating layer of glass between it and the heater elements. In addition the ion barrier of the present invention enhances adhesion of the wear layer to the heater elements.
The ion barrier described above is formed during a heat treatment process which also serves to adjust the value of 1~592013 the resistive elements. By controlLing the temperature and time of heat treatment, the ~esistor values may be increased to a resistance value compatible with drive electronics. Since deposits of resistive material are more uniform in thin film technology than in other fabrication processes, external trimming resistors are generally not required. However, since heat treatment effects the resistance of all heater elements uniformly, it does allow the upward adjustment of that resistance to accommodate the electronic drive circuitry.
In accordance with this invention there is provided a thin film thermal print head for operation in an environment including a source of ions comprising: an aluminum oxide substrate; a layer of glass glaze covering the substrate having a plurality of mesas formed on the surface thereof; a layer of resistive material covering the mesas to form resistive heater elements thereon; a plurality of electrical conductors coupled to the heater elements for connecting electrical power thereto; a layer of oxide of the resistive material covering each of the heater elemen~s to insulate the heater elements from the ions; and a layer of wear-resistant material covering the layer of oxide and having relatively high thermal conductivity~
Description of the Drawings Figure 1 is a cross-section of a substrate with glass glaze showing the mesa formed thereon for one heater element ~
constructed according to the preferred embodiment of the present ~ -invention.
Figure 2 is a cross-section of the su~strate of Figure 1 including the layers of resistive and conductive materials.
Figure 3 shows the change of resistance versus time at various temperatures for tantalum nitride.
Figure 4 is a cross-section of the su~strate of Figure
Backqround & Summarv of the Invention Thin film thermal print heads havin~ resistive heating elements are known in the prior art as disclosed in U. S. Patent ~o. ~,609,291, THER~L P~INTING HEAD WITH THIN FILM PRINTING
ELEMENTS, issued to Richard C. Cady, Jr. et al. on September 28, 1971. In this printing head, planar resistive heater elemenis are covered by a protective layer of material having substantia' ~ -thermal conductivity and electrical resistivity. ~e protective -layer is shaped to provide a raised area over each of the heater 28 elements. Thcse raised mesa-like areas are merely thicker . -l~9ZO~
portions of the overcoating which protects the entire structure.
The mesa-like areas provide concentrations of heat in close proximity to the thermally sensitive recording material. However, since the material is selected for high thermal conductivity, conduction of heat generated by the resistive heater elements to the surface of the recording material is dissipated by transmission of some of that heat into the thinner portions of the overcoating layer. Thus the thermal efficiency of this system is necessarily low. In the present invention, the resistive elements are formed over a mesa of glass glaze which places the source of heat itself in close proximity with the thermally sensitive recording material and reduces the heat dissipated throughout a protective overcoating layer. The thermal efficiency of the present invention is therefore much higher.
Ion migration barriers are also known in the prior art as disclosed in U. S. Patent ~o. 3,598,956, IO~ MIGR~TION
BARRIER, issued to Richard C. Cady, Jr. et al. on August 10, 1971. The ion migration barrier disclosed therein comprises ; an electrically conductive shield which isolates the resistive heater elements from ions which shortened heater element life.
The migration barrier is insulated from the heater elements and from the thermally sensitive recording material by layers of glass, and is most effective when electrically biased or grounded.
The ion barrier of the present invention is effective without electrical biasing or grounding, and does not require an insu-lating layer of glass between it and the heater elements. In addition the ion barrier of the present invention enhances adhesion of the wear layer to the heater elements.
The ion barrier described above is formed during a heat treatment process which also serves to adjust the value of 1~592013 the resistive elements. By controlLing the temperature and time of heat treatment, the ~esistor values may be increased to a resistance value compatible with drive electronics. Since deposits of resistive material are more uniform in thin film technology than in other fabrication processes, external trimming resistors are generally not required. However, since heat treatment effects the resistance of all heater elements uniformly, it does allow the upward adjustment of that resistance to accommodate the electronic drive circuitry.
In accordance with this invention there is provided a thin film thermal print head for operation in an environment including a source of ions comprising: an aluminum oxide substrate; a layer of glass glaze covering the substrate having a plurality of mesas formed on the surface thereof; a layer of resistive material covering the mesas to form resistive heater elements thereon; a plurality of electrical conductors coupled to the heater elements for connecting electrical power thereto; a layer of oxide of the resistive material covering each of the heater elemen~s to insulate the heater elements from the ions; and a layer of wear-resistant material covering the layer of oxide and having relatively high thermal conductivity~
Description of the Drawings Figure 1 is a cross-section of a substrate with glass glaze showing the mesa formed thereon for one heater element ~
constructed according to the preferred embodiment of the present ~ -invention.
Figure 2 is a cross-section of the su~strate of Figure 1 including the layers of resistive and conductive materials.
Figure 3 shows the change of resistance versus time at various temperatures for tantalum nitride.
Figure 4 is a cross-section of the su~strate of Figure
2 including the protective oxide and wear layer.
Figure 5 is a top view of a thermal print head having ~ - 3 -~59Z0~3 a plurality of heater elements constructed according to tne preferred embodiment of the present invention.
Description of the Preferred Embodiment Referring to Figure 1, substrate 10 is coated with a thick layer of high-temperature glass glaze 12. The glaze is then coated with a photoresist, baked, exposed and developed, leaving an etch-resistant pattern of photoresist material where the mesa is desiredO The remaining unprotected glaze is then etched with hydrofluoric acid to a thinner layer thickness than - 3a -mesa 14. Substrate 10 can be 94%-99O/o aluminum oxide or equivalent.
After the mesa has been formed for each resistive heater element as shown in Figure 1, a coating of resistive material is deposited over the entire glass glaze area by thin film techniques such as evaporation or sputtering. Thereafter, by similar thin film techniques, a layer of conductive material is deposited over the same area. For the preferred embodiment of the present invention, the resistive material may be either tantalum nitride or tantalum/aluminum alloy or equivalent, and the conductor material may be either gold or aluminum or equiv-alent.
Referring now to Figure 2, resistive material 20 is shown covering mesa 14. After applying, baking, exposing and developing photoresist to delineate the pattern of electrical conductors to the heater eIements, conductor material 22 is then chemically etched to form individual conductors to each resistive heating element. Since resistive material 20 must be removed from the areas between conductors, that material - 20 is removed by a suitable chemical etching process or equivalent.
..
; Photoresist material is then again applied over the entire area, except where the resistive heating element is to be formed over mesa 14, thus delineating the resistive heating element.
After baking, exposing and developing the photoresist, the conductor material is then chemically etched from the top of the resistor covering mesa 14.
Prior to application of a wear-resistant material over the heater elements, the entire substrate is heat-treated. As shown in Figure 3, by controlling the temperature and the time of heat treatment, the amount of resistance change in each ~05920~
resistive heating element can be controlled. While the resist-ance change is essentially uniform for all of the resistive heater elemen-ts on the substrate, this heat treatment provides a method by which the resistance value of the heater elements can be upwardly adjusted to accommodate particular electronic drive circuits.
During the heat treatment process, a protective oxide grows over each individual resistive heater element. This protective oxide serves as a barrier against migration of ions from commonly known sources such as the thermally sensitive recording material itself. Such ions migrating to and lnto the heater elements tends to contaminate those elements which reduces their reliability and shortens their life. In addition, this oxide provides a better adhesion of a wear layer applied to each heater element after heat treatment.
Referring now to Figure 4,wear layer 30 is now applied over the immediate area of each heater element. The material is a wear-resistant, thermally-conductive material such as aluminum oxide. Thus a resistive heater element formed over mesas of glass glaze having a chemical ion migration barrier - and protected by a wear layer has been constructed, which pro-vides efficient developing of thermally sensitive recording material. The printing portion of the resistive heating element is shown in Figure 3 at 34. Protective oxide 32 improves reliability in an ion-laden environment by a factor of approx-imately six to one. It can be shown that six times the number of heater element failures were encountered after printing more than 30,000 feet of paper without the protective oxide than with the protective oxide present.
Referring now to Figure 5, thin film thermal print head ~(1 5920~3 40 comprises 7 resistive heater elements, for example, 41, common cond~c~or 42 and individual conductors, for example, 44. Each of the resistive heater elements and the conductors were formed as explained above for one of such elements.
Print head 40 may be used for forming 5 x 7 matrix alpha-; numeric characters along one axis of thermally sensitive recording material such as is described in Canadian Patent Application Serial No. 234,013 entitled METHOD AND APPARATUS
FOR ENHANCING AND MAINTAINING CHARACTER QUALITY IN THERMAL
PRINTERS filed by A.W~ Kovalick on August 21, 1975, and assigned to the assignee hereof.
J , - 6 ~
~ .
Figure 5 is a top view of a thermal print head having ~ - 3 -~59Z0~3 a plurality of heater elements constructed according to tne preferred embodiment of the present invention.
Description of the Preferred Embodiment Referring to Figure 1, substrate 10 is coated with a thick layer of high-temperature glass glaze 12. The glaze is then coated with a photoresist, baked, exposed and developed, leaving an etch-resistant pattern of photoresist material where the mesa is desiredO The remaining unprotected glaze is then etched with hydrofluoric acid to a thinner layer thickness than - 3a -mesa 14. Substrate 10 can be 94%-99O/o aluminum oxide or equivalent.
After the mesa has been formed for each resistive heater element as shown in Figure 1, a coating of resistive material is deposited over the entire glass glaze area by thin film techniques such as evaporation or sputtering. Thereafter, by similar thin film techniques, a layer of conductive material is deposited over the same area. For the preferred embodiment of the present invention, the resistive material may be either tantalum nitride or tantalum/aluminum alloy or equivalent, and the conductor material may be either gold or aluminum or equiv-alent.
Referring now to Figure 2, resistive material 20 is shown covering mesa 14. After applying, baking, exposing and developing photoresist to delineate the pattern of electrical conductors to the heater eIements, conductor material 22 is then chemically etched to form individual conductors to each resistive heating element. Since resistive material 20 must be removed from the areas between conductors, that material - 20 is removed by a suitable chemical etching process or equivalent.
..
; Photoresist material is then again applied over the entire area, except where the resistive heating element is to be formed over mesa 14, thus delineating the resistive heating element.
After baking, exposing and developing the photoresist, the conductor material is then chemically etched from the top of the resistor covering mesa 14.
Prior to application of a wear-resistant material over the heater elements, the entire substrate is heat-treated. As shown in Figure 3, by controlling the temperature and the time of heat treatment, the amount of resistance change in each ~05920~
resistive heating element can be controlled. While the resist-ance change is essentially uniform for all of the resistive heater elemen-ts on the substrate, this heat treatment provides a method by which the resistance value of the heater elements can be upwardly adjusted to accommodate particular electronic drive circuits.
During the heat treatment process, a protective oxide grows over each individual resistive heater element. This protective oxide serves as a barrier against migration of ions from commonly known sources such as the thermally sensitive recording material itself. Such ions migrating to and lnto the heater elements tends to contaminate those elements which reduces their reliability and shortens their life. In addition, this oxide provides a better adhesion of a wear layer applied to each heater element after heat treatment.
Referring now to Figure 4,wear layer 30 is now applied over the immediate area of each heater element. The material is a wear-resistant, thermally-conductive material such as aluminum oxide. Thus a resistive heater element formed over mesas of glass glaze having a chemical ion migration barrier - and protected by a wear layer has been constructed, which pro-vides efficient developing of thermally sensitive recording material. The printing portion of the resistive heating element is shown in Figure 3 at 34. Protective oxide 32 improves reliability in an ion-laden environment by a factor of approx-imately six to one. It can be shown that six times the number of heater element failures were encountered after printing more than 30,000 feet of paper without the protective oxide than with the protective oxide present.
Referring now to Figure 5, thin film thermal print head ~(1 5920~3 40 comprises 7 resistive heater elements, for example, 41, common cond~c~or 42 and individual conductors, for example, 44. Each of the resistive heater elements and the conductors were formed as explained above for one of such elements.
Print head 40 may be used for forming 5 x 7 matrix alpha-; numeric characters along one axis of thermally sensitive recording material such as is described in Canadian Patent Application Serial No. 234,013 entitled METHOD AND APPARATUS
FOR ENHANCING AND MAINTAINING CHARACTER QUALITY IN THERMAL
PRINTERS filed by A.W~ Kovalick on August 21, 1975, and assigned to the assignee hereof.
J , - 6 ~
~ .
Claims (8)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A thin film thermal print head for operation in an environment including a source of ions comprising:
an aluminum oxide substrate;
a layer of glass glaze covering the substrate having a plurality of mesas formed on the surface thereof;
a layer of resistive material covering the mesas to form resistive heater elements thereon;
a plurality of electrical conductors coupled to the heater elements for connecting electrical power thereto;
a layer of oxide of the resistive material covering each of the heater elements to insulate the heater elements from the ions; and a layer of wear-resistant material covering the layer of oxide and having relatively high thermal conductivity.
an aluminum oxide substrate;
a layer of glass glaze covering the substrate having a plurality of mesas formed on the surface thereof;
a layer of resistive material covering the mesas to form resistive heater elements thereon;
a plurality of electrical conductors coupled to the heater elements for connecting electrical power thereto;
a layer of oxide of the resistive material covering each of the heater elements to insulate the heater elements from the ions; and a layer of wear-resistant material covering the layer of oxide and having relatively high thermal conductivity.
2. A thin film thermal print head as in claim 1 wherein the oxide layer also provides better adhesion of the wear-resistant material to the heater elements.
3. A thin film thermal print head as in claim 1 wherein the resistive material is selected from the group consisting of tantalum nitride and tantalum aluminum alloy.
4. A thin film thermal print head as in claim 1 wherein the wear-resistant material is aluminum oxide.
5. A thin film thermal print head as in claim 1 wherein the layer of oxide of the resistive material is formed by heating the heater elements.
6. A thin film thermal print head as in claim 5 wherein the resistance value of the heater elements is increased by said heating.
7. A thin film thermal print head as in claim 2 wherein the layer of oxide of the resistive material is effective as an ion insulator without electrical biasing said layer.
8. A thin film thermal print head as in claim 2 wherein the layer of oxide of the resistive material is effective as an ion insulator without electrically grounding said layer.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52410874A | 1974-11-15 | 1974-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1059208A true CA1059208A (en) | 1979-07-24 |
Family
ID=24087792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA233,178A Expired CA1059208A (en) | 1974-11-15 | 1975-08-07 | Thin film thermal print head |
Country Status (8)
| Country | Link |
|---|---|
| JP (2) | JPS5523550B2 (en) |
| CA (1) | CA1059208A (en) |
| DE (1) | DE2537142C3 (en) |
| FR (1) | FR2291032A1 (en) |
| GB (1) | GB1503969A (en) |
| HK (1) | HK26979A (en) |
| IT (1) | IT1052295B (en) |
| NL (1) | NL162014C (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5486354A (en) * | 1977-12-21 | 1979-07-09 | Toyo Dengu Seisakushiyo Kk | Thermal printing head |
| US4206541A (en) * | 1978-06-26 | 1980-06-10 | Extel Corporation | Method of manufacturing thin film thermal print heads |
| CA1109927A (en) * | 1978-06-26 | 1981-09-29 | Edmund T. Marciniec | Manufacture of thin film thermal print head |
| US4296421A (en) * | 1978-10-26 | 1981-10-20 | Canon Kabushiki Kaisha | Ink jet recording device using thermal propulsion and mechanical pressure changes |
| US4242565A (en) * | 1979-06-05 | 1980-12-30 | Minnesota Mining And Manufacturing Company | Thermal print head |
| JPS564481A (en) * | 1979-06-22 | 1981-01-17 | Tdk Corp | Thermal pen tip and preparation thereof |
| JPS5642667A (en) * | 1979-09-17 | 1981-04-20 | Nec Corp | Thermal head and production thereof |
| JPS5676589A (en) * | 1979-11-28 | 1981-06-24 | Tokyo Shibaura Electric Co | Wiring pattern |
| JPS56124362A (en) * | 1980-03-05 | 1981-09-30 | Hiromu Tezuka | Enriched sweetening agent |
| JPS56123878A (en) * | 1980-03-05 | 1981-09-29 | Hitachi Ltd | Thermosensitive recording head |
| JPS56159176A (en) * | 1980-05-12 | 1981-12-08 | Rohm Co Ltd | Thermal printing head |
| JPS59104963A (en) * | 1982-12-07 | 1984-06-18 | Seiko Instr & Electronics Ltd | Preparation of thermal head |
| JPS59120473A (en) * | 1982-12-28 | 1984-07-12 | Rohm Co Ltd | Thermal printer head |
| DE3347682C1 (en) * | 1983-01-04 | 1985-08-22 | F & O Electronic Systems GmbH & Co, 6901 Neckarsteinach | Thermal printing platen for a thermal printing device |
| DE3300104C1 (en) * | 1983-01-04 | 1983-12-15 | F & O Electronic Systems GmbH & Co, 6901 Neckarsteinach | Thermal printing board for a thermal printing device |
| FR2550132A1 (en) * | 1983-08-04 | 1985-02-08 | Dal Dan Felice | Improvements to thermal printers |
| JPH062416B2 (en) * | 1984-01-30 | 1994-01-12 | キヤノン株式会社 | Liquid jet recording head manufacturing method |
| JPS61255001A (en) * | 1985-05-07 | 1986-11-12 | 富士ゼロックス株式会社 | Thermal head |
| DE3804818C2 (en) * | 1988-02-12 | 1996-10-02 | Eastman Kodak Co | Thermal printing device |
| CN102029777A (en) * | 2010-09-26 | 2011-04-27 | 深圳市兴丽通科技有限公司 | Multifunctional color hot stamping machine applicable to curved surface package container |
| CN107901613A (en) * | 2017-11-27 | 2018-04-13 | 山东华菱电子股份有限公司 | A kind of novel thermosensitive printhead heating base plate and its manufacture method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3495070A (en) * | 1967-05-29 | 1970-02-10 | Murray H Zissen | Thermal printing apparatus |
| BR6802016D0 (en) * | 1967-10-02 | 1973-01-11 | Ncr | THERMAL PRINTING HEAD WITH THIN FILM PRINTING ELEMENTS |
| US3598956A (en) * | 1969-08-11 | 1971-08-10 | Ncr Co | Ion migration barrier |
| US3609294A (en) * | 1969-10-10 | 1971-09-28 | Ncr Co | Thermal printing head with thin film printing elements |
| US3726212A (en) * | 1970-09-21 | 1973-04-10 | Ncr | Method and apparatus for printing coded media |
| JPS4842983A (en) * | 1971-10-08 | 1973-06-21 | ||
| JPS545690B2 (en) * | 1972-03-06 | 1979-03-20 | ||
| JPS5737467B2 (en) * | 1973-02-05 | 1982-08-10 | ||
| JPS5012742U (en) * | 1973-05-29 | 1975-02-10 | ||
| JPS5151339A (en) * | 1974-10-31 | 1976-05-06 | Tokyo Shibaura Electric Co |
-
1975
- 1975-08-07 CA CA233,178A patent/CA1059208A/en not_active Expired
- 1975-08-08 GB GB3319375A patent/GB1503969A/en not_active Expired
- 1975-08-21 DE DE19752537142 patent/DE2537142C3/en not_active Expired
- 1975-08-26 NL NL7510038A patent/NL162014C/en not_active IP Right Cessation
- 1975-11-04 JP JP13268675A patent/JPS5523550B2/ja not_active Expired
- 1975-11-10 FR FR7534283A patent/FR2291032A1/en active Granted
- 1975-11-13 IT IT5219675A patent/IT1052295B/en active
-
1979
- 1979-04-26 HK HK26979A patent/HK26979A/en unknown
-
1984
- 1984-05-10 JP JP9380484A patent/JPS6046030B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59224372A (en) | 1984-12-17 |
| JPS5169639A (en) | 1976-06-16 |
| NL162014B (en) | 1979-11-15 |
| FR2291032B1 (en) | 1981-03-27 |
| DE2537142B2 (en) | 1978-08-17 |
| DE2537142A1 (en) | 1976-05-26 |
| HK26979A (en) | 1979-05-04 |
| NL7510038A (en) | 1976-05-18 |
| DE2537142C3 (en) | 1983-12-08 |
| IT1052295B (en) | 1981-06-20 |
| GB1503969A (en) | 1978-03-15 |
| FR2291032A1 (en) | 1976-06-11 |
| NL162014C (en) | 1980-04-15 |
| JPS5523550B2 (en) | 1980-06-24 |
| JPS6046030B2 (en) | 1985-10-14 |
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