JPS59120473A - Thermal printer head - Google Patents
Thermal printer headInfo
- Publication number
- JPS59120473A JPS59120473A JP57229835A JP22983582A JPS59120473A JP S59120473 A JPS59120473 A JP S59120473A JP 57229835 A JP57229835 A JP 57229835A JP 22983582 A JP22983582 A JP 22983582A JP S59120473 A JPS59120473 A JP S59120473A
- Authority
- JP
- Japan
- Prior art keywords
- glaze layer
- substrate
- chip
- extended
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Abstract
Description
【発明の詳細な説明】 この発明はサーマルプリンタヘッドに関する。[Detailed description of the invention] The present invention relates to a thermal printer head.
この種ヘッドにおいて−セラミックを基板とし。In this type of head - ceramic is used as the substrate.
その表面に断面を山状とするグレーズ層を設け、その頂
面に発熱要素を設置するようにＬ７た構成に別途提案さ
れている。この構成のヘッドにあってけ、グレーズ層の
得手方向に対［２て１交する方向にヘッドを烙動させて
、これを前記発熱要素からの熱に感応させて所要のプリ
ントを行なうようにしてｂる。ところでこのように表面
にグレーズ層を設けた基板の表面に更に発熱要素の発熱
制御のだめの回路、具体的には発熱要素への通電を制御
するドライバー、通電すべき発熱要素を選択制御するシ
フトレジスター、或ｌＡにラッチ回路その他の回路を設
けることが考えらハるうこのような構成によれば発熱要
素と制御回路とが１枚の基板上に収まるようになり一充
分な小型化が期待できるようになる。A separate L7 configuration has been proposed in which a glaze layer with a mountain-shaped cross section is provided on the surface, and a heat generating element is installed on the top surface of the glaze layer. If the head has this structure, the head is moved in a direction perpendicular to the direction of the glaze layer, and the head is made to respond to the heat from the heating element to perform the desired printing. bl. By the way, on the surface of the substrate with the glaze layer provided on the surface, there are additional circuits for controlling the heat generation of the heat generating elements, specifically, a driver for controlling the energization of the heat generating elements, and a shift register for selectively controlling the heat generating elements to be energized. It is considered that a latch circuit or other circuits may be provided in the 1A, but with such a configuration, the heat generating element and the control circuit can be housed on one board, and a sufficient reduction in size can be expected. It becomes like this.
通常この種回路は集槍化され、ひとつの工Ｃｑ−ツブと
（て構成さ釣ている。したがってこのＩＣモツプを前記
基板の表面に実装す引ばよ−。しかし実際にはとの工Ｃ
チップの電極端子は、発熱要素への通電のためのリード
にワイヤで接続することが必要であるつり−ドは通常基
板の表面にアルミニウムの蒸着等によって厚Ａ数μｍ（
たとえば２μｍ）程ＤＩＫＷめで薄く形成される。一方
基板けセラミック製であるからその表面は粗であり一し
たがってこの表面に形成さｈた薄いＩＪ−ドの表面も同
程度に粗であるだめ−ワイヤボンデインク゛がつきにく
く−そのためその接続に信頼性を損なう恐れがでてくる
。Normally, this type of circuit is assembled into a single piece of equipment. Therefore, it is necessary to mount this IC chip on the surface of the board. However, in reality, it is necessary to mount this IC on the surface of the board.
The electrode terminals of the chip need to be connected with wires to the leads for energizing the heat generating element.The suspension leads are usually made with a thickness of several μm (A) by vapor deposition of aluminum on the surface of the substrate.
For example, it is formed as thin as DIKW (about 2 μm). On the other hand, since the substrate is made of ceramic, its surface is rough, and the surface of the thin IJ card formed on this surface must also be rough to the same extent, making it difficult for wire bonding ink to stick to it.This makes the connection reliable. There is a risk of damaging the.
こノ発明は工Ｃチップをセラミック製の基板の表面に実
装する場合でも、リードへのワイヤボンディングを確実
にすることを目的とする。An object of the present invention is to ensure wire bonding to leads even when a C-chip is mounted on the surface of a ceramic substrate.
この発明は工Ｃ４−ツブを、基板の表面に設けたグレー
ズ層の上に実装するとともに、このグレーズ層の表面に
までリードを設け、グレーズ層表面のリード端部でワイ
ヤポンディングするようにし。In this invention, a C4-tube is mounted on a glaze layer provided on the surface of a substrate, and leads are provided even to the surface of this glaze layer, and wire bonding is performed at the end of the lead on the surface of the glaze layer.
たことを特徴とする。It is characterized by:
この発明の実施例を図によって貌、明すると−１けアに
ミナ等のセラミックからなる基板−２は断面をたとえば
高さが約４０μｍの山型とさｈて基板１の表面に形成さ
れたグレーズ層（ガラス層）−３はグレーズ層２０頂面
附近に設けちれた抵抗材か氏なる発熱要素で、グレーズ
層２の長手方向に沿ってライン状に配置される。４は各
発熱要素の一方の端部側に重ねるようにして接続さね、
であるリード、５け発熱要素の使方の端部側にまたがっ
て重ねるようにして接続されてあとコモンリードである
。両リード４．５はアルミニウムの蒸着等により薄膜状
（たとえば厚みが約２μｍ）に形成されてあろう
図の例では一感熱紙が基板１と平行して走行しやすいよ
うにするために、グレーズ層２と平行に同形状ハ突条層
６を設ける。これはグレーズ層２とともに同時に設ける
ようにしてもよいうこの場合は突条層６もグレーズ層と
なるう７は保護層でグレーズ層２（突条層６も含む。）
、発熱要素３等の、感熱紙の摺接による摩耗を防ぐため
の本のである。この種ヘッドでは、感熱紙はその幅をグ
レーズ層２の長手方向の畏さとほぼ等しくし一前記畏手
方向に対して直交する方向に走行させるので一保護層７
はグレーズ層２を含む領域すなわち第２図中の鎖線より
上方の領域にわたって設ければより０なお第２図、第３
図では保護層７は省略しである。An embodiment of the present invention will be described with reference to the drawings. A substrate 2 made of ceramic such as Mina is formed on the surface of the substrate 1 with a cross section having a mountain shape with a height of about 40 μm, for example. The glaze layer (glass layer)-3 is a heating element made of a resistive material provided near the top surface of the glaze layer 20, and is arranged in a line along the longitudinal direction of the glaze layer 2. 4 is connected to one end of each heat generating element so as to be overlapped,
The leads are connected so as to straddle the ends of the five heat generating elements and are connected in a way that they overlap and form a common lead. Both leads 4.5 are formed into a thin film (for example, about 2 μm thick) by vapor deposition of aluminum. A protrusion layer 6 having the same shape is provided in parallel with layer 2. This may be provided at the same time as the glaze layer 2. In this case, the ridge layer 6 also serves as a glaze layer. 7 is a protective layer that is the glaze layer 2 (including the ridge layer 6).
This is a book for preventing wear of heat-generating elements 3, etc. due to sliding contact with thermal paper. In this type of head, the width of the thermal paper is approximately equal to the longitudinal direction of the glaze layer 2, and the thermal paper is run in a direction perpendicular to the longitudinal direction of the glaze layer 2.
If it is provided over the region including the glaze layer 2, that is, the region above the chain line in FIG.
The protective layer 7 is omitted in the figure.
以上の構成は従来のものと大差はな１ハが、この発明に
したがい、基板ｌの表面に前記した制作１回路を集積化
した工Ｃチ・ツブ（以下迅にチ・ツブと言う。）８を実
装するのであるが、その九ｄ）に捷″′Ｊ″基板１の表
面の実装ラウンド部分に〃゛レース°層９設ける。こｆ
′１はグレーズ層２の形成と一緒に形成するようにする
とよい。このグレーズ層９の表面にチップ８をボンディ
ングなどによって実装する。又グレーズ層９の表面にま
でリード４の端部を延長１２．て設ける。周知のように
グレーズ層の表面はガラスと同じ程度のすぐねた平滑性
を備えているものであるかへ−その表面に形成される＋
１−ド４の表面も、こわが充分薄いことと相い１って同
程度の平滑性を具備するように々る。The above configuration is not much different from the conventional one, but in accordance with this invention, the above-mentioned production circuit is integrated on the surface of the board l. 8 is mounted, and in step 9d) a lace layer 9 is provided on the mounting round part of the surface of the ``J'' substrate 1. Kof
'1 is preferably formed at the same time as the glaze layer 2 is formed. A chip 8 is mounted on the surface of this glaze layer 9 by bonding or the like. Also, extend the ends of the leads 4 to the surface of the glaze layer 912. Provided. As is well known, the surface of the glaze layer must have the same level of smoothness as glass.
The surface of the 1-door 4 also has a sufficiently thin stiffness and has the same level of smoothness.
グレーズ層９の表面に実装さねた手・ツブ８の電極に連
る金線等か乙なるワイヤＩＱは−リード４にワイヤボン
ディングされる。又チ・ツブ８の電源側の電極に連る同
じようなワイヤ１１は外部引出用のリード１２にワイヤ
ボンディングされる。す・−ド１２本リード４と同じよ
うにグレーズ層９の表面にまで延優し７て設けられて−
る。なお実装されたチップ８けその表面を樹脂などでコ
ーティングするか或−はキャップをかぶせるなどし、で
保護する。ただし７図ではこ引ちの保詐のための構成は
省略し７である。A wire IQ, such as a gold wire, connected to the electrode of the hand/tube 8 mounted on the surface of the glaze layer 9 is wire-bonded to the -lead 4. A similar wire 11 connected to the electrode on the power supply side of the chip 8 is wire-bonded to a lead 12 for external extraction. Similar to the lead 4, there are 12 leads extending to the surface of the glaze layer 9.
Ru. The surface of the mounted chip 8 is protected by coating it with a resin or the like or by covering it with a cap. However, in FIG. 7, the configuration for security fraud is omitted.
以上のようにワイヤポンディングは、グレーズ層９の表
面に延長されて形成さねたり一ドに対して行なわ汎るが
、この部分は前記したようにグレーズ層９と同程度の平
滑性を具備１〜でいることにより−ワイヤボンデイング
が容易かつ確実にできるようになる５又グレ一ズ層９の
表面が平滑であるため、この表面に延長して設けるリー
ド４．］１のパターンがぼけるようなことばなくなり−
したがって正確なパターンができるし７、又できたパタ
ーンのぼけが少し）ことにより７その祷認も容易となる
。As described above, wire bonding is generally performed on a portion of the surface of the glaze layer 9 that extends to the surface of the glaze layer 9, and as described above, this portion has the same level of smoothness as the glaze layer 9. Since the surface of the five-pronged glazed layer 9 is smooth, the leads 4 are provided extending on this surface. ] There are no more words that make the pattern of 1 blurry.
Therefore, an accurate pattern can be made, and the resulting pattern will be slightly blurred, making it easier to recognize it.
なお上記の実施例では突条Ｍ６を併せて具備１−７た構
成としたが、これを必要とし２なりときけ、第４図に示
すようにグレーズ層２．９のみを股ケ引−ばよい。又グ
レーズ層２．９をそれぞれ独立［７て設ける代りにこれ
を連続して設けて本よく、第５図はグレーズ層２．９、
突条層６を一体に、又第６図はグレーズ層２．９を一体
に設けたときのパターンを示している。In the above embodiment, the ridges 1-7 are also provided, but this is necessary and can be removed by removing only the glaze layer 2.9 from the crotch area as shown in FIG. good. Also, instead of providing the glaze layers 2.9 independently [7], it is preferable to provide them consecutively; Fig. 5 shows the glaze layers 2.9,
6 shows a pattern when the protrusion layer 6 is provided integrally, and FIG. 6 shows a pattern when the glaze layer 2.9 is provided integrally.
以上詳述したようにこの発明によｈば、セラミック製の
基板の表面に山型状のグレーズ層を設け、その頂面にフ
ィンａ′に発熱要素を設けたプリンタヘッドにおいて−
その基板の表面に更に制御回路を構成する工Ｃチップを
実装する場合でも、こね。As detailed above, according to the present invention, in a printer head in which a mountain-shaped glaze layer is provided on the surface of a ceramic substrate, and a heating element is provided in the fin a' on the top surface of the glaze layer, -
Even when mounting the engineering chip that constitutes the control circuit on the surface of the board, kneading is required.
かちのワイヤをリードに確実にワイヤボンディングする
ことができ、かつそのリードのパターンを正確に作り得
るｌ〜、又その視認も容易となるといった効果を奏する
。It is possible to reliably wire-bond the wire to the lead, to accurately form the pattern of the lead, and to facilitate visual recognition.
第１図はこの発明の実施例を示す横断面図、第２図は同
平面図−第３図は同縦断面図、第４図乃至第６図はグレ
ーズ層のパターンを示す平面図である。
１・・・・・・基板、２・・・・・・グレーズ層、３・
・・・・・発熱要素、４、５．１２・・・・・・リード
−８・・・・・・ＩＣチップ−９・・・・・・グレーズ
層、１０．１１・・・・・・ワイヤ特許出願人 ローム
株式会社
代理人中沢謹之助FIG. 1 is a cross-sectional view showing an embodiment of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is a longitudinal cross-sectional view of the same, and FIGS. 4 to 6 are plan views showing patterns of a glaze layer. . 1...Substrate, 2...Glaze layer, 3.
... Heat generating element, 4, 5.12 ... Lead -8 ... IC chip -9 ... Glaze layer, 10.11 ... Wire patent applicant Kinnosuke Nakazawa, agent of ROHM Co., Ltd.
Claims (1)
ズ層を設け、その表面に発熱要素をライン状に配置する
とと本に、前記発熱要素を通電制御するための制御回路
を構成する工Ｃ４−ツブを、前記基板の表面に実装ラウ
ンド用に設けたグレーズ層の表面に実装し−このグレー
ズ層の表面にまで延畏されて形成され九−前記発熱要素
への通電用の１１−ドの端部に、前記工Ｃチップかちの
ワイヤをワイヤボンディングして接続してなるサーマル
プリンタヘッド。When a glaze layer with a mountain-shaped cross section is provided on the surface of a ceramic substrate, and heat generating elements are arranged in a line on the surface, a process C4 for configuring a control circuit for controlling energization of the heat generating elements is described. - The knob is mounted on the surface of a glaze layer provided on the surface of the substrate for mounting rounds. The thermal printer head is formed by connecting the wire of the C chip to the end by wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57229835A JPS59120473A (en) | 1982-12-28 | 1982-12-28 | Thermal printer head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57229835A JPS59120473A (en) | 1982-12-28 | 1982-12-28 | Thermal printer head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59120473A true JPS59120473A (en) | 1984-07-12 |
| JPS6319358B2 JPS6319358B2 (en) | 1988-04-22 |
Family
ID=16898414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57229835A Granted JPS59120473A (en) | 1982-12-28 | 1982-12-28 | Thermal printer head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59120473A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083750U (en) * | 1983-11-14 | 1985-06-10 | 沖電気工業株式会社 | Transverse thermal head |
| JPS63265660A (en) * | 1987-04-24 | 1988-11-02 | Pentel Kk | Thermal head |
| US4973987A (en) * | 1988-06-22 | 1990-11-27 | Konica Corporation | Thermal recording head |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5169639A (en) * | 1974-11-15 | 1976-06-16 | Hewlett Packard Yokogawa | |
| JPS5421854A (en) * | 1977-07-20 | 1979-02-19 | Toshiba Corp | Recording head |
| JPS5613186A (en) * | 1979-07-12 | 1981-02-09 | Matsushita Electric Ind Co Ltd | Production of thermal head |
| JPS56150574A (en) * | 1980-04-24 | 1981-11-21 | Canon Inc | Thermal head |
| JPS57165275A (en) * | 1981-04-07 | 1982-10-12 | Ricoh Co Ltd | Thermal head device |
-
1982
- 1982-12-28 JP JP57229835A patent/JPS59120473A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5169639A (en) * | 1974-11-15 | 1976-06-16 | Hewlett Packard Yokogawa | |
| JPS5421854A (en) * | 1977-07-20 | 1979-02-19 | Toshiba Corp | Recording head |
| JPS5613186A (en) * | 1979-07-12 | 1981-02-09 | Matsushita Electric Ind Co Ltd | Production of thermal head |
| JPS56150574A (en) * | 1980-04-24 | 1981-11-21 | Canon Inc | Thermal head |
| JPS57165275A (en) * | 1981-04-07 | 1982-10-12 | Ricoh Co Ltd | Thermal head device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083750U (en) * | 1983-11-14 | 1985-06-10 | 沖電気工業株式会社 | Transverse thermal head |
| JPS63265660A (en) * | 1987-04-24 | 1988-11-02 | Pentel Kk | Thermal head |
| US4973987A (en) * | 1988-06-22 | 1990-11-27 | Konica Corporation | Thermal recording head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6319358B2 (en) | 1988-04-22 |
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