CN109383133B - Thermal head - Google Patents
Thermal head Download PDFInfo
- Publication number
- CN109383133B CN109383133B CN201810890851.6A CN201810890851A CN109383133B CN 109383133 B CN109383133 B CN 109383133B CN 201810890851 A CN201810890851 A CN 201810890851A CN 109383133 B CN109383133 B CN 109383133B
- Authority
- CN
- China
- Prior art keywords
- scanning direction
- extending
- extending portions
- portions
- main scanning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052709 silver Inorganic materials 0.000 claims abstract description 21
- 239000004332 silver Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 15
- 230000001681 protective effect Effects 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims abstract description 11
- 239000002356 single layer Substances 0.000 claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 21
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 15
- 239000011295 pitch Substances 0.000 description 14
- 239000010931 gold Substances 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 9
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3351—Electrode layers
Landscapes
- Electronic Switches (AREA)
Abstract
The invention provides a thermal head which simplifies the process required for forming wiring. The thermal head includes: a common electrode having a plurality of first extending portions extending in a sub-scanning direction and formed on an insulating substrate in a main scanning direction; a plurality of independent electrodes formed on the insulating substrate along the main scanning direction, having a second extension portion between the two first extension portions and extending along the sub scanning direction at one end, and having a first pad at the other end; a heating element formed in a band shape on an upper layer of the plurality of first extending portions and the plurality of second extending portions; and a protective film that covers a first region including at least a plurality of first extension portions in the common electrode and a second region including at least a plurality of second extension portions in the plurality of individual electrodes and excluding the plurality of first pads, wherein at least a position covered with the protective film is configured as a single layer formed of a material containing silver with respect to the at least a plurality of first extension portions in the common electrode and the plurality of individual electrodes.
Description
Technical Field
The present invention relates to a thermal head.
Background
There is known a thermal head having a wiring pattern formed by overlapping two layers each containing silver (for example, patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 5952089
Disclosure of Invention
Problems to be solved by the invention
The prior art has the following problems: the wirings must be formed in a total of two to three layers by respective processes one by one.
Means for solving the problems
According to a first aspect of the present invention, a thermal head includes: a common electrode having a plurality of first extending portions extending in a sub-scanning direction and formed on an insulating substrate in a main scanning direction; a plurality of independent electrodes formed on the insulating substrate along the main scanning direction, each of the independent electrodes having a second extending portion at one end thereof, the second extending portion being located between the two first extending portions and extending along the sub scanning direction, and a first pad at the other end thereof; a heating element formed in a band shape on an upper layer of the plurality of first extending portions and the plurality of second extending portions; and a protective film that covers a first region and a second region, the first region including at least a plurality of first extension portions of the common electrode, the second region including at least a plurality of second extension portions of the individual electrodes, and the positions of the at least first extension portions of the common electrode and the individual electrodes, which are covered with the protective film, except for the first pads, being a single layer formed of a material containing silver.
According to a second aspect of the present invention, a thermal head includes: a common electrode having a common electrode base portion extending in a main scanning direction and a plurality of first extension portions extending from the common electrode base portion in a sub-scanning direction; a plurality of independent electrodes each having a second extending portion located between the two first extending portions and extending in the sub-scanning direction, a connecting portion extending in the sub-scanning direction from the second extending portion, and a first pad provided at the other end of the connecting portion; and a heating element formed in a band shape along a main scanning direction on an upper layer of the plurality of first extending portions and the plurality of second extending portions, wherein the plurality of first extending portions, the plurality of second extending portions, and the plurality of connecting portions are formed as a single layer made of a material containing silver.
Effects of the invention
According to the present invention, the process required for forming the wiring can be simplified.
Drawings
Fig. 1 is a plan view showing a structure of a thermal head according to a first embodiment.
Fig. 2 is a sectional view showing the structure of the thermal head of the first embodiment.
Fig. 3 is a plan view enlarging a part of fig. 1.
Fig. 4 is a plan view showing a modified example of the individual electrode.
In the drawings:
100-thermal head, 1-heating body, 2-common electrode, 3-independent electrode, 4-insulating substrate, 6-drive IC, 7-gold wire, 9-printed wiring board, 12-protective film, 20-first extension portion, 30-second extension portion, 31-first bonding pad, 60-second bonding pad.
Detailed Description
(first embodiment)
Fig. 1 is a plan view showing a structure of a thermal head according to a first embodiment of the present invention. Fig. 2 is a view schematically showing a cross section taken along line I-I of fig. 1. Fig. 3 is an enlarged plan view of a portion indicated by a broken line 40 in fig. 1. The thermal head 100 includes an insulating substrate 4 and a printed wiring board 9 fixed to a support plate 5. The insulating substrate 4 and the printed wiring board 9 are fixed to the support plate 5 by an adhesive layer 11.
The insulating substrate 4 is formed of an insulator such as ceramic. A common electrode 2 and a plurality of individual electrodes 3 are formed on an insulating substrate 4. The strip-shaped heating element 1 is formed on the common electrode 2 and the plurality of individual electrodes 3 by, for example, thick-film printing. The common electrode 2 and a part of the individual electrodes 3 are covered with a protective film 12. The protective film 12 is made of glass or the like, for example.
The printed wiring board 9 is provided with two driver ICs 6 and a connector 10 for connecting the thermal head 100 to an external device for performing print control and the like. One end of each individual electrode 3 is connected to any one of the driver ICs 6 via a gold wire 7. The gold wires 7 and the driver IC6 are molded with a sealing resin 8.
The common electrode 2 has a common electrode base 21 and a plurality of first extension portions 20. The common electrode base 21 is formed along three sides other than one side facing the printed wiring board 9 among four sides which the rectangular insulating substrate 4 has. The plurality of first extending portions 20 extend in the sub-scanning direction 42 (vertical direction on the paper surface in fig. 1) of the common electrode base portion 21.
The individual electrodes 3 each have a connection portion 32, a second extension portion 30, and a first pad 31. The second extension portion 30 is located between the two first extension portions 20 and extends in the sub-scanning direction 42. The connecting portion 32 extends from the second extending portion 30 in the sub-scanning direction 42. The first pad 31 is provided at the other end of the connection portion 32, that is, at the end of the connection portion 32 on the opposite side of the second extension portion 30. That is, the second extension portion 30 is provided at one end of the connection portion 32, and the first pad 31 is provided at the other end. In other words, the individual electrode 3 has the second extension portion 30 at one end and the first pad 31 at the other end.
The plurality of first extension portions 20 and the plurality of second extension portions 30 are formed to alternately face each other and engage with each other. The heating element 1 is formed across the plurality of first extending portions 20 and the plurality of second extending portions 30, and is provided to extend in a main scanning direction 41 (left-right direction of the paper surface in fig. 1) which is an arrangement direction of the first extending portions 20 and the second extending portions 30.
At least the first extension portion 20 and the plurality of individual electrodes 3 of the common electrode 2 are formed as a single layer by, for example, photolithography using a liquid resin paste in which silver particles are dispersed in a solvent. The common electrode base 21 may be formed by further laminating silver paste. By using a resin paste of liquid silver, the common electrode 2 and the plurality of individual electrodes 3 can be formed thinner than when using a so-called frit-type silver paste including silver powder and a glass frit. The extension portion 20 of the common electrode 2 and the plurality of individual electrodes 3 in the present embodiment have a thickness of, for example, 1.5 μm and are formed at a ratio of about 80 wt% of silver (Ag). Since the formation is performed through the firing step, the resin paste containing liquid silver used may contain, for example, a resin, a solvent, and the like in addition to silver, and in this case, the content of silver (Ag) is reduced from the above 80 wt% by the amount of the resin, the solvent, and the like.
For example, when the common electrode 2 and the plurality of individual electrodes 3 are formed using a frit-type silver paste, the thickness of the common electrode 2 and the plurality of individual electrodes 3 is, for example, 3 μm. In addition, in the case where at least the first extension portion 20 of the common electrode 2 and the plurality of individual electrodes 3 are formed of a plurality of layers, the thicknesses of at least the first extension portion 20 of the common electrode 2 and the plurality of individual electrodes 3 become thicker.
The first pads 31 are aligned in a line along the edge 4a (fig. 1 and 2) of the insulating substrate 4 on the printed wiring board 9 side, that is, along the main scanning direction 41. The driver IC6 has second pads 60 formed along the edge 6a (fig. 1 and 2) facing the insulating substrate 4, i.e., along the main scanning direction 41. The plurality of first pads 31 are arranged at the same pitch as the plurality of second pads 60. One second pad 60 corresponds to one first pad 31. Each first pad 31 is electrically connected to the corresponding second pad 60 by a gold wire 7. The gold wire 7 is used for electrical connection, and a metal wire other than gold, for example, a metal wire made of copper or silver as a main material may be used.
A partial region of the insulating substrate 4 is covered with a protective film 12 indicated by a chain line in fig. 2 and 3. The region protected by the protective film 12 includes the heating element 1, most of the common electrode 2 including at least the first extension portion 20, and the portion of the individual electrode 3 other than the first pad 31 (i.e., most of the second extension portion 30 and the connection portion 32).
The two drive ICs 6 flow a current from the common electrode 2 to each individual electrode 3 through the heating element 1. As a result, a current flows through the portion of the heating element 1 located between the portions of the first extension portion 20 and the second extension portion 30 that are alternately opposed and engaged with each other, and this portion generates heat. Printing is performed by applying the heat to a printing medium such as thermal paper.
The two driver ICs 6 make the potential of the second pad 60 corresponding to the portion to be printed lower than the potential of the common electrode 2. Thus, the current flows through the path of the common electrode 2, the part of the heating element 1 to be printed, the individual electrode 3, the gold wire 7, and the second pad 60. That is, the two drive ICs 6 independently control ON and OFF of currents flowing in the plurality of individual electrodes 3.
The density of printing varies depending on the amount of heat generation of the heat-generating body 1 portion. The amount of heat generation of the heating element 1 portion changes depending on the current flowing through the portion and the resistance value. In order to obtain excellent printing results, it is desirable to make the heat generation amount of each part of the heat generating body 1 to be printed uniform. That is, in order to obtain excellent printing results, it is desirable to make the resistance values of the heating element 1 to be printed and the currents flowing through the respective portions uniform.
The print resolution in the main scanning direction 41 of the thermal head 100 of the present embodiment is, for example, about 203 dpi. In this case, the width of the printed dots in the main scanning direction 41 is 125 μm. That is, the arrangement pitch 44 (fig. 3) of the first extending portions 20 and the arrangement pitch 45 (fig. 3) of the second extending portions 30 in the main scanning direction 41 are 125 μm.
The driver ICs 6 included in the thermal head 100 of the present embodiment control currents that flow through 192 individual electrodes 3 independently for each individual electrode.
In fig. 2 and 3, the individual electrodes 3 are shown in a simplified manner for convenience of drawing, rather than actually. Therefore, the number of the first extension portions 20, the number of the second extension portions 30, the number of the first pads 31, the number of the second pads 60, and the like are also shown to be smaller than the actual ones.
The arrangement pitch 46 (fig. 3) of the first pads 31 and the arrangement pitch 47 (fig. 3) of the second pads 60 in the main scanning direction 41 of the thermal head 100 according to the present embodiment are, for example, 63 μm. That is, the arrangement pitches 44 and 45 of the first extending portions 20 and the second extending portions 30 in the main scanning direction 41 are larger than the arrangement pitches 46 and 47 of the first pads 31 and the second pads 60 in the main scanning direction 41.
Since there is a difference in arrangement pitch, the plurality of individual electrodes 3 have different shapes depending on the relative positional relationship with the drive IC 6. For example, the individual electrode 3a (fig. 3) near the center of the driver IC6 has a linear shape from the second extension portion 30 provided at one end to the first pad 31 provided at the other end. On the other hand, the individual electrode 3b (fig. 3) near the end of the driver IC6 has a non-linear shape from the second extension portion 30 provided at one end to the first pad 31 provided at the other end. Specifically, the individual electrodes 3 corresponding to one drive IC6 are tapered from the heating element 1 side toward the drive IC 6. Therefore, the distance from one end to the other end of the individual electrode 3b, that is, the path length of the current flowing through the individual electrode 3b is longer than that of the individual electrode 3 a. For example, when the distance from one end to the other end of the individual electrode 3a is 2.3mm, the distance from one end to the other end of the individual electrode 3b is longer, 6.8 mm.
Then, since the individual electrodes 3 differ from each other with respect to the wiring length of the individual electrodes 3, the resistance value of the individual electrode 3 also differs from each individual electrode 3. For example, the resistance value of the individual electrode 3a is 3.0 Ω, and the resistance value of the individual electrode 3b is 9.5 Ω. That is, there is a difference in resistance value of 6.5 Ω between the shortest individual electrode 3a and the longest individual electrode 3 b. When the finished product resistance value of the thermal head 100 is 176 Ω or less, the relative difference in resistance values between the individual electrodes 3a and 3b is 6.5/176 — 3.7%.
In the case where the individual electrodes 3 are formed of a gold-based material, the resistance value of the individual electrode 3a is 4.0 Ω, and the resistance value of the individual electrode 3b is 18.7 Ω. That is, in the case where the individual electrodes 3 are formed of a gold-based material, there is a difference in resistance value of 14.7 Ω between the shortest individual electrode 3a and the longest individual electrode 3 b. When the finished product resistance value of the thermal head 100 is 176 Ω or less, the relative difference in resistance values between the individual electrodes 3a and 3b is 14.7/176 — 8.3%.
According to the above embodiment, the following operational effects can be obtained.
(1) At least the first extension portion 20 of the common electrode 2 and the plurality of individual electrodes 3 are configured as a single layer formed of a material containing silver. This can simplify the steps required for forming the wiring compared to conventional ones. Further, since the resistance values of the common electrode 2 and the plurality of individual electrodes 3 can be reduced by using silver as compared with the case of using gold or the like, it is possible to reduce the loss of current flowing through the heating element 1 connected to each individual electrode 3 and to reduce the difference in the relative resistance values.
(2) The arrangement pitches 44 and 45 of the first extension portion 20 and the second extension portion 30 in the main scanning direction 41 are 125 μm, which is larger than the arrangement pitch 46 of the plurality of first pads 31 in the main scanning direction 41, that is, 63 μm. This can reduce the size of the driver IC6 itself and further reduce the mounting area.
(3) At least the first extension portion 20 and the plurality of individual electrodes 3 of the common electrode 2 include 80 wt% or more Ag particles. This can reduce the resistance values of the common electrode 2 and the plurality of individual electrodes 3 as compared with the case of using a material such as gold (Au), for example, and thus can reduce the difference in the relative resistance values for each individual electrode 3.
(4) The common electrode 2 and the plurality of individual electrodes 3 are formed of a liquid silver resin paste. This makes it possible to make the common electrode 2 and the plurality of individual electrodes 3 thinner than in the case of using a silver paste containing a glass frit.
(5) The driver IC6 is provided with a plurality of second pads 60, and the plurality of second pads 60 are formed at the same arrangement pitch 47 as the plurality of first pads 31 along the main scanning direction 41 and are electrically connected to each of the plurality of first pads 31. This makes it possible to make the lengths of the gold wires 7 uniform and reduce variations in the resistance value of each individual electrode 3.
(6) In the case where a single drive IC6 controls a large number of individual electrodes 3, for example, the individual electrodes 3b located near the end of the drive IC6 are farther from the first pads 31 in the main scanning direction 41. In contrast, in the present embodiment, since the plurality of driver ICs 6 are provided on the printed wiring board 9, the distance from one end to the other end of the individual electrode 3b located near the end of the driver IC6 can be shortened as compared with the case where a single driver IC6 is used.
(7) The arrangement pitch of the plurality of second pads of the driver IC6 can be reduced, the area of the surface of the driver IC itself on which the second pads are arranged can be reduced, and the driver IC6 can be miniaturized.
(8) By suppressing the difference in resistance value between the plurality of independent wirings, the length of the insulating substrate 4 in the sub-scanning direction can be reduced, and the insulating substrate 4 can be further miniaturized.
The following modifications are also within the scope of the present invention, and one or more of the modifications may be combined with the above-described embodiments.
(modification 1)
The portions of the plurality of individual electrodes 3 not covered with the protective film 12 may be formed of a different material from the portions covered with the protective film 12. For example, the first pad 31 may have a two-layer structure, and the lower layer may be formed of a gold-based material and the upper layer may be formed of a silver-based material. Even in the case of such a configuration, the same effects as those of the above embodiment can be obtained.
(modification 2)
The numerical values described in the above embodiments are examples, and numerical values different from these may be used. For example, the arrangement pitches 44 and 45 of the first extension portions 20 and the second extension portions 30 may be larger than or smaller than 125 μm, and the arrangement pitches 46 and 47 of the first pads 31 and the second pads 60 may be larger than or smaller than 63 μm. As long as the former and the latter are different, the plurality of individual electrodes 3 have a difference in resistance value, and therefore, the same effects as those of the above embodiment can be obtained.
The finished resistance value of the thermal head 100 may not be 176 Ω. It may be set to 80 Ω, for example. In this case, the relative difference in resistance values between the individual electrode 3a located near the center of the driver IC6 and the individual electrode 3b located near the end of the driver IC6 was 7.8%, and sufficient print quality could be maintained. In contrast, when the individual electrodes 3 were formed of a gold-based material, the relative difference in the resistance values between the individual electrodes 3a and 3b was 19.7%. If the value exceeds 10.0%, the print quality cannot be sufficiently maintained. That is, by forming the individual electrodes 3 from a silver-based material, the degree of freedom in designing the thermal head 100 can be improved.
The number of terminals of the driver IC6 may be more or less than 192. The number of the driver ICs 6 may be different from two. For example, only one driver IC6 may be used, or three or more driver ICs 6 may be used. Even in the case of such a configuration, the same effects as those of the above embodiment can be obtained.
(modification 3)
The first pads 31 may be formed in two or more rows in the main scanning direction. In other words, the position of the first pad 31 in the sub-scanning direction 42 may be made different for each first pad 31. Fig. 4 shows an example in which the first pads 31 are formed in two rows. In fig. 4, the first pads 31a arranged in the upward direction of the drawing belong to a column 48. In fig. 4, the first pads 31b arranged in the downward direction of the paper belong to a row 49. Even in the case of such a configuration, the same effects as those of the above embodiment can be obtained. In this case, the length of the gold wire 7 is different for each individual electrode 3, and therefore, it is desirable to consider the resistance value of the individual electrode 3 including the gold wire 7.
(modification 4)
The connector 10 is a solution of an interface to the control side, and therefore, is not limited to this manner. For example, not only a ribbon cable but also a connector for FFC or FPC may be used, and the FFC or FPC may be connected directly by means of solder or the like by providing a land on the circuit board without the connector.
While the embodiments and the modifications have been described above, the present invention is not limited to these embodiments. Other modes that can be conceived within the scope of the technical idea of the present invention are also included in the scope of the present invention.
Claims (9)
1. A thermal head is characterized by comprising:
a common electrode having a plurality of first extending portions extending in a sub-scanning direction and formed on an insulating substrate in a main scanning direction;
a plurality of independent electrodes formed on the insulating substrate along the main scanning direction, each of the independent electrodes having a second extending portion at one end thereof, the second extending portion being located between the two first extending portions and extending along the sub scanning direction, and a first pad at the other end thereof;
a heating element formed in a band shape on an upper layer of the plurality of first extending portions and the plurality of second extending portions; and
a protective film covering a first region including at least a plurality of first extension portions of the common electrode and a second region including at least a plurality of second extension portions of the individual electrodes except for a plurality of first pads,
at least the first extending portions and the individual electrodes of the common electrode are formed as a single layer of a material containing silver at positions covered with the protective film,
an arrangement pitch of the first extending portions and the second extending portions in the main scanning direction is 125 μm, and an arrangement pitch of the plurality of first pads in the main scanning direction is 63 μm.
2. A thermal head is characterized by comprising:
a common electrode having a common electrode base portion extending in a main scanning direction and a plurality of first extension portions extending from the common electrode base portion in a sub-scanning direction;
a plurality of independent electrodes each having a second extending portion located between the two first extending portions and extending in the sub-scanning direction, a connecting portion extending in the sub-scanning direction from the second extending portion, and a first pad provided at the other end of the connecting portion; and
a heating element formed in a band shape along a main scanning direction on an upper layer of the plurality of first extending portions and the plurality of second extending portions,
the plurality of first extending portions, the plurality of second extending portions, and the plurality of connecting portions are formed as a single layer made of a material containing silver,
an arrangement pitch of the first extending portions and the second extending portions in the main scanning direction is 125 μm, and an arrangement pitch of the plurality of first pads in the main scanning direction is 63 μm.
3. The thermal head according to claim 1 or 2,
the arrangement pitch of the first extending portions and the second extending portions in the main scanning direction is larger than the arrangement pitch of the first pads in the main scanning direction.
4. The thermal head according to claim 1 or 2,
the common electrode and the individual electrode containing silver contain 80 wt% or more of silver particles.
5. The thermal head according to claim 1 or 2,
the monolayer is formed of a liquid silver paste.
6. The thermal head according to claim 1 or 2,
the thickness of the monolayer is 2.0 μm or less.
7. The thermal head according to claim 1 or 2,
the liquid crystal display device further includes a circuit board provided with a driver IC having a plurality of second pads formed at the same arrangement pitch as the plurality of first pads in the main scanning direction and electrically connected to the plurality of first pads, and independently controlling a current flowing through each of the plurality of second pads.
8. A thermal head according to claim 7,
the circuit board includes a plurality of the driver ICs.
9. A thermal head according to claim 7,
one of the driver ICs independently controls current flowing in 192 of the second pads.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-153430 | 2017-08-08 | ||
| JP2017153430A JP6754335B2 (en) | 2017-08-08 | 2017-08-08 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109383133A CN109383133A (en) | 2019-02-26 |
| CN109383133B true CN109383133B (en) | 2021-02-05 |
Family
ID=65417528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810890851.6A Active CN109383133B (en) | 2017-08-08 | 2018-08-07 | Thermal head |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6754335B2 (en) |
| CN (1) | CN109383133B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7356673B2 (en) | 2019-02-22 | 2023-10-05 | パナソニックホールディングス株式会社 | Secure secret distribution storage system using cloud services |
| JP2022133080A (en) * | 2021-03-01 | 2022-09-13 | アオイ電子株式会社 | Manufacturing method for thermal head and thermal head |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09314877A (en) * | 1996-05-29 | 1997-12-09 | Alps Electric Co Ltd | Thermal head and its production |
| JP2013173339A (en) * | 2012-01-25 | 2013-09-05 | Rohm Co Ltd | Method of manufacturing fine wiring pattern, fine wiring pattern, and thermal print head |
| JP2015036216A (en) * | 2013-08-13 | 2015-02-23 | アオイ電子株式会社 | Thermal head |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2508923B2 (en) * | 1991-01-18 | 1996-06-19 | ローム株式会社 | Thick film thermal head |
| JPH0890810A (en) * | 1994-07-29 | 1996-04-09 | Rohm Co Ltd | Thick thermal head |
| JP3864281B2 (en) * | 1996-10-15 | 2006-12-27 | 富士フイルムホールディングス株式会社 | Piezoelectric inkjet printer head and method for manufacturing piezoelectric inkjet printer head |
| JP3652831B2 (en) * | 1997-03-28 | 2005-05-25 | ローム株式会社 | Heat generating device and manufacturing method thereof |
| JP2000289242A (en) * | 1999-04-02 | 2000-10-17 | Aoi Electronics Co Ltd | Thermal head |
| JP4494605B2 (en) * | 2000-08-09 | 2010-06-30 | ローム株式会社 | Thermal print head |
| JP2002067366A (en) * | 2000-09-01 | 2002-03-05 | Rohm Co Ltd | Heating resistor for thermal print head, thermal print head, and method of manufacturing the heating resistor |
| JP2005085877A (en) * | 2003-09-05 | 2005-03-31 | Seiko Epson Corp | Method of manufacturing device, device, and electronic apparatus |
| JP2005225053A (en) * | 2004-02-12 | 2005-08-25 | Alps Electric Co Ltd | Thermal head |
| CN102555515B (en) * | 2010-11-19 | 2015-08-26 | 罗姆股份有限公司 | Thermal printing head and manufacture method thereof |
| JP5589811B2 (en) * | 2010-12-06 | 2014-09-17 | ブラザー工業株式会社 | Piezoelectric actuator |
| JP5765003B2 (en) * | 2011-03-29 | 2015-08-19 | セイコーエプソン株式会社 | Thermal head and thermal printer |
| JP6396001B2 (en) * | 2013-04-08 | 2018-09-26 | アオイ電子株式会社 | Circuit board and thermal print head |
| JP5977719B2 (en) * | 2013-08-13 | 2016-08-24 | アオイ電子株式会社 | Thermal head |
| JP6371529B2 (en) * | 2014-01-21 | 2018-08-08 | ローム株式会社 | Thermal print head, thermal printer |
| CN203713263U (en) * | 2014-01-27 | 2014-07-16 | 山东华菱电子有限公司 | Thermal-sensitive print head |
| CN204736569U (en) * | 2015-06-05 | 2015-11-04 | 山东华菱电子股份有限公司 | Printer head is beaten to temperature sensing |
| JP6364383B2 (en) * | 2015-06-30 | 2018-07-25 | アオイ電子株式会社 | Wiring board and thermal head |
| CN204977815U (en) * | 2015-07-24 | 2016-01-20 | 山东华菱电子股份有限公司 | Thermosensitive printing head |
-
2017
- 2017-08-08 JP JP2017153430A patent/JP6754335B2/en active Active
-
2018
- 2018-08-07 CN CN201810890851.6A patent/CN109383133B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09314877A (en) * | 1996-05-29 | 1997-12-09 | Alps Electric Co Ltd | Thermal head and its production |
| JP2013173339A (en) * | 2012-01-25 | 2013-09-05 | Rohm Co Ltd | Method of manufacturing fine wiring pattern, fine wiring pattern, and thermal print head |
| JP2015036216A (en) * | 2013-08-13 | 2015-02-23 | アオイ電子株式会社 | Thermal head |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109383133A (en) | 2019-02-26 |
| JP6754335B2 (en) | 2020-09-09 |
| JP2019031022A (en) | 2019-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9358804B2 (en) | Fine wiring pattern, manufacturing method thereof, and thermal print head | |
| US9937729B2 (en) | Thermal print head | |
| CN102529416A (en) | Thermal print head | |
| JP2022044731A (en) | Thermal print head and thermal print head manufacturing method | |
| JP6371529B2 (en) | Thermal print head, thermal printer | |
| CN105026165A (en) | Thermal head and thermal printer | |
| CN109383133B (en) | Thermal head | |
| JP2012116064A (en) | Thermal printing head | |
| JP2012158034A (en) | Thermal head | |
| JP7037401B2 (en) | Thermal print head | |
| JP6754339B2 (en) | Thermal head | |
| JP7093226B2 (en) | Thermal print head | |
| JP7016642B2 (en) | Manufacturing method of thermal print head and thermal print head | |
| JP5511510B2 (en) | Thermal head | |
| JP2009248415A (en) | Thermal printing head | |
| JP3289820B2 (en) | Thermal head | |
| JP6280478B2 (en) | Thermal head | |
| JP2014087938A (en) | Thermal print head | |
| US5781220A (en) | Thermal head | |
| JP6383852B2 (en) | Thermal print head | |
| JP2022055600A (en) | Thermal print head | |
| CN116118359A (en) | Thermal print head and method for manufacturing thermal print head | |
| JP2015096338A (en) | Thermal printing head | |
| JP2016215389A (en) | Thermal print head | |
| JP2001191572A (en) | Thermal head |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |