JPH0636577Y2 - 半導体オープナー装置における半導体ホルダ - Google Patents
半導体オープナー装置における半導体ホルダInfo
- Publication number
- JPH0636577Y2 JPH0636577Y2 JP14934787U JP14934787U JPH0636577Y2 JP H0636577 Y2 JPH0636577 Y2 JP H0636577Y2 JP 14934787 U JP14934787 U JP 14934787U JP 14934787 U JP14934787 U JP 14934787U JP H0636577 Y2 JPH0636577 Y2 JP H0636577Y2
- Authority
- JP
- Japan
- Prior art keywords
- ratchet shaft
- semiconductor
- core member
- semiconductor package
- opener device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 46
- 210000000078 claw Anatomy 0.000 claims description 24
- 239000000243 solution Substances 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000004063 acid-resistant material Substances 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14934787U JPH0636577Y2 (ja) | 1987-09-30 | 1987-09-30 | 半導体オープナー装置における半導体ホルダ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14934787U JPH0636577Y2 (ja) | 1987-09-30 | 1987-09-30 | 半導体オープナー装置における半導体ホルダ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6453978U JPS6453978U (enrdf_load_html_response) | 1989-04-03 |
| JPH0636577Y2 true JPH0636577Y2 (ja) | 1994-09-21 |
Family
ID=31421490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14934787U Expired - Lifetime JPH0636577Y2 (ja) | 1987-09-30 | 1987-09-30 | 半導体オープナー装置における半導体ホルダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636577Y2 (enrdf_load_html_response) |
-
1987
- 1987-09-30 JP JP14934787U patent/JPH0636577Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6453978U (enrdf_load_html_response) | 1989-04-03 |