JPS5544761A - Semiconductor manufacturing system - Google Patents

Semiconductor manufacturing system

Info

Publication number
JPS5544761A
JPS5544761A JP11823078A JP11823078A JPS5544761A JP S5544761 A JPS5544761 A JP S5544761A JP 11823078 A JP11823078 A JP 11823078A JP 11823078 A JP11823078 A JP 11823078A JP S5544761 A JPS5544761 A JP S5544761A
Authority
JP
Japan
Prior art keywords
package
printing
printing surface
automatic
operator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11823078A
Other languages
Japanese (ja)
Inventor
Yukihiro Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP11823078A priority Critical patent/JPS5544761A/en
Publication of JPS5544761A publication Critical patent/JPS5544761A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To make automatic heating and surface cleaning treatment of packages before printing for securing the safety of operator's body and raising productivity.
CONSTITUTION: When shot onto a shoot rail 31 from an automatic supplier 42 before printing, a package 11 is stopped by a stopper pin 43. The wax having sticked to the printing surface of the package 11 is melted by heating the printing surface, and a cylinder 44 is reciprocated. Then, the package 11 is separated and shot under a press roller 36, and fed out with the printing surface kept in contact with cottom cloth tape 35. At this time, the wax melted on the package 11 is wiped off with the tape 35. Then, the package 11 shoots into an automatic housing mechanism 41. Since no organic solvent is used, the safety of operator's body can be secured and productivity can be raised.
COPYRIGHT: (C)1980,JPO&Japio
JP11823078A 1978-09-25 1978-09-25 Semiconductor manufacturing system Pending JPS5544761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11823078A JPS5544761A (en) 1978-09-25 1978-09-25 Semiconductor manufacturing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11823078A JPS5544761A (en) 1978-09-25 1978-09-25 Semiconductor manufacturing system

Publications (1)

Publication Number Publication Date
JPS5544761A true JPS5544761A (en) 1980-03-29

Family

ID=14731438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11823078A Pending JPS5544761A (en) 1978-09-25 1978-09-25 Semiconductor manufacturing system

Country Status (1)

Country Link
JP (1) JPS5544761A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118402A (en) * 1984-11-13 1986-06-05 Agency Of Ind Science & Technol Covering of solid substance with polymer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5161770A (en) * 1974-11-27 1976-05-28 Hitachi Ltd HIMAAKUBUHINNOMAESHORIHOHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5161770A (en) * 1974-11-27 1976-05-28 Hitachi Ltd HIMAAKUBUHINNOMAESHORIHOHO

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118402A (en) * 1984-11-13 1986-06-05 Agency Of Ind Science & Technol Covering of solid substance with polymer

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